CN101715474A - 电沉积涂料组合物和电沉积方法 - Google Patents
电沉积涂料组合物和电沉积方法 Download PDFInfo
- Publication number
- CN101715474A CN101715474A CN200880015140A CN200880015140A CN101715474A CN 101715474 A CN101715474 A CN 101715474A CN 200880015140 A CN200880015140 A CN 200880015140A CN 200880015140 A CN200880015140 A CN 200880015140A CN 101715474 A CN101715474 A CN 101715474A
- Authority
- CN
- China
- Prior art keywords
- coating composition
- electrodeposition coating
- type electrodeposition
- block copolymerization
- described suspension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
- C09D5/4484—Anodic paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/10—Block or graft copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/04—Electrophoretic coating characterised by the process with organic material
- C25D13/06—Electrophoretic coating characterised by the process with organic material with polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Paints Or Removers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 比较例1 | 比较例2 | 比较例3 | |
膜厚度(μm) | 28 | 52 | 18 | 30 | 32 | 22 | 11 | 15 |
耐热性指数 | C类 | C类 | C类 | C类 | C类 | F类 | C类 | C类 |
膜伸长率(%) | 7.2 | 5.3 | 5.5 | 6.4 | 6 | 0.9 | 0.2 | 1 |
AC-耐电压性 | ○ | ○ | ○ | ○ | ○ | × | × | × |
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007122723 | 2007-05-07 | ||
JP122723/2007 | 2007-05-07 | ||
PCT/JP2008/058462 WO2008139990A1 (ja) | 2007-05-07 | 2008-05-07 | 電着塗料組成物及び電着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101715474A true CN101715474A (zh) | 2010-05-26 |
CN101715474B CN101715474B (zh) | 2013-01-02 |
Family
ID=40002190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800151409A Active CN101715474B (zh) | 2007-05-07 | 2008-05-07 | 电沉积涂料组合物和电沉积方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8372257B2 (zh) |
JP (1) | JP5513109B2 (zh) |
KR (1) | KR101423806B1 (zh) |
CN (1) | CN101715474B (zh) |
DE (1) | DE112008001233T5 (zh) |
TW (1) | TWI441878B (zh) |
WO (1) | WO2008139990A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107709632A (zh) * | 2015-07-02 | 2018-02-16 | 三菱综合材料株式会社 | 水分散型绝缘覆膜形成用电沉积液 |
CN108475562A (zh) * | 2015-12-16 | 2018-08-31 | 三菱综合材料株式会社 | 耐热性绝缘电线与用于形成其绝缘层的电沉积液 |
CN110205659A (zh) * | 2019-07-17 | 2019-09-06 | 广州三孚新材料科技股份有限公司 | 一种电镀锡添加剂及其制备方法 |
CN110234717A (zh) * | 2017-02-16 | 2019-09-13 | 三菱综合材料株式会社 | 电沉积液及使用了该电沉积液的带绝缘覆膜的导体的制造方法 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4771100B2 (ja) * | 2008-08-27 | 2011-09-14 | 信越化学工業株式会社 | 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物 |
JP5399685B2 (ja) * | 2008-10-31 | 2014-01-29 | 三菱電線工業株式会社 | リード線付き電子部品およびリード線の絶縁被覆方法 |
JP5551523B2 (ja) * | 2010-06-10 | 2014-07-16 | 三菱電線工業株式会社 | ポリイミド電着塗料の製造方法 |
JP5555063B2 (ja) * | 2010-06-10 | 2014-07-23 | 三菱電線工業株式会社 | ポリイミド電着塗料及びその製造方法 |
JP5657417B2 (ja) * | 2011-02-16 | 2015-01-21 | 三菱電線工業株式会社 | 電着方法及び電着装置 |
JP5706268B2 (ja) * | 2011-08-10 | 2015-04-22 | 三菱電線工業株式会社 | 電着塗料組成物及びそれを用いた絶縁部材 |
