CN102291949A - 多层电路板制作方法 - Google Patents
多层电路板制作方法 Download PDFInfo
- Publication number
- CN102291949A CN102291949A CN2010102031684A CN201010203168A CN102291949A CN 102291949 A CN102291949 A CN 102291949A CN 2010102031684 A CN2010102031684 A CN 2010102031684A CN 201010203168 A CN201010203168 A CN 201010203168A CN 102291949 A CN102291949 A CN 102291949A
- Authority
- CN
- China
- Prior art keywords
- marginal zone
- copper ring
- copper
- concentric
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010203168.4A CN102291949B (zh) | 2010-06-18 | 2010-06-18 | 多层电路板制作方法 |
US13/095,877 US8302300B2 (en) | 2010-06-18 | 2011-04-28 | Method for manufacturing multilayer printed circuit board with plated through holes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010203168.4A CN102291949B (zh) | 2010-06-18 | 2010-06-18 | 多层电路板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102291949A true CN102291949A (zh) | 2011-12-21 |
CN102291949B CN102291949B (zh) | 2013-08-28 |
Family
ID=45327385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010203168.4A Expired - Fee Related CN102291949B (zh) | 2010-06-18 | 2010-06-18 | 多层电路板制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8302300B2 (zh) |
CN (1) | CN102291949B (zh) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103442530A (zh) * | 2013-09-18 | 2013-12-11 | 胜华电子(惠阳)有限公司 | 一种pcb单边环孔的制作方法 |
CN103747639A (zh) * | 2014-02-13 | 2014-04-23 | 遂宁市广天电子有限公司 | 一种高层板制造方法 |
CN104427792A (zh) * | 2013-09-06 | 2015-03-18 | 欣兴电子股份有限公司 | 多层电路板的制作方法 |
CN104427793A (zh) * | 2013-09-06 | 2015-03-18 | 欣兴电子股份有限公司 | 多层电路板的制作方法 |
CN104582284A (zh) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | 封装基板的制作方法 |
CN106061106A (zh) * | 2016-08-04 | 2016-10-26 | 高德(江苏)电子科技有限公司 | 一种监测各层次内层芯板涨缩匹配度的方法 |
CN104023467B (zh) * | 2014-06-11 | 2017-02-01 | 深圳华麟电路技术有限公司 | 高机械钻孔良率的多层线路板及其制作方法 |
CN106413292A (zh) * | 2016-10-17 | 2017-02-15 | 珠海杰赛科技有限公司 | 优化叠层结构印制板涨缩匹配性的方法及叠层结构印制板 |
CN104053300B (zh) * | 2014-06-11 | 2017-03-01 | 深圳华麟电路技术有限公司 | 软硬多层线路板的定位孔结构及该定位孔的设定方法 |
CN107381494A (zh) * | 2016-05-16 | 2017-11-24 | 神盾股份有限公司 | 指纹感测器及其封装方法 |
CN108401358A (zh) * | 2018-01-24 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | 印制电路板及印制电路板的制作方法 |
CN108471681A (zh) * | 2018-03-16 | 2018-08-31 | 深圳市景旺电子股份有限公司 | 一种内埋电容线路板的制作方法 |
CN110876240A (zh) * | 2018-09-04 | 2020-03-10 | 胜宏科技(惠州)股份有限公司 | 一种检测多层线路板钻孔偏移的方法 |
CN114096065A (zh) * | 2021-11-24 | 2022-02-25 | 胜宏科技(惠州)股份有限公司 | 一种pcb板高精度钻孔文件的生成方法及钻孔方法 |
CN114554698A (zh) * | 2022-03-31 | 2022-05-27 | 深圳市大族数控科技股份有限公司 | Pcb板加工方法、pcb板以及pcb板钻孔方法 |
