CN101852992B - 光学位置确定设备及方法 - Google Patents

光学位置确定设备及方法 Download PDF

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Publication number
CN101852992B
CN101852992B CN2010101134518A CN201010113451A CN101852992B CN 101852992 B CN101852992 B CN 101852992B CN 2010101134518 A CN2010101134518 A CN 2010101134518A CN 201010113451 A CN201010113451 A CN 201010113451A CN 101852992 B CN101852992 B CN 101852992B
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China
Prior art keywords
substrate
alignment mark
alignment
detector
detectors
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Expired - Lifetime
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CN2010101134518A
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English (en)
Chinese (zh)
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CN101852992A (zh
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C·Q·桂
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ASML Netherlands BV
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ASML Netherlands BV
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2010101134518A 2004-10-28 2005-10-27 光学位置确定设备及方法 Expired - Lifetime CN101852992B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/975,183 US7388663B2 (en) 2004-10-28 2004-10-28 Optical position assessment apparatus and method
US10/975183 2004-10-28
US10/975,183 2004-10-28

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2005101185152A Division CN1766740B (zh) 2004-10-28 2005-10-27 光学位置确定设备及方法

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Publication Number Publication Date
CN101852992A CN101852992A (zh) 2010-10-06
CN101852992B true CN101852992B (zh) 2013-01-09

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CN2010101134518A Expired - Lifetime CN101852992B (zh) 2004-10-28 2005-10-27 光学位置确定设备及方法
CN2005101185152A Expired - Lifetime CN1766740B (zh) 2004-10-28 2005-10-27 光学位置确定设备及方法

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Country Link
US (1) US7388663B2 (enExample)
EP (1) EP1653288B1 (enExample)
JP (4) JP4310302B2 (enExample)
KR (1) KR100806280B1 (enExample)
CN (2) CN101852992B (enExample)
SG (3) SG147421A1 (enExample)
TW (2) TW200921304A (enExample)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7388663B2 (en) * 2004-10-28 2008-06-17 Asml Netherlands B.V. Optical position assessment apparatus and method
WO2006076151A2 (en) * 2004-12-21 2006-07-20 Carnegie Mellon University Lithography and associated methods, devices, and systems
US7459247B2 (en) * 2004-12-27 2008-12-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4533777B2 (ja) * 2005-02-28 2010-09-01 富士フイルム株式会社 シート体位置検出方法及び装置並びにそれを用いた描画装置
US8411271B2 (en) * 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
EP1983555B1 (en) * 2006-01-19 2014-05-28 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus and device manufacturing method
JP5115859B2 (ja) 2006-02-21 2013-01-09 株式会社ニコン パターン形成装置、露光装置及び露光方法、並びにデバイス製造方法
EP3267259A1 (en) 2006-02-21 2018-01-10 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
KR101495471B1 (ko) * 2006-02-21 2015-02-23 가부시키가이샤 니콘 패턴 형성 장치, 마크 검출 장치, 노광 장치, 패턴 형성 방법, 노광 방법 및 디바이스 제조 방법
US7525671B2 (en) * 2006-04-11 2009-04-28 Micronic Laser Systems Ab Registration method and apparatus therefor
EP2071611B1 (en) * 2006-08-31 2019-05-01 Nikon Corporation Mobile body drive system and mobile body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision method
EP2990872B1 (en) * 2006-08-31 2017-12-13 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
KR101585370B1 (ko) * 2006-08-31 2016-01-14 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
CN101405837B (zh) 2006-09-01 2012-08-29 株式会社尼康 移动体驱动方法、图案形成方法、曝光方法以及组件制造方法
TWI622084B (zh) 2006-09-01 2018-04-21 Nikon Corp Mobile body driving method, moving body driving system, pattern forming method and device, exposure method and device, component manufacturing method, and correction method
DE102006059818B4 (de) * 2006-12-11 2017-09-14 Kleo Ag Belichtungsanlage
US20090042139A1 (en) * 2007-04-10 2009-02-12 Nikon Corporation Exposure method and electronic device manufacturing method
US20090042115A1 (en) * 2007-04-10 2009-02-12 Nikon Corporation Exposure apparatus, exposure method, and electronic device manufacturing method
US20080270970A1 (en) * 2007-04-27 2008-10-30 Nikon Corporation Method for processing pattern data and method for manufacturing electronic device
WO2009150901A1 (ja) * 2008-06-09 2009-12-17 シャープ株式会社 露光装置および露光方法
US8432548B2 (en) * 2008-11-04 2013-04-30 Molecular Imprints, Inc. Alignment for edge field nano-imprinting
JP5381029B2 (ja) * 2008-11-10 2014-01-08 ウシオ電機株式会社 露光装置
DE102009032210B4 (de) * 2009-07-03 2011-06-09 Kleo Ag Bearbeitungsanlage
WO2011090057A1 (ja) * 2010-01-21 2011-07-28 シャープ株式会社 基板、基板に対する露光方法、光配向処理方法
NL2005975A (en) 2010-03-03 2011-09-06 Asml Netherlands Bv Imprint lithography.
WO2012008944A1 (en) 2010-07-12 2012-01-19 Otis Elevator Company Speed and position detection system
NL2007155A (en) 2010-08-25 2012-02-28 Asml Netherlands Bv Stage apparatus, lithographic apparatus and method of positioning an object table.
JP5793236B2 (ja) * 2011-03-29 2015-10-14 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィにおける放射ビームスポットの位置の測定
KR101326107B1 (ko) * 2011-12-20 2013-11-06 삼성디스플레이 주식회사 레이저 가공장치 및 그 제어방법
CN102654387B (zh) * 2012-05-25 2014-07-02 南京理工大学 一种基于空间曲面约束的工业机器人在线标定装置及其实现方法
CN102706277B (zh) * 2012-05-25 2014-11-05 南京理工大学 一种基于全方位点约束的工业机器人在线零位标定装置及方法
CN104102092A (zh) * 2013-04-11 2014-10-15 常熟晶悦半导体设备有限公司 一种具有自动对准系统的四曝光头光学曝光机
JP5605770B2 (ja) * 2013-05-20 2014-10-15 株式会社ニコン 表示素子の製造方法、及び表示素子の製造装置
JP6228420B2 (ja) * 2013-10-08 2017-11-08 キヤノン株式会社 検出装置、リソグラフィ装置、および物品の製造方法
KR102419494B1 (ko) * 2014-09-29 2022-07-12 삼성디스플레이 주식회사 마스크리스 노광 장치, 마스크리스 노광 방법 및 이에 의해 제조되는 표시 기판
KR102255033B1 (ko) * 2015-01-13 2021-05-25 삼성디스플레이 주식회사 마스크리스 노광 장치 및 이를 이용한 마스크리스 노광 방법
TWI753865B (zh) * 2015-11-03 2022-02-01 以色列商奧寶科技有限公司 用於高解析度電子圖案化的無針跡直接成像
US10707107B2 (en) 2015-12-16 2020-07-07 Kla-Tencor Corporation Adaptive alignment methods and systems
KR102556130B1 (ko) * 2016-09-27 2023-07-14 가부시키가이샤 니콘 결정 방법 및 장치, 프로그램, 정보 기록 매체, 노광 장치, 레이아웃 정보 제공 방법, 레이아웃 방법, 마크 검출 방법, 노광 방법, 그리고 디바이스 제조 방법
CN108121162B (zh) * 2016-11-29 2019-09-17 上海微电子装备（集团）股份有限公司 一种投影曝光装置及曝光方法
EP3339959A1 (en) 2016-12-23 2018-06-27 ASML Netherlands B.V. Method of determining a position of a feature
JP6447845B2 (ja) * 2017-04-18 2019-01-09 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
US11152238B2 (en) * 2017-11-30 2021-10-19 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor processing stage profiler jig
JP7045890B2 (ja) * 2018-03-20 2022-04-01 株式会社Ｓｃｒｅｅｎホールディングス パターン描画装置およびパターン描画方法
CN110296666B (zh) * 2018-03-23 2021-04-20 泓邦科技有限公司 三维量测器件
JP2019045875A (ja) * 2018-12-07 2019-03-22 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
CN112445088B (zh) * 2020-12-04 2025-10-10 百及纳米科技(上海)有限公司 一种步进式光刻机、其工作方法及图形对准装置
US12379676B2 (en) * 2022-03-12 2025-08-05 Applied Materials, Inc. Package imaging for die location correction in digital lithography
WO2025224801A1 (ja) * 2024-04-22 2025-10-30 株式会社ニコン 露光方法、基板処理方法、及び露光装置
WO2025233103A1 (en) * 2024-05-10 2025-11-13 Asml Netherlands B.V. Fixed parallel alignment sensors in combination with fast scanning
WO2025242414A1 (en) * 2024-05-21 2025-11-27 Asml Netherlands B.V. Substrate alignment system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220176A (en) * 1991-09-13 1993-06-15 Nikon Corporation Apparatus and method for detecting alignment marks having alignment optical systems' driving means
EP0715214A1 (en) * 1994-11-29 1996-06-05 Ushiodenki Kabushiki Kaisha Process for positioning a mask relative to a workpiece and device for carrying out the process
EP0786702A2 (en) * 1996-01-11 1997-07-30 Ushiodenki Kabushiki Kaisha Process for pattern searching and a device for positioning of a mask to a workpiece
CN1333554A (zh) * 2001-07-26 2002-01-30 清华大学 阵列式光探针扫描集成电路光刻系统中的对准方法及其装置
CN1459671A (zh) * 2002-05-22 2003-12-03 尼康株式会社 曝光方法、曝光装置及元件制造方法

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079877B2 (ja) * 1986-07-11 1995-02-01 株式会社ニコン アライメント装置
US5523193A (en) 1988-05-31 1996-06-04 Texas Instruments Incorporated Method and apparatus for patterning and imaging member
GB8827952D0 (en) * 1988-11-30 1989-01-05 Screen Form Inc Display device
JPH02242259A (ja) * 1989-03-15 1990-09-26 Toppan Printing Co Ltd 基板露光における見当合わせ方法及びその装置
WO1991017483A1 (de) 1990-05-02 1991-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Belichtungsvorrichtung
JP3031993B2 (ja) * 1990-11-05 2000-04-10 株式会社東芝 Ｘ線露光装置
US5229872A (en) 1992-01-21 1993-07-20 Hughes Aircraft Company Exposure device including an electrically aligned electronic mask for micropatterning
US6219015B1 (en) 1992-04-28 2001-04-17 The Board Of Directors Of The Leland Stanford, Junior University Method and apparatus for using an array of grating light valves to produce multicolor optical images
JP3224041B2 (ja) 1992-07-29 2001-10-29 株式会社ニコン 露光方法及び装置
US5496407A (en) * 1993-04-19 1996-03-05 Mcaleavey; Michael E. System and method for monitoring and controlling thickness
US5729331A (en) 1993-06-30 1998-03-17 Nikon Corporation Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus
US5614988A (en) * 1993-12-06 1997-03-25 Nikon Corporation Projection exposure apparatus and method with a plurality of projection optical units
JP3339149B2 (ja) 1993-12-08 2002-10-28 株式会社ニコン 走査型露光装置ならびに露光方法
KR100377887B1 (ko) * 1994-02-10 2003-06-18 가부시키가이샤 니콘 정렬방법
US5492601A (en) * 1994-07-29 1996-02-20 Wangner Systems Corporation Laser apparatus and method for monitoring the de-watering of stock on papermaking machines
KR100381629B1 (ko) * 1994-08-16 2003-08-21 가부시키가이샤 니콘 노광장치
US5546808A (en) * 1994-09-06 1996-08-20 Harris Instrument Corporation Apparatus and method for binocular measurement system
JP3050498B2 (ja) * 1994-10-17 2000-06-12 日立電子エンジニアリング株式会社 位置ずれ量測定光学系の調整方法および位置ずれ量測定装置
KR100399813B1 (ko) * 1994-12-14 2004-06-09 가부시키가이샤 니콘 노광장치
US5677703A (en) 1995-01-06 1997-10-14 Texas Instruments Incorporated Data loading circuit for digital micro-mirror device
US5530482A (en) 1995-03-21 1996-06-25 Texas Instruments Incorporated Pixel data processing for spatial light modulator having staggered pixels
JP2994232B2 (ja) 1995-07-28 1999-12-27 ウシオ電機株式会社 マスクとマスクまたはマスクとワークの位置合わせ方法および装置
US6133986A (en) 1996-02-28 2000-10-17 Johnson; Kenneth C. Microlens scanner for microlithography and wide-field confocal microscopy
DE69711929T2 (de) 1997-01-29 2002-09-05 Micronic Laser Systems Ab, Taeby Verfahren und gerät zur erzeugung eines musters auf einem mit fotoresist beschichteten substrat mittels fokusiertem laserstrahl
US6177980B1 (en) 1997-02-20 2001-01-23 Kenneth C. Johnson High-throughput, maskless lithography system
SE509062C2 (sv) 1997-02-28 1998-11-30 Micronic Laser Systems Ab Dataomvandlingsmetod för en laserskrivare med flera strålar för mycket komplexa mikrokolitografiska mönster
US5982553A (en) 1997-03-20 1999-11-09 Silicon Light Machines Display device incorporating one-dimensional grating light-valve array
JP4029130B2 (ja) 1997-06-03 2008-01-09 株式会社ニコン 露光装置及び露光方法
US5956134A (en) * 1997-07-11 1999-09-21 Semiconductor Technologies & Instruments, Inc. Inspection system and method for leads of semiconductor devices
IL135139A0 (en) * 1997-09-19 2001-05-20 Nikon Corp Stage apparatus, scanning type exposure apparatus, and device produced with the same
SE9800665D0 (sv) 1998-03-02 1998-03-02 Micronic Laser Systems Ab Improved method for projection printing using a micromirror SLM
US6261728B1 (en) * 1998-10-19 2001-07-17 Vanguard International Semiconductor Corporation Mask image scanning exposure method
JP2001033976A (ja) * 1999-07-21 2001-02-09 Nikon Corp 位置合わせ装置、位置合わせ方法および露光装置
JP2001118773A (ja) * 1999-10-18 2001-04-27 Nikon Corp ステージ装置及び露光装置
US6355994B1 (en) * 1999-11-05 2002-03-12 Multibeam Systems, Inc. Precision stage
KR100827874B1 (ko) 2000-05-22 2008-05-07 가부시키가이샤 니콘 노광 장치, 노광 장치의 제조 방법, 노광 방법, 마이크로 장치의 제조 방법, 및 디바이스의 제조 방법
JP3563384B2 (ja) 2001-11-08 2004-09-08 大日本スクリーン製造株式会社 画像記録装置
JP2004012903A (ja) 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 露光装置
KR100545297B1 (ko) 2002-06-12 2006-01-24 에이에스엠엘 네델란즈 비.브이. 리소그래피장치 및 디바이스 제조방법
US6870554B2 (en) 2003-01-07 2005-03-22 Anvik Corporation Maskless lithography with multiplexed spatial light modulators
SE0300453D0 (sv) * 2003-02-20 2003-02-20 Micronic Laser Systems Ab Pattern generation method
JP2004272167A (ja) * 2003-03-12 2004-09-30 Dainippon Printing Co Ltd パターン形成装置、パターン形成方法、基材
US6950188B2 (en) * 2003-04-23 2005-09-27 International Business Machines Corporation Wafer alignment system using parallel imaging detection
EP1482373A1 (en) 2003-05-30 2004-12-01 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP3860582B2 (ja) * 2003-07-31 2006-12-20 株式会社東芝 半導体装置の製造方法
US7388663B2 (en) * 2004-10-28 2008-06-17 Asml Netherlands B.V. Optical position assessment apparatus and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220176A (en) * 1991-09-13 1993-06-15 Nikon Corporation Apparatus and method for detecting alignment marks having alignment optical systems' driving means
EP0715214A1 (en) * 1994-11-29 1996-06-05 Ushiodenki Kabushiki Kaisha Process for positioning a mask relative to a workpiece and device for carrying out the process
EP0786702A2 (en) * 1996-01-11 1997-07-30 Ushiodenki Kabushiki Kaisha Process for pattern searching and a device for positioning of a mask to a workpiece
CN1333554A (zh) * 2001-07-26 2002-01-30 清华大学 阵列式光探针扫描集成电路光刻系统中的对准方法及其装置
CN1459671A (zh) * 2002-05-22 2003-12-03 尼康株式会社 曝光方法、曝光装置及元件制造方法

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CN101852992A (zh) 2010-10-06
SG172672A1 (en) 2011-07-28
JP5238771B2 (ja) 2013-07-17
JP2006128693A (ja) 2006-05-18
TW200627096A (en) 2006-08-01
CN1766740A (zh) 2006-05-03
SG121953A1 (en) 2006-05-26
JP2010268005A (ja) 2010-11-25
KR100806280B1 (ko) 2008-02-22
JP4310302B2 (ja) 2009-08-05
SG147421A1 (en) 2008-11-28
TWI326015B (en) 2010-06-11
US20060092419A1 (en) 2006-05-04
JP2013047850A (ja) 2013-03-07
JP2009010420A (ja) 2009-01-15
CN1766740B (zh) 2010-05-05
US7388663B2 (en) 2008-06-17
EP1653288A1 (en) 2006-05-03
JP5554819B2 (ja) 2014-07-23
TW200921304A (en) 2009-05-16
JP4648442B2 (ja) 2011-03-09
EP1653288B1 (en) 2019-05-15
KR20060052321A (ko) 2006-05-19

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