TWI488750B - 於半導體製程中減少可撓性基材之翹曲及彎曲之方法及總成 - Google Patents

於半導體製程中減少可撓性基材之翹曲及彎曲之方法及總成 Download PDF

Info

Publication number
TWI488750B
TWI488750B TW098111721A TW98111721A TWI488750B TW I488750 B TWI488750 B TW I488750B TW 098111721 A TW098111721 A TW 098111721A TW 98111721 A TW98111721 A TW 98111721A TW I488750 B TWI488750 B TW I488750B
Authority
TW
Taiwan
Prior art keywords
flexible substrate
substrate
layer
rigid support
assembly
Prior art date
Application number
TW098111721A
Other languages
English (en)
Chinese (zh)
Other versions
TW201004803A (en
Inventor
尚恩 歐羅凱
道格拉斯 羅伊
姜漢卿
Original Assignee
美國亞利桑那州之亞利桑那州立大學董事會
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美國亞利桑那州之亞利桑那州立大學董事會 filed Critical 美國亞利桑那州之亞利桑那州立大學董事會
Publication of TW201004803A publication Critical patent/TW201004803A/zh
Application granted granted Critical
Publication of TWI488750B publication Critical patent/TWI488750B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31942—Of aldehyde or ketone condensation product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW098111721A 2008-04-08 2009-04-08 於半導體製程中減少可撓性基材之翹曲及彎曲之方法及總成 TWI488750B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4322308P 2008-04-08 2008-04-08

Publications (2)

Publication Number Publication Date
TW201004803A TW201004803A (en) 2010-02-01
TWI488750B true TWI488750B (zh) 2015-06-21

Family

ID=41011823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098111721A TWI488750B (zh) 2008-04-08 2009-04-08 於半導體製程中減少可撓性基材之翹曲及彎曲之方法及總成

Country Status (8)

Country Link
US (1) US8685201B2 (enExample)
EP (1) EP2274162A1 (enExample)
JP (1) JP5555226B2 (enExample)
KR (1) KR101517263B1 (enExample)
CN (1) CN101980861B (enExample)
SG (1) SG188921A1 (enExample)
TW (1) TWI488750B (enExample)
WO (1) WO2009126544A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10660200B2 (en) 2015-01-02 2020-05-19 Arizona Board Of Regents On Behalf Of Arizona State University Archimedean spiral design for deformable electronics