US9870844B2 (en) | 2012-11-27 | 2018-01-16 | Ppg Industries Ohio, Inc. | Methods of coating an electrically conductive substrate and related electrodepositable compositions |
US10763490B2 (en) | 2011-09-30 | 2020-09-01 | Ppg Industries Ohio, Inc. | Methods of coating an electrically conductive substrate and related electrodepositable compositions including graphenic carbon particles |
JP5924836B2 (ja) * | 2011-10-24 | 2016-05-25 | 国立研究開発法人理化学研究所 | 高温超伝導被覆線及びそれを有する高温超伝導コイル |
TW201329448A (zh) * | 2012-01-13 | 2013-07-16 | Nat Univ Tsing Hua | 工作電極、製造工作電極的方法及感測晶片 |
JP2013234257A (ja) * | 2012-05-08 | 2013-11-21 | Mitsubishi Cable Ind Ltd | 電着塗料組成物および電着方法、ならびに絶縁部材 |
JP5978842B2 (ja) * | 2012-08-03 | 2016-08-24 | 宇部興産株式会社 | ポリイミド被膜の製造方法 |
JP6069035B2 (ja) * | 2013-03-07 | 2017-01-25 | 三菱マテリアル株式会社 | 電着塗装体の製造方法 |
DE102013004659A1 (de) | 2013-03-16 | 2014-09-18 | Volkswagen Aktiengesellschaft | Schaltring, elektrische Maschine mit einem solchen und Verfahren zur Herstellung |
WO2017002666A1 (ja) * | 2015-07-02 | 2017-01-05 | 三菱マテリアル株式会社 | 水分散型絶縁皮膜形成用電着液 |
GB2548266B (en) | 2015-11-04 | 2018-06-27 | Payton Planar Magnetics Ltd | Planar transformer components comprising electrophoretically deposited coating |
US10865330B2 (en) | 2016-07-28 | 2020-12-15 | 3M Innovative Properties Company | Segmented silicone polyamide block copolymers and articles containing the same |
CN109476815B (zh) | 2016-07-28 | 2021-05-04 | 3M创新有限公司 | 分段有机硅聚酰胺嵌段共聚物和包含其的制品 |
KR102672003B1 (ko) | 2016-10-21 | 2024-06-03 | 한국전기연구원 | 전착코팅용 이미드계 고분자 콜로이드 분산액 및 그 제조방법 |
KR20240025998A (ko) | 2022-08-19 | 2024-02-27 | 한국전기연구원 | 레독스 물질을 포함하는 전착코팅용 조성물, 전착코팅용 조성물의 제조방법 및 이를 이용하는 전착코팅방법 |
KR20240026559A (ko) | 2022-08-22 | 2024-02-29 | 한국전기연구원 | 레독스 물질을 포함하는 이미드계 고분자 전착코팅용 조성물 및 이의 제조방법 |
Family Cites Families (14)
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US3855169A (en) | 1972-06-23 | 1974-12-17 | Gen Electric | Electrocoating compositions and method for making same |
JPS5232943A (en) | 1975-09-10 | 1977-03-12 | Mitsubishi Electric Corp | Preparation of aqueous dispersion for electrodeposition |
JPH0776440B2 (ja) | 1986-10-29 | 1995-08-16 | 三井東圧化学株式会社 | 金属の被覆方法 |
US5502143A (en) | 1992-12-25 | 1996-03-26 | Pi Material Research Laboratory | Process for preparing polyimide resins |
JP3089195B2 (ja) | 1995-10-12 | 2000-09-18 | 大日本塗料株式会社 | 電着用ポリイミド組成物 |
EP0852252B1 (en) * | 1996-07-23 | 2006-04-26 | Nippon Paint Co., Ltd. | Electrodeposition coating composition having electrodeposition potentiality and process for electrodeposition coating |
EP1024407A4 (en) | 1997-10-13 | 2004-06-30 | Pi R & D Co Ltd | POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION |
JP2000178481A (ja) | 1998-12-16 | 2000-06-27 | Dainippon Printing Co Ltd | 転写用電着膜形成液 |
JP2003213129A (ja) | 2002-01-29 | 2003-07-30 | Shin Etsu Chem Co Ltd | ポリイミドシリコーン系樹脂組成物 |
