TWI584418B - 指紋感測器及其封裝方法 - Google Patents

指紋感測器及其封裝方法 Download PDF

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Publication number
TWI584418B
TWI584418B TW105115027A TW105115027A TWI584418B TW I584418 B TWI584418 B TW I584418B TW 105115027 A TW105115027 A TW 105115027A TW 105115027 A TW105115027 A TW 105115027A TW I584418 B TWI584418 B TW I584418B
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Taiwan
Prior art keywords
dielectric layer
printed circuit
fingerprint
circuit board
multilayer printed
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TW105115027A
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English (en)
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TW201742195A (zh
Inventor
Pin Yu Chen
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Egis Tech Inc
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Application filed by Egis Tech Inc filed Critical Egis Tech Inc
Priority to TW105115027A priority Critical patent/TWI584418B/zh
Priority to CN201610378252.7A priority patent/CN107381494B/zh
Priority to US15/212,116 priority patent/US9875387B2/en
Priority to KR1020160105893A priority patent/KR101834461B1/ko
Application granted granted Critical
Publication of TWI584418B publication Critical patent/TWI584418B/zh
Publication of TW201742195A publication Critical patent/TW201742195A/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
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Description

指紋感測器及其封裝方法
本發明有關於一種指紋感測器，且特別有關於一種指紋感測器的封裝結構及其封裝方法。
近年來，隨著生物辨識技術逐漸成熟，許多不同的生物特徵皆可被用來辨識使用者的身分。其中，由於指紋辨識技術之辨識率及準確率較其它生物特徵之辨識技術更好，故目前指紋辨識之應用層面較廣。例如，手機、平板電腦、個人電腦、電子鎖等電子裝置可配備指紋辨識功能以辨識使用者的身分。
指紋辨識之技術係先感測使用者的指紋圖樣(pattern)，再擷取指紋圖樣中獨特的指紋特徵並儲存至記憶體中。之後，當使用者再次按壓或滑刷指紋時，指紋感測器會感測指紋圖樣並且擷取指紋特徵，以便與先前所儲存之指紋特徵進行比對以進行辨識。若二者相符，則使用者之身分得以確認。
本發明提供一種指紋感測器。上述指紋感測器包括一多層印刷電路板、一指紋感測晶粒以及一模封材料。上述多層印刷電路板包括一底部介電層、設置在上述底部介電層之 上方的至少一中間介電層、設置在上述中間介電層之上方的一頂部介電層，以及一溝槽。上述溝槽係挖空部分之上述中間介電層以及部分之上述頂部介電層而形成。上述指紋感測晶粒係設置在上述多層印刷電路板之上述溝槽內，並安裝於上述多層印刷電路板之上述底部介電層之上表面。上述指紋感測晶粒包括一感測陣列，用以感測一使用者之指紋資訊。上述模封材料係覆蓋上述指紋感測晶粒，並填滿上述多層印刷電路板之上述溝槽。