CN117963453A (zh) * | 2024-03-28 | 2024-05-03 | 江苏冠宇机械设备制造有限公司 | 一种具有测试功能的汽车制造输送线 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5830347B2 (ja) * | 2011-10-25 | 2015-12-09 | 日本特殊陶業株式会社 | 配線基板の製造方法 |
KR102250042B1 (ko) * | 2014-03-17 | 2021-05-11 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102194824B1 (ko) * | 2014-03-17 | 2020-12-24 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
CN105050339A (zh) * | 2015-07-10 | 2015-11-11 | 东莞市科佳电路有限公司 | 一种检测多层印制电路板层间位置偏移的方法 |
US11644501B2 (en) | 2020-09-21 | 2023-05-09 | International Business Machines Corporation | Method for identifying PCB core-layer properties |
CN114190016B (zh) * | 2022-02-16 | 2022-04-22 | 四川英创力电子科技股份有限公司 | 一种精细检测多层电路板层偏的系统及其检测方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03170006A (ja) * | 1989-11-29 | 1991-07-23 | Hitachi Chem Co Ltd | 多層プリント配線板の試験方法 |
JPH06152149A (ja) * | 1992-11-16 | 1994-05-31 | Hitachi Ltd | 多層プリント配線板の穴明け方法 |
JPH09205281A (ja) * | 1996-01-26 | 1997-08-05 | Matsushita Electric Works Ltd | 多層プリント配線板の内層回路パターンずれ検査方法 |
US6000124A (en) * | 1995-11-07 | 1999-12-14 | Seiko Precision Inc. | Method and apparatus for manufacturing multilayer printed circuit board |
JP2001168537A (ja) * | 1999-12-03 | 2001-06-22 | Muraki:Kk | 多層プリント配線板と、その層間ズレの測定方法 |
CN101094565A (zh) * | 1997-12-11 | 2007-12-26 | 伊比登株式会社 | 多层印刷电路板的制造方法 |
CN101106871A (zh) * | 2006-07-10 | 2008-01-16 | 株式会社阿迪泰克工程 | 在用于生产多层印刷电路板的处理中使用的标记设备 |
CN101242711A (zh) * | 2007-02-01 | 2008-08-13 | 松下电器产业株式会社 | 检查标记结构、基板片层叠体及其设计方法、多层电路基板及其层叠一致精度的检查方法 |
CN101662895A (zh) * | 2008-08-25 | 2010-03-03 | 富葵精密组件(深圳)有限公司 | 多层电路板、该电路板的制作方法及其对准度的检测方法 |
Family Cites Families (1)
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US5048178A (en) * | 1990-10-23 | 1991-09-17 | International Business Machines Corp. | Alignment--registration tool for fabricating multi-layer electronic packages |
-
2010
- 2010-06-18 CN CN201010203168.4A patent/CN102291949B/zh not_active Expired - Fee Related
-
2011
- 2011-04-28 US US13/095,877 patent/US8302300B2/en not_active Expired - Fee Related
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03170006A (ja) * | 1989-11-29 | 1991-07-23 | Hitachi Chem Co Ltd | 多層プリント配線板の試験方法 |
JPH06152149A (ja) * | 1992-11-16 | 1994-05-31 | Hitachi Ltd | 多層プリント配線板の穴明け方法 |
US6000124A (en) * | 1995-11-07 | 1999-12-14 | Seiko Precision Inc. | Method and apparatus for manufacturing multilayer printed circuit board |
JPH09205281A (ja) * | 1996-01-26 | 1997-08-05 | Matsushita Electric Works Ltd | 多層プリント配線板の内層回路パターンずれ検査方法 |
CN101094565A (zh) * | 1997-12-11 | 2007-12-26 | 伊比登株式会社 | 多层印刷电路板的制造方法 |
JP2001168537A (ja) * | 1999-12-03 | 2001-06-22 | Muraki:Kk | 多層プリント配線板と、その層間ズレの測定方法 |
CN101106871A (zh) * | 2006-07-10 | 2008-01-16 | 株式会社阿迪泰克工程 | 在用于生产多层印刷电路板的处理中使用的标记设备 |
US20080013679A1 (en) * | 2006-07-10 | 2008-01-17 | Wataru Nakagawa | Marking apparatus used in a process for producing multi-layered printed circuit board |
CN101242711A (zh) * | 2007-02-01 | 2008-08-13 | 松下电器产业株式会社 | 检查标记结构、基板片层叠体及其设计方法、多层电路基板及其层叠一致精度的检查方法 |
CN101662895A (zh) * | 2008-08-25 | 2010-03-03 | 富葵精密组件(深圳)有限公司 | 多层电路板、该电路板的制作方法及其对准度的检测方法 |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104427792B (zh) * | 2013-09-06 | 2017-07-28 | 欣兴电子股份有限公司 | 多层电路板的制作方法 |
CN104427792A (zh) * | 2013-09-06 | 2015-03-18 | 欣兴电子股份有限公司 | 多层电路板的制作方法 |
CN104427793A (zh) * | 2013-09-06 | 2015-03-18 | 欣兴电子股份有限公司 | 多层电路板的制作方法 |
CN104427793B (zh) * | 2013-09-06 | 2017-06-30 | 欣兴电子股份有限公司 | 多层电路板的制作方法 |
CN103442530A (zh) * | 2013-09-18 | 2013-12-11 | 胜华电子(惠阳)有限公司 | 一种pcb单边环孔的制作方法 |
CN103747639A (zh) * | 2014-02-13 | 2014-04-23 | 遂宁市广天电子有限公司 | 一种高层板制造方法 |
CN104023467B (zh) * | 2014-06-11 | 2017-02-01 | 深圳华麟电路技术有限公司 | 高机械钻孔良率的多层线路板及其制作方法 |
CN104053300B (zh) * | 2014-06-11 | 2017-03-01 | 深圳华麟电路技术有限公司 | 软硬多层线路板的定位孔结构及该定位孔的设定方法 |
CN104582284A (zh) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | 封装基板的制作方法 |
CN104582284B (zh) * | 2014-12-31 | 2017-11-10 | 广州兴森快捷电路科技有限公司 | 封装基板的制作方法 |
CN107381494A (zh) * | 2016-05-16 | 2017-11-24 | 神盾股份有限公司 | 指纹感测器及其封装方法 |
CN106061106A (zh) * | 2016-08-04 | 2016-10-26 | 高德(江苏)电子科技有限公司 | 一种监测各层次内层芯板涨缩匹配度的方法 |
CN106061106B (zh) * | 2016-08-04 | 2018-10-12 | 高德(江苏)电子科技有限公司 | 一种监测各层次内层芯板涨缩匹配度的方法 |
CN106413292A (zh) * | 2016-10-17 | 2017-02-15 | 珠海杰赛科技有限公司 | 优化叠层结构印制板涨缩匹配性的方法及叠层结构印制板 |
CN108401358A (zh) * | 2018-01-24 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | 印制电路板及印制电路板的制作方法 |
CN108401358B (zh) * | 2018-01-24 | 2020-06-23 | 广州兴森快捷电路科技有限公司 | 印制电路板及印制电路板的制作方法 |
CN108471681B (zh) * | 2018-03-16 | 2020-05-05 | 深圳市景旺电子股份有限公司 | 一种内埋电容线路板的制作方法 |
CN108471681A (zh) * | 2018-03-16 | 2018-08-31 | 深圳市景旺电子股份有限公司 | 一种内埋电容线路板的制作方法 |
CN110876240A (zh) * | 2018-09-04 | 2020-03-10 | 胜宏科技(惠州)股份有限公司 | 一种检测多层线路板钻孔偏移的方法 |
CN110876240B (zh) * | 2018-09-04 | 2021-07-02 | 胜宏科技(惠州)股份有限公司 | 一种检测多层线路板钻孔偏移的方法 |
CN114096065A (zh) * | 2021-11-24 | 2022-02-25 | 胜宏科技(惠州)股份有限公司 | 一种pcb板高精度钻孔文件的生成方法及钻孔方法 |
CN114554698A (zh) * | 2022-03-31 | 2022-05-27 | 深圳市大族数控科技股份有限公司 | Pcb板加工方法、pcb板以及pcb板钻孔方法 |
CN117963453A (zh) * | 2024-03-28 | 2024-05-03 | 江苏冠宇机械设备制造有限公司 | 一种具有测试功能的汽车制造输送线 |
CN117963453B (zh) * | 2024-03-28 | 2024-06-07 | 江苏冠宇机械设备制造有限公司 | 一种具有测试功能的汽车制造输送线 |
Also Published As
Publication number | Publication date |
---|---|
CN102291949B (zh) | 2013-08-28 |
US8302300B2 (en) | 2012-11-06 |
US20110308082A1 (en) | 2011-12-22 |
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