CN102347211A - 保持用于热处理的多个平面基板的方法和设备 - Google Patents
保持用于热处理的多个平面基板的方法和设备 Download PDFInfo
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- CN102347211A CN102347211A CN2011102058111A CN201110205811A CN102347211A CN 102347211 A CN102347211 A CN 102347211A CN 2011102058111 A CN2011102058111 A CN 2011102058111A CN 201110205811 A CN201110205811 A CN 201110205811A CN 102347211 A CN102347211 A CN 102347211A
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- 238000010438 heat treatment Methods 0.000 claims description 34
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 18
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- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
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- 229910052711 selenium Inorganic materials 0.000 claims description 5
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- 230000000284 resting effect Effects 0.000 claims description 4
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
- H01L21/67316—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Chemical Vapour Deposition (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (26)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36721110P | 2010-07-23 | 2010-07-23 | |
US61/367,211 | 2010-07-23 | ||
US13/171,089 | 2011-06-28 | ||
US13/171,089 US8461061B2 (en) | 2010-07-23 | 2011-06-28 | Quartz boat method and apparatus for thin film thermal treatment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102347211A true CN102347211A (zh) | 2012-02-08 |
CN102347211B CN102347211B (zh) | 2015-08-12 |
Family
ID=45493965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110205811.1A Expired - Fee Related CN102347211B (zh) | 2010-07-23 | 2011-07-21 | 保持用于热处理的多个平面基板的方法和设备 |
Country Status (4)
Country | Link |
---|---|
US (2) | US8461061B2 (zh) |
CN (1) | CN102347211B (zh) |
DE (1) | DE102011108321A1 (zh) |
TW (1) | TWI466192B (zh) |
Cited By (3)
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CN102723301A (zh) * | 2012-06-05 | 2012-10-10 | 山东力诺太阳能电力股份有限公司 | 一种扩散用石英舟 |
CN103311164A (zh) * | 2012-03-06 | 2013-09-18 | 绿阳光电股份有限公司 | 基板载具及其硒化制程系统 |
CN103870207B (zh) * | 2012-12-17 | 2016-09-21 | 银灿科技股份有限公司 | 可携式装置的虚拟光驱的光盘数据切换系统及其方法 |
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US9105776B2 (en) * | 2006-05-15 | 2015-08-11 | Stion Corporation | Method and structure for thin film photovoltaic materials using semiconductor materials |
US8071179B2 (en) | 2007-06-29 | 2011-12-06 | Stion Corporation | Methods for infusing one or more materials into nano-voids if nanoporous or nanostructured materials |
US8759671B2 (en) * | 2007-09-28 | 2014-06-24 | Stion Corporation | Thin film metal oxide bearing semiconductor material for single junction solar cell devices |
US7998762B1 (en) | 2007-11-14 | 2011-08-16 | Stion Corporation | Method and system for large scale manufacture of thin film photovoltaic devices using multi-chamber configuration |
US8772078B1 (en) | 2008-03-03 | 2014-07-08 | Stion Corporation | Method and system for laser separation for exclusion region of multi-junction photovoltaic materials |
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US20100180927A1 (en) * | 2008-08-27 | 2010-07-22 | Stion Corporation | Affixing method and solar decal device using a thin film photovoltaic and interconnect structures |
US7855089B2 (en) * | 2008-09-10 | 2010-12-21 | Stion Corporation | Application specific solar cell and method for manufacture using thin film photovoltaic materials |
US7947524B2 (en) * | 2008-09-30 | 2011-05-24 | Stion Corporation | Humidity control and method for thin film photovoltaic materials |
US8425739B1 (en) | 2008-09-30 | 2013-04-23 | Stion Corporation | In chamber sodium doping process and system for large scale cigs based thin film photovoltaic materials |
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US8741689B2 (en) * | 2008-10-01 | 2014-06-03 | Stion Corporation | Thermal pre-treatment process for soda lime glass substrate for thin film photovoltaic materials |
US8168463B2 (en) | 2008-10-17 | 2012-05-01 | Stion Corporation | Zinc oxide film method and structure for CIGS cell |
US8507786B1 (en) | 2009-06-27 | 2013-08-13 | Stion Corporation | Manufacturing method for patterning CIGS/CIS solar cells |
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US8628997B2 (en) | 2010-10-01 | 2014-01-14 | Stion Corporation | Method and device for cadmium-free solar cells |
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US8436445B2 (en) | 2011-08-15 | 2013-05-07 | Stion Corporation | Method of manufacture of sodium doped CIGS/CIGSS absorber layers for high efficiency photovoltaic devices |
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DE102015111144A1 (de) * | 2015-07-09 | 2017-01-12 | Hanwha Q.CELLS GmbH | Vorrichtung zur paarweisen Aufnahme von Substraten |
JP6688714B2 (ja) * | 2016-09-29 | 2020-04-28 | 株式会社Screenホールディングス | 基板配列装置および基板配列方法 |
US10068787B2 (en) * | 2016-12-30 | 2018-09-04 | Sunpower Corporation | Bowing semiconductor wafers |
US10020213B1 (en) * | 2016-12-30 | 2018-07-10 | Sunpower Corporation | Semiconductor wafer carriers |
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DE102011108321A1 (de) | 2012-01-26 |
US8461061B2 (en) | 2013-06-11 |
TWI466192B (zh) | 2014-12-21 |
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US20120021552A1 (en) | 2012-01-26 |
TW201207949A (en) | 2012-02-16 |
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