CN103959929A - 电磁波吸收性导热片材和电磁波吸收性导热片材的制备方法 - Google Patents

电磁波吸收性导热片材和电磁波吸收性导热片材的制备方法 Download PDF

Info

Publication number
CN103959929A
CN103959929A CN201280059976.5A CN201280059976A CN103959929A CN 103959929 A CN103959929 A CN 103959929A CN 201280059976 A CN201280059976 A CN 201280059976A CN 103959929 A CN103959929 A CN 103959929A
Authority
CN
China
Prior art keywords
electromagnetic wave
coupling agent
conductive sheet
thermally
wave absorbability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280059976.5A
Other languages
English (en)
Chinese (zh)
Inventor
久村达雄
久保佑介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN103959929A publication Critical patent/CN103959929A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/08—Metallic powder characterised by particles having an amorphous microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0856—Iron
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147—Alloys characterised by their composition
    • H01F1/153—Amorphous metallic alloys, e.g. glassy metals
    • H01F1/15308—Amorphous metallic alloys, e.g. glassy metals based on Fe/Ni
CN201280059976.5A 2011-12-05 2012-12-05 电磁波吸收性导热片材和电磁波吸收性导热片材的制备方法 Pending CN103959929A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011265645A JP2013118313A (ja) 2011-12-05 2011-12-05 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法
JP2011-265645 2011-12-05
PCT/JP2012/081476 WO2013084920A1 (ja) 2011-12-05 2012-12-05 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法

Publications (1)

Publication Number Publication Date
CN103959929A true CN103959929A (zh) 2014-07-30

Family

ID=48574278

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280059976.5A Pending CN103959929A (zh) 2011-12-05 2012-12-05 电磁波吸收性导热片材和电磁波吸收性导热片材的制备方法

Country Status (4)

Country Link
JP (1) JP2013118313A (ja)
CN (1) CN103959929A (ja)
TW (1) TWI553673B (ja)
WO (1) WO2013084920A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106701010A (zh) * 2016-11-30 2017-05-24 陕西群力电工有限责任公司 一种大功率接触器用高绝缘高耐压导磁灌封胶及其制备方法
WO2018196517A1 (zh) * 2017-04-25 2018-11-01 深圳光启高等理工研究院 吸波材料及其制作方法
CN108886881A (zh) * 2016-03-25 2018-11-23 迪睿合电子材料有限公司 电磁波吸收导热片、电磁波吸收导热片的制造方法及半导体装置
CN112567899A (zh) * 2019-06-10 2021-03-26 富士高分子工业株式会社 电磁波吸收性导热性组合物及其片材
CN109880377B (zh) * 2019-03-14 2021-11-12 浙江三元电子科技有限公司 一种硅胶/羰基铁粉复合宽频吸波片及其制备方法
CN113789058A (zh) * 2021-09-28 2021-12-14 美信新材料股份有限公司 一种低应力导热硅胶及其制备方法、电子仪器
US11785752B2 (en) 2019-06-10 2023-10-10 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermally conductive composition and sheet thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11411263B2 (en) * 2019-03-06 2022-08-09 Laird Technologies, Inc. Thermal management and/or EMI mitigation materials including coated fillers
CN110951448B (zh) * 2019-10-23 2022-05-17 新纶光电材料(深圳)有限公司 一种双组份加成型有机硅导热胶及其制备方法
CN111961439A (zh) * 2020-08-17 2020-11-20 苏州超弦新材料有限公司 一种高性能吸波粉体表面处理工艺
CN114933800A (zh) * 2022-05-13 2022-08-23 哈尔滨理工大学 一种纳米铁氧体/液体硅橡胶雷达吸波复合材料
CN114891353B (zh) * 2022-06-28 2023-11-03 北京科技大学广州新材料研究院 复合材料垫片及其制备方法和应用、电子器件

