CN107381494A - 指纹感测器及其封装方法 - Google Patents

指纹感测器及其封装方法 Download PDF

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CN107381494A
CN107381494A CN201610378252.7A CN201610378252A CN107381494A CN 107381494 A CN107381494 A CN 107381494A CN 201610378252 A CN201610378252 A CN 201610378252A CN 107381494 A CN107381494 A CN 107381494A
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dielectric layer
fingerprint sensing
crystal grain
multilayer board
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CN107381494B (zh
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陈品谕
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Egis Technology Inc
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Abstract

本发明提供一种指纹感测器。指纹感测器包括一多层印刷电路板、一指纹感测晶粒以及一模封材料。多层印刷电路板包括一底部介电层、设置在底部介电层上方的至少一中间介电层、设置在中间介电层上方的一顶部介电层与一沟槽。沟槽为挖空部分的中间介电层以及部分的顶部介电层而形成。指纹感测晶粒设置在多层印刷电路板的沟槽内并安装于底部介电层的上表面。指纹感测晶粒包括可感测使用者的指纹信息的一感测阵列。模封材料覆盖指纹感测晶粒，并填满多层印刷电路板的沟槽。当静电放电事件发生时，来自指纹感测器上方的静电放电能量可以通过金属层快速地传递至多层印刷电路板的接地平面，以进行放电，使得静电放电能量不会对指纹感测晶粒造成损坏。