Families Citing this family (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10702293B2 (en) 2008-06-13 2020-07-07 Shockwave Medical, Inc. Two-stage method for treating calcified lesions within the wall of a blood vessel
EP2300091B1 (en) 2008-06-13 2018-03-21 Shockwave Medical, Inc. Shockwave balloon catheter system
US9752022B2 (en) 2008-07-10 2017-09-05 Avery Dennison Corporation Composition, film and related methods
US9044618B2 (en) 2008-11-05 2015-06-02 Shockwave Medical, Inc. Shockwave valvuloplasty catheter system
JP5583140B2 (ja) 2008-12-02 2014-09-03 アリゾナ・ボード・オブ・リージェンツ，フォー・アンド・オン・ビハーフ・オブ・アリゾナ・ステート・ユニバーシティ フレキシブル基板アセンブリを準備する方法およびその方法により準備されたフレキシブル基板アセンブリ
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
WO2015057719A1 (en) * 2013-10-14 2015-04-23 Arizona Board Of Regents For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
TWI505410B (zh) * 2008-12-30 2015-10-21 財團法人工業技術研究院 應用於軟性電子元件之基板結構及其製造方法
KR101362025B1 (ko) 2009-05-29 2014-02-13 아리조나 보드 오브 리젠츠 퍼 앤 온 비하프 오브 아리조나 스테이트 유니버시티 고온에서 가요성 반도체 장치를 제공하는 방법 및 그 가요성 반도체 장치
PL2542409T3 (pl) 2010-03-04 2019-05-31 Avery Dennison Corp Folie i laminaty foliowe nie zawierające PCW
US8233280B2 (en) 2010-03-15 2012-07-31 Lincoln Global, Inc. Electronic module with center mounting fasteners
WO2012021196A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
WO2012021197A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
CN102637575B (zh) * 2011-02-09 2015-07-01 群康科技(深圳)有限公司 元件基板的制造方法
US8574247B2 (en) 2011-11-08 2013-11-05 Shockwave Medical, Inc. Shock wave valvuloplasty device with moveable shock wave generator
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
US9642673B2 (en) 2012-06-27 2017-05-09 Shockwave Medical, Inc. Shock wave balloon catheter with multiple shock wave sources
ES2715678T3 (es) 2012-08-06 2019-06-05 Shockwave Medical Inc Electrodos de perfil bajo para un catéter de ondas de choque de angioplastia
EP2882357A1 (en) 2012-08-08 2015-06-17 Shockwave Medical, Inc. Shockwave valvuloplasty with multiple balloons
US9333000B2 (en) 2012-09-13 2016-05-10 Shockwave Medical, Inc. Shockwave catheter system with energy control
US9522012B2 (en) 2012-09-13 2016-12-20 Shockwave Medical, Inc. Shockwave catheter system with energy control
CN105102217A (zh) * 2012-10-05 2015-11-25 康宁股份有限公司 玻璃/金属层合结构和制造层合结构的方法
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
EP3527363A1 (en) * 2013-01-07 2019-08-21 Corning Incorporated Strengthened laminated glass structures
KR102130547B1 (ko) * 2013-03-27 2020-07-07 삼성디스플레이 주식회사 가요성 기판 및 이를 포함하는 가요성 표시 장치
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
US20150183544A1 (en) 2013-12-30 2015-07-02 Avery Dennison Corporation Label Application System
WO2017034645A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS, a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
JP6770432B2 (ja) 2014-01-27 2020-10-14 コーニング インコーポレイテッド 薄いシートの担体との制御された結合のための物品および方法
CN106457758B (zh) 2014-04-09 2018-11-16 康宁股份有限公司 装置改性的基材制品及其制备方法
KR102466741B1 (ko) 2014-05-13 2022-11-15 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 전자 디바이스를 제공하는 방법
US10249741B2 (en) 2014-05-13 2019-04-02 Joseph T. Smith System and method for ion-selective, field effect transistor on flexible substrate
CN106573448A (zh) * 2014-08-20 2017-04-19 康宁股份有限公司 大且薄的玻璃/金属层压件
USD761820S1 (en) 2014-08-28 2016-07-19 Samsung Electronics Co., Ltd. Display screen or portion thereof with graphical user interface
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
CN104559852B (zh) * 2014-12-31 2018-02-27 深圳市化讯半导体材料有限公司 一种用于薄晶圆加工的临时键合胶及其制备方法
US10890669B2 (en) 2015-01-14 2021-01-12 General Electric Company Flexible X-ray detector and methods for fabricating the same
EP3266808B1 (en) * 2015-03-05 2020-12-09 LG Chem, Ltd. Composition for polyimide film for flexible substrate of optoelectronic device
EP3297824A1 (en) 2015-05-19 2018-03-28 Corning Incorporated Articles and methods for bonding sheets with carriers
CN107683313B (zh) * 2015-06-03 2021-02-05 3M创新有限公司 用于柔性显示器的组件层
EP3313799B1 (en) 2015-06-26 2022-09-07 Corning Incorporated Methods and articles including a sheet and a carrier
CN105093615B (zh) * 2015-07-29 2018-01-26 合肥鑫晟光电科技有限公司 曲面显示面板及其制备方法、显示装置
WO2017087195A1 (en) 2015-11-18 2017-05-26 Shockwave Medical, Inc. Shock wave electrodes
US10226265B2 (en) 2016-04-25 2019-03-12 Shockwave Medical, Inc. Shock wave device with polarity switching
TW201825623A (zh) 2016-08-30 2018-07-16 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
EP3777723B1 (en) 2016-10-06 2024-01-17 Shockwave Medical, Inc. Aortic leaflet repair using shock wave applicators
US10357264B2 (en) 2016-12-06 2019-07-23 Shockwave Medical, Inc. Shock wave balloon catheter with insertable electrodes
US10068787B2 (en) * 2016-12-30 2018-09-04 Sunpower Corporation Bowing semiconductor wafers
WO2018212871A2 (en) 2017-05-16 2018-11-22 Hanqing Jiang Three-dimensional soft electrode for lithium metal batteries
