JP2011520248A5 - - Google Patents

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Publication number
JP2011520248A5
JP2011520248A5 JP2011504098A JP2011504098A JP2011520248A5 JP 2011520248 A5 JP2011520248 A5 JP 2011520248A5 JP 2011504098 A JP2011504098 A JP 2011504098A JP 2011504098 A JP2011504098 A JP 2011504098A JP 2011520248 A5 JP2011520248 A5 JP 2011520248A5
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JP
Japan
Prior art keywords
flexible substrate
adhesive layer
rigid support
assembly
adhesive
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JP2011504098A
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English (en)
Japanese (ja)
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JP2011520248A (ja
JP5555226B2 (ja
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Priority claimed from PCT/US2009/039577 external-priority patent/WO2009126544A1/en
Publication of JP2011520248A publication Critical patent/JP2011520248A/ja
Publication of JP2011520248A5 publication Critical patent/JP2011520248A5/ja
Application granted granted Critical
Publication of JP5555226B2 publication Critical patent/JP5555226B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011504098A 2008-04-08 2009-04-06 半導体加工中のフレキシブル基板のｗａｒｐおよびｂｏｗを減少させるアセンブリおよび方法 Expired - Fee Related JP5555226B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4322308P 2008-04-08 2008-04-08
US61/043,223 2008-04-08
PCT/US2009/039577 WO2009126544A1 (en) 2008-04-08 2009-04-06 Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing

Publications (3)

Publication Number Publication Date
JP2011520248A JP2011520248A (ja) 2011-07-14
JP2011520248A5 true JP2011520248A5 (enExample) 2012-05-24
JP5555226B2 JP5555226B2 (ja) 2014-07-23

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JP2011504098A Expired - Fee Related JP5555226B2 (ja) 2008-04-08 2009-04-06 半導体加工中のフレキシブル基板のｗａｒｐおよびｂｏｗを減少させるアセンブリおよび方法

Country Status (8)

Country Link
US (1) US8685201B2 (enExample)
EP (1) EP2274162A1 (enExample)
JP (1) JP5555226B2 (enExample)
KR (1) KR101517263B1 (enExample)
CN (1) CN101980861B (enExample)
SG (1) SG188921A1 (enExample)
TW (1) TWI488750B (enExample)
WO (1) WO2009126544A1 (enExample)

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