CN103681458A - 一种制作嵌入式超薄芯片的三维柔性堆叠封装结构的方法 - Google Patents
一种制作嵌入式超薄芯片的三维柔性堆叠封装结构的方法 Download PDFInfo
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- CN103681458A CN103681458A CN201210321441.2A CN201210321441A CN103681458A CN 103681458 A CN103681458 A CN 103681458A CN 201210321441 A CN201210321441 A CN 201210321441A CN 103681458 A CN103681458 A CN 103681458A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210321441.2A CN103681458B (zh) | 2012-09-03 | 2012-09-03 | 一种制作嵌入式超薄芯片的三维柔性堆叠封装结构的方法 |
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CN201210321441.2A CN103681458B (zh) | 2012-09-03 | 2012-09-03 | 一种制作嵌入式超薄芯片的三维柔性堆叠封装结构的方法 |
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CN103681458A true CN103681458A (zh) | 2014-03-26 |
CN103681458B CN103681458B (zh) | 2016-06-01 |
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CN201210321441.2A Active CN103681458B (zh) | 2012-09-03 | 2012-09-03 | 一种制作嵌入式超薄芯片的三维柔性堆叠封装结构的方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106025050A (zh) * | 2016-06-08 | 2016-10-12 | 中国电子科技集团公司第五十八研究所 | 一种柔性共形封装结构 |
CN106328600A (zh) * | 2015-07-02 | 2017-01-11 | 欣兴电子股份有限公司 | 封装结构及其制作方法 |
CN108428662A (zh) * | 2017-02-15 | 2018-08-21 | 英飞凌科技股份有限公司 | 在芯片制造期间处置薄晶片 |
CN110335815A (zh) * | 2019-06-17 | 2019-10-15 | 浙江荷清柔性电子技术有限公司 | 柔性芯片的制备方法及柔性芯片 |
WO2019233072A1 (zh) * | 2018-06-08 | 2019-12-12 | 北京大学 | 一种类扇出多器件混合集成柔性微系统及其制备方法 |
CN111341678A (zh) * | 2020-02-28 | 2020-06-26 | 浙江集迈科微电子有限公司 | 一种不同厚度芯片嵌入的封装方法 |
CN111863794A (zh) * | 2020-07-28 | 2020-10-30 | 南通通富微电子有限公司 | 一种半导体封装器件 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6879047B1 (en) * | 2003-02-19 | 2005-04-12 | Amkor Technology, Inc. | Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor |
TW200849515A (en) * | 2007-06-13 | 2008-12-16 | Siliconware Precision Industries Co Ltd | Heat dissipation type package structure and fabrication method thereof |
CN101569008A (zh) * | 2007-09-19 | 2009-10-28 | 日本电气株式会社 | 半导体装置及其制造方法 |
CN102254898A (zh) * | 2011-07-01 | 2011-11-23 | 中国科学院微电子研究所 | 一种基于柔性基板封装的屏蔽结构及其制作工艺 |
CN102593016A (zh) * | 2012-03-20 | 2012-07-18 | 中国科学院微电子研究所 | 一种在柔性基板上安装薄芯片的方法 |
-
2012
- 2012-09-03 CN CN201210321441.2A patent/CN103681458B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6879047B1 (en) * | 2003-02-19 | 2005-04-12 | Amkor Technology, Inc. | Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor |
TW200849515A (en) * | 2007-06-13 | 2008-12-16 | Siliconware Precision Industries Co Ltd | Heat dissipation type package structure and fabrication method thereof |
CN101569008A (zh) * | 2007-09-19 | 2009-10-28 | 日本电气株式会社 | 半导体装置及其制造方法 |
CN102254898A (zh) * | 2011-07-01 | 2011-11-23 | 中国科学院微电子研究所 | 一种基于柔性基板封装的屏蔽结构及其制作工艺 |
CN102593016A (zh) * | 2012-03-20 | 2012-07-18 | 中国科学院微电子研究所 | 一种在柔性基板上安装薄芯片的方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106328600A (zh) * | 2015-07-02 | 2017-01-11 | 欣兴电子股份有限公司 | 封装结构及其制作方法 |
CN106328600B (zh) * | 2015-07-02 | 2019-04-30 | 欣兴电子股份有限公司 | 封装结构及其制作方法 |
CN106025050A (zh) * | 2016-06-08 | 2016-10-12 | 中国电子科技集团公司第五十八研究所 | 一种柔性共形封装结构 |
CN108428662A (zh) * | 2017-02-15 | 2018-08-21 | 英飞凌科技股份有限公司 | 在芯片制造期间处置薄晶片 |
WO2019233072A1 (zh) * | 2018-06-08 | 2019-12-12 | 北京大学 | 一种类扇出多器件混合集成柔性微系统及其制备方法 |
US11296033B2 (en) | 2018-06-08 | 2022-04-05 | Peking University | Fan-out multi-device hybrid integrated flexible micro system and fabrication method thereof |
CN110335815A (zh) * | 2019-06-17 | 2019-10-15 | 浙江荷清柔性电子技术有限公司 | 柔性芯片的制备方法及柔性芯片 |
CN111341678A (zh) * | 2020-02-28 | 2020-06-26 | 浙江集迈科微电子有限公司 | 一种不同厚度芯片嵌入的封装方法 |
CN111341678B (zh) * | 2020-02-28 | 2023-11-17 | 浙江集迈科微电子有限公司 | 一种不同厚度芯片嵌入的封装方法 |
CN111863794A (zh) * | 2020-07-28 | 2020-10-30 | 南通通富微电子有限公司 | 一种半导体封装器件 |
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CN103681458B (zh) | 2016-06-01 |
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Effective date of registration: 20150302 Address after: 214135 Jiangsu Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Applicant after: National Center for Advanced Packaging Co.,Ltd. Address before: 100083 Beijing city Chaoyang District Beitucheng West Road No. 3 Applicant before: Institute of Microelectronics of the Chinese Academy of Sciences |
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Effective date of registration: 20170818 Address after: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee after: Shanghai State Intellectual Property Services Co.,Ltd. Address before: 214135 Jiangsu Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co.,Ltd. |
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Effective date of registration: 20191209 Address after: 214028 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee after: National Center for Advanced Packaging Co.,Ltd. Address before: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee before: Shanghai State Intellectual Property Services Co.,Ltd. |