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0912727A (ja) * 1995-06-27 1997-01-14 Soken Chem & Eng Co Ltd 樹脂粒子およびｆｒｐ組成物
JP2001308584A (ja) * 2000-04-27 2001-11-02 Polymatech Co Ltd 電波吸収体
US20020077439A1 (en) * 2000-10-25 2002-06-20 Ikuo Sakurai Electromagnetic wave absorbing silicone rubber compositions
JP2005310952A (ja) * 2004-04-20 2005-11-04 Nec Tokin Corp 電磁干渉抑制体
CN101310577A (zh) * 2005-09-26 2008-11-19 矢崎总业株式会社 用于热成型的电磁波吸收材料
CN101536121A (zh) * 2006-10-31 2009-09-16 索尼化学&信息部件株式会社 片状软磁性材料及其制备方法
CN101669414A (zh) * 2007-03-16 2010-03-10 三菱瓦斯化学株式会社 透光型电磁波屏蔽层叠体及其制造方法、透光型电波吸收体以及粘接剂组合物
JP4576206B2 (ja) * 2004-11-02 2010-11-04 株式会社デンソー 軟磁性材料の製造方法
TW201129769A (en) * 2010-02-22 2011-09-01 Sony Chem & Inf Device Corp Heat conduction piece
CN103053230A (zh) * 2010-08-23 2013-04-17 迪睿合电子材料有限公司 电磁波吸收性导热片材和电磁波吸收性导热片材的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148321A (ja) * 1994-11-21 1996-06-07 Minnesota Mining & Mfg Co <3M> 磁性組成物および樹脂結合型磁石
JP4588285B2 (ja) * 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
TW585342U (en) * 2003-04-25 2004-04-21 Cateron Corp Composite material structure with high heat conduction and electromagnetic shielding functions
JP4299261B2 (ja) * 2005-03-31 2009-07-22 東洋炭素株式会社 伝熱シート、放熱構造体および伝熱シートの使用方法
JP5646812B2 (ja) * 2008-12-15 2014-12-24 スリーエム イノベイティブ プロパティズ カンパニー アクリル系熱伝導性シートおよびその製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0912727A (ja) * 1995-06-27 1997-01-14 Soken Chem & Eng Co Ltd 樹脂粒子およびｆｒｐ組成物
JP2001308584A (ja) * 2000-04-27 2001-11-02 Polymatech Co Ltd 電波吸収体
US20020077439A1 (en) * 2000-10-25 2002-06-20 Ikuo Sakurai Electromagnetic wave absorbing silicone rubber compositions
JP2005310952A (ja) * 2004-04-20 2005-11-04 Nec Tokin Corp 電磁干渉抑制体
JP4576206B2 (ja) * 2004-11-02 2010-11-04 株式会社デンソー 軟磁性材料の製造方法
CN101310577A (zh) * 2005-09-26 2008-11-19 矢崎总业株式会社 用于热成型的电磁波吸收材料
CN101536121A (zh) * 2006-10-31 2009-09-16 索尼化学&信息部件株式会社 片状软磁性材料及其制备方法
CN101669414A (zh) * 2007-03-16 2010-03-10 三菱瓦斯化学株式会社 透光型电磁波屏蔽层叠体及其制造方法、透光型电波吸收体以及粘接剂组合物
TW201129769A (en) * 2010-02-22 2011-09-01 Sony Chem & Inf Device Corp Heat conduction piece
CN103053230A (zh) * 2010-08-23 2013-04-17 迪睿合电子材料有限公司 电磁波吸收性导热片材和电磁波吸收性导热片材的制造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112055513B (zh) * 2016-03-25 2023-03-28 迪睿合电子材料有限公司 电磁波吸收导热片
CN108886881A (zh) * 2016-03-25 2018-11-23 迪睿合电子材料有限公司 电磁波吸收导热片、电磁波吸收导热片的制造方法及半导体装置
CN112055513A (zh) * 2016-03-25 2020-12-08 迪睿合电子材料有限公司 电磁波吸收导热片
US10892204B2 (en) 2016-03-25 2021-01-12 Dexerials Corporation Electromagnetic wave absorbing heat conductive sheet, method for producing electromagnetic wave absorbing heat conductive sheet, and semiconductor device
CN106701010A (zh) * 2016-11-30 2017-05-24 陕西群力电工有限责任公司 一种大功率接触器用高绝缘高耐压导磁灌封胶及其制备方法
WO2018196517A1 (zh) * 2017-04-25 2018-11-01 深圳光启高等理工研究院 吸波材料及其制作方法
CN108727778A (zh) * 2017-04-25 2018-11-02 深圳光启高等理工研究院 吸波材料及其制作方法
CN109880377B (zh) * 2019-03-14 2021-11-12 浙江三元电子科技有限公司 一种硅胶/羰基铁粉复合宽频吸波片及其制备方法
CN112567899A (zh) * 2019-06-10 2021-03-26 富士高分子工业株式会社 电磁波吸收性导热性组合物及其片材
CN112567899B (zh) * 2019-06-10 2023-06-20 富士高分子工业株式会社 电磁波吸收性导热性组合物及其片材
US11785752B2 (en) 2019-06-10 2023-10-10 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermally conductive composition and sheet thereof
CN113789058B (zh) * 2021-09-28 2023-01-20 美信新材料股份有限公司 一种低应力导热硅胶及其制备方法、电子仪器
CN113789058A (zh) * 2021-09-28 2021-12-14 美信新材料股份有限公司 一种低应力导热硅胶及其制备方法、电子仪器

