CN202297105U - 微机电系统mems器件的方形扁平无引脚封装qfn结构 - Google Patents
微机电系统mems器件的方形扁平无引脚封装qfn结构 Download PDFInfo
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- CN202297105U CN202297105U CN2011204234679U CN201120423467U CN202297105U CN 202297105 U CN202297105 U CN 202297105U CN 2011204234679 U CN2011204234679 U CN 2011204234679U CN 201120423467 U CN201120423467 U CN 201120423467U CN 202297105 U CN202297105 U CN 202297105U
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CN2011204234679U CN202297105U (zh) | 2011-10-31 | 2011-10-31 | 微机电系统mems器件的方形扁平无引脚封装qfn结构 |
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CN2011204234679U CN202297105U (zh) | 2011-10-31 | 2011-10-31 | 微机电系统mems器件的方形扁平无引脚封装qfn结构 |
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CN202297105U true CN202297105U (zh) | 2012-07-04 |
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CN2011204234679U Expired - Fee Related CN202297105U (zh) | 2011-10-31 | 2011-10-31 | 微机电系统mems器件的方形扁平无引脚封装qfn结构 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102344110A (zh) * | 2011-10-31 | 2012-02-08 | 嘉盛半导体(苏州)有限公司 | 微机电系统器件的方形扁平无引脚封装结构及方法 |
CN105036067A (zh) * | 2015-05-29 | 2015-11-11 | 中国科学院电子学研究所 | Mems传感器倒装叠层封装结构及其制备方法 |
WO2022026000A1 (en) * | 2020-07-30 | 2022-02-03 | Invensense, Inc. | Reducing delamination in a packaged integrated circuit |
-
2011
- 2011-10-31 CN CN2011204234679U patent/CN202297105U/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102344110A (zh) * | 2011-10-31 | 2012-02-08 | 嘉盛半导体(苏州)有限公司 | 微机电系统器件的方形扁平无引脚封装结构及方法 |
CN102344110B (zh) * | 2011-10-31 | 2015-07-15 | 嘉盛半导体(苏州)有限公司 | 微机电系统器件的方形扁平无引脚封装结构及方法 |
CN105036067A (zh) * | 2015-05-29 | 2015-11-11 | 中国科学院电子学研究所 | Mems传感器倒装叠层封装结构及其制备方法 |
WO2022026000A1 (en) * | 2020-07-30 | 2022-02-03 | Invensense, Inc. | Reducing delamination in a packaged integrated circuit |
US11584638B2 (en) | 2020-07-30 | 2023-02-21 | Invensense, Inc. | Reducing delamination in sensor package |
TWI795761B (zh) * | 2020-07-30 | 2023-03-11 | 美商伊凡聖斯股份有限公司 | 減少感測器封裝中的脫層及其方法 |
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