CN102010574B - 阻燃模塑组合物 - Google Patents
阻燃模塑组合物 Download PDFInfo
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- CN102010574B CN102010574B CN2010105575134A CN201010557513A CN102010574B CN 102010574 B CN102010574 B CN 102010574B CN 2010105575134 A CN2010105575134 A CN 2010105575134A CN 201010557513 A CN201010557513 A CN 201010557513A CN 102010574 B CN102010574 B CN 102010574B
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- moulding compound
- epoxy
- metal
- resins
- polyol
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- 239000003063 flame retardant Substances 0.000 title abstract description 34
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title abstract description 23
- 150000001875 compounds Chemical class 0.000 claims abstract description 37
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims abstract description 31
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 14
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- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 9
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- 229910052581 Si3N4 Inorganic materials 0.000 description 1
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- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34928—Salts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Paints Or Removers (AREA)
- Fireproofing Substances (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/426,374 US6936646B2 (en) | 2003-04-30 | 2003-04-30 | Flame-retardant molding compositions |
US10/426,374 | 2003-04-30 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2003801102888A Division CN1771290A (zh) | 2003-04-30 | 2003-11-25 | 阻燃模塑组合物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102010574A CN102010574A (zh) | 2011-04-13 |
CN102010574B true CN102010574B (zh) | 2013-03-13 |
Family
ID=33309850
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105575134A Expired - Fee Related CN102010574B (zh) | 2003-04-30 | 2003-11-25 | 阻燃模塑组合物 |
CNA2003801102888A Pending CN1771290A (zh) | 2003-04-30 | 2003-11-25 | 阻燃模塑组合物 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2003801102888A Pending CN1771290A (zh) | 2003-04-30 | 2003-11-25 | 阻燃模塑组合物 |
Country Status (10)
Country | Link |
---|---|
US (2) | US6936646B2 (zh) |
EP (1) | EP1622976B1 (zh) |
JP (1) | JP4870928B2 (zh) |
KR (1) | KR101068791B1 (zh) |
CN (2) | CN102010574B (zh) |
AT (1) | ATE331758T1 (zh) |
AU (1) | AU2003293202A1 (zh) |
DE (1) | DE60306554T2 (zh) |
MX (1) | MXPA05011648A (zh) |
WO (1) | WO2004099313A1 (zh) |
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US7456235B2 (en) * | 2003-04-30 | 2008-11-25 | Henkel Corporation | Flame-retardant composition for coating powders |
JP4163162B2 (ja) * | 2003-08-29 | 2008-10-08 | 住友ベークライト株式会社 | エポキシ樹脂用潜伏性触媒、エポキシ樹脂組成物および半導体装置 |
WO2006057498A1 (en) | 2004-11-26 | 2006-06-01 | Lg Chem, Ltd. | Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same |
CN101273076B (zh) * | 2005-09-27 | 2011-01-19 | 住友电木株式会社 | 潜伏性催化剂的制造方法和环氧树脂组合物 |
KR100758880B1 (ko) * | 2005-12-20 | 2007-09-14 | 제일모직주식회사 | 비할로겐계 반도체 소자 밀봉용 에폭시 수지 조성물 |
KR100751181B1 (ko) * | 2005-12-21 | 2007-08-22 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
CN101558113B (zh) * | 2006-10-25 | 2013-06-12 | Pp聚合物公司 | 不含卤素、氧化锑和含磷物质的用于聚合物的阻燃添加剂 |
US20080255283A1 (en) * | 2007-02-06 | 2008-10-16 | Takayuki Aoki | Thermosetting epoxy resin composition and semiconductor device |
JP5470680B2 (ja) | 2007-02-06 | 2014-04-16 | 日亜化学工業株式会社 | 発光装置及びその製造方法並びに成形体 |
DE102007041988A1 (de) * | 2007-09-05 | 2009-03-12 | Forschungszentrum Karlsruhe Gmbh | Flammhemmende Additive |
US8703288B2 (en) | 2008-03-21 | 2014-04-22 | General Cable Technologies Corporation | Low smoke, fire and water resistant cable coating |
CN102272226B (zh) * | 2009-01-06 | 2015-06-10 | 陶氏环球技术有限责任公司 | 无溴阻燃环氧树脂中的金属化合物 |
JP5504803B2 (ja) * | 2009-09-30 | 2014-05-28 | 住友ベークライト株式会社 | フェノール樹脂成形材料 |
DE102010004743A1 (de) * | 2010-01-14 | 2011-07-21 | Merck Patent GmbH, 64293 | Laseradditiv |