Also Published As

Publication number Publication date
TW201337971A (zh) 2013-09-16
WO2013084920A1 (ja) 2013-06-13
TWI553673B (zh) 2016-10-11
JP2013118313A (ja) 2013-06-13

Similar Documents

Publication Publication Date Title
CN103959929A (zh) 电磁波吸收性导热片材和电磁波吸收性导热片材的制备方法
CN103053230B (zh) 电磁波吸收性导热片材和电磁波吸收性导热片材的制造方法
CN110157316A (zh) 一种隔热吸波材及其制备方法
JP4849220B2 (ja) 電磁波干渉抑制用シート及びその製造法、高周波信号用フラットケーブル並びにフレキシブルプリント基板
US20070196671A1 (en) Electromagnetic wave absorber
CN103304888B (zh) 一种电磁屏蔽聚丙烯复合材料及其制备方法和用途
US20200152581A1 (en) Semiconductor device
CN105474334B (zh) 磁性构件用绝缘包覆粉末
JP6683091B2 (ja) 窒化ホウ素粒子集合体を含む有機無機コンポジット材料の製造方法
JP5602650B2 (ja) 酸化マグネシウム粉末
CN105950112A (zh) 一种纳米复合吸波材料及其制备方法
CN114213922A (zh) 一种散热涂料及其制备方法
JP6076510B2 (ja) 酸化マグネシウム、熱伝導性フィラー及びこれを含む熱伝導性樹脂組成物並びに酸化マグネシウムの製造方法
CN100546451C (zh) 电磁波吸收体
CN101800104A (zh) 电磁波抑制和散热用合成物及其制造方法
JP5795168B2 (ja) 熱伝導性樹脂組成物及び半導体パッケージ
JP2008001757A (ja) 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP2007042883A (ja) 軟磁性材料及びその製造法、該軟磁性材料を含む圧粉磁心
US20080258119A1 (en) Squeezable, Cross-Linked, Grease-Like Electromagnetic Wave Absorber
JP6461463B2 (ja) シリカ被覆磁性材料粒子およびその製造方法
JP2013244463A (ja) 複合粒子分散液、複合体およびそれらの製造方法
JP2020111748A (ja) 半導体封止用樹脂組成物およびそれを用いた半導体装置
CN108384245A (zh) 一种电子元件用多元硅脂导热纳米材料
CN101899708B (zh) 一种四角状氧化锌/铁氧体薄膜材料及其制备方法
CN107892899A (zh) 一种抗emi的双组份灌封胶及其制备方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140730

WD01 Invention patent application deemed withdrawn after publication