再者，本發明提供一種指紋感測器的封裝方法。對一多層印刷電路板執行一蝕刻製程，以於上述多層印刷電路板中形成一溝槽，其中上述多層印刷電路板包括一底部介電層、至少一中間介電層以及一頂部介電層。設置一指紋感測晶粒於上述多層印刷電路板之上述溝槽內，並安裝上述指紋感測晶粒於上述多層印刷電路板之上述底部介電層之上表面。填入一模封材料於上述多層印刷電路板之上述溝槽內，以覆蓋上述指紋感測晶粒並填滿上述多層印刷電路板之上述溝槽。
100‧‧‧電子裝置
110‧‧‧指紋感測器
120‧‧‧功能模組
130‧‧‧感測陣列
135‧‧‧感測單元
140‧‧‧處理器
150‧‧‧絕緣表面
300‧‧‧多層印刷電路板
310‧‧‧底部介電層
320‧‧‧中間介電層
330‧‧‧頂部介電層
340‧‧‧溝槽
400‧‧‧指紋感測器
410‧‧‧指紋感測晶粒
510‧‧‧模封材料
520A、520B‧‧‧貫穿孔
530A、530B‧‧‧導通孔
540、570、580‧‧‧金屬層
550‧‧‧接地平面
590‧‧‧連結線
S210-S230‧‧‧步驟
第1圖係顯示根據本發明一實施例所述之電子裝置；第2圖係顯示根據本發明一實施例所述之指紋感測器之封裝方法；第3圖係顯示根據本發明一實施例所述之對多層印刷電路板執行蝕刻製程之示意圖；第4圖係顯示根據本發明一實施例所述之指紋感測器的上 視圖；以及第5圖係顯示沿第4圖中A-AA剖面線之指紋感測器400的剖面圖。
為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂，下文特舉出較佳實施例，並配合所附圖式，作詳細說明如下：第1圖係顯示根據本發明一實施例所述之電子裝置100。電子裝置100包括指紋感測器110以及功能模組120。指紋感測器110包括感測陣列130以及絕緣表面150，其中感測陣列130以及絕緣表面150係設置在一指紋感測晶粒(die)中。為了簡化說明，指紋感測器110內的其他電路(例如讀取電路等)將不進一步描述。感測陣列130係由複數感測單元135以二維方式排列而成，其中絕緣表面150係覆蓋於感測陣列130的全部感測單元135之上。此外，在此實施例中，感測陣列130的感測單元135係排列成矩形。在此實施例中，功能模組120包括處理器140。根據感測陣列130內感測單元135之感測電壓，指紋感測器110可提供手指之指紋資訊給功能模組120的處理器140。例如，指紋感測器110會判斷是否有使用者之手指接觸絕緣表面150的上方，並判斷出該感測電壓係對應於手指之指紋波峰(ridge)或指紋波谷(valley)。接著，根據來自指紋感測器110之手指的指紋資訊，處理器140可經由指紋辨識演算法來執行指紋辨識操作。在一實施例中，指紋感測器110以及功能模組120係設置在電子裝置100的主電路板上。
第2圖係顯示根據本發明一實施例所述之指紋感測器(例如第1圖之指紋感測器110)之封裝方法。首先，在步驟S210，對多層印刷電路板執行蝕刻、雷射切割或機械切割製程，以便在多層印刷電路板中形成溝槽(trench)，其中多層印刷電路係由複數介電層所堆疊而形成。此外，上述蝕刻、雷射切割或機械切割製程也可以係在形成上述多層印刷電路板之前執行。例如，對多層印刷電路的全部介電層同時執行蝕刻、雷射切割或機械切割製程，或是在進行堆疊時，依序對每一介電層執行蝕刻、雷射切割或機械切割製程。接著，在步驟S220，將指紋感測晶粒設置在多層印刷電路板的溝槽內，以將指紋感測晶粒安裝(mount)在多層印刷電路板之底部介電層之上表面，以便將指紋感測晶粒電性連接於底部介電層上之信號路徑。為了簡化說明，指紋感測晶粒之接腳與多層印刷電路板之接合墊的連接方式將不進一步描述。接著，在步驟S230，填入模封材料(molding compound)於多層印刷電路板之溝槽內，以覆蓋指紋感測晶粒並填滿溝槽。於是，指紋感測晶粒可固定在多層印刷電路板的溝槽內。值得注意的是，模封材料係具有高介電常數(dielectric constant，DK)。在一實施例中，模封材料可以是環氧樹脂模封材料(Epoxy molding compound，EMC)，其係經由灌模製程(molding process)而形成於多層印刷電路板之溝槽內。
第3圖係顯示根據本發明一實施例所述之對多層印刷電路板300執行蝕刻製程(例如第2圖之步驟S210)之示意圖。多層印刷電路板300包括底部介電層310、至少一中間介電 層320以及頂部介電層330，其中底部介電層310、中間介電層320與頂部介電層330包括玻璃纖維布(pre-pregnant，PP)材料或是FR-4等級之耐燃材料。如第3圖所顯示，在經過蝕刻製程之後，多層印刷電路板300的部分的中間介電層320以及部分的頂部介電層330會被挖空，以形成溝槽340。在此實施例中，底部介電層310與頂部介電層330的厚度是相同的。此外，中間介電層320的厚度係大於頂部介電層330與底部介電層310的厚度。在一實施例中，多層印刷電路板300具有複數中間介電層320，而中間介電層320的數量可根據信號路徑的數量與佈局之複雜度而決定。
第4圖係顯示根據本發明一實施例所述之指紋感測器400的上視圖。在第4圖中，移除掉指紋感測器400的模封材料以方便說明，其中指紋感測器400的模封材料將描述於後。指紋感測器400包括指紋感測晶粒410以及多層印刷電路板300。多層印刷電路板300具有溝槽340，而指紋感測晶粒410係設置在多層印刷電路板300的溝槽340內。一般來說，指紋感測晶粒410包括感測陣列(例如第1圖之感測陣列130)、讀取模組(未顯示)等電路。在指紋感測晶粒410中，在得到感測陣列之感測輸出之後，指紋感測晶粒410會判斷是否有使用者之手指接觸指紋感測器400之感測表面，並進一步得到手指之指紋資訊，以便判斷出該感測輸出係對應於手指之指紋波峰或指紋波谷。接著，指紋感測器400會將手指之指紋資訊提供給電子裝置內的其他電路或模組(例如第1圖之功能模組120)，以進行後續程序，例如可經由指紋辨識演算法來執行指紋辨識操作 等。為了簡化說明，印刷電路板300上的其他元件，例如表面黏著元件(surface mount device，SMD)，將不進一步描述。
第5圖係顯示沿第4圖中A-AA剖面線之指紋感測器400的剖面圖。同時參考第4圖與第5圖，指紋感測晶粒410係安裝於多層印刷電路板300。如先前所描述，多層印刷電路板300包括底部介電層310、至少一中間介電層320以及頂部介電層330。此外，溝槽340係透過蝕刻製程而將部分之中間介電層320與部分之頂部介電層330挖空而形成。在一實施例中，中間介電層320為核心絕緣體(core insulator)。指紋感測晶粒410係設置在底部介電層310的上表面，並可透過連結線(bonding wire)590或是焊球而電性連接於位在底部介電層310之上表面的信號路徑(例如由金屬層570所形成)，以便透過底部介電層310之上表面的信號路徑、複數導通孔(via)530A與530B以及底部介電層310之下表面的信號路徑(例如由金屬層580所形成)而將感測到之手指的指紋資訊提供給其他模組(例如功能模組)或電路，以進行後續程序。值得注意的是，在多層印刷電路板300中，指紋感測晶粒410與底部介電層310之間的信號路徑之連接關係可根據實際應用而決定。此外，在底部介電層310之上表面以及下表面皆可透過相對應之金屬層(例如金屬層570或580)來形成信號路徑。再者，根據實際應用，設置在底部介電層310之上表面的信號路徑可透過底部介電層310之導通孔(例如導通孔530A或530B)而電性連接於設置在底部介電層310之下表面的信號路徑。
在第5圖中，模封材料510會完全地覆蓋指紋感測 晶粒410，並填滿溝槽340。此外，模封材料510會直接接觸於底部介電層310、中間介電層320以及頂部介電層330。值得注意的是，模封材料510的上表面係與頂部介電層330的上表面係共平面的。此外，模封材料510的下表面係與中間介電層320的下表面係共平面的。由於部分的中間介電層320以及部分的頂部介電層330被挖空，所以中間介電層320以及頂部介電層330的面積會小於底部介電層310的面積。此外，中間介電層320以及頂部介電層330具有相同的面積。金屬層540設置在頂部介電層330的上表面，其中金屬層540係完全或部分地覆蓋頂部介電層330的上表面。於是，金屬層540會圍繞模封材料510。此外，金屬層540可經由設置在多層印刷電路板300的複數貫穿孔(through holes)520A及520B而耦接於設置在底部介電層310之下表面的接地平面550。在此實施例中，接地平面550會耦接於電子裝置中的接地端。為了簡化說明，多層印刷電路板300之阻焊層(solder resist，SR)的設置方式將不進一步描述。
當靜電放電事件發生時，來自指紋感測器400上方的靜電放電能量EESD可以經由金屬層540快速地傳遞至多層印刷電路板300的接地平面550，以進行放電。舉例來說，當靜電放電能量EESD釋放到金屬層540上(如標號560所顯示)時，靜電放電能量EESD會經由金屬層540傳遞至最接近的貫穿孔520B，而放電至多層印刷電路板300的接地平面550。於是，靜電放電能量可經由金屬層540、貫穿孔520B以及接地平面550所形成的放電路徑而傳遞到電子裝置中功能模組(例如第1圖之功能模組120)的接地端，其中該放電路徑不會經過指紋感 測晶粒410。在電子裝置中，功能模組的接地端係耦接於較大的接地平面，所以能快速地提供放電路徑，使得靜電放電能量EESD不會對指紋感測晶粒410造成損壞。此外，相較於需要額外使用放電環(例如導電條)的傳統指紋感測器，藉由在多層印刷電路板300上設置金屬層540，可降低製造成本。一般而言，印刷電路板上的金屬層係由鋁、銅等金屬所形成。再者，相應於多層印刷電路板300之溝槽的形狀與尺寸，金屬層540的形狀以及數量可適當地調整。值得注意的是，貫穿孔520A與520B的數量以及位置可根據不同應用而決定。除了提供放電路徑之外，耦接於接地平面550的金屬層540亦可提高指紋感測器400的抗干擾能力。
雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中包括通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
