CN102277124B - 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 - Google Patents
粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 Download PDFInfo
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- CN102277124B CN102277124B CN201110222529.4A CN201110222529A CN102277124B CN 102277124 B CN102277124 B CN 102277124B CN 201110222529 A CN201110222529 A CN 201110222529A CN 102277124 B CN102277124 B CN 102277124B
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
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- H—ELECTRICITY
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- H01L2924/078—Adhesive characteristics other than chemical
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
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- Spectroscopy & Molecular Physics (AREA)
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Abstract
Description
Claims (71)
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JP2005074913A JP4760069B2 (ja) | 2005-03-16 | 2005-03-16 | 接着剤組成物、回路接続用接着剤組成物及びそれを用いた回路接続構造体、半導体装置 |
JP2005-074999 | 2005-03-16 | ||
JP2005074999A JP4760070B2 (ja) | 2005-03-16 | 2005-03-16 | 接着剤、回路接続用接着剤、接続体及び半導体装置 |
JP2005-074913 | 2005-03-16 |
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CN2006800081746A Division CN101142292B (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
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CN2011102205106A Expired - Fee Related CN102277123B (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
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CN201210279675.5A Expired - Fee Related CN102796487B (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
CN2011102233002A Pending CN102391822A (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
CN2011102224874A Pending CN102355793A (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
CN2012102796789A Expired - Fee Related CN102786908B (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
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CN2011102205106A Expired - Fee Related CN102277123B (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
CN201210279658.1A Expired - Fee Related CN102796486B (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
CN201210284584.0A Expired - Fee Related CN102807836B (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
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CN2011102233002A Pending CN102391822A (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
CN2011102224874A Pending CN102355793A (zh) | 2005-03-16 | 2006-03-15 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
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JP2005026547A (ja) * | 2003-07-04 | 2005-01-27 | Hitachi Chem Co Ltd | 半導体装置およびその製造方法、ならびに半導体装置に用いられる接着シート |
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