US10966737B2 (en) 2017-06-19 2021-04-06 Shockwave Medical, Inc. Device and method for generating forward directed shock waves
JP7260523B2 (ja) 2017-08-18 2023-04-18 コーニング インコーポレイテッド ポリカチオン性高分子を使用した一時的結合
US10709462B2 (en) 2017-11-17 2020-07-14 Shockwave Medical, Inc. Low profile electrodes for a shock wave catheter
CN111615567B (zh) 2017-12-15 2023-04-14 康宁股份有限公司 用于处理基板的方法和用于制备包括粘合片材的制品的方法
CN108282960A (zh) * 2018-01-08 2018-07-13 苏州群策科技有限公司 一种超薄板的制造方法
US11267613B2 (en) 2018-02-02 2022-03-08 Arizona Board Of Regents On Behalf Of Arizona State University Origami-based collapsible and watertight cases
WO2019245746A1 (en) 2018-06-21 2019-12-26 Shockwave Medical, Inc. System for treating occlusions in body lumens
JP7515576B2 (ja) 2019-09-24 2024-07-12 ショックウェーブ メディカル， インコーポレイテッド 身体管腔内の血栓を治療するためのシステム
ES3009524T3 (en) 2019-09-24 2025-03-27 Shockwave Medical Inc Lesion crossing shock wave catheter
EP4295788B1 (en) 2019-09-24 2025-03-12 Shockwave Medical, Inc. Low profile electrodes for a shock wave catheter
US11076491B2 (en) * 2019-10-16 2021-07-27 Compass Technology Company Limited Integrated electro-optical flexible circuit board
US11992232B2 (en) 2020-10-27 2024-05-28 Shockwave Medical, Inc. System for treating thrombus in body lumens
CN112203402B (zh) * 2020-10-27 2022-08-26 中国科学院深圳先进技术研究院 印制电路板及其制备方法
US12232755B2 (en) 2020-12-11 2025-02-25 Shockwave Medical, Inc. Lesion crossing shock wave catheter
US12469725B2 (en) 2021-06-27 2025-11-11 Delta Design, Inc. Method for determining corrective film pattern to reduce semiconductor wafer bow
US12622716B2 (en) 2021-08-05 2026-05-12 Cardiovascular Systems, Inc. Systems, devices and methods for generating patterns of voltage pulses and electrical arcs between spaced-apart electrode pairs in intravascular lithotripsy
US12661136B2 (en) 2021-08-05 2026-06-23 Cardiovascular Systems, Inc. Methods, systems and devices for generating pressure waves in intravascular lithotripsy
US12622718B2 (en) 2021-08-05 2026-05-12 Cardiovascular Systems, Inc. Intravascular lithoplasty balloon systems, devices and methods
US11957369B2 (en) 2021-08-05 2024-04-16 Nextern Innovation, Llc Intravascular lithotripsy systems and methods
US12089861B2 (en) 2021-08-05 2024-09-17 Nextern Innovation, Llc Intravascular lithotripsy system and device
US12023098B2 (en) 2021-10-05 2024-07-02 Shockwave Medical, Inc. Lesion crossing shock wave catheter
MX2024004753A (es) 2021-10-19 2024-05-27 Shockwave Medical Inc Cateter de litotricia intravascular con ondas de choque interferentes.
MX2024006515A (es) 2021-11-30 2024-06-11 Shockwave Medical Inc Dise?o de electrodo para cateteres de litotricia direccional.
EP4546312A4 (en) * 2022-08-02 2025-10-08 Samsung Electronics Co Ltd ELECTRONIC DEVICE COMPRISING A FLEXIBLE SCREEN
EP4637582A1 (en) 2022-12-23 2025-10-29 Cardiovascular Systems, Inc. Intravascular lithoplasty system with improved durability, efficiency and pressure output variability
US12290268B2 (en) 2023-03-31 2025-05-06 Shockwave Medical, Inc. Shockwave catheters for treating rhinosinusitis
US12035932B1 (en) 2023-04-21 2024-07-16 Shockwave Medical, Inc. Intravascular lithotripsy catheter with slotted emitter bands
US12220141B2 (en) 2023-06-29 2025-02-11 Shockwave Medical, Inc. Catheter system with independently controllable bubble and arc generation
US12496078B2 (en) 2023-08-24 2025-12-16 Shockwave Medical, Inc. Lithotripsy catheters having electrodes formed in metallization layers
US12426904B2 (en) 2023-11-17 2025-09-30 Shockwave Medical, Inc. Intravascular lithotripsy catheter with oscillating impactor
US12402899B2 (en) 2023-11-30 2025-09-02 Shockwave Medical, Inc. Systems, devices, and methods for generating shock waves in a forward direction
US12594085B2 (en) 2023-11-30 2026-04-07 Shockwave Medical, Inc. Shock wave catheter with shock absorber
US12616490B2 (en) 2023-11-30 2026-05-05 Shockwave Medical, Inc. Systems, devices, and methods for treatment of target material in a body lumen with shock waves
US12433620B2 (en) 2024-02-23 2025-10-07 Shockwave Medical, Inc. Locus emitter shock wave catheter devices with increased longevity and higher sonic output
US12642545B2 (en) 2024-03-04 2026-06-02 Shockwave Medical, Inc. Burst mode operation of intravascular lithotripsy (IVL)
US12471939B2 (en) 2024-03-05 2025-11-18 Shockwave Medical, Inc. Shock wave catheter with retractable enclosure
US12178458B1 (en) 2024-05-16 2024-12-31 Shockwave Medical, Inc. Guidewireless shock wave catheters
US12502188B2 (en) 2024-05-31 2025-12-23 Shockwave Medical, Inc. Systems, devices, and methods for shock wave generation utilizing catheters with multi-metal joints
US12453565B1 (en) 2024-11-18 2025-10-28 Shockwave Medical, Inc. Shock wave catheters and methods of use thereof for treating, imaging, and characterizing body lumens

