JP4897882B2 - 硬質担体を基板に暫定的に取り付ける方法 - Google Patents
硬質担体を基板に暫定的に取り付ける方法 Download PDFInfo
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- JP4897882B2 JP4897882B2 JP2009518611A JP2009518611A JP4897882B2 JP 4897882 B2 JP4897882 B2 JP 4897882B2 JP 2009518611 A JP2009518611 A JP 2009518611A JP 2009518611 A JP2009518611 A JP 2009518611A JP 4897882 B2 JP4897882 B2 JP 4897882B2
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- H01L2224/80948—Thermal treatments, e.g. annealing, controlled cooling
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Description
テン)が含まれる。
用語「分解温度」は、1つ以上の熱分解性材料を含む組成物が、より小さい、より揮発性またはその両方である分子へと分解を開始する温度を意味する。
膜を形成する工程とを含む。
これに代えて、フレキシブル基板14上に一時的材料の膜12を形成するために、一時的材料の溶液の層をフレキシブル基板14の裏面に被覆させ、続いて、上述のように乾燥プロセス、真空乾燥プロセスまたはその両方を行ってもよい。好適には、フレキシブル基板上に一時的材料の膜を形成する場合、溶液のスピンコートを行うことによって溶液の層を形成し、続いて上述のように、層を乾燥させて膜を形成する。
る。例えば、Tgは、次に限定されないが、熱重量分析(TGA)、熱機械分析(TMA)、示差走査熱量分析(DSC)、および動的機械分析(DMA)のうちの1つ以上などの手法を用いて決定できる。従って、この実施形態では、一時的材料の膜12は一時的材料としてのみならず接着物質としても機能する。
好適には、一時的材料の膜は、ポリ(アルキレンカーボネート)、ニトロセルロース、エチルセルロース、ポリ(メチルメタクリレート)、ポリ(ビニルアルコール)、ポリ(ビニルブチリル)、ポリ(イソブチレン)、ポリ(ビニルピロリドン)、微結晶セルロース、ワックス、ポリ(乳酸)、ポリ(ジオキサノン)、ポリ(ヒドロキシブチレート)、ポリ(アクリレート)、ポリ(ベンゾシクロブテン)、およびそれらの混合物からなる群から選択される1つ以上の材料を含む。さらに好適には、一時的材料の膜はポリ(アルキレンカーボネート)、例えば、ポリ(エチレンカーボネート)[QPAC(登録商標)25]、ポリ(プロピレンカーボネート)[QPAC(登録商標)40]、ポリ(ブチレンカーボネート)、またはそれらの混合物を含む。さらに好適には、一時的材料の膜はポリ(プロピレンカーボネート)を含む。ポリ(アルキレンカーボネート)の分解は極めてクリーンであるので、そうした材料は半導体素子の汚染リスクが低いために本発明において有利である。
72gのポリ(プロピレンカーボネート)(QPAC(登録商標)40)を150gの酢酸エチルおよび528gの酢酸ジエチレングリコールモノエチルエーテル(イーストマン社(Eastman)のDE Acetate)へ混合した。これらの材料をまとめ、穏やかに回転させながら24時間溶解させた。溶液の調製後、シリコンウエハの上面に20mlを分配し、400回毎分で20秒間スピンさせた。次いで、スピンさせた材料を120℃で40分間乾燥させ、シリコンウエハの上面上にポリ(プロピレンカーボネート)の膜を形成した。このポリ(プロピレンカーボネート)膜から確実にほぼ完全に溶媒を除去するために、この系を100℃で16時間、真空焼成し、次いで、最後に1時間、180℃で真空焼成した。
シリコンウエハ硬質支持体上のポリ(プロピレンカーボネート)の膜を実施例1に従って調製した。ステンレス鋼フレキシブル基板をシリコンウエハと整合するようにポリ(プロピレンカーボネート)膜の表面上に配置した。次いで、このアセンブリをポリ(プロピレンカーボネート)層がわずかに軟化するまで約120℃〜140℃で加熱し、ステンレス鋼基板と硬質担体とを暫定的に結合させた。
シリコンウエハ硬質支持体上のポリ(プロピレンカーボネート)の膜を実施例1に従って調製した。アルミニウムの層(厚さ約500nm)をポリ(プロピレンカーボネート)膜の表面上にスパッタリングした。次に、両面接着物層をアルミニウム層の上面上に配置し、ステンレス鋼ホイル(Sumitomo、タイプ304。厚さ125μm)を両面接着物層の上側に配置した。
Claims (31)
- フレキシブル基板上で電子回路の組立を行う方法において、
一時的材料を含む膜を硬質担体上またはフレキシブル基板上に形成する膜形成工程であって、前記硬質担体は半導体ウエハである膜形成工程と、
前記フレキシブル基板と前記硬質担体との間に前記膜が配置されるように、前記フレキシブル基板を前記硬質担体へ結合する結合工程と、
前記フレキシブル基板の露出面上で電子回路の組立を行う組立工程と、
組立後、前記硬質担体から前記フレキシブル基板を取り外す取外工程と、を含む方法。 - 膜形成工程は、前記硬質担体または前記フレキシブル基板上に、溶媒中に一時的材料を含む溶液の層を形成する溶液層形成工程と、
前記膜を形成するために前記溶液層を乾燥させる溶液層乾燥工程とを含む請求項1に記載の方法。 - 前記一時的材料は熱分解性ポリマーである請求項1に記載の方法。