JP3879529B2 (ja) * | 2002-02-15 | 2007-02-14 | Jsr株式会社 | 表面処理方法 |
JP4594615B2 (ja) | 2003-12-05 | 2010-12-08 | 株式会社ピーアイ技術研究所 | 絶縁電線及び絶縁コイル |
JP2005162954A (ja) * | 2003-12-05 | 2005-06-23 | Pi R & D Co Ltd | 電着塗料組成物及びそれを用いた電着方法 |
US20070097137A1 (en) | 2005-10-27 | 2007-05-03 | Walton Andrew C | Utilities, methods and device providing vector images that may be updated to reflect the status of a device |
TW200910385A (en) * | 2007-05-07 | 2009-03-01 | Mitsubishi Cable Ind Ltd | Insulation members |
-
2008
- 2008-05-05 TW TW097116432A patent/TWI441878B/zh active
- 2008-05-07 US US12/451,336 patent/US8372257B2/en active Active
- 2008-05-07 WO PCT/JP2008/058462 patent/WO2008139990A1/ja active Application Filing
- 2008-05-07 CN CN2008800151409A patent/CN101715474B/zh active Active
- 2008-05-07 KR KR1020097025432A patent/KR101423806B1/ko active IP Right Grant
- 2008-05-07 DE DE112008001233T patent/DE112008001233T5/de not_active Ceased
- 2008-05-07 JP JP2009514127A patent/JP5513109B2/ja active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107709632A (zh) * | 2015-07-02 | 2018-02-16 | 三菱综合材料株式会社 | 水分散型绝缘覆膜形成用电沉积液 |
TWI709613B (zh) * | 2015-07-02 | 2020-11-11 | 日商三菱綜合材料股份有限公司 | 水分散型絕緣皮膜形成用電沈積液 |
CN107709632B (zh) * | 2015-07-02 | 2020-11-27 | 三菱综合材料株式会社 | 水分散型绝缘覆膜形成用电沉积液 |
CN108475562A (zh) * | 2015-12-16 | 2018-08-31 | 三菱综合材料株式会社 | 耐热性绝缘电线与用于形成其绝缘层的电沉积液 |
CN110234717A (zh) * | 2017-02-16 | 2019-09-13 | 三菱综合材料株式会社 | 电沉积液及使用了该电沉积液的带绝缘覆膜的导体的制造方法 |
US11286576B2 (en) | 2017-02-16 | 2022-03-29 | Mitsubishi Materials Corporation | Electrodeposition solution and method for producing conductor with insulating film using same |
CN110205659A (zh) * | 2019-07-17 | 2019-09-06 | 广州三孚新材料科技股份有限公司 | 一种电镀锡添加剂及其制备方法 |
CN110205659B (zh) * | 2019-07-17 | 2020-06-16 | 广州三孚新材料科技股份有限公司 | 一种电镀锡添加剂及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101423806B1 (ko) | 2014-07-25 |
KR20100029190A (ko) | 2010-03-16 |
US8372257B2 (en) | 2013-02-12 |
TWI441878B (zh) | 2014-06-21 |
CN101715474B (zh) | 2013-01-02 |
WO2008139990A1 (ja) | 2008-11-20 |
TW200906988A (en) | 2009-02-16 |
JPWO2008139990A1 (ja) | 2010-08-05 |
DE112008001233T5 (de) | 2010-05-20 |
JP5513109B2 (ja) | 2014-06-04 |
US20100108533A1 (en) | 2010-05-06 |
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Effective date of registration: 20201013 Address after: Tokyo Capital of Japan Patentee after: MITSUBISHI MATERIALS Corp. Patentee after: PI Technology Research Institute Co., Ltd Address before: Tokyo Capital of Japan Patentee before: MITSUBISHI CABLE INDUSTRIES, Ltd. Patentee before: PI R & D Co.,Ltd. |
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Effective date of registration: 20220406 Address after: Tokyo, Japan Patentee after: MITSUBISHI MATERIALS Corp. Patentee after: Hefei hanzhihe New Material Technology Co., Ltd Address before: Tokyo, Japan Patentee before: MITSUBISHI MATERIALS Corp. Patentee before: PI R. & D. CO.,LTD. |