CN101678605B - 脱模薄膜 - Google Patents

脱模薄膜 Download PDF

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Publication number
CN101678605B
CN101678605B CN2008800166391A CN200880016639A CN101678605B CN 101678605 B CN101678605 B CN 101678605B CN 2008800166391 A CN2008800166391 A CN 2008800166391A CN 200880016639 A CN200880016639 A CN 200880016639A CN 101678605 B CN101678605 B CN 101678605B
Authority
CN
China
Prior art keywords
release film
mould release
roughness
roughness curve
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
CN2008800166391A
Other languages
English (en)
Chinese (zh)
Other versions
CN101678605A (zh
Inventor
土谷雅弘
松本弘丈
五藤靖志
森伸浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40467928&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN101678605(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN101678605A publication Critical patent/CN101678605A/zh
Application granted granted Critical
Publication of CN101678605B publication Critical patent/CN101678605B/zh
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/24—Thermosetting resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN2008800166391A 2007-09-21 2008-09-18 脱模薄膜 Ceased CN101678605B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP245140/2007 2007-09-21
JP2007245140 2007-09-21
PCT/JP2008/066840 WO2009038118A1 (ja) 2007-09-21 2008-09-18 離型フィルム

Publications (2)

Publication Number Publication Date
CN101678605A CN101678605A (zh) 2010-03-24
CN101678605B true CN101678605B (zh) 2013-04-10

Family

ID=40467928

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800166391A Ceased CN101678605B (zh) 2007-09-21 2008-09-18 脱模薄膜

Country Status (5)

Country Link
JP (1) JP4332204B2 (enExample)
KR (2) KR20100090728A (enExample)
CN (1) CN101678605B (enExample)
TW (1) TW200920589A (enExample)
WO (1) WO2009038118A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5245497B2 (ja) * 2008-03-31 2013-07-24 住友ベークライト株式会社 離型フィルム
JP5438367B2 (ja) * 2009-04-27 2014-03-12 積水化学工業株式会社 多層離型フィルム
CN102791480B (zh) * 2010-03-12 2015-06-17 积水化学工业株式会社 脱模膜和脱模膜的制造方法
JP5565230B2 (ja) * 2010-09-16 2014-08-06 日本ゼオン株式会社 光学フィルムロール及び光学フィルムロールの製造方法
JP5907786B2 (ja) * 2012-04-09 2016-04-26 倉敷紡績株式会社 転写フィルム
JP5832480B2 (ja) * 2012-10-19 2015-12-16 三井化学東セロ株式会社 離型フィルム
JP5992091B2 (ja) * 2013-03-14 2016-09-14 三井化学東セロ株式会社 離型フィルム
JP5874768B2 (ja) * 2013-04-30 2016-03-02 住友ベークライト株式会社 離型フィルムおよび離型フィルムの使用方法
JP5874774B2 (ja) * 2013-06-06 2016-03-02 住友ベークライト株式会社 離型フィルムおよび離型フィルムの使用方法
JP6205874B2 (ja) * 2013-06-07 2017-10-04 東レ株式会社 離型フィルム
JP6307078B2 (ja) * 2013-07-16 2018-04-04 倉敷紡績株式会社 離型フィルム
JP6574468B2 (ja) * 2013-08-05 2019-09-11 積水化学工業株式会社 離型フィルム
JP6223913B2 (ja) * 2013-08-05 2017-11-01 積水化学工業株式会社 離型フィルム
JP5804141B1 (ja) * 2014-06-18 2015-11-04 住友ベークライト株式会社 離型フィルム
JP5862740B1 (ja) * 2014-09-30 2016-02-16 住友ベークライト株式会社 離型フィルムおよび離型フィルムの使用方法
JP6531555B2 (ja) * 2014-10-31 2019-06-19 東レ株式会社 光学フィルム製造用ポリエステルフィルム
JP6494761B2 (ja) * 2015-07-24 2019-04-03 富士フイルム株式会社 剥離フィルムおよび粘着剤積層体
JP2017047594A (ja) * 2015-09-01 2017-03-09 大日本印刷株式会社 加飾シート、加飾成形品、および加飾成形品の製造方法
JP6391554B2 (ja) * 2015-12-14 2018-09-19 住友ベークライト株式会社 離型フィルム
JP6970025B2 (ja) * 2018-01-10 2021-11-24 タツタ電線株式会社 電磁波シールドフィルム
JP7400263B2 (ja) * 2018-08-23 2023-12-19 東レ株式会社 フィルム、及びフィルムの製造方法
WO2021010412A1 (ja) * 2019-07-17 2021-01-21 株式会社クラレ 水溶性フィルムおよび包装体
TWI788659B (zh) * 2020-04-24 2023-01-01 南亞塑膠工業股份有限公司 多孔隙抗沾黏膜的製造方法
KR102297307B1 (ko) * 2020-08-18 2021-09-02 황진상 반도체 패키지 몰드용 엠보싱 이형필름의 제조방법 및 그에 따른 엠보싱 이형필름
JPWO2023032793A1 (enExample) * 2021-08-31 2023-03-09
JP2023059203A (ja) * 2021-10-14 2023-04-26 東レ株式会社 コンプレッションモールド用離型フィルム
KR102799321B1 (ko) * 2023-01-27 2025-04-23 (주)상아프론테크 불소계 이형필름, 이를 통한 반도체 패키지 제조방법 및 반도체 패키지
JP7619505B1 (ja) 2024-03-26 2025-01-22 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
JP7619506B1 (ja) 2024-03-26 2025-01-22 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
JP7619507B1 (ja) 2024-03-26 2025-01-22 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1795227A (zh) * 2003-12-26 2006-06-28 积水化学工业株式会社 脱模薄膜
CN1849206A (zh) * 2003-09-30 2006-10-18 积水化学工业株式会社 多层片

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1298451C (en) * 1985-08-02 1992-04-07 Hiromi Shigemoto Surface-roughened film and sheet, and process for production and use thereof
JP2701924B2 (ja) * 1989-03-13 1998-01-21 三井石油化学工業株式会社 ポリ４―メチル―１―ペンテン製の両面が粗化された離型フィルム及びその製造方法
JPH0361011A (ja) * 1989-07-28 1991-03-15 Mitsui Petrochem Ind Ltd 離型フィルム及びその製造方法
JP3014421B2 (ja) * 1990-08-22 2000-02-28 三井化学株式会社 多層プリント基板の外装板粗面化用マットフィルム
EP1226933A4 (en) * 1999-08-31 2003-01-29 Mitsubishi Plastics Inc SEVERABLE MULTILAYER FILM
JP4580541B2 (ja) * 2000-11-17 2010-11-17 大日本印刷株式会社 離型紙及びそれを用いて製造された合成皮革
JP2006130796A (ja) * 2004-11-05 2006-05-25 Daicel Chem Ind Ltd ポリメチルペンテン系樹脂層を含む積層体及びその製造方法
CN101175637B (zh) * 2005-05-13 2012-07-25 三井化学株式会社 含有4-甲基-1-戊烯类聚合物的层合体及由其构成的脱模膜
JP2007083459A (ja) * 2005-09-20 2007-04-05 Tohcello Co Ltd 表面粗化フィルム及びその用途
JP4894344B2 (ja) 2006-04-25 2012-03-14 パナソニック電工株式会社 片面板の製造方法及び多層プリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1849206A (zh) * 2003-09-30 2006-10-18 积水化学工业株式会社 多层片
CN1795227A (zh) * 2003-12-26 2006-06-28 积水化学工业株式会社 脱模薄膜

Also Published As

Publication number Publication date
KR20100090728A (ko) 2010-08-16
KR101018621B1 (ko) 2011-03-03
TW200920589A (en) 2009-05-16
KR20090120519A (ko) 2009-11-24
WO2009038118A1 (ja) 2009-03-26
JP2009090647A (ja) 2009-04-30
TWI318599B (enExample) 2009-12-21
JP4332204B2 (ja) 2009-09-16
CN101678605A (zh) 2010-03-24

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
IW01 Full invalidation of patent right
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20221028

Decision number of declaring invalidation: 58826

Granted publication date: 20130410