DE60306554D1 - Flammhemmende formbare zusammensetzungen - Google Patents

Flammhemmende formbare zusammensetzungen

Info

Publication number
DE60306554D1
DE60306554D1 DE60306554T DE60306554T DE60306554D1 DE 60306554 D1 DE60306554 D1 DE 60306554D1 DE 60306554 T DE60306554 T DE 60306554T DE 60306554 T DE60306554 T DE 60306554T DE 60306554 D1 DE60306554 D1 DE 60306554D1
Authority
DE
Germany
Prior art keywords
molding composition
flame
elements
reducing
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60306554T
Other languages
English (en)
Other versions
DE60306554T2 (de
Inventor
Tanweer Ahsan
N Volante
S Bischof
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Corp
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Application granted granted Critical
Publication of DE60306554D1 publication Critical patent/DE60306554D1/de
Publication of DE60306554T2 publication Critical patent/DE60306554T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34928—Salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/387—Borates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Fireproofing Substances (AREA)
DE60306554T 2003-04-30 2003-11-25 Flammhemmende formbare zusammensetzungen Expired - Lifetime DE60306554T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US426374 1999-10-25
US10/426,374 US6936646B2 (en) 2003-04-30 2003-04-30 Flame-retardant molding compositions
PCT/US2003/038155 WO2004099313A1 (en) 2003-04-30 2003-11-25 Flame-retardant molding compositions

Publications (2)

Publication Number Publication Date
DE60306554D1 true DE60306554D1 (de) 2006-08-10
DE60306554T2 DE60306554T2 (de) 2007-06-21

Family

ID=33309850

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60306554T Expired - Lifetime DE60306554T2 (de) 2003-04-30 2003-11-25 Flammhemmende formbare zusammensetzungen

Country Status (10)

Country Link
US (2) US6936646B2 (de)
EP (1) EP1622976B1 (de)
JP (1) JP4870928B2 (de)
KR (1) KR101068791B1 (de)
CN (2) CN1771290A (de)
AT (1) ATE331758T1 (de)
AU (1) AU2003293202A1 (de)
DE (1) DE60306554T2 (de)
MX (1) MXPA05011648A (de)
WO (1) WO2004099313A1 (de)

