CN102315142B - 流路切换装置、处理装置、流路切换方法、处理方法 - Google Patents

流路切换装置、处理装置、流路切换方法、处理方法 Download PDF

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Publication number
CN102315142B
CN102315142B CN201110168465.4A CN201110168465A CN102315142B CN 102315142 B CN102315142 B CN 102315142B CN 201110168465 A CN201110168465 A CN 201110168465A CN 102315142 B CN102315142 B CN 102315142B
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China
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mentioned
flow path
rotating cylinder
urceolus
drain passageway
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CN201110168465.4A
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English (en)
Chinese (zh)
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CN102315142A (zh
Inventor
绪方信博
长峰秀一
清田健司
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0324—With control of flow by a condition or characteristic of a fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control
    • Y10T137/87684—Valve in each inlet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages
    • Y10T137/87877—Single inlet with multiple distinctly valved outlets

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Multiple-Way Valves (AREA)
CN201110168465.4A 2010-06-22 2011-06-17 流路切换装置、处理装置、流路切换方法、处理方法 Active CN102315142B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-141921 2010-06-22
JP2010141921A JP5240245B2 (ja) 2010-06-22 2010-06-22 流路切替え装置、処理装置、流路切替え方法及び処理方法並びに記憶媒体

Publications (2)

Publication Number Publication Date
CN102315142A CN102315142A (zh) 2012-01-11
CN102315142B true CN102315142B (zh) 2015-03-18

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Country Status (5)

Country Link
US (1) US8840752B2 (https=)
JP (1) JP5240245B2 (https=)
KR (1) KR101417208B1 (https=)
CN (1) CN102315142B (https=)
TW (1) TWI487049B (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5240245B2 (ja) * 2010-06-22 2013-07-17 東京エレクトロン株式会社 流路切替え装置、処理装置、流路切替え方法及び処理方法並びに記憶媒体
JP2013011289A (ja) * 2011-06-28 2013-01-17 Tokyo Electron Ltd ゲートバルブ及びそれを用いた基板処理システム
JP6003716B2 (ja) * 2012-04-17 2016-10-05 株式会社デンソー 流路切替装置
CN103453215B (zh) * 2012-05-31 2016-04-27 英属开曼群岛商精曜有限公司 阀门总成以及阀门
JP6219848B2 (ja) * 2012-12-28 2017-10-25 株式会社Ｓｃｒｅｅｎホールディングス 処理装置とその排気切換装置並びに排気切換ユニットと切換弁ボックス
US9698029B2 (en) * 2014-02-19 2017-07-04 Lam Research Ag Method and apparatus for processing wafer-shaped articles
JP6482979B2 (ja) * 2015-07-29 2019-03-13 東京エレクトロン株式会社 液処理装置
TWI629116B (zh) * 2016-06-28 2018-07-11 荏原製作所股份有限公司 清洗裝置、具備該清洗裝置之鍍覆裝置、以及清洗方法
CA2976081C (en) 2016-08-10 2025-01-14 Pat Technology Systems Inc. Fume extraction device with movable extraction opening
JP6990602B2 (ja) * 2018-02-27 2022-01-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
JP7019184B2 (ja) * 2018-07-17 2022-02-15 スピードファム株式会社 処理液切換装置
JP7203545B2 (ja) 2018-09-21 2023-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6611893B2 (ja) * 2018-11-01 2019-11-27 東京エレクトロン株式会社 基板液処理装置
CN209540113U (zh) * 2019-01-05 2019-10-25 宁波大叶园林工业股份有限公司 一种新型四通通水结构
JP7370277B2 (ja) * 2020-02-26 2023-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US12512342B2 (en) * 2020-02-26 2025-12-30 SCREEN Holdings Co., Ltd. Substrate treating apparatus
CN113494680B (zh) * 2020-04-07 2023-05-12 添可智能科技有限公司 通路切换装置、液体供给系统和通路切换方法
JP7807275B2 (ja) * 2022-03-23 2026-01-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2026004903A (ja) * 2024-06-26 2026-01-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2541112Y (zh) * 2002-05-29 2003-03-26 苏州精机机械工业有限公司 旋转式油位闸门
CN101114579A (zh) * 2006-07-26 2008-01-30 东京毅力科创株式会社 液体处理系统
CN101680861A (zh) * 2007-05-15 2010-03-24 通用电气健康护理生物科学股份公司 流量分配阀

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD206687A3 (de) * 1981-07-28 1984-02-01 Mikroelektronik Zt Forsch Tech Verfahren und vorrichtung zur gasfuehrung fuer lp cvd prozesse in einem rohrreaktor
JPH1012523A (ja) * 1996-06-21 1998-01-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3669897B2 (ja) * 1999-06-09 2005-07-13 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP3584185B2 (ja) * 1999-09-21 2004-11-04 エア・ウォーター株式会社 冷凍機およびこれに用いるロータリー弁
US8298338B2 (en) * 2007-12-26 2012-10-30 Samsung Electronics Co., Ltd. Chemical vapor deposition apparatus
JP4881345B2 (ja) * 2008-04-03 2012-02-22 東京エレクトロン株式会社 圧力制御機構、基板処理装置、基板処理方法及び記憶媒体
JP5012651B2 (ja) * 2008-05-14 2012-08-29 東京エレクトロン株式会社 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP5240245B2 (ja) * 2010-06-22 2013-07-17 東京エレクトロン株式会社 流路切替え装置、処理装置、流路切替え方法及び処理方法並びに記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2541112Y (zh) * 2002-05-29 2003-03-26 苏州精机机械工业有限公司 旋转式油位闸门
CN101114579A (zh) * 2006-07-26 2008-01-30 东京毅力科创株式会社 液体处理系统
CN101680861A (zh) * 2007-05-15 2010-03-24 通用电气健康护理生物科学股份公司 流量分配阀

Also Published As

Publication number Publication date
JP5240245B2 (ja) 2013-07-17
JP2012009511A (ja) 2012-01-12
US20110308626A1 (en) 2011-12-22
KR101417208B1 (ko) 2014-07-08
TW201214601A (en) 2012-04-01
KR20110139096A (ko) 2011-12-28
TWI487049B (zh) 2015-06-01
US8840752B2 (en) 2014-09-23
CN102315142A (zh) 2012-01-11

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