MXPA05011648A - Composiciones de moldeo de combustion lenta. - Google Patents

Composiciones de moldeo de combustion lenta.

Info

Publication number
MXPA05011648A
MXPA05011648A MXPA05011648A MXPA05011648A MXPA05011648A MX PA05011648 A MXPA05011648 A MX PA05011648A MX PA05011648 A MXPA05011648 A MX PA05011648A MX PA05011648 A MXPA05011648 A MX PA05011648A MX PA05011648 A MXPA05011648 A MX PA05011648A
Authority
MX
Mexico
Prior art keywords
molding composition
flame
elements
electrical
molding compositions
Prior art date
Application number
MXPA05011648A
Other languages
English (en)
Inventor
Charles S Bischof
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Publication of MXPA05011648A publication Critical patent/MXPA05011648A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34928—Salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/387—Borates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Fireproofing Substances (AREA)

Abstract

Una composicion de moldeo de combustion lenta que incluye una resina epoxi, cianurato de melamina, y una o mas sales de metal hidratadas capaces de liberar agua cuando se calientan. La sal de metal hidratada puede incluir uno o mas compuestos seleccionados de las sales de borato de metal, oxidos del Grupo IIB, y polihidroxidos de uno o mas elementos seleccionados de los elementos del Grupo IIA y elementos del Grupo IIIB. La composicion de moldeo puede utilizarse para revestir un dispositivo electrico o electronico al calentar la composicion de moldeo a una temperatura suficiente para curar la composicion de moldeo y formar un polimero en la superficie del dispositivo. Los dispositivos electricos y electronicos formados por el metodo tambien se describen.
MXPA05011648A 2003-04-30 2003-11-25 Composiciones de moldeo de combustion lenta. MXPA05011648A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/426,374 US6936646B2 (en) 2003-04-30 2003-04-30 Flame-retardant molding compositions
PCT/US2003/038155 WO2004099313A1 (en) 2003-04-30 2003-11-25 Flame-retardant molding compositions

Publications (1)

Publication Number Publication Date
MXPA05011648A true MXPA05011648A (es) 2006-02-13

Family

ID=33309850

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA05011648A MXPA05011648A (es) 2003-04-30 2003-11-25 Composiciones de moldeo de combustion lenta.

Country Status (10)

