CN101901788B - 树脂密封型半导体装置及其制造方法 - Google Patents

树脂密封型半导体装置及其制造方法 Download PDF

Info

Publication number
CN101901788B
CN101901788B CN201010113656.6A CN201010113656A CN101901788B CN 101901788 B CN101901788 B CN 101901788B CN 201010113656 A CN201010113656 A CN 201010113656A CN 101901788 B CN101901788 B CN 101901788B
Authority
CN
China
Prior art keywords
resin
microspheres
semiconductor device
semiconductor element
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010113656.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN101901788A (zh
Inventor
木村纪幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ablic Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of CN101901788A publication Critical patent/CN101901788A/zh
Application granted granted Critical
Publication of CN101901788B publication Critical patent/CN101901788B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H10W72/07504—Connecting or disconnecting of bond wires using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201010113656.6A 2009-02-06 2010-02-05 树脂密封型半导体装置及其制造方法 Expired - Fee Related CN101901788B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009026507 2009-02-06
JP2009-026507 2009-02-06
JP2009258415A JP5588150B2 (ja) 2009-02-06 2009-11-11 樹脂封止型半導体装置
JP2009-258415 2009-11-11

Publications (2)

Publication Number Publication Date
CN101901788A CN101901788A (zh) 2010-12-01
CN101901788B true CN101901788B (zh) 2014-10-29

Family

ID=42539745

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010113656.6A Expired - Fee Related CN101901788B (zh) 2009-02-06 2010-02-05 树脂密封型半导体装置及其制造方法

Country Status (5)

Country Link
US (2) US8703532B2 (https=)
JP (1) JP5588150B2 (https=)
KR (1) KR101665963B1 (https=)
CN (1) CN101901788B (https=)
TW (1) TWI478296B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5642473B2 (ja) 2010-09-22 2014-12-17 セイコーインスツル株式会社 Ｂｇａ半導体パッケージおよびその製造方法
CN102786028B (zh) * 2012-07-17 2015-05-06 西南交通大学 一种用于大面积摩擦诱导微/纳米加工的多针尖阵列的制作方法
CN102832141A (zh) * 2012-08-18 2012-12-19 孙青秀 一种基于框架的无载体式封装件的制作工艺
US9711479B2 (en) 2013-07-03 2017-07-18 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
DE102015212177A1 (de) * 2015-06-30 2017-01-05 Osram Gmbh Schaltungsträger für eine elektronische Schaltung und Verfahren zum Herstellen eines derartigen Schaltungsträgers
CN105489509A (zh) * 2015-12-25 2016-04-13 华天科技（西安）有限公司 应用钢网印刷技术优化点胶工艺的光学传感芯片封装方法
CN110517963A (zh) * 2019-09-05 2019-11-29 合肥矽迈微电子科技有限公司 一种环膜结构注塑工艺
WO2021049235A1 (ja) * 2019-09-13 2021-03-18 昭和電工株式会社 積層体およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1638194A (zh) * 2004-01-07 2005-07-13 日立化成工业株式会社 电路连接用粘接薄膜和电路连接结构体

