CN108962868B - 封装结构及其制法 - Google Patents

封装结构及其制法 Download PDF

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Publication number
CN108962868B
CN108962868B CN201710377478.XA CN201710377478A CN108962868B CN 108962868 B CN108962868 B CN 108962868B CN 201710377478 A CN201710377478 A CN 201710377478A CN 108962868 B CN108962868 B CN 108962868B
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conductive
layer
carrier
conductive element
electronic
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CN108962868A (zh
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唐绍祖
叶嘉峰
刘易轩
陈美琪
蔡瀛洲
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Siliconware Precision Industries Co Ltd
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Siliconware Precision Industries Co Ltd
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Priority to CN201710377478.XA priority Critical patent/CN108962868B/zh
Priority to US15/720,552 priority patent/US10872847B2/en
Publication of CN108962868A publication Critical patent/CN108962868A/zh
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Priority to US17/096,359 priority patent/US11404361B2/en
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Abstract

一种封装结构及其制法，于承载件上设置如感测芯片的电子元件与如焊线的导电元件，且以封装层包覆该电子元件与该导电元件，再以导电层电性连接该电子元件与该导电元件，使该电子元件可藉由该导电层与该导电元件电性连接至该承载件，俾利用现有封装技术制程即可完成感测芯片的封装，以降低生产成本与缩短生产时间及提高生产良率。