300‧‧‧多層印刷電路板
310‧‧‧底部介電層
320‧‧‧中間介電層
330‧‧‧頂部介電層
400‧‧‧指紋感測器
410‧‧‧指紋感測晶粒
510‧‧‧模封材料
520A、520B‧‧‧貫穿孔
530A、530B‧‧‧導通孔
540、570、580‧‧‧金屬層
550‧‧‧接地平面
590‧‧‧連結線

Claims (20)

  1. 一種指紋感測器，包括：一多層印刷電路板，包括：一底部介電層；至少一中間介電層，設置在上述底部介電層之上方；一頂部介電層，設置在上述中間介電層之上方；以及一溝槽，其中上述溝槽係挖空部分之上述中間介電層以及部分之上述頂部介電層而形成；一指紋感測晶粒，設置在上述多層印刷電路板之上述溝槽內，並安裝於上述多層印刷電路板之上述底部介電層之上表面，包括：一感測陣列，用以感測一使用者之指紋資訊；以及一模封材料，覆蓋上述指紋感測晶粒，並填滿上述多層印刷電路板之上述溝槽。
  2. 如申請專利範圍第1項所述之指紋感測器，其中上述模封材料的上表面係與上述頂部介電層之上表面係共平面。
  3. 如申請專利範圍第1項所述之指紋感測器，其中上述模封材料的下表面係與上述中間介電層之下表面係共平面。
  4. 如申請專利範圍第2項所述之指紋感測器，其中上述頂部介電層以及上述中間介電層具有相同的面積。
  5. 如申請專利範圍第4項所述之指紋感測器，其中上述底部介電層的面積係大於上述頂部介電層的面積。
  6. 如申請專利範圍第1項所述之指紋感測器，其中上述多層印刷電路板更包括： 一第一金屬層，設置在上述頂部介電層之上表面；一接地平面，設置在上述底部介電層之下表面；以及複數貫穿孔，貫穿上述頂部介電層、上述中間介電層以及上述底部介電層，其中上述第一金屬層係經由上述貫穿孔而電性連接於上述接地平面。
  7. 如申請專利範圍第6項所述之指紋感測器，其中當一靜電放電事件發生時，一靜電放電能量係從上述第一金屬層經由上述貫穿孔而放電至上述接地平面，且不通過上述指紋感測晶粒。
  8. 如申請專利範圍第1項所述之指紋感測器，其中上述多層印刷電路板更包括：一第二金屬層，設置在上述底部介電層之上表面，並電性連接於上述指紋感測晶粒；一第三金屬層，設置在上述底部介電層之下表面；以及複數導通孔，設置於上述底部介電層中，其中上述第二金屬層係經由上述導通孔電性連接於上述第三金屬層，以便傳送來自上述指紋感測晶粒之上述使用者之指紋資訊至一功能模組。
  9. 如申請專利範圍第1項所述之指紋感測器，其中上述模封材料具有高介電常數。
  10. 如申請專利範圍第1項所述之指紋感測器，其中上述中間介電層的厚度係大於上述頂部介電層以及上述底部介電層的厚度。
  11. 一種指紋感測器的封裝方法，包括：對一多層印刷電路板執行一蝕刻製程，以於上述多層印刷電路板中形成一溝槽，其中上述多層印刷電路板包括一底部介電層、至少一中間介電層以及一頂部介電層；設置一指紋感測晶粒於上述多層印刷電路板之上述溝槽內，並安裝上述指紋感測晶粒於上述多層印刷電路板之上述底部介電層之上表面；以及填入一模封材料於上述多層印刷電路板之上述溝槽內，以覆蓋上述指紋感測晶粒並填滿上述多層印刷電路板之上述溝槽。
  12. 如申請專利範圍第11項所述之封裝方法，其中上述模封材料的上表面係與上述頂部介電層之上表面係共平面。
  13. 如申請專利範圍第11項所述之封裝方法，其中上述模封材料的下表面係與上述中間介電層之下表面係共平面。
  14. 如申請專利範圍第11項所述之封裝方法，其中上述頂部介電層以及上述中間介電層具有相同的面積。
  15. 如申請專利範圍第14項所述之指封裝方法，其中上述底部介電層的面積係大於上述頂部介電層的面積。
  16. 如申請專利範圍第11項所述之封裝方法，其中上述多層印刷電路板更包括：一第一金屬層，設置在上述頂部介電層之上表面；一接地平面，設置在上述底部介電層之下表面；以及複數貫穿孔，貫穿上述頂部介電層、上述中間介電層以及上述底部介電層， 其中上述第一金屬層係經由上述貫穿孔而電性連接於上述接地平面。
  17. 如申請專利範圍第16項所述之封裝方法，其中當一靜電放電事件發生時，一靜電放電能量係從上述第一金屬層經由上述貫穿孔而放電至上述接地平面，且不通過上述指紋感測晶粒。
  18. 如申請專利範圍第11項所述之封裝方法，其中上述多層印刷電路板更包括：一第二金屬層，設置在上述底部介電層之上表面，並電性連接於上述指紋感測晶粒；一第三金屬層，設置在上述底部介電層之下表面；以及複數導通孔，設置於上述底部介電層中，其中上述第二金屬層係經由上述導通孔電性連接於上述第三金屬層，以便傳送來自上述指紋感測晶粒之上述使用者之指紋資訊至一功能模組。
  19. 如申請專利範圍第11項所述之封裝方法，其中上述模封材料具有高介電常數。
  20. 如申請專利範圍第11項所述之封裝方法，其中上述中間介電層的厚度係大於上述頂部介電層以及上述底部介電層的厚度。
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