CN103117252A - 一种对二维封装柔性基板进行三维折叠封装的方法 - Google Patents
一种对二维封装柔性基板进行三维折叠封装的方法 Download PDFInfo
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- CN103117252A CN103117252A CN2013100586206A CN201310058620A CN103117252A CN 103117252 A CN103117252 A CN 103117252A CN 2013100586206 A CN2013100586206 A CN 2013100586206A CN 201310058620 A CN201310058620 A CN 201310058620A CN 103117252 A CN103117252 A CN 103117252A
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103280417A (zh) * | 2013-06-17 | 2013-09-04 | 华进半导体封装先导技术研发中心有限公司 | 一种柔性基板封装的装置 |
CN103311189A (zh) * | 2013-06-17 | 2013-09-18 | 华进半导体封装先导技术研发中心有限公司 | 一种柔性基板多层封装装置 |
CN103311161A (zh) * | 2013-06-17 | 2013-09-18 | 华进半导体封装先导技术研发中心有限公司 | 一种改进的柔性基板封装装置 |
CN103400813A (zh) * | 2013-08-02 | 2013-11-20 | 华进半导体封装先导技术研发中心有限公司 | 柔性基板封装结构及其封灌方法 |
CN104637927A (zh) * | 2013-11-12 | 2015-05-20 | 中国科学院微电子研究所 | 一种基于柔性基板的三维封装结构及工艺方法 |
CN104934296A (zh) * | 2014-03-21 | 2015-09-23 | 广东丹邦科技有限公司 | 一种柔性基板弯折设备及方法 |
CN112885727A (zh) * | 2021-01-19 | 2021-06-01 | 济南南知信息科技有限公司 | 一种芯片集成电路封装及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100025844A1 (en) * | 2007-09-19 | 2010-02-04 | Takao Yamazaki | Semiconductor device and manufacturing method thereof |
US20120020612A1 (en) * | 2010-07-16 | 2012-01-26 | Ibiden Co., Ltd. | Optical interconnect |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20100025844A1 (en) * | 2007-09-19 | 2010-02-04 | Takao Yamazaki | Semiconductor device and manufacturing method thereof |
US20120020612A1 (en) * | 2010-07-16 | 2012-01-26 | Ibiden Co., Ltd. | Optical interconnect |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103280417A (zh) * | 2013-06-17 | 2013-09-04 | 华进半导体封装先导技术研发中心有限公司 | 一种柔性基板封装的装置 |
CN103311189A (zh) * | 2013-06-17 | 2013-09-18 | 华进半导体封装先导技术研发中心有限公司 | 一种柔性基板多层封装装置 |
CN103311161A (zh) * | 2013-06-17 | 2013-09-18 | 华进半导体封装先导技术研发中心有限公司 | 一种改进的柔性基板封装装置 |
CN103311189B (zh) * | 2013-06-17 | 2017-02-08 | 华进半导体封装先导技术研发中心有限公司 | 一种柔性基板多层封装装置 |
CN103400813A (zh) * | 2013-08-02 | 2013-11-20 | 华进半导体封装先导技术研发中心有限公司 | 柔性基板封装结构及其封灌方法 |
CN103400813B (zh) * | 2013-08-02 | 2015-10-28 | 华进半导体封装先导技术研发中心有限公司 | 柔性基板封装结构及其封灌方法 |
CN104637927A (zh) * | 2013-11-12 | 2015-05-20 | 中国科学院微电子研究所 | 一种基于柔性基板的三维封装结构及工艺方法 |
CN104637927B (zh) * | 2013-11-12 | 2019-01-22 | 中国科学院微电子研究所 | 一种基于柔性基板的三维封装结构及工艺方法 |
CN104934296A (zh) * | 2014-03-21 | 2015-09-23 | 广东丹邦科技有限公司 | 一种柔性基板弯折设备及方法 |
CN112885727A (zh) * | 2021-01-19 | 2021-06-01 | 济南南知信息科技有限公司 | 一种芯片集成电路封装及其制造方法 |
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