CN102803574B - 电子材料用铜合金及其制备方法 - Google Patents
电子材料用铜合金及其制备方法 Download PDFInfo
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- CN102803574B CN102803574B CN201180015302.0A CN201180015302A CN102803574B CN 102803574 B CN102803574 B CN 102803574B CN 201180015302 A CN201180015302 A CN 201180015302A CN 102803574 B CN102803574 B CN 102803574B
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- particle diameter
- crystal grain
- copper alloy
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 56
- 239000012776 electronic material Substances 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims description 15
- 239000002245 particle Substances 0.000 claims abstract description 61
- 239000013078 crystal Substances 0.000 claims abstract description 55
- 238000005096 rolling process Methods 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims description 23
- 238000005498 polishing Methods 0.000 claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 claims description 13
- 238000000227 grinding Methods 0.000 claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910000906 Bronze Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000010974 bronze Substances 0.000 claims description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 6
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 45
- 238000000034 method Methods 0.000 description 23
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 239000010949 copper Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 238000005554 pickling Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000012535 impurity Substances 0.000 description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 230000000007 visual effect Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000005238 degreasing Methods 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 7
- 239000011701 zinc Substances 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000005097 cold rolling Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000006396 nitration reaction Methods 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000011978 dissolution method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010956 nickel silver Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010066397A JP4629154B1 (ja) | 2010-03-23 | 2010-03-23 | 電子材料用銅合金及びその製造方法 |
JP2010-066397 | 2010-03-23 | ||
PCT/JP2011/057026 WO2011118650A1 (ja) | 2010-03-23 | 2011-03-23 | 電子材料用銅合金及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102803574A CN102803574A (zh) | 2012-11-28 |
CN102803574B true CN102803574B (zh) | 2015-09-02 |
Family
ID=43638543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180015302.0A Active CN102803574B (zh) | 2010-03-23 | 2011-03-23 | 电子材料用铜合金及其制备方法 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2551384A4 (ja) |
JP (1) | JP4629154B1 (ja) |
KR (1) | KR101335201B1 (ja) |
CN (1) | CN102803574B (ja) |
MX (1) | MX2012010887A (ja) |
TW (1) | TWI429763B (ja) |
WO (1) | WO2011118650A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4831552B1 (ja) * | 2011-03-28 | 2011-12-07 | Jx日鉱日石金属株式会社 | Co−Si系銅合金板 |
JP5961371B2 (ja) * | 2011-12-06 | 2016-08-02 | Jx金属株式会社 | Ni−Co−Si系銅合金板 |
JP6141708B2 (ja) * | 2013-07-09 | 2017-06-07 | 三菱伸銅株式会社 | 光沢度に優れためっき付き銅合金板 |
JP6085536B2 (ja) * | 2013-08-05 | 2017-02-22 | 株式会社Shカッパープロダクツ | 銅条、めっき付銅条、リードフレーム及びledモジュール |
KR101879827B1 (ko) * | 2013-08-14 | 2018-07-18 | 미쯔비시 케미컬 주식회사 | 나노임프린트용 몰드의 제조방법 및 반사방지물품 |
JP6320759B2 (ja) * | 2014-01-06 | 2018-05-09 | 三菱伸銅株式会社 | Cu−Fe−P系銅合金板の製造方法 |
JP6228941B2 (ja) | 2015-01-09 | 2017-11-08 | Jx金属株式会社 | めっき層を有するチタン銅 |
KR102503365B1 (ko) * | 2015-09-01 | 2023-02-24 | 후루카와 덴키 고교 가부시키가이샤 | 내열성이 우수한 도금재 및 그 제조방법 |
JP6662685B2 (ja) * | 2016-03-31 | 2020-03-11 | Jx金属株式会社 | めっき層を有するチタン銅箔 |
JP6271626B2 (ja) * | 2016-03-31 | 2018-01-31 | Jx金属株式会社 | めっき層を有するチタン銅箔 |
JP2016211078A (ja) * | 2016-07-26 | 2016-12-15 | Jx金属株式会社 | Cu−Ni−Si系合金及びその製造方法 |
JP6793005B2 (ja) * | 2016-10-27 | 2020-12-02 | Dowaメタルテック株式会社 | 銅合金板材およびその製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1244033A (zh) * | 1998-07-31 | 2000-02-09 | 科莱恩(法国)公司 | 铜基材料表层的机械化学抛光方法 |
CN101213314A (zh) * | 2005-07-05 | 2008-07-02 | 古河电气工业株式会社 | 电子设备用铜合金及其制造方法 |
CN101215698A (zh) * | 2007-12-28 | 2008-07-09 | 天津大学 | 一种在紫铜表面制备纳米厚度的薄膜表面的方法 |
JP2008223106A (ja) * | 2007-03-14 | 2008-09-25 | Furukawa Electric Co Ltd:The | ベアボンディング性に優れるリードフレーム用銅合金及びその製造方法 |
CN101509850A (zh) * | 2009-03-20 | 2009-08-19 | 北京科技大学 | 一种制备电铸铜金相样品及显示组织的方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5516415A (en) * | 1993-11-16 | 1996-05-14 | Ontario Hydro | Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube |
JP3550482B2 (ja) | 1997-07-09 | 2004-08-04 | 三島光産株式会社 | 連続鋳造に用いる鋳型片のめっき方法 |
JP4001491B2 (ja) * | 2001-02-20 | 2007-10-31 | 日鉱金属株式会社 | 高強度チタン銅合金及びその製造法並びにそれを用いた端子・コネクター |
JP2006002233A (ja) * | 2004-06-18 | 2006-01-05 | Furukawa Electric Co Ltd:The | 成形加工性に優れた被めっき物 |
JP2007039804A (ja) * | 2005-07-05 | 2007-02-15 | Furukawa Electric Co Ltd:The | 電子機器用銅合金及びその製造方法 |
CN101939453A (zh) * | 2008-02-08 | 2011-01-05 | 古河电气工业株式会社 | 电气电子零件用铜合金材料 |
-
2010
- 2010-03-23 JP JP2010066397A patent/JP4629154B1/ja active Active
-
2011
- 2011-03-21 TW TW100109511A patent/TWI429763B/zh active
- 2011-03-23 MX MX2012010887A patent/MX2012010887A/es active IP Right Grant
- 2011-03-23 EP EP11759455.6A patent/EP2551384A4/en not_active Withdrawn
- 2011-03-23 CN CN201180015302.0A patent/CN102803574B/zh active Active
- 2011-03-23 KR KR1020127020755A patent/KR101335201B1/ko active IP Right Grant
- 2011-03-23 WO PCT/JP2011/057026 patent/WO2011118650A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1244033A (zh) * | 1998-07-31 | 2000-02-09 | 科莱恩(法国)公司 | 铜基材料表层的机械化学抛光方法 |
CN101213314A (zh) * | 2005-07-05 | 2008-07-02 | 古河电气工业株式会社 | 电子设备用铜合金及其制造方法 |
JP2008223106A (ja) * | 2007-03-14 | 2008-09-25 | Furukawa Electric Co Ltd:The | ベアボンディング性に優れるリードフレーム用銅合金及びその製造方法 |
CN101215698A (zh) * | 2007-12-28 | 2008-07-09 | 天津大学 | 一种在紫铜表面制备纳米厚度的薄膜表面的方法 |
CN101509850A (zh) * | 2009-03-20 | 2009-08-19 | 北京科技大学 | 一种制备电铸铜金相样品及显示组织的方法 |
Non-Patent Citations (1)
Title |
---|
吴复宇.10.4研磨材料的发展.《汽车涂装技术》.2006,(第1版),第227页. * |
Also Published As
Publication number | Publication date |
---|---|
EP2551384A4 (en) | 2017-07-19 |
EP2551384A1 (en) | 2013-01-30 |
TW201139703A (en) | 2011-11-16 |
MX2012010887A (es) | 2012-12-17 |
JP4629154B1 (ja) | 2011-02-09 |
KR101335201B1 (ko) | 2013-11-29 |
JP2011195927A (ja) | 2011-10-06 |
KR20120114341A (ko) | 2012-10-16 |
CN102803574A (zh) | 2012-11-28 |
WO2011118650A1 (ja) | 2011-09-29 |
TWI429763B (zh) | 2014-03-11 |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
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CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |