CN101980861B - 用于降低半导体加工期间挠性基材的翘曲度和弯曲度的组件和方法 - Google Patents

用于降低半导体加工期间挠性基材的翘曲度和弯曲度的组件和方法 Download PDF

Info

Publication number
CN101980861B
CN101980861B CN200980111340.9A CN200980111340A CN101980861B CN 101980861 B CN101980861 B CN 101980861B CN 200980111340 A CN200980111340 A CN 200980111340A CN 101980861 B CN101980861 B CN 101980861B
Authority
CN
China
Prior art keywords
flexible substrate
rigid carrier
adhesive phase
flexible
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200980111340.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN101980861A (zh
Inventor
S·奥罗尔科
D·罗伊
H·江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arizona State University ASU
Original Assignee
Arizona State University ASU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arizona State University ASU filed Critical Arizona State University ASU
Publication of CN101980861A publication Critical patent/CN101980861A/zh
Application granted granted Critical
Publication of CN101980861B publication Critical patent/CN101980861B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31942—Of aldehyde or ketone condensation product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN200980111340.9A 2008-04-08 2009-04-06 用于降低半导体加工期间挠性基材的翘曲度和弯曲度的组件和方法 Active CN101980861B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4322308P 2008-04-08 2008-04-08
US61/043,223 2008-04-08
PCT/US2009/039577 WO2009126544A1 (en) 2008-04-08 2009-04-06 Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing

Publications (2)

Publication Number Publication Date
CN101980861A CN101980861A (zh) 2011-02-23
CN101980861B true CN101980861B (zh) 2014-08-06

Family

ID=41011823

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980111340.9A Active CN101980861B (zh) 2008-04-08 2009-04-06 用于降低半导体加工期间挠性基材的翘曲度和弯曲度的组件和方法

Country Status (8)

Country Link
US (1) US8685201B2 (enExample)
EP (1) EP2274162A1 (enExample)
JP (1) JP5555226B2 (enExample)
KR (1) KR101517263B1 (enExample)
CN (1) CN101980861B (enExample)
SG (1) SG188921A1 (enExample)
TW (1) TWI488750B (enExample)
WO (1) WO2009126544A1 (enExample)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5636363B2 (ja) 2008-06-13 2014-12-03 ディージェイティー、 エルエルシー 衝撃波バルーンカテーテル装置
US10702293B2 (en) 2008-06-13 2020-07-07 Shockwave Medical, Inc. Two-stage method for treating calcified lesions within the wall of a blood vessel
US9752022B2 (en) 2008-07-10 2017-09-05 Avery Dennison Corporation Composition, film and related methods
US9044618B2 (en) 2008-11-05 2015-06-02 Shockwave Medical, Inc. Shockwave valvuloplasty catheter system
WO2010138811A2 (en) 2009-05-29 2010-12-02 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
SG171917A1 (en) * 2008-12-02 2011-07-28 Univ Arizona Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
WO2015057719A1 (en) * 2013-10-14 2015-04-23 Arizona Board Of Regents For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
TWI505410B (zh) * 2008-12-30 2015-10-21 Ind Tech Res Inst 應用於軟性電子元件之基板結構及其製造方法
RU2571140C2 (ru) 2010-03-04 2015-12-20 Авери Деннисон Корпорейшн Не содержащая пвх пленка и не содержащая пвх многослойная пленка
US8233280B2 (en) 2010-03-15 2012-07-31 Lincoln Global, Inc. Electronic module with center mounting fasteners
WO2012021196A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
WO2012021197A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
CN102637575B (zh) * 2011-02-09 2015-07-01 群康科技(深圳)有限公司 元件基板的制造方法
US8574247B2 (en) 2011-11-08 2013-11-05 Shockwave Medical, Inc. Shock wave valvuloplasty device with moveable shock wave generator
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
US9642673B2 (en) 2012-06-27 2017-05-09 Shockwave Medical, Inc. Shock wave balloon catheter with multiple shock wave sources
AU2013300176B2 (en) 2012-08-06 2017-08-17 Shockwave Medical, Inc. Low profile electrodes for an angioplasty shock wave catheter
JP2015524709A (ja) 2012-08-08 2015-08-27 ショックウェーブ メディカル， インコーポレイテッド 複数のバルーンを伴う衝撃波弁形成
US9522012B2 (en) 2012-09-13 2016-12-20 Shockwave Medical, Inc. Shockwave catheter system with energy control
US9333000B2 (en) 2012-09-13 2016-05-10 Shockwave Medical, Inc. Shockwave catheter system with energy control
US10166744B2 (en) 2012-10-05 2019-01-01 Corning Incorporated Glass/metal laminated structures and methods of manufacturing laminated structures
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
KR102136376B1 (ko) * 2013-01-07 2020-07-22 코닝 인코포레이티드 강화 적층 유리 구조
KR102130547B1 (ko) * 2013-03-27 2020-07-07 삼성디스플레이 주식회사 가요성 기판 및 이를 포함하는 가요성 표시 장치
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
CN105899587A (zh) 2013-12-30 2016-08-24 艾利丹尼森公司 聚氨酯保护性膜
WO2017034644A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
CN106132688B (zh) 2014-01-27 2020-07-14 康宁股份有限公司 用于薄片与载体的受控粘结的制品和方法
KR20160145062A (ko) 2014-04-09 2016-12-19 코닝 인코포레이티드 디바이스 변경된 기판 물품 및 제조 방법
JP2017518638A (ja) 2014-05-13 2017-07-06 アリゾナ・ボード・オブ・リージェンツ・フォー・アンド・オン・ビハーフ・オブ・アリゾナ・ステイト・ユニバーシティＡｒｉｚｏｎａ Ｂｏａｒｄ Ｏｆ Ｒｅｇｅｎｔｓ Ｆｏｒ Ａｎｄ Ｏｎ Ｂｅｈａｌｆ Ｏｆ Ａｒｉｚｏｎａ Ｓｔａｔｅ Ｕｎｉｖｅｒｓｉｔｙ 電子デバイスを提供する方法およびその電子デバイス
US10249741B2 (en) 2014-05-13 2019-04-02 Joseph T. Smith System and method for ion-selective, field effect transistor on flexible substrate
KR20170043586A (ko) * 2014-08-20 2017-04-21 코닝 인코포레이티드 크고 얇은 유리/금속 라미네이트
USD761820S1 (en) 2014-08-28 2016-07-19 Samsung Electronics Co., Ltd. Display screen or portion thereof with graphical user interface
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
CN104559852B (zh) * 2014-12-31 2018-02-27 深圳市化讯半导体材料有限公司 一种用于薄晶圆加工的临时键合胶及其制备方法
CN107431059B (zh) 2015-01-02 2020-03-17 亚利桑那州立大学董事会 用于可变形电子装置的阿基米德螺线设计
US10890669B2 (en) * 2015-01-14 2021-01-12 General Electric Company Flexible X-ray detector and methods for fabricating the same
KR101993652B1 (ko) * 2015-03-05 2019-09-24 주식회사 엘지화학 광전소자의 플렉시블 기판용 폴리이미드 필름용 조성물
EP3297824A1 (en) 2015-05-19 2018-03-28 Corning Incorporated Articles and methods for bonding sheets with carriers
KR102024481B1 (ko) * 2015-06-03 2019-09-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 디스플레이용 조립체 층
CN107810168A (zh) 2015-06-26 2018-03-16 康宁股份有限公司 包含板材和载体的方法和制品
CN105093615B (zh) 2015-07-29 2018-01-26 合肥鑫晟光电科技有限公司 曲面显示面板及其制备方法、显示装置
WO2017087195A1 (en) 2015-11-18 2017-05-26 Shockwave Medical, Inc. Shock wave electrodes
US10226265B2 (en) 2016-04-25 2019-03-12 Shockwave Medical, Inc. Shock wave device with polarity switching
TW201825623A (zh) 2016-08-30 2018-07-16 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI821867B (zh) 2016-08-31 2023-11-11 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
EP4309608A3 (en) 2016-10-06 2024-04-17 Shockwave Medical, Inc. Aortic leaflet repair using shock wave applicators
US10357264B2 (en) 2016-12-06 2019-07-23 Shockwave Medical, Inc. Shock wave balloon catheter with insertable electrodes
US10068787B2 (en) * 2016-12-30 2018-09-04 Sunpower Corporation Bowing semiconductor wafers
WO2018212871A2 (en) 2017-05-16 2018-11-22 Hanqing Jiang Three-dimensional soft electrode for lithium metal batteries
US10966737B2 (en) 2017-06-19 2021-04-06 Shockwave Medical, Inc. Device and method for generating forward directed shock waves
WO2019036710A1 (en) 2017-08-18 2019-02-21 Corning Incorporated TEMPORARY BINDING USING POLYCATIONIC POLYMERS
US10709462B2 (en) 2017-11-17 2020-07-14 Shockwave Medical, Inc. Low profile electrodes for a shock wave catheter
CN111615567B (zh) 2017-12-15 2023-04-14 康宁股份有限公司 用于处理基板的方法和用于制备包括粘合片材的制品的方法
CN108282960A (zh) * 2018-01-08 2018-07-13 苏州群策科技有限公司 一种超薄板的制造方法
US11267613B2 (en) 2018-02-02 2022-03-08 Arizona Board Of Regents On Behalf Of Arizona State University Origami-based collapsible and watertight cases
AU2019290401B2 (en) 2018-06-21 2025-02-27 Shockwave Medical, Inc. System for treating occlusions in body lumens
EP4034005B1 (en) 2019-09-24 2024-12-18 Shockwave Medical, Inc. Lesion crossing shock wave catheter
AU2020354885A1 (en) 2019-09-24 2022-04-07 Shockwave Medical, Inc. Low profile electrodes for a shock wave catheter
EP4034006A1 (en) 2019-09-24 2022-08-03 Shockwave Medical, Inc. System for treating thrombus in body lumens
US11076491B2 (en) * 2019-10-16 2021-07-27 Compass Technology Company Limited Integrated electro-optical flexible circuit board
CN112203402B (zh) * 2020-10-27 2022-08-26 中国科学院深圳先进技术研究院 印制电路板及其制备方法
US11992232B2 (en) 2020-10-27 2024-05-28 Shockwave Medical, Inc. System for treating thrombus in body lumens
US12232755B2 (en) 2020-12-11 2025-02-25 Shockwave Medical, Inc. Lesion crossing shock wave catheter
US12469725B2 (en) 2021-06-27 2025-11-11 Delta Design, Inc. Method for determining corrective film pattern to reduce semiconductor wafer bow
US12089861B2 (en) 2021-08-05 2024-09-17 Nextern Innovation, Llc Intravascular lithotripsy system and device
US12023098B2 (en) 2021-10-05 2024-07-02 Shockwave Medical, Inc. Lesion crossing shock wave catheter
EP4419023A4 (en) 2021-10-19 2025-07-30 Shockwave Medical Inc Intravascular lithotripsy catheter with interfering shock waves
WO2024029759A1 (ko) * 2022-08-02 2024-02-08 삼성전자 주식회사 플렉서블 디스플레이를 포함하는 전자 장치
US12290268B2 (en) 2023-03-31 2025-05-06 Shockwave Medical, Inc. Shockwave catheters for treating rhinosinusitis
US12035932B1 (en) 2023-04-21 2024-07-16 Shockwave Medical, Inc. Intravascular lithotripsy catheter with slotted emitter bands
US12220141B2 (en) 2023-06-29 2025-02-11 Shockwave Medical, Inc. Catheter system with independently controllable bubble and arc generation
US12426904B2 (en) 2023-11-17 2025-09-30 Shockwave Medical, Inc. Intravascular lithotripsy catheter with oscillating impactor
US12402899B2 (en) 2023-11-30 2025-09-02 Shockwave Medical, Inc. Systems, devices, and methods for generating shock waves in a forward direction
US12433620B2 (en) 2024-02-23 2025-10-07 Shockwave Medical, Inc. Locus emitter shock wave catheter devices with increased longevity and higher sonic output
US12471939B2 (en) 2024-03-05 2025-11-18 Shockwave Medical, Inc. Shock wave catheter with retractable enclosure
US12178458B1 (en) 2024-05-16 2024-12-31 Shockwave Medical, Inc. Guidewireless shock wave catheters
US12453565B1 (en) 2024-11-18 2025-10-28 Shockwave Medical, Inc. Shock wave catheters and methods of use thereof for treating, imaging, and characterizing body lumens

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2679972Y (zh) * 2003-12-16 2005-02-16 上海华仕德电路技术有限公司 刚挠多层板
EP1605491A1 (en) * 2004-06-09 2005-12-14 Nitto Denko Corporation Laminate sheet, method of producing back substrate for plasma display panel, back substrate for plasma display panel, and plasma display panel
JP2007146121A (ja) * 2005-11-01 2007-06-14 Hitachi Chem Co Ltd 粘弾性樹脂組成物、これを用いた金属箔張積層板、プリプレグ、樹脂付き金属箔及び樹脂フィルム。
WO2008005979A1 (en) * 2006-07-05 2008-01-10 The Arizona Board Of Regents, A Body Corporate Acting For And On Behalf Of Arizona State University Method of temporarily attaching a rigid carrier to a substrate

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2113288A (en) * 1987-09-08 1989-03-09 Dow Chemical Company, The Aqueous latex laminating adhesives which improve adherence between various substrates
JP3453390B2 (ja) * 1996-10-08 2003-10-06 日立化成工業株式会社 半導体装置、半導体チップ搭載用基板及びその製造法
JPH10242086A (ja) * 1997-02-26 1998-09-11 Nitto Denko Corp 半導体ウエハ保持シート
KR100320983B1 (ko) * 1997-08-22 2002-06-20 포만 제프리 엘 칩조립체및직접적인개방열전도성경로의제공방법
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
JP4034911B2 (ja) 1999-07-22 2008-01-16 三菱樹脂株式会社 合わせガラス用中間膜及び合わせガラス
JP3878386B2 (ja) 2000-02-23 2007-02-07 三菱樹脂株式会社 中間膜用粘着シート及び合わせガラス積層体
US6784555B2 (en) * 2001-09-17 2004-08-31 Dow Corning Corporation Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
US20030068841A1 (en) * 2001-09-26 2003-04-10 Nitto Denko Corporation Process of producing semiconductor device and resin composition sheet used therefor
JP2003174125A (ja) * 2001-09-26 2003-06-20 Nitto Denko Corp 半導体装置の製造法及びこれに用いるシート状樹脂組成物
DE10162676B4 (de) * 2001-12-19 2005-06-02 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip und einer Umverdrahtungsplatte und Systemträger für mehrere elektronische Bauteile sowie Verfahren zur Herstellung derselben
JP2004300231A (ja) 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
US20040248488A1 (en) * 2003-06-05 2004-12-09 Tebbetts Carly P. Wallcovering backing fabric
US20060154546A1 (en) * 2003-06-25 2006-07-13 Andover Coated Products, Inc. Air permeable pressure-sensitive adhesive tapes
JP2005026547A (ja) * 2003-07-04 2005-01-27 Hitachi Chem Co Ltd 半導体装置およびその製造方法、ならびに半導体装置に用いられる接着シート
JP4566527B2 (ja) * 2003-08-08 2010-10-20 日東電工株式会社 再剥離型粘着シート
JP2005280172A (ja) * 2004-03-30 2005-10-13 Nisshin Steel Co Ltd ヘアライン調ラミネート金属板
TWI260065B (en) * 2005-01-03 2006-08-11 Unimicron Technology Corp Substrate and method for fabricating the same
KR101125762B1 (ko) * 2007-04-10 2012-03-20 스미토모 베이클리트 컴퍼니 리미티드 반도체용 접착필름 및 이를 이용한 반도체 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2679972Y (zh) * 2003-12-16 2005-02-16 上海华仕德电路技术有限公司 刚挠多层板
EP1605491A1 (en) * 2004-06-09 2005-12-14 Nitto Denko Corporation Laminate sheet, method of producing back substrate for plasma display panel, back substrate for plasma display panel, and plasma display panel
JP2007146121A (ja) * 2005-11-01 2007-06-14 Hitachi Chem Co Ltd 粘弾性樹脂組成物、これを用いた金属箔張積層板、プリプレグ、樹脂付き金属箔及び樹脂フィルム。
WO2008005979A1 (en) * 2006-07-05 2008-01-10 The Arizona Board Of Regents, A Body Corporate Acting For And On Behalf Of Arizona State University Method of temporarily attaching a rigid carrier to a substrate

Also Published As

Publication number Publication date
CN101980861A (zh) 2011-02-23
US8685201B2 (en) 2014-04-01
TW201004803A (en) 2010-02-01
JP2011520248A (ja) 2011-07-14
SG188921A1 (en) 2013-04-30
JP5555226B2 (ja) 2014-07-23
TWI488750B (zh) 2015-06-21
KR101517263B1 (ko) 2015-04-30
KR20110053921A (ko) 2011-05-24
US20110064953A1 (en) 2011-03-17
EP2274162A1 (en) 2011-01-19
WO2009126544A1 (en) 2009-10-15

Similar Documents

Publication Publication Date Title
CN101980861B (zh) 用于降低半导体加工期间挠性基材的翘曲度和弯曲度的组件和方法
JP4897882B2 (ja) 硬質担体を基板に暫定的に取り付ける方法
JP4834758B2 (ja) フレキシブル電子デバイスに適用される基板構造およびその作製方法
TW201106447A (en) Substrate structures applied in flexible electrical devices and fabrication method thereof
US20200057178A1 (en) Multi-layer wet-dry hardcoats for flexible cover lens
CN104377118B (zh) 柔性显示基板的制作方法及柔性显示基板母板
CN102301835A (zh) 准备柔性基板组件的方法和从其得到的柔性基板组件
JP2011520248A5 (enExample)
US20120064669A1 (en) Manufacturing method of semiconductor device
WO2015119210A1 (ja) ガラス積層体
JP6042840B2 (ja) 機能性フィルムおよび機能性フィルムの製造方法
CN112601616A (zh) 层叠体及其制造方法
TW201922482A (zh) 透明導電性膜
JP5944875B2 (ja) 機能性フィルムおよび機能性フィルムの製造方法
JP2007331996A (ja) 機能性ガラス体
KR20190034524A (ko) 기판을 홀딩하기 위한 홀딩 어레인지먼트, 홀딩 어레인지먼트를 포함하는 캐리어, 캐리어를 이용하는 프로세싱 시스템, 기판을 홀딩하기 위한 방법, 및 기판을 홀딩 어레인지먼트로부터 릴리스하기 위한 방법
JP2020183484A (ja) 真空プロセス用粘着テープ
CN102013415A (zh) 应用于柔性电子元件的基板结构及其制造方法
JP2018062553A (ja) 熱硬化性樹脂組成物及び加工フィルムの製造方法
JP2023121715A (ja) 積層体、ウインドウフィルム及びタッチパネル
KR20160053503A (ko) 가스 발생 점착 필름, 이를 포함하는 연성 표시소자 및 이를 이용한 연성 표시소자 제조 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant