CN102796487A - 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 - Google Patents

粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 Download PDF

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Publication number
CN102796487A
CN102796487A CN2012102796755A CN201210279675A CN102796487A CN 102796487 A CN102796487 A CN 102796487A CN 2012102796755 A CN2012102796755 A CN 2012102796755A CN 201210279675 A CN201210279675 A CN 201210279675A CN 102796487 A CN102796487 A CN 102796487A
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China
Prior art keywords
adhesive
circuit connection
circuit
methyl
compsn
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CN2012102796755A
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CN102796487B (zh
Inventor
加藤木茂树
伊泽弘行
须藤朋子
汤佐正己
藤绳贡
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日立化成工业株式会社
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Priority to JP2005074913A priority Critical patent/JP4760069B2/ja
Priority to JP2005074999A priority patent/JP4760070B2/ja
Priority to JP2005-074999 priority
Priority to JP2005-074913 priority
Application filed by 日立化成工业株式会社 filed Critical 日立化成工业株式会社
Publication of CN102796487A publication Critical patent/CN102796487A/zh
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