Country Link
US (2) US6936646B2 (es)
EP (1) EP1622976B1 (es)
JP (1) JP4870928B2 (es)
KR (1) KR101068791B1 (es)
CN (2) CN1771290A (es)
AT (1) ATE331758T1 (es)
AU (1) AU2003293202A1 (es)
DE (1) DE60306554T2 (es)
MX (1) MXPA05011648A (es)
WO (1) WO2004099313A1 (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6846448B2 (en) * 2001-12-20 2005-01-25 Kimberly-Clark Worldwide, Inc. Method and apparatus for making on-line stabilized absorbent materials
US7456235B2 (en) * 2003-04-30 2008-11-25 Henkel Corporation Flame-retardant composition for coating powders
JP4163162B2 (ja) 2003-08-29 2008-10-08 住友ベークライト株式会社 エポキシ樹脂用潜伏性触媒、エポキシ樹脂組成物および半導体装置
WO2006057498A1 (en) 2004-11-26 2006-06-01 Lg Chem, Ltd. Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
KR100970020B1 (ko) * 2005-09-27 2010-07-16 스미토모 베이클리트 컴퍼니 리미티드 잠복성 촉매의 제조 방법 및 에폭시 수지 조성물
KR100758880B1 (ko) * 2005-12-20 2007-09-14 제일모직주식회사 비할로겐계 반도체 소자 밀봉용 에폭시 수지 조성물
KR100751181B1 (ko) * 2005-12-21 2007-08-22 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
EP2076564B1 (en) * 2006-10-25 2016-12-07 PP Polymer AB Flame retardant additive for polymers, free of halogens, antimony oxide and phosphorus containg substances
US20080255283A1 (en) * 2007-02-06 2008-10-16 Takayuki Aoki Thermosetting epoxy resin composition and semiconductor device
JP5470680B2 (ja) 2007-02-06 2014-04-16 日亜化学工業株式会社 発光装置及びその製造方法並びに成形体
DE102007041988A1 (de) * 2007-09-05 2009-03-12 Forschungszentrum Karlsruhe Gmbh Flammhemmende Additive
US8703288B2 (en) * 2008-03-21 2014-04-22 General Cable Technologies Corporation Low smoke, fire and water resistant cable coating
CN102272226B (zh) * 2009-01-06 2015-06-10 陶氏环球技术有限责任公司 无溴阻燃环氧树脂中的金属化合物
JP5504803B2 (ja) * 2009-09-30 2014-05-28 住友ベークライト株式会社 フェノール樹脂成形材料
DE102010004743A1 (de) * 2010-01-14 2011-07-21 Merck Patent GmbH, 64293 Laseradditiv
US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
WO2013142751A2 (en) * 2012-03-23 2013-09-26 Dow Global Technologies Llc Flame retardant structural epoxy resin adhesives and process for bonding metal members
JP2014208839A (ja) * 2014-07-02 2014-11-06 ダウ グローバル テクノロジーズ エルエルシー 非臭素化難燃性エポキシ樹脂における金属化合物
US10531555B1 (en) * 2016-03-22 2020-01-07 The United States Of America As Represented By The Secretary Of The Army Tungsten oxide thermal shield
JP6821316B2 (ja) * 2016-03-29 2021-01-27 上野製薬株式会社 液晶ポリマー組成物
EP3275914B1 (en) 2016-07-29 2022-05-11 3M Innovative Properties Company Flame retardant adhesive composition
EP3275915B1 (en) 2016-07-29 2022-11-30 3M Innovative Properties Company Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties
CN107652684A (zh) * 2017-10-25 2018-02-02 浙江威思康塑胶有限公司 一种电缆用复合阻燃协效剂
PT3702390T (pt) * 2017-10-27 2024-02-05 Eneos Corp Composição para resina curada, produto curado da referida composição, método de produção para a referida composição e o referido produto curado, e dispositivo semicondutor
JP6896591B2 (ja) * 2017-11-14 2021-06-30 Ｅｎｅｏｓ株式会社 プリプレグ、繊維強化複合材料及び成形体
ES2940297T3 (es) * 2019-01-31 2023-05-05 Dow Global Technologies Llc Composiciones reactivas con isocianato
CN114456543B (zh) * 2021-12-29 2024-02-09 江苏中科科化新材料股份有限公司 环氧树脂组合物、环氧树脂塑封料及其制备方法和应用
CN116478581B (zh) * 2023-03-27 2024-01-02 清华大学 一种持续性除醛阻燃涂料及其制备方法和应用

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US629665A (en) * 1899-03-24 1899-07-25 Westinghouse Electric & Mfg Co Controller for electric motors.
JPH06145602A (ja) * 1992-09-02 1994-05-27 Nippon Paint Co Ltd 熱硬化性塗料組成物
EP0629665B1 (en) 1993-05-25 1996-12-18 Sumitomo Bakelite Company Limited Flame-retardant resin composition
JP2000091477A (ja) * 1993-08-20 2000-03-31 Nitto Denko Corp 半導体装置
AT400574B (de) * 1993-10-21 1996-01-25 Isovolta Halogenfreie harzmischung, ein diese harzmischung enthaltendes, selbstverlöschendes prepreg sowie dessen verwendung
JPH07331033A (ja) * 1994-06-15 1995-12-19 Sumitomo Bakelite Co Ltd 強靭で難燃性良好なエポキシ樹脂組成物
EP0742261B1 (en) * 1995-04-10 2000-08-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith
JPH0940752A (ja) * 1995-07-26 1997-02-10 Toshiba Chem Corp 難燃性エポキシ樹脂組成物
JPH1060229A (ja) 1996-08-20 1998-03-03 Toshiba Chem Corp 難燃性エポキシ樹脂組成物
DE19643279A1 (de) * 1996-10-21 1998-04-23 Basf Ag Flammgeschützte Formmassen
WO1998047968A1 (en) 1997-04-21 1998-10-29 Nitto Denko Corporation Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device
JPH11100492A (ja) 1997-09-29 1999-04-13 Nitto Denko Corp 半導体封止用樹脂組成物及びそれを用いた半導体装置
ID22006A (id) * 1997-10-15 1999-08-19 Otsuka Chemical Co Ltd Senyawa fenoksifosfazena taut-silang, penghambat nyala, komposisi resin penghambat nyala, dan pencetakan resin penghambat nyala
US6207735B1 (en) * 1997-12-08 2001-03-27 Tosch Corporation Flame retardant and flame retardant resin composition containing it
JP4029456B2 (ja) * 1998-01-29 2008-01-09 日立化成工業株式会社 難燃性非ハロゲンエポキシ樹脂組成物、それを用いたプリプレグ及び電気配線板用積層板
DE19903707C2 (de) * 1999-01-30 2003-05-28 Clariant Gmbh Flammwidrige duroplastische Massen
JP2000226438A (ja) * 1999-02-03 2000-08-15 Sanyu Resin Kk 難燃性エポキシ樹脂組成物
US6440567B1 (en) * 2000-03-31 2002-08-27 Isola Laminate Systems Corp. Halogen free flame retardant adhesive resin coated composite
JP2001302880A (ja) * 2000-04-18 2001-10-31 Toshiba Chem Corp 封止用樹脂組成物および半導体封止装置
EP1300409A4 (en) * 2000-06-29 2003-07-16 Nippon Chemical Ind Company Lt PHOSPHORUS-CONTAINING HYDROCHINONE DERIVATIVES, METHOD FOR THE PRODUCTION THEREOF, PHOSPHORUS-CONTAINING EPOXY RESINS PRODUCED THEREFOR, FLAME RESISTANT RESIN COMPOSITIONS, SEALANTS AND LAMINATES
CN100462401C (zh) * 2000-09-25 2009-02-18 日立化成工业株式会社 封装用环氧树脂模塑料及半导体装置
US6660811B2 (en) * 2001-01-30 2003-12-09 Dainippon Ink And Chemicals, Inc. Epoxy resin composition and curing product thereof
US20040166241A1 (en) * 2003-02-20 2004-08-26 Henkel Loctite Corporation Molding compositions containing quaternary organophosphonium salts

Also Published As

Publication number Publication date
US6936646B2 (en) 2005-08-30
DE60306554T2 (de) 2007-06-21
US20050209378A1 (en) 2005-09-22
DE60306554D1 (de) 2006-08-10
CN102010574A (zh) 2011-04-13
AU2003293202A1 (en) 2004-11-26
US20040217376A1 (en) 2004-11-04
CN1771290A (zh) 2006-05-10
WO2004099313A1 (en) 2004-11-18
CN102010574B (zh) 2013-03-13
ATE331758T1 (de) 2006-07-15
US20050139861A9 (en) 2005-06-30
JP2006525377A (ja) 2006-11-09
EP1622976B1 (en) 2006-06-28
JP4870928B2 (ja) 2012-02-08
EP1622976A1 (en) 2006-02-08
US7338993B2 (en) 2008-03-04
KR101068791B1 (ko) 2011-09-30
KR20060007042A (ko) 2006-01-23

Similar Documents

Publication Publication Date Title
MXPA05011648A (es) Composiciones de moldeo de combustion lenta.
TW201129614A (en) Epoxy-containing polymer compound, photocurable resin composition comprising the same, method for forming pattern, and film for protecting electric/electronic part
TW200833758A (en) Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion
TW200833788A (en) Heat stable aryl polysiloxane compositions
DE602005023531D1 (de) Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung
WO2007103741A3 (en) Emi shielding and thermal management assemblies including frames and covers with multi-position latching
TW200745073A (en) Adamantane derivative, resin composition containing the same, and optoelectronic member and sealing agent for electronic circuit using those
DK1240811T3 (da) Konstruktionsramme af termisk ledende materiale
TW200733824A (en) Wiring circuit board
ATE404631T1 (de) Benzoxazin und epoxidharz enthaltende zusammensetzung
MY118700A (en) Thermosetting resin compositions
WO2007146382A3 (en) Hydrophobic compositions for electronic applications
ATE295385T1 (de) Latente kombinationsverbindungen und latente ammoniumsalze aus epoxidharzhärter und flammschutzmittel sowie daraus hergestellte epoxidharz-systeme und -produkte
MX2015016482A (es) Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.
TW200600542A (en) Compositions with polymers for advanced materials
WO2012091320A3 (en) Epoxy resin compound and radiant heat circuit board using the same
IN2012DN05096A (es)
WO2012148644A3 (en) Conductive polymer fuse
EP2662395A3 (en) Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
ATE440125T1 (de) Oberflächenmodifiziertes corund sowie harzzusammensetzung
WO2005033161A3 (en) Epoxy resin compositions, processes utilzing same and articles made therefrom
TW200710120A (en) Resin compositions, prepregs and laminates
GB2556246A8 (en) Method for forming a coating on an electronic or electrical device
WO2013009113A3 (en) Epoxy resin compound and radiant heat circuit board using the same
TW200634095A (en) Polyoxyalkyleneamine modified polyamidepolyimide resin and composition thereof

Legal Events

Date Code Title Description
FG Grant or registration