- 前記一時的材料は、ポリ(アルキレンカーボネート)、ニトロセルロース、エチルセルロース、ポリ(メチルメタクリレート)、ポリ(ビニルアルコール)、ポリ(ビニルブチリル)、ポリ(イソブチレン)、ポリ(ビニルピロリドン)、微結晶セルロース、ワックス、ポリ(乳酸)、ポリ(ジオキサノン)、ポリ(ヒドロキシブチレート)、ポリ(アクリレート)、ポリ(ベンゾシクロブテン)、およびそれらの混合物からなる群から選択される請求項3に記載の方法。
- 前記一時的材料はポリ(アルキレンカーボネート)またはその混合物である請求項4に記載の方法。
- 前記一時的材料はポリ(プロピレンカーボネート)である請求項5に記載の方法。
- 前記フレキシブル基板はプラスチック基板または金属基板である請求項1に記載の方法
。 - 前記プラスチック基板は、ポリエチレンナフタレート(PEN)、ポリエチレンテレフタレート(PET)、ポリエーテルスルホン(PES)、ポリイミド、ポリカーボネート、環状オレフィンコポリマー、またはこれらの混合物を含む請求項7に記載の方法。
- 前記金属基板は、INVAR、KOVAR、チタン、タンタル、モリブデン、アルクローム、アルミニウム、およびステンレス鋼を含む請求項7に記載の方法。
- 溶液層形成工程は、
前記硬質担体の表面上に前記溶液を分配する工程と、
前記溶液を均一に分散させるために前記硬質担体を回転させる工程とを含む請求項2に記載の方法。 - 溶液層乾燥工程は、80℃〜180℃の範囲の温度で乾燥させる工程を含む請求項2に記載の方法。
- 溶液層乾燥工程は、100℃〜180℃の範囲の温度で真空焼成する工程をさらに含む請求項11に記載の方法。
- 結合工程は、
前記一時的材料の層を軟化状態まで加熱する工程と、
前記フレキシブル基板を前記硬質担体に直に取り付ける工程とを含む請求項1に記載の方法。 - 前記溶液はニトロセルロースまたはエチルセルロースをさらに含む請求項2に記載の方法。
- 結合工程は、
前記膜上に金属層または絶縁層を堆積する工程と、
前記金属層または絶縁層上に両面接着物を配置する工程と、
前記両面接着物上に前記フレキシブル基板を配置する工程とを含む請求項1に記載の方法。 - 前記金属層または絶縁層はアルミニウムを含む金属層である請求項15に記載の方法。
- 前記金属層または絶縁層はSiNまたはSiO2を含む絶縁層である請求項15に記載の方法。
- 取外工程は、前記一時的材料の分解温度以上の温度まで前記一時的材料を加熱する工程を含む請求項1に記載の方法。
- 前記一時的材料は240℃〜300℃の温度まで加熱される請求項18に記載の方法。
- 前記一時的材料は空気中で加熱される請求項18に記載の方法。
- 半導体基板上で電子回路の組立を行う方法であって、
第一の面および第二の面を備えた半導体基板を一時的材料の膜によって硬質担体へ暫定的に取り付ける暫定取付工程を備え、
第一の面は少なくとも1つの電子回路を備え、
前記一時的材料の膜は、前記半導体基板の第一の面と前記硬質担体との間にあり、
前記一時的材料はポリ(アルキレンカーボネート)を含む、方法。 - 前記半導体基板の厚みを減らすために前記半導体基板の第二の面の裏面研磨を行う裏面研磨工程をさらに含む請求項21に記載の方法。
- 裏面研磨工程は機械研磨またはウェットエッチングを含む請求項22に記載の方法。
- 前記硬質担体から前記半導体基板を取り外すために前記一時的材料を加熱する工程をさらに含む請求項22に記載の方法。
- 前記一時的材料は240℃〜300℃の温度まで加熱される請求項24に記載の方法。
- 前記一時的材料は空気の存在下で加熱される請求項24に記載の方法。
- 暫定取付工程は、
一時的材料を含む膜を前記硬質担体上または前記半導体基板上に形成する膜形成工程と、
前記フレキシブル基板と前記硬質担体との間に前記膜が配置されるように、前記半導体基板を前記硬質担体へ結合する結合工程とを含む請求項21に記載の方法。 - 膜形成工程は、
前記硬質担体上または前記半導体基板上に、溶媒中に前記一時的材料を含む溶液の層を形成する溶液層形成工程と、
前記膜を形成するために前記溶液層を乾燥させる溶液乾燥工程とを含む、請求項27に記載の方法。 - 前記ポリ(アルキレンカーボネート)はポリ(プロピレンカーボネート)またはポリ(エチレンカーボネート)である請求項21に記載の方法。
- 前記ポリ(アルキレンカーボネート)はポリ(プロピレンカーボネート)である請求項21に記載の方法。
- 前記硬質担体は半導体基板またはガラスである請求項21に記載の方法。
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EP2041782A1 (en) | 2009-04-01 |
WO2008005979A1 (en) | 2008-01-10 |
KR20090026792A (ko) | 2009-03-13 |
US20150348935A1 (en) | 2015-12-03 |
KR101095159B1 (ko) | 2011-12-16 |
CN101484988B (zh) | 2012-08-08 |
JP2009542035A (ja) | 2009-11-26 |
CN101484988A (zh) | 2009-07-15 |
EP2041782A4 (en) | 2014-03-26 |
SG172621A1 (en) | 2011-07-28 |
US20100297829A1 (en) | 2010-11-25 |
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