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040248488A1 (en) * 2003-06-05 2004-12-09 Tebbetts Carly P. Wallcovering backing fabric
US20060154546A1 (en) * 2003-06-25 2006-07-13 Andover Coated Products, Inc. Air permeable pressure-sensitive adhesive tapes

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2113288A (en) * 1987-09-08 1989-03-09 Dow Chemical Company, The Aqueous latex laminating adhesives which improve adherence between various substrates
KR20040000387A (ko) * 1996-10-08 2004-01-03 히다치 가세고교 가부시끼가이샤 접착제 및 양면 접착 필름
JPH10242086A (ja) * 1997-02-26 1998-09-11 Nitto Denko Corp 半導体ウエハ保持シート
KR100320983B1 (ko) * 1997-08-22 2002-06-20 포만 제프리 엘 칩조립체및직접적인개방열전도성경로의제공방법
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
JP4034911B2 (ja) * 1999-07-22 2008-01-16 三菱樹脂株式会社 合わせガラス用中間膜及び合わせガラス
JP3878386B2 (ja) 2000-02-23 2007-02-07 三菱樹脂株式会社 中間膜用粘着シート及び合わせガラス積層体
US6784555B2 (en) * 2001-09-17 2004-08-31 Dow Corning Corporation Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
JP2003174125A (ja) * 2001-09-26 2003-06-20 Nitto Denko Corp 半導体装置の製造法及びこれに用いるシート状樹脂組成物
US20030068841A1 (en) 2001-09-26 2003-04-10 Nitto Denko Corporation Process of producing semiconductor device and resin composition sheet used therefor
DE10162676B4 (de) * 2001-12-19 2005-06-02 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip und einer Umverdrahtungsplatte und Systemträger für mehrere elektronische Bauteile sowie Verfahren zur Herstellung derselben
JP2004300231A (ja) 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP2005026547A (ja) * 2003-07-04 2005-01-27 Hitachi Chem Co Ltd 半導体装置およびその製造方法、ならびに半導体装置に用いられる接着シート
JP4566527B2 (ja) 2003-08-08 2010-10-20 日東電工株式会社 再剥離型粘着シート
CN2679972Y (zh) * 2003-12-16 2005-02-16 上海华仕德电路技术有限公司 刚挠多层板
JP2005280172A (ja) * 2004-03-30 2005-10-13 Nisshin Steel Co Ltd ヘアライン調ラミネート金属板
JP4103116B2 (ja) * 2004-06-09 2008-06-18 日東電工株式会社 積層シート、プラズマディスプレイパネル用背面基板の製造方法、プラズマディスプレイパネル用背面基板、及びプラズマディスプレイパネル
TWI260065B (en) * 2005-01-03 2006-08-11 Unimicron Technology Corp Substrate and method for fabricating the same
JP2007146121A (ja) * 2005-11-01 2007-06-14 Hitachi Chem Co Ltd 粘弾性樹脂組成物、これを用いた金属箔張積層板、プリプレグ、樹脂付き金属箔及び樹脂フィルム。
JP4897882B2 (ja) * 2006-07-05 2012-03-14 アリゾナ ボード オブ リージェンツ ア ボディー コーポレート アクティング オン ビハーフ オブ アリゾナ ステイト ユニバーシティ 硬質担体を基板に暫定的に取り付ける方法
KR101125762B1 (ko) * 2007-04-10 2012-03-20 스미토모 베이클리트 컴퍼니 리미티드 반도체용 접착필름 및 이를 이용한 반도체 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040248488A1 (en) * 2003-06-05 2004-12-09 Tebbetts Carly P. Wallcovering backing fabric
US20060154546A1 (en) * 2003-06-25 2006-07-13 Andover Coated Products, Inc. Air permeable pressure-sensitive adhesive tapes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10660200B2 (en) 2015-01-02 2020-05-19 Arizona Board Of Regents On Behalf Of Arizona State University Archimedean spiral design for deformable electronics

Also Published As

Publication number Publication date
WO2009126544A1 (en) 2009-10-15
EP2274162A1 (en) 2011-01-19
JP2011520248A (ja) 2011-07-14
US8685201B2 (en) 2014-04-01
US20110064953A1 (en) 2011-03-17
KR101517263B1 (ko) 2015-04-30
KR20110053921A (ko) 2011-05-24
CN101980861A (zh) 2011-02-23
TW201004803A (en) 2010-02-01
SG188921A1 (en) 2013-04-30
JP5555226B2 (ja) 2014-07-23
CN101980861B (zh) 2014-08-06

Similar Documents

Publication Publication Date Title
US8685201B2 (en) Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing
US12292635B2 (en) Flexible multi-layered cover lens stacks for foldable displays
TWI476100B (zh) Glass and resin and the use of its electronic devices
JP4897882B2 (ja) 硬質担体を基板に暫定的に取り付ける方法
JP5583140B2 (ja) フレキシブル基板アセンブリを準備する方法およびその方法により準備されたフレキシブル基板アセンブリ
TW201106447A (en) Substrate structures applied in flexible electrical devices and fabrication method thereof
CN104377118A (zh) 柔性显示基板的制作方法及柔性显示基板母板
CN102687244A (zh) 使用溶液法制作柔性板的方法
KR20190034524A (ko) 기판을 홀딩하기 위한 홀딩 어레인지먼트, 홀딩 어레인지먼트를 포함하는 캐리어, 캐리어를 이용하는 프로세싱 시스템, 기판을 홀딩하기 위한 방법, 및 기판을 홀딩 어레인지먼트로부터 릴리스하기 위한 방법
JP6783978B2 (ja) 熱硬化性樹脂組成物及び加工フィルムの製造方法
CN102013415A (zh) 应用于柔性电子元件的基板结构及其制造方法
JP2023121715A (ja) 積層体、ウインドウフィルム及びタッチパネル
JP2023121714A (ja) 積層体、ウインドウフィルム及びタッチパネル

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees