CN102124648A - 压电装置及其制造方法 - Google Patents

压电装置及其制造方法 Download PDF

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Publication number
CN102124648A
CN102124648A CN2009801320324A CN200980132032A CN102124648A CN 102124648 A CN102124648 A CN 102124648A CN 2009801320324 A CN2009801320324 A CN 2009801320324A CN 200980132032 A CN200980132032 A CN 200980132032A CN 102124648 A CN102124648 A CN 102124648A
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CN
China
Prior art keywords
electrode
layer
hole
external electrode
electrode layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801320324A
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English (en)
Chinese (zh)
Inventor
川原浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Publication of CN102124648A publication Critical patent/CN102124648A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN2009801320324A 2008-09-29 2009-09-24 压电装置及其制造方法 Pending CN102124648A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-251180 2008-09-29
JP2008251180A JP4809410B2 (ja) 2008-09-29 2008-09-29 圧電デバイスとその製造方法
PCT/JP2009/004789 WO2010035457A1 (ja) 2008-09-29 2009-09-24 圧電デバイスとその製造方法

Publications (1)

Publication Number Publication Date
CN102124648A true CN102124648A (zh) 2011-07-13

Family

ID=42059470

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801320324A Pending CN102124648A (zh) 2008-09-29 2009-09-24 压电装置及其制造方法

Country Status (6)

Country Link
US (1) US8610337B2 (enExample)
EP (1) EP2343802A4 (enExample)
JP (1) JP4809410B2 (enExample)
CN (1) CN102124648A (enExample)
TW (1) TW201014156A (enExample)
WO (1) WO2010035457A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103259503A (zh) * 2012-02-20 2013-08-21 日本电波工业株式会社 压电振动元件及压电装置
CN103311430A (zh) * 2012-03-15 2013-09-18 日本电波工业株式会社 压电装置以及压电装置的制造方法
CN103828395A (zh) * 2011-09-30 2014-05-28 株式会社村田制作所 超声波传感器
CN104079253A (zh) * 2013-03-29 2014-10-01 精工爱普生株式会社 振动器件、振动器件的制造方法、电子设备、移动体
CN103296196B (zh) * 2012-02-22 2017-03-01 日本电波工业株式会社 压电元件以及压电元件的制造方法
CN107431472A (zh) * 2015-04-27 2017-12-01 株式会社村田制作所 谐振子以及谐振装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4865002B2 (ja) * 2009-04-15 2012-02-01 日本電波工業株式会社 水晶センサー及び感知装置
WO2011136070A1 (ja) * 2010-04-27 2011-11-03 京セラ株式会社 弾性波装置およびその製造方法
TWI424583B (zh) * 2011-07-25 2014-01-21 國立清華大學 薄膜太陽能電池的製造方法
JP5854123B2 (ja) 2012-03-02 2016-02-09 富士通株式会社 水晶振動子及びその製造方法
WO2014027538A1 (ja) * 2012-08-17 2014-02-20 日本碍子株式会社 複合基板，弾性表面波デバイス及び複合基板の製造方法
KR20140118792A (ko) 2013-03-29 2014-10-08 세이코 엡슨 가부시키가이샤 진동 소자, 진동자, 발진기, 전자 기기, 센서, 및 이동체
JP6135296B2 (ja) * 2013-05-20 2017-05-31 富士通株式会社 パッケージ構造及びパッケージ構造を基板に接合する方法
JP6371518B2 (ja) * 2013-12-17 2018-08-08 太陽誘電株式会社 圧電薄膜共振器およびその製造方法、フィルタ並びにデュプレクサ
US10333053B2 (en) * 2014-01-06 2019-06-25 Daishinku Corporation Piezoelectric resonator device, and bonding structure of piezoelectric resonator device and circuit board
WO2016111038A1 (ja) * 2015-01-08 2016-07-14 株式会社村田製作所 圧電振動部品及びその製造方法
US10411181B2 (en) * 2017-05-30 2019-09-10 Metis Design Corporation Electrical via providing electrode pair access on a single side of a device
CN112970195B (zh) * 2019-03-29 2024-03-08 株式会社村田制作所 振子和振子的制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022773A (ja) * 1996-07-03 1998-01-23 Matsushita Electric Ind Co Ltd 振動子とその製造方法
CN1398044A (zh) * 2001-07-12 2003-02-19 株式会社村田制作所 压电元件
US20060158067A1 (en) * 2005-01-14 2006-07-20 Kiyoshi Aratake Surface mount type piezoelectric vibrator, oscillator, electronic device, and radio clock