Description

指纹感测器及其封装方法
技术领域
本发明有关于一种指纹感测器，且特别有关于一种指纹感测器及其封装方法。
背景技术
近年来，随着生物辨识技术逐渐成熟，许多不同的生物特征皆可被用来辨识使用者的身份。其中，由于指纹辨识技术的辨识率及准确率较其它生物特征的辨识技术更好，故目前指纹辨识的应用层面较广。例如，手机、平板电脑、个人电脑、电子锁等电子装置可配备指纹辨识功能以辨识使用者的身份。
指纹辨识的技术先感测使用者的指纹图样(pattern)，再撷取指纹图样中独特的指纹特征并储存至存储器中。之后，当使用者再次按压或滑刷指纹时，指纹感测器会感测指纹图样并且撷取指纹特征，以便与先前所储存的指纹特征进行比对以进行辨识。若二者相符，则使用者的身份得以确认。
发明内容
本发明提供一种指纹感测器及其封装方法，以解决指纹感测器上方的静电放电能量对指纹感测晶粒造成损伤的问题。
本发明提供一种指纹感测器。上述指纹感测器包括一多层印刷电路板、一指纹感测晶粒以及一模封材料。上述多层印刷电路板包括一底部介电层、设置在上述底部介电层的上方的至少一中间介电层、设置在上述中间介电层的上方的一顶部介电层，以及一沟槽。上述沟槽为挖空部分的上述中间介电层以及部分的上述顶部介电层而形成。上述指纹感测晶粒设置在上述多层印刷电路板的上述沟槽内，并安装于上述多层印刷电路板的上述底部介电层的上表面。上述指纹感测晶粒包括一感测阵列，用以感测一使用者的指纹信息。上述模封材料覆盖上述指纹感测晶粒，并填满上述多层印刷电路板的上述沟槽。
再者，本发明提供一种指纹感测器的封装方法。对一多层印刷电路板执行一蚀刻工艺，以于上述多层印刷电路板中形成一沟槽，其中上述多层印刷电路板包括一底部介电层、至少一中间介电层以及一顶部介电层。设置一指纹感测晶粒于上述多层印刷电路板的上述沟槽内，并安装上述指纹感测晶粒于上述多层印刷电路板的上述底部介电层的上表面。填入一模封材料于上述多层印刷电路板的上述沟槽内，以覆盖上述指纹感测晶粒并填满上述多层印刷电路板的上述沟槽。
基于上述技术方案，本发明的技术效果在于：
当静电放电事件发生时，来自指纹感测器上方的静电放电能量可以通过金属层快速地传递至多层印刷电路板的接地平面，以进行放电。功能模块的接地端耦接于较大的接地平面，所以能快速地提供放电路径，使得静电放电能量不会对指纹感测晶粒造成损坏。
附图说明
图1为显示根据本发明一实施例所述的电子装置；
图2为显示根据本发明一实施例所述的指纹感测器的封装方法；
图3为显示根据本发明一实施例所述的对多层印刷电路板执行蚀刻工艺的示意图；
图4为显示根据本发明一实施例所述的指纹感测器的上视图；以及
图5为显示沿图4中A-AA剖面线的指纹感测器400的剖面图。
附图标记说明：
100～电子装置；
110～指纹感测器；
120～功能模块；
130～感测阵列；
135～感测单元；
140～处理器；
150～绝缘表面；
300～多层印刷电路板；
310～底部介电层；
320～中间介电层；
330～顶部介电层；
340～沟槽；
400～指纹感测器；
410～指纹感测晶粒；
510～模封材料；
520A、520B～贯穿孔；
530A、530B～导通孔；
540、570、580～金属层；
550～接地平面；以及
590～连结线；
S210-S230～步骤。
具体实施方式
为让本发明的上述和其他目的、特征、和优点能更明显易懂，下文特举出较佳实施例，并配合附图说明书附图，作详细说明如下：
图1为显示根据本发明一实施例所述的电子装置100。电子装置100包括指纹感测器110以及功能模块120。指纹感测器110包括感测阵列130以及绝缘表面150，其中感测阵列130以及绝缘表面150设置在一指纹感测晶粒(die)中。为了简化说明，指纹感测器110内的其他电路(例如读取电路等)将不进一步描述。感测阵列130由多个感测单元135以二维方式排列而成，其中绝缘表面150覆盖于感测阵列130的全部感测单元135之上。此外，在此实施例中，感测阵列130的感测单元135排列成矩形。在此实施例中，功能模块120包括处理器140。根据感测阵列130内感测单元135的感测电压，指纹感测器110可提供手指的指纹信息给功能模块120的处理器140。例如，指纹感测器110会判断是否有使用者的手指接触绝缘表面150的上方，并判断出该感测电压对应于手指的指纹波峰(ridge)或指纹波谷(valley)。接着，根据来自指纹感测器110的手指的指纹信息，处理器140可通过指纹辨识演算法来执行指纹辨识操作。在一实施例中，指纹感测器110以及功能模块120设置在电子装置100的主电路板上。
图2为显示根据本发明一实施例所述的指纹感测器(例如图1的指纹感测器110)的封装方法。首先，在步骤S210，对多层印刷电路板执行蚀刻、激光切割或机械切割工艺，以便在多层印刷电路板中形成沟槽(trench)，其中多层印刷电路由多个介电层所堆叠而形成。此外，上述蚀刻、激光切割或机械切割工艺也可以在形成上述多层印刷电路板之前执行。例如，对多层印刷电路的全部介电层同时执行蚀刻、激光切割或机械切割工艺，或是在进行堆叠时，依序对每一介电层执行蚀刻、激光切割或机械切割工艺。接着，在步骤S220，将指纹感测晶粒设置在多层印刷电路板的沟槽内，以将指纹感测晶粒安装(mount)在多层印刷电路板的底部介电层的上表面，以便将指纹感测晶粒电性连接于底部介电层上的信号路径。为了简化说明，指纹感测晶粒的接脚与多层印刷电路板的接合垫的连接方式将不进一步描述。接着，在步骤S230，填入模封材料(molding compound)于多层印刷电路板的沟槽内，以覆盖指纹感测晶粒并填满沟槽。于是，指纹感测晶粒可固定在多层印刷电路板的沟槽内。值得注意的是，模封材料具有高介电常数(dielectric constant，DK)。在一实施例中，模封材料可以是环氧树脂模封材料(Epoxy molding compound，EMC)，其通过灌模工艺(moldingprocess)而形成于多层印刷电路板的沟槽内。
图3为显示根据本发明一实施例所述的对多层印刷电路板300执行蚀刻工艺(例如图2的步骤S210)的示意图。多层印刷电路板300包括底部介电层310、至少一中间介电层320以及顶部介电层330，其中底部介电层310、中间介电层320与顶部介电层330包括玻璃纤维布(pre-pregnant，PP)材料或是FR-4等级的耐燃材料。如图3所显示，在经过蚀刻工艺之后，多层印刷电路板300的部分的中间介电层320以及部分的顶部介电层330会被挖空，以形成沟槽340。在此实施例中，底部介电层310与顶部介电层330的厚度是相同的。此外，中间介电层320的厚度大于顶部介电层330与底部介电层310的厚度。在一实施例中，多层印刷电路板300具有多个中间介电层320，而中间介电层320的数量可根据信号路径的数量与布局的复杂度而决定。
图4为显示根据本发明一实施例所述的指纹感测器400的上视图。在图4中，移除掉指纹感测器400的模封材料以方便说明，其中指纹感测器400的模封材料将描述于后。指纹感测器400包括指纹感测晶粒410以及多层印刷电路板300。多层印刷电路板300具有沟槽340，而指纹感测晶粒410设置在多层印刷电路板300的沟槽340内。一般来说，指纹感测晶粒410包括感测阵列(例如图1的感测阵列130)、读取模块(未显示)等电路。在指纹感测晶粒410中，在得到感测阵列的感测输出之后，指纹感测晶粒410会判断是否有使用者的手指接触指纹感测器400的感测表面，并进一步得到手指的指纹信息，以便判断出该感测输出对应于手指的指纹波峰或指纹波谷。接着，指纹感测器400会将手指的指纹信息提供给电子装置内的其他电路或模块(例如图1的功能模块120)，以进行后续程序，例如可通过指纹辨识演算法来执行指纹辨识操作等。为了简化说明，印刷电路板300上的其他元件，例如表面粘着元件(surface mount device，SMD)，将不进一步描述。
图5为显示沿图4中A-AA剖面线的指纹感测器400的剖面图。同时参考图4与图5，指纹感测晶粒410安装于多层印刷电路板300。如先前所描述，多层印刷电路板300包括底部介电层310、至少一中间介电层320以及顶部介电层330。此外，沟槽340通过蚀刻工艺而将部分的中间介电层320与部分的顶部介电层330挖空而形成。在一实施例中，中间介电层320为核心绝缘体(core insulator)。指纹感测晶粒410设置在底部介电层310的上表面，并可通过连结线(bonding wire)590或是焊球而电性连接于位在底部介电层310的上表面的信号路径(例如由金属层570所形成)，以便通过底部介电层310的上表面的信号路径、多个导通孔(via)530A与530B以及底部介电层310的下表面的信号路径(例如由金属层580所形成)而将感测到的手指的指纹信息提供给其他模块(例如功能模块)或电路，以进行后续程序。值得注意的是，在多层印刷电路板300中，指纹感测晶粒410与底部介电层310之间的信号路径的连接关可根据实际应用而决定。此外，在底部介电层310的上表面以及下表面皆可通过相对应的金属层(例如金属层570或580)来形成信号路径。再者，根据实际应用，设置在底部介电层310的上表面的信号路径可通过底部介电层310的导通孔(例如导通孔530A或530B)而电性连接于设置在底部介电层310的下表面的信号路径。
在图5中，模封材料510会完全地覆盖指纹感测晶粒410，并填满沟槽340。此外，模封材料510会直接接触于底部介电层310、中间介电层320以及顶部介电层330。值得注意的是，模封材料510的上表面与顶部介电层330的上表面共平面的。此外，模封材料510的下表面与中间介电层320的下表面共平面的。由于部分的中间介电层320以及部分的顶部介电层330被挖空，所以中间介电层320以及顶部介电层330的面积会小于底部介电层310的面积。此外，中间介电层320以及顶部介电层330具有相同的面积。金属层540设置在顶部介电层330的上表面，其中金属层540完全或部分地覆盖顶部介电层330的上表面。于是，金属层540会围绕模封材料510。此外，金属层540可通过设置在多层印刷电路板300的多个贯穿孔(through holes)520A及520B而耦接于设置在底部介电层310的下表面的接地平面550。在此实施例中，接地平面550会耦接于电子装置中的接地端。为了简化说明，多层印刷电路板300的阻焊层(solder resist，SR)的设置方式将不进一步描述。
当静电放电事件发生时，来自指纹感测器400上方的静电放电能量EESD可以通过金属层540快速地传递至多层印刷电路板300的接地平面550，以进行放电。举例来说，当静电放电能量EESD释放到金属层540上(如标号560所显示)时，静电放电能量EESD会通过金属层540传递至最接近的贯穿孔520B，而放电至多层印刷电路板300的接地平面550。于是，静电放电能量可通过金属层540、贯穿孔520B以及接地平面550所形成的放电路径而传递到电子装置中功能模块(例如图1的功能模块120)的接地端，其中该放电路径不会经过指纹感测晶粒410。在电子装置中，功能模块的接地端耦接于较大的接地平面，所以能快速地提供放电路径，使得静电放电能量EESD不会对指纹感测晶粒410造成损坏。此外，相较于需要额外使用放电环(例如导电条)的传统指纹感测器，通过在多层印刷电路板300上设置金属层540，可降低制造成本。一般而言，印刷电路板上的金属层由铝、铜等金属所形成。再者，相应于多层印刷电路板300的沟槽的形状与尺寸，金属层540的形状以及数量可适当地调整。值得注意的是，贯穿孔520A与520B的数量以及位置可根据不同应用而决定。除了提供放电路径之外，耦接于接地平面550的金属层540亦可提高指纹感测器400的抗干扰能力。
虽然本发明已以较佳实施例公开如上，然其并非用以限定本发明，任何所属技术领域中包括通常知识者，在不脱离本发明的精神和范围内，当可作些许的变动与润饰，因此本发明的保护范围当视所附的权利要求所界定者为准。

Claims (20)

1.一种指纹感测器，其特征在于，包括：
一多层印刷电路板，包括：
一底部介电层；
至少一中间介电层，设置在上述底部介电层的上方；
一顶部介电层，设置在上述中间介电层的上方；以及
一沟槽，其中上述沟槽为挖空部分的上述中间介电层以及部分的上述顶部介电层而形成；
一指纹感测晶粒，设置在上述多层印刷电路板的上述沟槽内，并安装于上述多层印刷电路板的上述底部介电层的上表面，包括：
一感测阵列，用以感测一使用者的指纹信息；
一模封材料，覆盖上述指纹感测晶粒，并填满上述多层印刷电路板的上述沟槽。
2.如权利要求1所述的指纹感测器，其特征在于，上述模封材料的上表面与上述顶部介电层的上表面共平面。
3.如权利要求1所述的指纹感测器，其特征在于，上述模封材料的下表面与上述中间介电层的下表面共平面。
4.如权利要求2所述的指纹感测器，其特征在于，上述顶部介电层以及上述中间介电层具有相同的面积。
5.如权利要求4所述的指纹感测器，其特征在于，上述底部介电层的面积大于上述顶部介电层的面积。
6.如权利要求1所述的指纹感测器，其特征在于，上述多层印刷电路板还包括：
一第一金属层，设置在上述顶部介电层的上表面；
一接地平面，设置在上述底部介电层的下表面；以及
多个贯穿孔，贯穿上述顶部介电层、上述中间介电层以及上述底部介电层，
其中上述第一金属层通过上述贯穿孔而电性连接于上述接地平面。
7.如权利要求6所述的指纹感测器，其特征在于，当一静电放电事件发生时，一静电放电能量从上述第一金属层通过上述贯穿孔而放电至上述接地平面，且不通过上述指纹感测晶粒。
8.如权利要求1所述的指纹感测器，其特征在于，上述多层印刷电路板还包括：
一第二金属层，设置在上述底部介电层的上表面，并电性连接于上述指纹感测晶粒；
一第三金属层，设置在上述底部介电层的下表面；以及
多个导通孔，设置于上述底部介电层中，
其中上述第二金属层通过上述导通孔电性连接于上述第三金属层，以便传送来自上述指纹感测晶粒的上述使用者的指纹信息至一功能模块。
9.如权利要求1所述的指纹感测器，其特征在于，上述模封材料具有高介电常数。
10.如权利要求1所述的指纹感测器，其特征在于，上述中间介电层的厚度大于上述顶部介电层以及上述底部介电层的厚度。
11.一种指纹感测器的封装方法，其特征在于，包括：
对一多层印刷电路板执行一蚀刻工艺，以于上述多层印刷电路板中形成一沟槽，其中上述多层印刷电路板包括一底部介电层、至少一中间介电层以及一顶部介电层；
设置一指纹感测晶粒于上述多层印刷电路板的上述沟槽内，并安装上述指纹感测晶粒于上述多层印刷电路板的上述底部介电层的上表面；以及
填入一模封材料于上述多层印刷电路板的上述沟槽内，以覆盖上述指纹感测晶粒并填满上述多层印刷电路板的上述沟槽。
12.如权利要求11所述的封装方法，其特征在于，上述模封材料的上表面与上述顶部介电层的上表面共平面。
13.如权利要求11所述的封装方法，其特征在于，上述模封材料的下表面与上述中间介电层的下表面共平面。
14.如权利要求11所述的封装方法，其特征在于，上述顶部介电层以及上述中间介电层具有相同的面积。
15.如权利要求14所述的指封装方法，其特征在于，上述底部介电层的面积大于上述顶部介电层的面积。
16.如权利要求11所述的封装方法，其特征在于，上述多层印刷电路板还包括：
一第一金属层，设置在上述顶部介电层的上表面；
一接地平面，设置在上述底部介电层的下表面；以及
多个贯穿孔，贯穿上述顶部介电层、上述中间介电层以及上述底部介电层，
其中上述第一金属层通过上述贯穿孔而电性连接于上述接地平面。
17.如权利要求16所述的封装方法，其特征在于，当一静电放电事件发生时，一静电放电能量从上述第一金属层通过上述贯穿孔而放电至上述接地平面，且不通过上述指纹感测晶粒。
18.如权利要求11所述的封装方法，其特征在于，上述多层印刷电路板还包括：
一第二金属层，设置在上述底部介电层的上表面，并电性连接于上述指纹感测晶粒；
一第三金属层，设置在上述底部介电层的下表面；以及
多个导通孔，设置于上述底部介电层中，
其中上述第二金属层通过上述导通孔电性连接于上述第三金属层，以便传送来自上述指纹感测晶粒的上述使用者的指纹信息至一功能模块。
19.如权利要求11所述的封装方法，其特征在于，上述模封材料具有高介电常数。
20.如权利要求11所述的封装方法，其特征在于，上述中间介电层的厚度大于上述顶部介电层以及上述底部介电层的厚度。
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