Description

封装结构及其制法
技术领域
本发明有关一种半导体封装结构，尤指一种感测式封装结构。
背景技术
随着消费者对于隐私的注重程度提升，诸多高阶电子产品皆已装载使用者辨识系统，以增加电子产品中资料的安全性，因此辨识系统的研发与设计也随着消费者需求成为电子产业开发的方向。
于生物辨识系统(biometric)中，依据辨识标的的不同可概括分为生理特征(如，指纹、瞳孔、人脸、声纹)与行为特征(如，签名、语音)两种类型的生物辨识系统，其中，辨识生理特征的生物辨识系统具有单一性、防伪程度高与便利等优点，因此广为消费者所接受。
此外，由于高阶电子产品皆朝往轻、薄、短、小等高集积度方向发展，因此所装载的生物辨识装置多为指纹辨识装置或人脸辨识装置，其中又以指纹辨识装置最广泛被使用，藉以达到使该电子产品达到轻薄短小的目的。现有指纹辨识装置中，依据指纹的扫描方式分为扫描指纹图案的光学指纹辨识装置以及侦测指纹纹路中的微量电荷的硅晶指纹辨识装置。
如图1所示，悉知指纹感测(fingerprint sensor)封装结构1于芯片本体10的边缘对应电极垫100处形成多个硅穿孔(Through silicon via，简称TSV)12，再于该些硅穿孔12中形成一导电层14，且该导电层14延伸至该芯片本体10下侧以作为接点，并覆盖绝缘保护层13于该导电层14上以防止该些硅穿孔12之间发生漏电现象，且令该些接点外露于该绝缘保护层13以结合焊锡材15。
然而，悉知指纹感测封装结构1中，该些硅穿孔12需位于该芯片本体10的边缘，而该芯片本体10的边缘的厚度很薄，故容易使该些硅穿孔12发生碎裂(Crack)的问题。
此外，于制作该些硅穿孔12时，需使用昂贵的干蚀刻(DRY Etching)进行穿孔制程，之后还需于硅穿孔12中形成该绝缘保护层13，致使制程繁琐，因而导致制程耗时冗长，且每一制程步骤都可能产生良率损耗，故悉知指纹感测封装结构1的制作不仅制造成本高，且良率不高。
因此，如何克服上述悉知技术的种种问题，实为业界迫切待开发的方向。
发明内容
鉴于上述悉知技术的缺失，本发明提供一种封装结构及其制法，以降低生产成本与缩短生产时间及提高生产良率。
本发明的封装结构，包括：承载件；具感测面的电子元件，其设于该承载件上；至少一导电元件，其设于该承载件上；封装层，其形成于该承载件上以包覆该电子元件与该导电元件，并使该电子元件的感测面与该导电元件的部分表面外露于该封装层；以及导电层，其形成于该封装层上以电性连接该导电元件与该电子元件。
本发明还提供一种封装结构的制法，包括：将一具感测面的电子元件与至少一导电元件设于一承载件上；于该承载件上形成包覆该电子元件与该导电元件的封装层，并使该电子元件的感测面与该导电元件的部分表面外露于该封装层；以及形成导电层于该封装层上，以令该导电层电性连接该导电元件与该电子元件。
前述的封装结构及其制法中，该承载件为线路板或导线架。
前述的封装结构及其制法中，该电子元件为指纹辨识芯片。
前述的封装结构及其制法中，该导电元件为弧形焊线或焊线段。
前述的封装结构及其制法中，该导电元件电性连接该承载件。
前述的封装结构及其制法中，还包括形成开口于该封装层上，以外露出该导电元件的部分表面。
前述的封装结构及其制法中，该承载件具有相对的两侧，其中一侧接置该电子元件、导电元件与封装层，而另一侧具有多个电性连接垫。由上可知，本发明的封装结构及其制法，主要藉由该导电元件取代悉知硅穿孔，使本发明以现有封装技术制程即可完成，而无需进行悉知TSV相关制程，故相较于悉知技术，本发明能降低生产成本，缩短生产时间及提高生产良率。
附图说明
图1为悉知指纹感测封装结构的剖面示意图；
图2A至图2E为本发明的封装结构的制法的剖面示意图；其中，图2C’为对应图2C的立体上视示意图，图2E’为对应图2E的平面上视示意图；以及
图3A至图3C为对应图2E的其它实施例的剖面示意图；其中，图3A’为对应图3A的另一实施例。
符号说明
1,2,3,3’,3” 封装结构
10 芯片本体
100,210 电极垫
12 硅穿孔
13 绝缘保护层
14,24 导电层
15 焊锡材
20,30 承载件
200 黏着层
201 电性连接垫
202 电性接触垫
21 电子元件
21a 感测面
21b 非感测面
22,32 导电元件
22a,22b 端部
23 封装层
23a 第一表面
23b 第二表面
230 开口
25 组层
250 开口区
300 置晶垫
301 导脚
32c 弧顶
9 激光。
具体实施方式
以下藉由特定的具体实例说明本发明的实施方式，熟悉此技艺的人士可由本说明书所揭示的内容轻易地了解本发明的其他优点与功效。本发明也可藉由其他不同的具体实例加以施行或应用，本说明书中的各项细节也可基于不同观点与应用，在不悖离本发明的精神下进行各种修饰与变更。
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供熟悉此技艺的人士的了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。本说明书中所引用的如“上”及、“一”等的用语，也仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2A至图2E为显示本发明的封装结构2的制法的示意图。
如图2A所示，将一电子元件21接置于一承载件20上，并形成至少一导电元件22于该承载件20上。接着，形成一封装层23于该承载件20上，使该封装层23包覆该电子元件21与该导电元件22。
于本实施例中，该承载件20为线路板，如具线路的封装基板或半导体板等，且该电子元件21为感测芯片，例如，用以侦测生物体电荷变化、温度差、压力等的感测芯片，更佳为指纹辨识芯片，该指纹辨识芯片为能藉由感测区所接收的电容差进行生物辨识。例如，该电子元件21具有相对的感测面21a与非感测面21b，其中，该感测面21a具有多个电极垫210，且该电子元件21以该非感测面21b藉由黏着层200(如环氧树脂膜)黏结至该承载件20。
此外，该承载件20的上侧与下侧具有多个电性连接垫201与电性接触垫202，该下侧的电性接触垫202用以外接如电路板、封装件或其它组件的电子装置(图略)，且该导电元件22为接触地结合至该承载件20的上侧的电性连接垫201上，使该导电元件22电性连接该承载件20，且该导电元件22为打线方式所用的焊线段，以令该焊线段的其中一端部22a结合至该承载件20的电性连接垫201上，其中，至少一该电性连接垫201的电性为接地，以于后续使用时，将静电经由该承载件20的内部线路(图未示)及该下侧电性接触垫202传导至后续制程设于该承载件20下侧的电路板(图未示)。
又，藉由模压(molding)成型制程，以形成该封装层23于该承载件20上，使该封装层23包覆该些电子元件21与该导电元件22，且该封装层23定义有相对的第一表面23a与第二表面23b，其中，该第一表面23a结合至该承载件20上，且该电子元件21的感测面21a外露于该第二表面23b，例如，该电子元件21的感测面21a齐平该第二表面23b。具体地，于模压成型制程中，可先于上方模具贴附一层薄膜(Film)，以遮盖该电极垫210，藉此防止该封装层23遮盖该电极垫210，待灌模作业后，移除上方模具以显露该电极垫210。
如图2B所示，形成至少一开口230于该封装层23的第二表面23b上，以令该导电元件22的另一端部22b外露于该开口230。
于本实施例中，由于该封装层23已硬化，故以激光方式形成该开口230，且因该电子元件21为指纹辨识芯片型式，其电极垫210数量不多(如18个)，故以激光方式开出成本低，且耗时短。须注意，若以蚀刻液蚀刻已硬化的封装层23，不仅难度高，且需使用特定光罩图案及其相关制程(如曝光显影等)，故不符合成本。
如图2C所示，形成一阻层25于该封装层23的部分第二表面23b与该电子元件21的部分感测面21a上，且该阻层25形成有至少一开口区250以外露出该开口230、电极垫210及该开口230与该电极垫210两者之间的区域。
于本实施例中，如图2C’所示，是以激光9方式烧灼该阻层25以形成该开口区250。
如图2D所示，形成一导电层24于该开口区250中，以令该导电层24电性连接该导电元件22与该电子元件21的电极垫210。
于本实施例中，该电子元件21藉由该导电层24与该导电元件22电性连接该承载件20。具体地，该导电层24形成于该开口230中以接触该导电元件22的端部22b。
此外，也可以电镀、溅镀或沉积金属材等方式形成该导电层24，例如，形成该导电层24的构造包含不锈钢/铜/不锈钢。应可理解地，可将导电胶(如银胶)填入该开口区250中并加热固化以作为该导电层24。
又，该导电层24由该开口230中延伸至该封装层23的第二表面23b上，以透过该导电层24藉由该导电元件22接地至该承载件20，而能传导手指按压指纹感测器时的静电。应可理解地，该导电层24也可填满该开口230。
如图2E及图2E’所示，移除该阻层25，以完成该封装结构2的制作。
于另一实施例中，该导电元件32也可为弧形焊线，如图3A所示，使该导电层24接触该导电元件32的弧顶32c；或者，使用较强的激光形成该开口230时，一并烧断该导电元件32，使该导电元件32呈现两线段，且各该线段的端点外露于该开口230以接触该导电层24。应可理解地，该导电元件22,32也可为包含焊锡材料、铜材等的凸块(bump)、金属柱或金属框架。
此外，于其它实施例中，如图3B及图3C所示，该承载件30可为导线架，其包含置晶垫300与多个导脚301，使该电子元件21设于该置晶垫300上，且该导电元件22,32设于该些导脚301上。应可理解地，该些导脚301外露于该封装层23的方式可依产品需求作调整，如图3B所示的缺口方式、如图3C所示的平整方式或其它方式，并无特别限制。
本发明的制法以现有封装技术制程即可完成，而无需进行悉知TSV相关制程(如干蚀刻、孔洞绝缘、多次光阻等)，也就是以该导电元件22,32取代悉知硅穿孔，故相较于悉知技术，本发明的制法能降低生产成本，缩短生产时间及提高生产良率。
此外，该导电元件22,32及导电层24采用现有设备所制成的元件，故无需额外特制元件，因而能降低制作成本。
又，应可理解地，该导电元件22,32的部分表面也可齐平该封装层23的第二表面23b，以令该导电元件22,32外露于该封装层23的第二表面23b。
本发明提供一种封装结构2,3,3’,3”，包括：一承载件20,30、一具感测面21a的电子元件21、至少一导电元件22,32、一封装层23以及导电层24。
所述的电子元件21设于该承载件20上。
所述的导电元件22,32设于该承载件20上并电性连接该承载件20。
所述的封装层23形成于该承载件20上以包覆该电子元件21与与该导电元件22,32，并使该电子元件21的感测面21a与该导电元件22,32的部分表面(端部22b或弧顶32c)外露于该封装层23。
所述的导电层24形成于该封装层23上以电性连接该导电元件22,32与该电子元件21。
于一实施例中，该承载件20,30为线路板或导线架。
于一实施例中，该电子元件21为指纹辨识芯片。
于一实施例中，该导电元件22,32为弧形焊线或焊线段。
于一实施例中，该封装层23形成有外露该导电元件22,32的部分表面(端部22b或弧顶32c)的开口230。
于一实施例中，该承载件20具有相对的两侧，其中一侧接置该电子元件21、导电元件22,32与封装层23，而另一侧具有多个电性接触垫202。
综上所述，本发明的封装结构及其制法中，藉由导电元件取代悉知硅穿孔，使本发明以现有封装技术制程即可完成，而无需进行悉知TSV相关制程，故本发明能降低生产成本，缩短生产时间及提高生产良率。
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟习此项技艺的人士均可在不违背本发明的精神及范畴下，对上述实施例进行修饰与改变。因此，本发明的权利保护范围，应如权利要求书所列。

Claims (12)

1.一种封装结构，其特征为，该封装结构包括：
承载件；
具感测面的电子元件，其设于该承载件上；
至少一导电元件，其设于该承载件上；
封装层，其形成于该承载件上以包覆该电子元件与该导电元件，使该电子元件的感测面外露于该封装层，该封装层上形成有开口，使该导电元件的部分表面外露于该开口；以及
导电层，其形成于该封装层上、该电子元件上及该开口中，以电性连接该导电元件与该电子元件。
2.根据权利要求1所述的封装结构，其特征为，该承载件为线路板或导线架。
3.根据权利要求1所述的封装结构，其特征为，该电子元件为指纹辨识芯片。
4.根据权利要求1所述的封装结构，其特征为，该导电元件为弧形焊线或焊线段。
5.根据权利要求1所述的封装结构，其特征为，该导电元件电性连接该承载件。
6.根据权利要求1所述的封装结构，其特征为，该承载件具有相对的两侧，其中一侧接置该电子元件、导电元件与封装层，而另一侧具有多个电性接触垫。
7.一种封装结构的制法，其特征为，该制法包括：
将一具感测面的电子元件与至少一导电元件设于一承载件上；
于该承载件上形成包覆该电子元件与该导电元件的封装层使该电子元件的感测面外露于该封装层，并于该封装层上形成开口，使该导电元件的部分表面外露于该开口；以及
形成导电层于该封装层上、该电子元件上及该开口中，以令该导电层电性连接该导电元件与该电子元件。
8.根据权利要求7所述的封装结构的制法，其特征为，该承载件为线路板或导线架。
9.根据权利要求7所述的封装结构的制法，其特征为，该电子元件为指纹辨识芯片。
10.根据权利要求7所述的封装结构的制法，其特征为，该导电元件为弧形焊线或焊线段。
11.根据权利要求7所述的封装结构的制法，其特征为，该导电元件电性连接该承载件。
12.根据权利要求7所述的封装结构的制法，其特征为，该承载件具有相对的两侧，其中一侧接置该电子元件、导电元件与封装层，而另一侧具有多个电性接触垫。
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