DE602006002273D1 - Benzoxazin und epoxidharz enthaltende zusammensetzung - Google Patents

Benzoxazin und epoxidharz enthaltende zusammensetzung

Info

Publication number
DE602006002273D1
DE602006002273D1 DE602006002273T DE602006002273T DE602006002273D1 DE 602006002273 D1 DE602006002273 D1 DE 602006002273D1 DE 602006002273 T DE602006002273 T DE 602006002273T DE 602006002273 T DE602006002273 T DE 602006002273T DE 602006002273 D1 DE602006002273 D1 DE 602006002273D1
Authority
DE
Germany
Prior art keywords
compositions
benzoxazine
composition
epoxy resin
bisphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006002273T
Other languages
English (en)
Inventor
Dave Tsuei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Huntsman Advanced Materials Switzerland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Advanced Materials Switzerland GmbH filed Critical Huntsman Advanced Materials Switzerland GmbH
Publication of DE602006002273D1 publication Critical patent/DE602006002273D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
DE602006002273T 2005-04-01 2006-03-21 Benzoxazin und epoxidharz enthaltende zusammensetzung Active DE602006002273D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05102604A EP1647576A1 (de) 2005-04-01 2005-04-01 Zusammensetzung beinhaltend Benzoxazin- und Epoxyharz
PCT/EP2006/060909 WO2006103185A1 (en) 2005-04-01 2006-03-21 Composition comprising benzoxazine and epoxy resin

Publications (1)

Publication Number Publication Date
DE602006002273D1 true DE602006002273D1 (de) 2008-09-25

Family

ID=34939108

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006002273T Active DE602006002273D1 (de) 2005-04-01 2006-03-21 Benzoxazin und epoxidharz enthaltende zusammensetzung

Country Status (9)

Country Link
US (1) US8062455B2 (de)
EP (2) EP1647576A1 (de)
JP (1) JP5161067B2 (de)
KR (1) KR101246943B1 (de)
AT (1) ATE404631T1 (de)
DE (1) DE602006002273D1 (de)
ES (1) ES2310404T3 (de)
TW (1) TWI385208B (de)
WO (1) WO2006103185A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI374137B (en) * 2004-09-28 2012-10-11 Huntsman Adv Mat Switzerland Organic compounds
US7649060B2 (en) 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
JP4248592B2 (ja) * 2006-02-20 2009-04-02 積水化学工業株式会社 熱硬化性樹脂の製造方法、熱硬化性樹脂、それを含む熱硬化性組成物、成形体、硬化体、並びにそれらを含む電子機器
US20100016504A1 (en) * 2006-09-21 2010-01-21 Henkel Ag & Co. Kgaa Catalytic low temperature polymerization
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
JP5438035B2 (ja) * 2008-02-21 2014-03-12 ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー 高ｔｇ用途のためのハロゲンを含まないベンゾキサジンをベースとする硬化型組成物
WO2009115488A1 (en) * 2008-03-19 2009-09-24 Henkel Ag & Co. Kgaa Copolymerization method
EP2313452A1 (de) * 2008-08-12 2011-04-27 Huntsman Advanced Materials (Switzerland) GmbH Wärmehärtende zusammensetzung
DE102009028099A1 (de) * 2009-07-29 2011-02-03 Henkel Ag & Co. Kgaa Schlagzähmodifizierte Zusammensetzungen
HUE048499T2 (hu) * 2010-03-05 2020-07-28 Huntsman Advanced Mat Americas Llc Alacsony dielektromos veszteségû hõre keményedõ gyantarendszer nagyfrekvencián elektromos alkatrészekben történõ alkalmazásra
KR101844753B1 (ko) 2010-08-25 2018-04-03 헌츠만 어드밴스드 머티리얼스 아메리카스 엘엘씨 운송 분야에서 사용하기 위한 제형화된 벤족사진계 시스템
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
WO2012124307A1 (ja) * 2011-03-14 2012-09-20 住友ベークライト株式会社 ビルドアップ用プリプレグ
KR20140021613A (ko) * 2011-03-28 2014-02-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 경화성 조성물, 물품, 경화 방법, 및 반응 생성물
CN102351909B (zh) * 2011-07-18 2014-04-09 南京大学 含二茂铁基苯并噁嗪单体或前驱体的制备及其热固化树脂
TWI450913B (zh) * 2011-11-04 2014-09-01 Elite Material Co Ltd Thermosetting resin composition and application board and circuit board
KR102338982B1 (ko) * 2016-06-27 2021-12-14 코오롱인더스트리 주식회사 열경화성 수지 조성물, 이를 이용한 프리프레그 및 기판
CN109694553B (zh) * 2018-12-26 2021-06-04 广东生益科技股份有限公司 一种无卤无磷阻燃树脂组合物、包含其的粘结材料及覆金属箔层压板
CN113413918A (zh) * 2021-06-10 2021-09-21 南京理工大学 具有吸附与催化芬顿反应功能的二茂铁树脂及其制备方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019639A (en) * 1987-04-07 1991-05-28 Ciba-Geigy Corporation Novel epoxy resins
JPH06263842A (ja) * 1993-03-12 1994-09-20 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JPH06306142A (ja) * 1993-04-27 1994-11-01 Toshiba Corp エポキシ樹脂組成物及びそれを用いた複合材料
JPH08183835A (ja) * 1994-12-28 1996-07-16 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、接着剤シート及び接着剤付き 金属はく
JP4423779B2 (ja) * 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP2001131393A (ja) * 1999-10-29 2001-05-15 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2001207026A (ja) * 1999-11-19 2001-07-31 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
EP1253168B1 (de) * 1999-12-27 2005-03-23 Ajinomoto Co., Inc. Harzadditiv-zusammensetzung und verfahren zu dessen herstellung
JP2001220455A (ja) * 2000-02-10 2001-08-14 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
CN1628946A (zh) * 2000-03-03 2005-06-22 日立化成工业株式会社 一种预浸基板、铺设金属片的叠层板及印刷电路板
JP2001323047A (ja) * 2000-05-17 2001-11-20 Nippon Kayaku Co Ltd エポキシ樹脂組成物
US6660811B2 (en) * 2001-01-30 2003-12-09 Dainippon Ink And Chemicals, Inc. Epoxy resin composition and curing product thereof
JP2002241590A (ja) * 2001-02-20 2002-08-28 Ajinomoto Co Inc 難燃性エポキシ樹脂組成物
CA2379505A1 (en) * 2001-04-02 2002-10-02 Hidenori Tanaka Coating composition containing benzoxazine compound
US6547518B1 (en) * 2001-04-06 2003-04-15 General Electric Company Low hoop stress turbine frame support
JP2002309200A (ja) * 2001-04-17 2002-10-23 Ajinomoto Co Inc 接着フィルム
JP2003012894A (ja) * 2001-07-03 2003-01-15 Hitachi Chem Co Ltd エポキシ樹脂組成物、それを用いた絶縁樹脂シート及びプリント配線板
JP2003147165A (ja) * 2001-08-29 2003-05-21 Osaka City 熱硬化性樹脂組成物
JP2003268069A (ja) * 2002-03-15 2003-09-25 Sumitomo Bakelite Co Ltd 難燃性エポキシ樹脂組成物およびそれを用いた半導体封止材料並びに半導体装置
JP2004059643A (ja) * 2002-07-25 2004-02-26 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
JP2004197032A (ja) * 2002-12-20 2004-07-15 Hitachi Chem Co Ltd 難燃性樹脂組成物およびこの組成物を用いるプリプレグ，積層板，プリント配線板
JP2004300213A (ja) * 2003-03-28 2004-10-28 Sumitomo Bakelite Co Ltd 難燃性エポキシ樹脂組成物およびそれを用いた半導体装置
US7157509B2 (en) * 2003-06-27 2007-01-02 Henkel Corporation Curable compositions
JP2005023118A (ja) * 2003-06-30 2005-01-27 Hitachi Chem Co Ltd 難燃性樹脂組成物およびこの組成物を用いるプリプレグ，積層板，プリント配線板、及び電子部品

Also Published As

Publication number Publication date
KR20080000633A (ko) 2008-01-02
TW200641034A (en) 2006-12-01
EP1647576A1 (de) 2006-04-19
WO2006103185A1 (en) 2006-10-05
ES2310404T3 (es) 2009-01-01
JP5161067B2 (ja) 2013-03-13
KR101246943B1 (ko) 2013-03-25
ATE404631T1 (de) 2008-08-15
US20080302471A1 (en) 2008-12-11
TWI385208B (zh) 2013-02-11
US8062455B2 (en) 2011-11-22
EP1871835B1 (de) 2008-08-13
EP1871835A1 (de) 2008-01-02
JP2008534725A (ja) 2008-08-28

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