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0559951U (ja) * 1992-01-09 1993-08-06 株式会社村田製作所 圧電部品
JP3864467B2 (ja) * 1996-10-23 2006-12-27 松下電器産業株式会社 電子部品の製造方法
TW569424B (en) * 2000-03-17 2004-01-01 Matsushita Electric Industrial Co Ltd Module with embedded electric elements and the manufacturing method thereof
JP2002319838A (ja) * 2001-02-19 2002-10-31 Seiko Epson Corp 圧電デバイス及びそのパッケージ
JP2006180169A (ja) * 2004-12-22 2006-07-06 Kyocera Kinseki Corp 振動子パッケージの製造方法
JP4891235B2 (ja) * 2005-06-01 2012-03-07 パナソニック株式会社 回路基板とその製造方法及びこれを用いた電子部品
JP4777745B2 (ja) * 2005-11-01 2011-09-21 セイコーインスツル株式会社 圧電振動子及びこれを備える発振器、電波時計並びに電子機器
JP4906361B2 (ja) 2006-01-27 2012-03-28 三井化学株式会社 無機酸化物超微粒子およびその製造法
JP5007522B2 (ja) * 2006-05-01 2012-08-22 セイコーエプソン株式会社 圧電振動子およびその製造方法
JP2008147895A (ja) * 2006-12-08 2008-06-26 Epson Toyocom Corp 水晶振動子、水晶振動子の製造方法
JP2008211543A (ja) * 2007-02-27 2008-09-11 Epson Toyocom Corp 水晶振動子および水晶振動子の製造方法
JP4647677B2 (ja) * 2008-08-11 2011-03-09 日本電波工業株式会社 圧電デバイス
JP2010141293A (ja) * 2008-11-14 2010-06-24 Seiko Epson Corp 半導体装置及び半導体装置の製造方法
JP4763769B2 (ja) * 2008-12-03 2011-08-31 日本電波工業株式会社 圧電デバイスの製造方法
JP4988799B2 (ja) * 2009-09-16 2012-08-01 日本電波工業株式会社 圧電振動デバイス及び圧電振動デバイスの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022773A (ja) * 1996-07-03 1998-01-23 Matsushita Electric Ind Co Ltd 振動子とその製造方法
CN1398044A (zh) * 2001-07-12 2003-02-19 株式会社村田制作所 压电元件
US20060158067A1 (en) * 2005-01-14 2006-07-20 Kiyoshi Aratake Surface mount type piezoelectric vibrator, oscillator, electronic device, and radio clock

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103828395A (zh) * 2011-09-30 2014-05-28 株式会社村田制作所 超声波传感器
CN103259503A (zh) * 2012-02-20 2013-08-21 日本电波工业株式会社 压电振动元件及压电装置
CN103296196B (zh) * 2012-02-22 2017-03-01 日本电波工业株式会社 压电元件以及压电元件的制造方法
CN103311430A (zh) * 2012-03-15 2013-09-18 日本电波工业株式会社 压电装置以及压电装置的制造方法
CN103311430B (zh) * 2012-03-15 2017-06-09 日本电波工业株式会社 压电装置以及压电装置的制造方法
CN104079253A (zh) * 2013-03-29 2014-10-01 精工爱普生株式会社 振动器件、振动器件的制造方法、电子设备、移动体
CN104079253B (zh) * 2013-03-29 2018-08-17 精工爱普生株式会社 振动器件、振动器件的制造方法、电子设备、移动体
CN107431472A (zh) * 2015-04-27 2017-12-01 株式会社村田制作所 谐振子以及谐振装置
CN107431472B (zh) * 2015-04-27 2020-05-12 株式会社村田制作所 谐振子以及谐振装置

Also Published As

Publication number Publication date
EP2343802A4 (en) 2012-10-17
US8610337B2 (en) 2013-12-17
JP4809410B2 (ja) 2011-11-09
EP2343802A1 (en) 2011-07-13
US20110309720A1 (en) 2011-12-22
JP2010087573A (ja) 2010-04-15
WO2010035457A1 (ja) 2010-04-01
TW201014156A (en) 2010-04-01

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Application publication date: 20110713