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3129169B2 (ja) * 1995-11-08 2001-01-29 富士通株式会社 半導体装置及びその製造方法
KR100332378B1 (ko) * 1999-09-11 2002-04-12 이병구 반도체 패키지의 솔더볼 마운팅 방법
JP3823651B2 (ja) * 2000-01-05 2006-09-20 松下電器産業株式会社 樹脂封止型半導体装置の製造方法
JP2001230270A (ja) * 2000-02-14 2001-08-24 Fujitsu Ltd 半導体装置及びその製造方法
JP3626075B2 (ja) 2000-06-20 2005-03-02 九州日立マクセル株式会社 半導体装置の製造方法
US20020033527A1 (en) * 2000-09-19 2002-03-21 Siliconware Precision Industries Co., Ltd. Semiconductor device and manufacturing process thereof
US7297572B2 (en) * 2001-09-07 2007-11-20 Hynix Semiconductor, Inc. Fabrication method for electronic system modules
JP4014912B2 (ja) * 2001-09-28 2007-11-28 株式会社ルネサステクノロジ 半導体装置
CN1477703A (zh) * 2002-08-02 2004-02-25 ǧס������ҵ��ʽ���� 焊球组件及其生产方法，形成焊块的方法
JP2004319577A (ja) * 2003-04-11 2004-11-11 Dainippon Printing Co Ltd 樹脂封止型半導体装置とその製造方法、および積層型樹脂封止型半導体装置
US7056766B2 (en) * 2003-12-09 2006-06-06 Freescale Semiconductor, Inc. Method of forming land grid array packaged device
KR20050079399A (ko) * 2004-02-05 2005-08-10 삼성전자주식회사 이방성도전필름 및 범프와, 이를 갖는 반도체 칩의 실장구조체
US7205178B2 (en) * 2004-03-24 2007-04-17 Freescale Semiconductor, Inc. Land grid array packaged device and method of forming same
JP2006066521A (ja) * 2004-08-25 2006-03-09 Fujitsu Ltd 半導体装置及び半導体装置の製造方法
US8169067B2 (en) * 2006-10-20 2012-05-01 Broadcom Corporation Low profile ball grid array (BGA) package with exposed die and method of making same
KR100792663B1 (ko) * 2006-12-01 2008-01-09 주식회사 동부하이텍 다층구조의 금속층으로 적층된 전자패키지용 플라스틱솔더볼의 제조방법 및 그로부터 제조된 플라스틱 솔더볼
US20080308935A1 (en) * 2007-06-18 2008-12-18 Samsung Electronics Co., Ltd. Semiconductor chip package, semiconductor package including semiconductor chip package, and method of fabricating semiconductor package
US8501088B2 (en) * 2007-07-25 2013-08-06 Nippon Steel & Sumikin Materials Co., Ltd. Solder alloy, solder ball and electronic member having solder bump

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1638194A (zh) * 2004-01-07 2005-07-13 日立化成工业株式会社 电路连接用粘接薄膜和电路连接结构体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2006-66521A 2006.03.09

Also Published As

Publication number Publication date
US20100200982A1 (en) 2010-08-12
US9490224B2 (en) 2016-11-08
US20140117544A1 (en) 2014-05-01
TWI478296B (zh) 2015-03-21
KR101665963B1 (ko) 2016-10-24
KR20100090666A (ko) 2010-08-16
CN101901788A (zh) 2010-12-01
JP2010206162A (ja) 2010-09-16
TW201036118A (en) 2010-10-01
US8703532B2 (en) 2014-04-22
JP5588150B2 (ja) 2014-09-10

Similar Documents

Publication Publication Date Title
CN101901788B (zh) 树脂密封型半导体装置及其制造方法
US9245864B2 (en) Ball grid array semiconductor package and method of manufacturing the same
JP2000243887A (ja) 半導体装置とその製造方法
CN1441492A (zh) 电子元件及其它的制造方法
CN1231971C (zh) 表面安装型片式半导体器件和制造方法
JP2010062316A (ja) 半導体装置及び半導体装置の製造方法
JPWO2007052476A1 (ja) 電子回路装置およびその製造方法
CN102804363B (zh) 半导体装置及半导体装置的制造方法
US20050158917A1 (en) Manufacturing method for resin sealed semiconductor device
JP4334047B2 (ja) 半導体装置とその製造方法
CN113725721A (zh) 半导体侧发射式激光器的引线框架封装及其制造方法
JP2956659B2 (ja) 半導体装置およびそのリードフレーム
CN101310379A (zh) 半导体器件及其制造方法
JP4979661B2 (ja) 半導体装置の製造方法
KR100831481B1 (ko) 반도체 장치와 그것을 이용한 반도체 패키지 및 회로 장치
JP4305326B2 (ja) 半導体パッケージの製造方法
JP2001110847A (ja) 電子部品の保持治具、保持方法および電子部品の製造方法
JP4409528B2 (ja) 半導体装置
JP2002184547A (ja) 電気コネクタの製造方法
JP2006073689A (ja) 基板の製造方法及び半導体パッケージの製造方法
JP2006202977A (ja) 基板及び基板の製造方法、並びに半導体パッケージ及び半導体パッケージの製造方法
JP2006196667A (ja) 半導体パッケージの製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160324

Address after: Chiba County, Japan

Patentee after: DynaFine Semiconductor Co.,Ltd.

Address before: Chiba County, Japan

Patentee before: Seiko Instruments Inc.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Chiba County, Japan

Patentee after: ABLIC Inc.

Address before: Chiba County, Japan

Patentee before: DynaFine Semiconductor Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141029

Termination date: 20220205