CN101755328B - 电子器件用胶粘剂 - Google Patents

电子器件用胶粘剂 Download PDF

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Publication number
CN101755328B
CN101755328B CN200880024920XA CN200880024920A CN101755328B CN 101755328 B CN101755328 B CN 101755328B CN 200880024920X A CN200880024920X A CN 200880024920XA CN 200880024920 A CN200880024920 A CN 200880024920A CN 101755328 B CN101755328 B CN 101755328B
Authority
CN
China
Prior art keywords
adhesive
value
mentioned
inorganic fine
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880024920XA
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English (en)
Chinese (zh)
Other versions
CN101755328A (zh
Inventor
早川明伸
石泽英亮
竹田幸平
增井良平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN101755328A publication Critical patent/CN101755328A/zh
Application granted granted Critical
Publication of CN101755328B publication Critical patent/CN101755328B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
CN200880024920XA 2007-07-19 2008-07-17 电子器件用胶粘剂 Expired - Fee Related CN101755328B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP188623/2007 2007-07-19
JP2007188623 2007-07-19
PCT/JP2008/062906 WO2009011383A1 (ja) 2007-07-19 2008-07-17 電子部品用接着剤

Publications (2)

Publication Number Publication Date
CN101755328A CN101755328A (zh) 2010-06-23
CN101755328B true CN101755328B (zh) 2011-08-31

Family

ID=40259715

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880024920XA Expired - Fee Related CN101755328B (zh) 2007-07-19 2008-07-17 电子器件用胶粘剂

Country Status (6)

Country Link
US (1) US7838577B2 (OSRAM)
JP (1) JP4376957B2 (OSRAM)
KR (1) KR100988184B1 (OSRAM)
CN (1) CN101755328B (OSRAM)
TW (1) TW200911946A (OSRAM)
WO (1) WO2009011383A1 (OSRAM)

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US6962940B2 (en) 2002-03-20 2005-11-08 Celgene Corporation (+)-2-[1-(3-Ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4-acetylaminoisoindoline-1,3-dione: methods of using and compositions thereof
TWI435887B (zh) * 2008-02-26 2014-05-01 Toray Industries 環氧樹脂組成物、預浸透物及纖維強化複合材料
TWI481685B (zh) * 2009-01-29 2015-04-21 積水化學工業股份有限公司 Adhesive for electronic parts
KR102032749B1 (ko) 2010-04-16 2019-10-16 에스더블유아이엠씨 엘엘씨 패키징 용품을 위한 코팅 조성물 및 코팅 방법
JP5527816B2 (ja) * 2010-06-22 2014-06-25 信越化学工業株式会社 ダイボンド剤組成物及び半導体装置。
WO2012161758A2 (en) 2011-02-07 2012-11-29 Valspar Sourcing, Inc. Coating compositions for containers and other articles and methods of coating
DE112012004032A5 (de) * 2011-09-27 2014-07-24 Rupprecht Gabriel Elektrisch isolierendes Harz-Gehäuse für Halbleiterbauelemente oder Baugruppen und Herstellungsverfahren mit einem Mold-Prozess
RU2618704C2 (ru) 2012-08-09 2017-05-11 Вэлспар Сорсинг, Инк. Композиции для контейнеров и других изделий и способы их применения
AU2013300118B2 (en) 2012-08-09 2017-07-13 Swimc Llc Container coating system
EP3131965B1 (en) 2014-04-14 2024-06-12 Swimc Llc Methods of preparing compositions for containers and other articles and methods of using same
WO2016010067A1 (ja) 2014-07-18 2016-01-21 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
WO2016088832A1 (ja) * 2014-12-04 2016-06-09 積水化学工業株式会社 硬化性組成物、硬化性組成物の製造方法及び半導体装置
JP2017041633A (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
KR102195623B1 (ko) * 2016-03-30 2020-12-28 세키스이가가쿠 고교가부시키가이샤 인덕터용 접착제 및 인덕터
JP7028545B2 (ja) * 2016-03-30 2022-03-02 株式会社日本触媒 ブロック共重合体及び樹脂組成物
KR102268270B1 (ko) * 2018-01-23 2021-06-23 주식회사 엘지화학 접착제 조성물
KR102573694B1 (ko) 2018-12-17 2023-09-04 닛폰세이테츠 가부시키가이샤 적층 코어 및 회전 전기 기기
JP7418350B2 (ja) 2018-12-17 2024-01-19 日本製鉄株式会社 ステータ用接着積層コアおよび回転電機
TWI725670B (zh) 2018-12-17 2021-04-21 日商日本製鐵股份有限公司 積層鐵芯、其製造方法及旋轉電機
WO2020129937A1 (ja) 2018-12-17 2020-06-25 日本製鉄株式会社 積層コアおよび回転電機
SG11202108923TA (en) 2018-12-17 2021-09-29 Nippon Steel Corp Laminated core, laminated core manufacturing method, and electric motor
JP7576981B2 (ja) 2018-12-17 2024-11-01 日本製鉄株式会社 積層コアおよび回転電機
EA202192063A1 (ru) 2018-12-17 2021-11-24 Ниппон Стил Корпорейшн Шихтованный сердечник и электродвигатель
WO2020129928A1 (ja) 2018-12-17 2020-06-25 日本製鉄株式会社 積層コアおよび回転電機
JP6863525B2 (ja) 2018-12-17 2021-04-21 日本製鉄株式会社 積層コアおよび回転電機
RS65460B1 (sr) 2018-12-17 2024-05-31 Nippon Steel Corp Laminirano jezgro i električni motor
CA3131675C (en) 2018-12-17 2024-04-16 Nippon Steel Corporation Adhesively-laminated core for stator, method of manufacturing same, and electric motor
EA202192064A1 (ru) 2018-12-17 2021-11-24 Ниппон Стил Корпорейшн Шихтованный сердечник и электродвигатель
WO2020129923A1 (ja) 2018-12-17 2020-06-25 日本製鉄株式会社 積層コアおよび回転電機
EP3902121B1 (en) 2018-12-17 2025-08-13 Nippon Steel Corporation Adhesively laminated core for stator and electric motor
JP6940007B2 (ja) 2018-12-17 2021-09-22 日本製鉄株式会社 積層コア、コアブロック、回転電機およびコアブロックの製造方法
JP7207429B2 (ja) 2018-12-17 2023-01-18 日本製鉄株式会社 接着積層コア、その製造方法及び回転電機
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JP2006181838A (ja) * 2004-12-27 2006-07-13 Fuji Photo Film Co Ltd 平版印刷版原版
CN101103314B (zh) * 2005-10-26 2010-11-24 佳能株式会社 调色剂
JP2007169448A (ja) 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
US7915743B2 (en) * 2006-07-20 2011-03-29 Sekisui Chemical Co., Ltd. Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device

Non-Patent Citations (2)

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JP特开2007-169448A 2007.07.05

Also Published As

Publication number Publication date
US7838577B2 (en) 2010-11-23
KR20100018624A (ko) 2010-02-17
KR100988184B1 (ko) 2010-10-18
CN101755328A (zh) 2010-06-23
TW200911946A (en) 2009-03-16
WO2009011383A1 (ja) 2009-01-22
JP4376957B2 (ja) 2009-12-02
US20100197830A1 (en) 2010-08-05
JPWO2009011383A1 (ja) 2010-09-24
TWI321148B (OSRAM) 2010-03-01

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110831