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US6846448B2 (en) * 2001-12-20 2005-01-25 Kimberly-Clark Worldwide, Inc. Method and apparatus for making on-line stabilized absorbent materials
US7456235B2 (en) * 2003-04-30 2008-11-25 Henkel Corporation Flame-retardant composition for coating powders
JP4163162B2 (ja) 2003-08-29 2008-10-08 住友ベークライト株式会社 エポキシ樹脂用潜伏性触媒、エポキシ樹脂組成物および半導体装置
EP1814949B1 (de) * 2004-11-26 2009-11-04 LG Chem, Ltd. Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit
WO2007037024A1 (ja) * 2005-09-27 2007-04-05 Sumitomo Bakelite Co., Ltd. 潜伏性触媒の製造方法及びエポキシ樹脂組成物
KR100758880B1 (ko) * 2005-12-20 2007-09-14 제일모직주식회사 비할로겐계 반도체 소자 밀봉용 에폭시 수지 조성물
KR100751181B1 (ko) * 2005-12-21 2007-08-22 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
US8975320B2 (en) * 2006-10-25 2015-03-10 Pp Polymer Ab Flame retardant additive for polymers, free of halogens, antimony oxide and phosphorus containing substances
US20080255283A1 (en) * 2007-02-06 2008-10-16 Takayuki Aoki Thermosetting epoxy resin composition and semiconductor device
JP5470680B2 (ja) * 2007-02-06 2014-04-16 日亜化学工業株式会社 発光装置及びその製造方法並びに成形体
DE102007041988A1 (de) * 2007-09-05 2009-03-12 Forschungszentrum Karlsruhe Gmbh Flammhemmende Additive
US8703288B2 (en) 2008-03-21 2014-04-22 General Cable Technologies Corporation Low smoke, fire and water resistant cable coating
CN102272226B (zh) * 2009-01-06 2015-06-10 陶氏环球技术有限责任公司 无溴阻燃环氧树脂中的金属化合物
JP5504803B2 (ja) * 2009-09-30 2014-05-28 住友ベークライト株式会社 フェノール樹脂成形材料
DE102010004743A1 (de) * 2010-01-14 2011-07-21 Merck Patent GmbH, 64293 Laseradditiv
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
BR112014018126B1 (pt) * 2012-03-23 2021-07-13 Dow Global Technologies Llc Adesivo estrutural termocurável e processo para unir e soldar membros metálicos
JP2014208839A (ja) * 2014-07-02 2014-11-06 ダウ グローバル テクノロジーズ エルエルシー 非臭素化難燃性エポキシ樹脂における金属化合物
US10531555B1 (en) * 2016-03-22 2020-01-07 The United States Of America As Represented By The Secretary Of The Army Tungsten oxide thermal shield
JP6821316B2 (ja) * 2016-03-29 2021-01-27 上野製薬株式会社 液晶ポリマー組成物
EP3275915B1 (de) 2016-07-29 2022-11-30 3M Innovative Properties Company Nichthalogener schnellhärtender zweikomponentiger epoxidklebstoff mit flammhemmenden eigenschaften
EP3275914B1 (de) 2016-07-29 2022-05-11 3M Innovative Properties Company Flammhemmende klebstoffzusammensetzung
CN107652684A (zh) * 2017-10-25 2018-02-02 浙江威思康塑胶有限公司 一种电缆用复合阻燃协效剂
EP3702390B1 (de) * 2017-10-27 2023-12-27 ENEOS Corporation Zusammensetzung für vernetzbare harze, vernetztes produkt dieser zusammensetzung, verfahren zur herstellung dieser zusammensetzung und dieses vernetzten produkts sowie halbleitervorrichtung
JP6896591B2 (ja) * 2017-11-14 2021-06-30 Ｅｎｅｏｓ株式会社 プリプレグ、繊維強化複合材料及び成形体
CN113286834B (zh) * 2019-01-31 2023-06-13 陶氏环球技术有限责任公司 异氰酸酯反应性组合物
CN114456543B (zh) * 2021-12-29 2024-02-09 江苏中科科化新材料股份有限公司 环氧树脂组合物、环氧树脂塑封料及其制备方法和应用
CN116478581B (zh) * 2023-03-27 2024-01-02 清华大学 一种持续性除醛阻燃涂料及其制备方法和应用

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JPH06145602A (ja) * 1992-09-02 1994-05-27 Nippon Paint Co Ltd 熱硬化性塗料組成物
EP0629665B1 (de) 1993-05-25 1996-12-18 Sumitomo Bakelite Company Limited Flammfeste Harzzusammensetzung
JP2000091477A (ja) * 1993-08-20 2000-03-31 Nitto Denko Corp 半導体装置
AT400574B (de) * 1993-10-21 1996-01-25 Isovolta Halogenfreie harzmischung, ein diese harzmischung enthaltendes, selbstverlöschendes prepreg sowie dessen verwendung
JPH07331033A (ja) * 1994-06-15 1995-12-19 Sumitomo Bakelite Co Ltd 強靭で難燃性良好なエポキシ樹脂組成物
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JPH11100492A (ja) 1997-09-29 1999-04-13 Nitto Denko Corp 半導体封止用樹脂組成物及びそれを用いた半導体装置
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Also Published As

Publication number Publication date
EP1622976B1 (de) 2006-06-28
KR101068791B1 (ko) 2011-09-30
DE60306554T2 (de) 2007-06-21
US20040217376A1 (en) 2004-11-04
KR20060007042A (ko) 2006-01-23
EP1622976A1 (de) 2006-02-08
JP2006525377A (ja) 2006-11-09
JP4870928B2 (ja) 2012-02-08
MXPA05011648A (es) 2006-02-13
CN102010574A (zh) 2011-04-13
CN1771290A (zh) 2006-05-10
WO2004099313A1 (en) 2004-11-18
US20050209378A1 (en) 2005-09-22
AU2003293202A1 (en) 2004-11-26
ATE331758T1 (de) 2006-07-15
US6936646B2 (en) 2005-08-30
CN102010574B (zh) 2013-03-13
US7338993B2 (en) 2008-03-04
US20050139861A9 (en) 2005-06-30

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Legal Events

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