EP2551384A4 - Copper alloy for electronic material and method of manufacture for same - Google Patents

Copper alloy for electronic material and method of manufacture for same Download PDF

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Publication number
EP2551384A4
EP2551384A4 EP11759455.6A EP11759455A EP2551384A4 EP 2551384 A4 EP2551384 A4 EP 2551384A4 EP 11759455 A EP11759455 A EP 11759455A EP 2551384 A4 EP2551384 A4 EP 2551384A4
Authority
EP
European Patent Office
Prior art keywords
manufacture
same
copper alloy
electronic material
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11759455.6A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2551384A1 (en
Inventor
Hiroshi Kuwagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP2551384A1 publication Critical patent/EP2551384A1/en
Publication of EP2551384A4 publication Critical patent/EP2551384A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP11759455.6A 2010-03-23 2011-03-23 Copper alloy for electronic material and method of manufacture for same Withdrawn EP2551384A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010066397A JP4629154B1 (ja) 2010-03-23 2010-03-23 電子材料用銅合金及びその製造方法
PCT/JP2011/057026 WO2011118650A1 (ja) 2010-03-23 2011-03-23 電子材料用銅合金及びその製造方法

Publications (2)

Publication Number Publication Date
EP2551384A1 EP2551384A1 (en) 2013-01-30
EP2551384A4 true EP2551384A4 (en) 2017-07-19

Family

ID=43638543

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11759455.6A Withdrawn EP2551384A4 (en) 2010-03-23 2011-03-23 Copper alloy for electronic material and method of manufacture for same

Country Status (7)

Country Link
EP (1) EP2551384A4 (ja)
JP (1) JP4629154B1 (ja)
KR (1) KR101335201B1 (ja)
CN (1) CN102803574B (ja)
MX (1) MX2012010887A (ja)
TW (1) TWI429763B (ja)
WO (1) WO2011118650A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4831552B1 (ja) * 2011-03-28 2011-12-07 Ｊｘ日鉱日石金属株式会社 Ｃｏ−Ｓｉ系銅合金板
JP5961371B2 (ja) * 2011-12-06 2016-08-02 Ｊｘ金属株式会社 Ｎｉ−Ｃｏ−Ｓｉ系銅合金板
JP6141708B2 (ja) * 2013-07-09 2017-06-07 三菱伸銅株式会社 光沢度に優れためっき付き銅合金板
JP6085536B2 (ja) * 2013-08-05 2017-02-22 株式会社Ｓｈカッパープロダクツ 銅条、めっき付銅条、リードフレーム及びｌｅｄモジュール
CN105451967B (zh) * 2013-08-14 2017-11-10 三菱化学株式会社 纳米压印用模具的制造方法以及防反射物品
JP6320759B2 (ja) * 2014-01-06 2018-05-09 三菱伸銅株式会社 Ｃｕ−Ｆｅ−Ｐ系銅合金板の製造方法
JP6228941B2 (ja) * 2015-01-09 2017-11-08 Ｊｘ金属株式会社 めっき層を有するチタン銅
WO2017038825A1 (ja) * 2015-09-01 2017-03-09 古河電気工業株式会社 耐熱性に優れためっき材及びその製造方法
JP6662685B2 (ja) * 2016-03-31 2020-03-11 Ｊｘ金属株式会社 めっき層を有するチタン銅箔
JP6271626B2 (ja) * 2016-03-31 2018-01-31 Ｊｘ金属株式会社 めっき層を有するチタン銅箔
JP2016211078A (ja) * 2016-07-26 2016-12-15 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP6793005B2 (ja) * 2016-10-27 2020-12-02 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995014121A1 (en) * 1993-11-16 1995-05-26 Ontario Hydro Metal tube having a section with an internal electroplated structural layer
JP2006002233A (ja) * 2004-06-18 2006-01-05 Furukawa Electric Co Ltd:The 成形加工性に優れた被めっき物
US20070015001A1 (en) * 2005-07-05 2007-01-18 The Furukawa Electric Co., Ltd. Copper alloy for electronic machinery and tools and method of producing the same
CN101215698A (zh) * 2007-12-28 2008-07-09 天津大学 一种在紫铜表面制备纳米厚度的薄膜表面的方法
WO2009099198A1 (ja) * 2008-02-08 2009-08-13 The Furukawa Electric Co., Ltd. 電気電子部品用銅合金材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550482B2 (ja) 1997-07-09 2004-08-04 三島光産株式会社 連続鋳造に用いる鋳型片のめっき方法
FR2781922B1 (fr) * 1998-07-31 2001-11-23 Clariant France Sa Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre
JP4001491B2 (ja) * 2001-02-20 2007-10-31 日鉱金属株式会社 高強度チタン銅合金及びその製造法並びにそれを用いた端子・コネクター
JP2007039804A (ja) * 2005-07-05 2007-02-15 Furukawa Electric Co Ltd:The 電子機器用銅合金及びその製造方法
JP5128152B2 (ja) * 2007-03-14 2013-01-23 古河電気工業株式会社 ベアボンディング性に優れるリードフレーム用銅合金及びその製造方法
CN101509850A (zh) * 2009-03-20 2009-08-19 北京科技大学 一种制备电铸铜金相样品及显示组织的方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995014121A1 (en) * 1993-11-16 1995-05-26 Ontario Hydro Metal tube having a section with an internal electroplated structural layer
JP2006002233A (ja) * 2004-06-18 2006-01-05 Furukawa Electric Co Ltd:The 成形加工性に優れた被めっき物
US20070015001A1 (en) * 2005-07-05 2007-01-18 The Furukawa Electric Co., Ltd. Copper alloy for electronic machinery and tools and method of producing the same
CN101215698A (zh) * 2007-12-28 2008-07-09 天津大学 一种在紫铜表面制备纳米厚度的薄膜表面的方法
WO2009099198A1 (ja) * 2008-02-08 2009-08-13 The Furukawa Electric Co., Ltd. 電気電子部品用銅合金材料
EP2243847A1 (en) * 2008-02-08 2010-10-27 The Furukawa Electric Co., Ltd. Copper alloy material for electric and electronic components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011118650A1 *

Also Published As

Publication number Publication date
JP2011195927A (ja) 2011-10-06
TW201139703A (en) 2011-11-16
MX2012010887A (es) 2012-12-17
EP2551384A1 (en) 2013-01-30
KR101335201B1 (ko) 2013-11-29
TWI429763B (zh) 2014-03-11
CN102803574B (zh) 2015-09-02
JP4629154B1 (ja) 2011-02-09
KR20120114341A (ko) 2012-10-16
WO2011118650A1 (ja) 2011-09-29
CN102803574A (zh) 2012-11-28

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