US8728568B2 (en) | 2012-01-16 | 2014-05-20 | Itron, Inc. | Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier |
US8481626B1 (en) * | 2012-01-16 | 2013-07-09 | Itron, Inc. | Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits |
BR112014018126B1 (pt) * | 2012-03-23 | 2021-07-13 | Dow Global Technologies Llc | Adesivo estrutural termocurável e processo para unir e soldar membros metálicos |
JP2014208839A (ja) * | 2014-07-02 | 2014-11-06 | ダウ グローバル テクノロジーズ エルエルシー | 非臭素化難燃性エポキシ樹脂における金属化合物 |
US10531555B1 (en) * | 2016-03-22 | 2020-01-07 | The United States Of America As Represented By The Secretary Of The Army | Tungsten oxide thermal shield |
JP6821316B2 (ja) * | 2016-03-29 | 2021-01-27 | 上野製薬株式会社 | 液晶ポリマー組成物 |
EP3275915B1 (en) | 2016-07-29 | 2022-11-30 | 3M Innovative Properties Company | Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties |
EP3275914B1 (en) | 2016-07-29 | 2022-05-11 | 3M Innovative Properties Company | Flame retardant adhesive composition |
CN107652684A (zh) * | 2017-10-25 | 2018-02-02 | 浙江威思康塑胶有限公司 | 一种电缆用复合阻燃协效剂 |
WO2019083003A1 (ja) * | 2017-10-27 | 2019-05-02 | Jxtgエネルギー株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
JP6896591B2 (ja) * | 2017-11-14 | 2021-06-30 | Eneos株式会社 | プリプレグ、繊維強化複合材料及び成形体 |
WO2020160206A1 (en) * | 2019-01-31 | 2020-08-06 | Dow Global Technologies Llc | Isocyanate reactive compositions |
CN114456543B (zh) * | 2021-12-29 | 2024-02-09 | 江苏中科科化新材料股份有限公司 | 环氧树脂组合物、环氧树脂塑封料及其制备方法和应用 |
CN116478581B (zh) * | 2023-03-27 | 2024-01-02 | 清华大学 | 一种持续性除醛阻燃涂料及其制备方法和应用 |
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US5648436A (en) * | 1993-10-21 | 1997-07-15 | Isovolta Osterreichische Isolierstoffwerke Aktiengesellschaft | Halogen-free mixture, a self-extinguishing prepreg containing this mixture and the use of such a prepreg |
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-
2003
- 2003-04-30 US US10/426,374 patent/US6936646B2/en not_active Expired - Lifetime
- 2003-11-25 AT AT03790193T patent/ATE331758T1/de not_active IP Right Cessation
- 2003-11-25 DE DE60306554T patent/DE60306554T2/de not_active Expired - Lifetime
- 2003-11-25 WO PCT/US2003/038155 patent/WO2004099313A1/en active IP Right Grant
- 2003-11-25 KR KR1020057020483A patent/KR101068791B1/ko active IP Right Grant
- 2003-11-25 MX MXPA05011648A patent/MXPA05011648A/es active IP Right Grant
- 2003-11-25 CN CN2010105575134A patent/CN102010574B/zh not_active Expired - Fee Related
- 2003-11-25 JP JP2004571722A patent/JP4870928B2/ja not_active Expired - Fee Related
- 2003-11-25 AU AU2003293202A patent/AU2003293202A1/en not_active Abandoned
- 2003-11-25 CN CNA2003801102888A patent/CN1771290A/zh active Pending
- 2003-11-25 EP EP03790193A patent/EP1622976B1/en not_active Expired - Lifetime
-
2005
- 2005-05-17 US US11/130,489 patent/US7338993B2/en not_active Expired - Lifetime
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EP0629665A2 (en) * | 1993-05-25 | 1994-12-21 | Sumitomo Bakelite Company Limited | Flame-retardant resin composition |
US5648436A (en) * | 1993-10-21 | 1997-07-15 | Isovolta Osterreichische Isolierstoffwerke Aktiengesellschaft | Halogen-free mixture, a self-extinguishing prepreg containing this mixture and the use of such a prepreg |
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Also Published As
Publication number | Publication date |
---|---|
DE60306554D1 (de) | 2006-08-10 |
MXPA05011648A (es) | 2006-02-13 |
EP1622976A1 (en) | 2006-02-08 |
CN1771290A (zh) | 2006-05-10 |
EP1622976B1 (en) | 2006-06-28 |
US7338993B2 (en) | 2008-03-04 |
WO2004099313A1 (en) | 2004-11-18 |
CN102010574A (zh) | 2011-04-13 |
US20050209378A1 (en) | 2005-09-22 |
JP2006525377A (ja) | 2006-11-09 |
US20040217376A1 (en) | 2004-11-04 |
US20050139861A9 (en) | 2005-06-30 |
DE60306554T2 (de) | 2007-06-21 |
ATE331758T1 (de) | 2006-07-15 |
AU2003293202A1 (en) | 2004-11-26 |
KR20060007042A (ko) | 2006-01-23 |
JP4870928B2 (ja) | 2012-02-08 |
KR101068791B1 (ko) | 2011-09-30 |
US6936646B2 (en) | 2005-08-30 |
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