CN102105546B - 构件的临时固定/剥离方法及适于其的临时固定用胶粘剂 - Google Patents

构件的临时固定/剥离方法及适于其的临时固定用胶粘剂 Download PDF

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CN102105546B
CN102105546B CN200980128706.3A CN200980128706A CN102105546B CN 102105546 B CN102105546 B CN 102105546B CN 200980128706 A CN200980128706 A CN 200980128706A CN 102105546 B CN102105546 B CN 102105546B
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methyl
fixing
acrylate
component
interim
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CN102105546A (zh
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栗村启之
金井朋之
大岛和宏
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Denka Co Ltd
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Denki Kagaku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
CN200980128706.3A 2008-07-22 2009-07-22 构件的临时固定/剥离方法及适于其的临时固定用胶粘剂 Active CN102105546B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-188295 2008-07-22
JP2008188295 2008-07-22
PCT/JP2009/063119 WO2010010900A1 (ja) 2008-07-22 2009-07-22 部材の仮固定・剥離方法及びそれに好適な仮固定用接着剤

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CN102105546A CN102105546A (zh) 2011-06-22
CN102105546B true CN102105546B (zh) 2016-12-07

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JP (1) JP5675355B2 (ja)
KR (1) KR101660056B1 (ja)
CN (1) CN102105546B (ja)
MY (1) MY162000A (ja)
WO (1) WO2010010900A1 (ja)

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JP5350055B2 (ja) * 2009-04-14 2013-11-27 電気化学工業株式会社 接着剤用（メタ）アクリル系樹脂組成物
JP5674332B2 (ja) * 2010-04-14 2015-02-25 電気化学工業株式会社 接着剤組成物及びそれを用いた部材の仮固定方法
US9227385B2 (en) * 2010-11-19 2016-01-05 Denka Company Limited Method for processing transluscent rigid substrate laminate and method for manufacturing plate shaped product
US9023173B2 (en) 2010-11-30 2015-05-05 Denki Kagaku Kogyo Kabushiki Kaisha Method of processing translucent rigid substrate laminate, and process of manufacturing plate-shaped product employing the method
WO2013011969A1 (ja) 2011-07-15 2013-01-24 電気化学工業株式会社 透光性硬質基板積層体の製造方法及び透光性硬質基板貼り合わせ装置
TWI541275B (zh) * 2011-07-15 2016-07-11 Denka Company Ltd And a method for producing a plate-like product
WO2013084953A1 (ja) * 2011-12-05 2013-06-13 電気化学工業株式会社 透光性硬質基板積層体の製造方法
WO2014142085A1 (ja) * 2013-03-11 2014-09-18 リンテック株式会社 粘着シートおよび加工されたデバイス関連部材の製造方法
JP6895714B2 (ja) * 2016-03-30 2021-06-30 デンカ株式会社 薄厚基板用組成物及び仮固定方法
JP7028660B2 (ja) * 2018-01-30 2022-03-02 日東電工株式会社 粘着シートおよびその製造方法、ならびに粘着性フィルム
KR102334413B1 (ko) * 2019-12-18 2021-12-03 (주)이녹스첨단소재 광경화성 접착제 조성물 및 이를 이용하는 부재의 가고정 방법
KR102334412B1 (ko) * 2019-12-18 2021-12-03 (주)이녹스첨단소재 광경화성 접착제 조성물 및 이를 이용하는 부재의 가고정 방법
KR102339285B1 (ko) * 2019-12-18 2021-12-15 삼성디스플레이 주식회사 광경화성 접착제 조성물 및 이를 이용하는 부재의 가고정 방법
KR102652909B1 (ko) * 2020-08-14 2024-04-01 (주)이녹스첨단소재 박막유리 가공용 점착시트 및 이를 이용하는 박막유리 가공방법
EP4328279A1 (en) * 2021-04-26 2024-02-28 Denka Company Limited Composition

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CN101146837A (zh) * 2005-03-18 2008-03-19 电气化学工业株式会社 粘接性组合物以及使用该组合物的构件的临时固定方法
CN101213225A (zh) * 2005-07-04 2008-07-02 电气化学工业株式会社 固化性组合物以及使用该组合物的构件的暂时固定方法

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JPH06116534A (ja) 1992-10-05 1994-04-26 Three Bond Co Ltd 接着剤組成物
JPH0959571A (ja) * 1995-08-28 1997-03-04 Toshiba Corp 部品の接着固定装置および接着固定方法
JPH10130309A (ja) * 1996-10-25 1998-05-19 Toagosei Co Ltd 仮固定用光硬化性組成物及び物品の製造方法
JPH1171553A (ja) 1997-08-28 1999-03-16 Toagosei Co Ltd 仮固定用光硬化性組成物及び物品の製造方法
JP4601757B2 (ja) 2000-02-17 2010-12-22 株式会社 アーデル 仮固定用接着剤組成物及びその使用方法
JP2003303510A (ja) * 2002-04-11 2003-10-24 Toshiba Lighting & Technology Corp 照明器具
JP4326747B2 (ja) * 2002-04-23 2009-09-09 株式会社 アーデル 仮固定用接着剤を用いる加工方法、及び仮固定用接着剤の剥離方法
EP2383303A1 (en) * 2005-07-04 2011-11-02 Denki Kagaku Kogyo Kabushiki Kaisha Curable composition and temporary fixation method of member using it
JP5132045B2 (ja) * 2005-09-13 2013-01-30 電気化学工業株式会社 組成物及びそれを用いた部材の仮固定方法
JP5408836B2 (ja) * 2005-09-27 2014-02-05 電気化学工業株式会社 組成物及びそれを用いる部材の仮固定剥離方法
JP2007169560A (ja) * 2005-12-26 2007-07-05 Denki Kagaku Kogyo Kk 組成物及びそれを用いた部材の仮固定方法
JP5016224B2 (ja) * 2006-01-16 2012-09-05 電気化学工業株式会社 組成物及びそれを用いた部材の仮固定方法
JP4932300B2 (ja) * 2006-03-28 2012-05-16 電気化学工業株式会社 仮固定用組成物及びそれを用いた部材の仮固定方法
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CN101213225A (zh) * 2005-07-04 2008-07-02 电气化学工业株式会社 固化性组合物以及使用该组合物的构件的暂时固定方法

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Publication number Publication date
CN102105546A (zh) 2011-06-22
JP5675355B2 (ja) 2015-02-25
WO2010010900A1 (ja) 2010-01-28
KR20110031347A (ko) 2011-03-25
KR101660056B1 (ko) 2016-09-30
MY162000A (en) 2017-05-31
JPWO2010010900A1 (ja) 2012-01-05

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