ATE331758T1 - Flammhemmende formbare zusammensetzungen - Google Patents

Flammhemmende formbare zusammensetzungen

Info

Publication number
ATE331758T1
ATE331758T1 AT03790193T AT03790193T ATE331758T1 AT E331758 T1 ATE331758 T1 AT E331758T1 AT 03790193 T AT03790193 T AT 03790193T AT 03790193 T AT03790193 T AT 03790193T AT E331758 T1 ATE331758 T1 AT E331758T1
Authority
AT
Austria
Prior art keywords
molding composition
elements
flame retardant
electrical
group
Prior art date
Application number
AT03790193T
Other languages
English (en)
Inventor
Tanweer Ahsan
Charles N Volante
Charles S Bischof
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Application granted granted Critical
Publication of ATE331758T1 publication Critical patent/ATE331758T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34928—Salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/387—Borates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Fireproofing Substances (AREA)
AT03790193T 2003-04-30 2003-11-25 Flammhemmende formbare zusammensetzungen ATE331758T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/426,374 US6936646B2 (en) 2003-04-30 2003-04-30 Flame-retardant molding compositions

Publications (1)

Publication Number Publication Date
ATE331758T1 true ATE331758T1 (de) 2006-07-15

Family

ID=33309850

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03790193T ATE331758T1 (de) 2003-04-30 2003-11-25 Flammhemmende formbare zusammensetzungen

Country Status (10)

Country Link
US (2) US6936646B2 (de)
EP (1) EP1622976B1 (de)
JP (1) JP4870928B2 (de)
KR (1) KR101068791B1 (de)
CN (2) CN1771290A (de)
AT (1) ATE331758T1 (de)
AU (1) AU2003293202A1 (de)
DE (1) DE60306554T2 (de)
MX (1) MXPA05011648A (de)
WO (1) WO2004099313A1 (de)

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US7456235B2 (en) * 2003-04-30 2008-11-25 Henkel Corporation Flame-retardant composition for coating powders
SG109590A1 (en) * 2003-08-29 2005-03-30 Sumitomo Bakelite Co Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
CN101044204A (zh) 2004-11-26 2007-09-26 株式会社Lg化学 非卤素阻燃剂环氧树脂组合物，和使用其的预浸料坯和包铜的层压制品
US20090234080A1 (en) * 2005-09-27 2009-09-17 Sumitomo Dakelite Co., Ltd. Process for producing latent catalyst and epoxy resin composition
KR100758880B1 (ko) * 2005-12-20 2007-09-14 제일모직주식회사 비할로겐계 반도체 소자 밀봉용 에폭시 수지 조성물
KR100751181B1 (ko) * 2005-12-21 2007-08-22 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
CN101558113B (zh) * 2006-10-25 2013-06-12 Pp聚合物公司 不含卤素、氧化锑和含磷物质的用于聚合物的阻燃添加剂
US20080255283A1 (en) * 2007-02-06 2008-10-16 Takayuki Aoki Thermosetting epoxy resin composition and semiconductor device
JP5470680B2 (ja) * 2007-02-06 2014-04-16 日亜化学工業株式会社 発光装置及びその製造方法並びに成形体
DE102007041988A1 (de) * 2007-09-05 2009-03-12 Forschungszentrum Karlsruhe Gmbh Flammhemmende Additive
US8703288B2 (en) 2008-03-21 2014-04-22 General Cable Technologies Corporation Low smoke, fire and water resistant cable coating
KR101593529B1 (ko) * 2009-01-06 2016-02-16 블루 큐브 아이피 엘엘씨 비브롬화 난연성 에폭시 수지 중 금속 화합물
JP5504803B2 (ja) * 2009-09-30 2014-05-28 住友ベークライト株式会社 フェノール樹脂成形材料
DE102010004743A1 (de) * 2010-01-14 2011-07-21 Merck Patent GmbH, 64293 Laseradditiv
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
KR102097069B1 (ko) * 2012-03-23 2020-04-06 다우 글로벌 테크놀로지스 엘엘씨 난연성 구조용 에폭시 수지 접착제 및 금속 부재의 접합 방법
JP2014208839A (ja) * 2014-07-02 2014-11-06 ダウ グローバル テクノロジーズ エルエルシー 非臭素化難燃性エポキシ樹脂における金属化合物
US10531555B1 (en) * 2016-03-22 2020-01-07 The United States Of America As Represented By The Secretary Of The Army Tungsten oxide thermal shield
JP6821316B2 (ja) * 2016-03-29 2021-01-27 上野製薬株式会社 液晶ポリマー組成物
EP3275915B1 (de) 2016-07-29 2022-11-30 3M Innovative Properties Company Nichthalogener schnellhärtender zweikomponentiger epoxidklebstoff mit flammhemmenden eigenschaften
EP3275914B1 (de) 2016-07-29 2022-05-11 3M Innovative Properties Company Flammhemmende klebstoffzusammensetzung
CN107652684A (zh) * 2017-10-25 2018-02-02 浙江威思康塑胶有限公司 一种电缆用复合阻燃协效剂
WO2019083003A1 (ja) * 2017-10-27 2019-05-02 Ｊｘｔｇエネルギー株式会社 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置
JP6896591B2 (ja) * 2017-11-14 2021-06-30 Ｅｎｅｏｓ株式会社 プリプレグ、繊維強化複合材料及び成形体
ES2940297T3 (es) * 2019-01-31 2023-05-05 Dow Global Technologies Llc Composiciones reactivas con isocianato
CN114456543B (zh) * 2021-12-29 2024-02-09 江苏中科科化新材料股份有限公司 环氧树脂组合物、环氧树脂塑封料及其制备方法和应用
CN116478581B (zh) * 2023-03-27 2024-01-02 清华大学 一种持续性除醛阻燃涂料及其制备方法和应用

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Also Published As

Publication number Publication date
WO2004099313A1 (en) 2004-11-18
CN1771290A (zh) 2006-05-10
US20050139861A9 (en) 2005-06-30
DE60306554T2 (de) 2007-06-21
JP2006525377A (ja) 2006-11-09
CN102010574A (zh) 2011-04-13
AU2003293202A1 (en) 2004-11-26
US20040217376A1 (en) 2004-11-04
US20050209378A1 (en) 2005-09-22
JP4870928B2 (ja) 2012-02-08
KR20060007042A (ko) 2006-01-23
MXPA05011648A (es) 2006-02-13
EP1622976B1 (de) 2006-06-28
KR101068791B1 (ko) 2011-09-30
DE60306554D1 (de) 2006-08-10
EP1622976A1 (de) 2006-02-08
US6936646B2 (en) 2005-08-30
CN102010574B (zh) 2013-03-13
US7338993B2 (en) 2008-03-04

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