TW585342U - Composite material structure with high heat conduction and electromagnetic shielding functions - Google Patents
Composite material structure with high heat conduction and electromagnetic shielding functionsInfo
- Publication number
- TW585342U TW585342U TW92206575U TW92206575U TW585342U TW 585342 U TW585342 U TW 585342U TW 92206575 U TW92206575 U TW 92206575U TW 92206575 U TW92206575 U TW 92206575U TW 585342 U TW585342 U TW 585342U
- Authority
- TW
- Taiwan
- Prior art keywords
- composite material
- heat conduction
- high heat
- electromagnetic shielding
- material structure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3976—Including strand which is stated to have specific attributes [e.g., heat or fire resistance, chemical or solvent resistance, high absorption for aqueous composition, water solubility, heat shrinkability, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3976—Including strand which is stated to have specific attributes [e.g., heat or fire resistance, chemical or solvent resistance, high absorption for aqueous composition, water solubility, heat shrinkability, etc.]
- Y10T442/3984—Strand is other than glass and is heat or fire resistant
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92206575U TW585342U (en) | 2003-04-25 | 2003-04-25 | Composite material structure with high heat conduction and electromagnetic shielding functions |
US10/813,164 US20040214496A1 (en) | 2003-04-25 | 2004-03-31 | Material having characteristics of high thermal conductivity and electromagnetic interference resistance |
JP2004128828A JP2004322649A (en) | 2003-04-25 | 2004-04-23 | Composite material structure provided with high heat conduction and electromagnetic shielding function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92206575U TW585342U (en) | 2003-04-25 | 2003-04-25 | Composite material structure with high heat conduction and electromagnetic shielding functions |
Publications (1)
Publication Number | Publication Date |
---|---|
TW585342U true TW585342U (en) | 2004-04-21 |
Family
ID=33297716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92206575U TW585342U (en) | 2003-04-25 | 2003-04-25 | Composite material structure with high heat conduction and electromagnetic shielding functions |
Country Status (3)
Country | Link |
---|---|
US (1) | US20040214496A1 (en) |
JP (1) | JP2004322649A (en) |
TW (1) | TW585342U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103098575A (en) * | 2010-09-14 | 2013-05-08 | 莱尔德技术股份有限公司 | Compliant multilayered thermally-conductive interface assemblies having emi shielding properties |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006098528A1 (en) * | 2005-03-15 | 2006-09-21 | Sung Suk Ju | Conductive device for electronic equipment |
KR20080039507A (en) * | 2005-08-30 | 2008-05-07 | 마쯔시다덴기산교 가부시키가이샤 | Substrate structure |
JP4978478B2 (en) * | 2008-01-11 | 2012-07-18 | ソニー株式会社 | Electromagnetic wave suppressing heat radiation sheet and electronic device |
GB201112740D0 (en) | 2011-07-25 | 2011-09-07 | Qinetiq Ltd | Radiation absorption |
JP2013118313A (en) * | 2011-12-05 | 2013-06-13 | Dexerials Corp | Electromagnetic wave-absorbing thermally conductive sheet, and manufacturing method of electromagnetic wave-absorbing thermally conductive sheet |
KR102066482B1 (en) * | 2013-07-16 | 2020-01-15 | 삼성전자주식회사 | Fiber reinforced plastic material and electronic device including the same |
GB2521835A (en) * | 2014-01-02 | 2015-07-08 | Nokia Technologies Oy | Electromagnetic shielding |
JP1550139S (en) * | 2015-07-23 | 2016-05-23 | ||
JP1550138S (en) * | 2015-07-23 | 2016-05-23 | ||
US9781819B2 (en) | 2015-07-31 | 2017-10-03 | Laird Technologies, Inc. | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding |
CN107567270A (en) * | 2017-08-30 | 2018-01-09 | 艾威尔电路(深圳)有限公司 | Rigid-flex combined board with high-intensity signal shielding |
CN108909113A (en) * | 2018-08-24 | 2018-11-30 | 深圳市飞鸿达科技有限公司 | A kind of thermally conductive noise suppression sheet and preparation method thereof |
US10462944B1 (en) * | 2018-09-25 | 2019-10-29 | Getac Technology Corporation | Wave absorbing heat dissipation structure |
CN109243684B (en) * | 2018-10-31 | 2024-03-12 | 舜仕(深圳)科技有限公司 | Shockproof, filtering and anti-electromagnetic interference signal line |
CN114267960B (en) * | 2021-12-27 | 2022-11-01 | 彗晶新材料科技(杭州)有限公司 | Composite material with heat conduction and wave absorption and electromagnetic shielding functions and preparation method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5178704A (en) * | 1974-12-28 | 1976-07-08 | Onahama Seiren Kk | |
DE3365839D1 (en) * | 1983-05-27 | 1986-10-09 | Ibm Deutschland | Composite magnetic disk |
US5632942A (en) * | 1993-05-24 | 1997-05-27 | Industrial Technoology Research Institute | Method for preparing multilayer ceramic/glass substrates with electromagnetic shielding |
US6720082B1 (en) * | 1999-08-25 | 2004-04-13 | Bridgestone Corporation | Glass improved in impact resistance |
-
2003
- 2003-04-25 TW TW92206575U patent/TW585342U/en not_active IP Right Cessation
-
2004
- 2004-03-31 US US10/813,164 patent/US20040214496A1/en not_active Abandoned
- 2004-04-23 JP JP2004128828A patent/JP2004322649A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103098575A (en) * | 2010-09-14 | 2013-05-08 | 莱尔德技术股份有限公司 | Compliant multilayered thermally-conductive interface assemblies having emi shielding properties |
Also Published As
Publication number | Publication date |
---|---|
US20040214496A1 (en) | 2004-10-28 |
JP2004322649A (en) | 2004-11-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |