CN101656215A - 横向双扩散金属氧化物半导体晶体管及其制造方法 - Google Patents
横向双扩散金属氧化物半导体晶体管及其制造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 229910044991 metal oxide Inorganic materials 0.000 title claims abstract description 8
- 150000004706 metal oxides Chemical class 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 77
- 210000000746 body region Anatomy 0.000 claims description 34
- 230000003647 oxidation Effects 0.000 claims description 31
- 238000007254 oxidation reaction Methods 0.000 claims description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 30
- 229910052710 silicon Inorganic materials 0.000 claims description 29
- 239000010703 silicon Substances 0.000 claims description 29
- 239000002019 doping agent Substances 0.000 claims description 27
- 230000015572 biosynthetic process Effects 0.000 claims description 20
- 238000005516 engineering process Methods 0.000 claims description 19
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 150000004767 nitrides Chemical class 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 7
- 238000002955 isolation Methods 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000003989 dielectric material Substances 0.000 claims description 3
- 238000002513 implantation Methods 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 66
- 230000008569 process Effects 0.000 description 30
- 238000010586 diagram Methods 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 10
- 229920005591 polysilicon Polymers 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 6
- 238000001914 filtration Methods 0.000 description 5
- 230000000699 topical effect Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 210000003323 beak Anatomy 0.000 description 2
- 230000006399 behavior Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66681—Lateral DMOS transistors, i.e. LDMOS transistors
- H01L29/66689—Lateral DMOS transistors, i.e. LDMOS transistors with a step of forming an insulating sidewall spacer
-
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
-
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0856—Source regions
- H01L29/086—Impurity concentration or distribution
-
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
- H01L29/512—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures the variation being parallel to the channel plane
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
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- H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (26)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/288,836 US8119507B2 (en) | 2008-10-23 | 2008-10-23 | Lateral double-diffused metal oxide semiconductor (LDMOS) transistors |
US12/288,836 | 2008-10-23 |
Publications (2)
Publication Number | Publication Date |
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CN101656215A true CN101656215A (zh) | 2010-02-24 |
CN101656215B CN101656215B (zh) | 2012-10-31 |
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CN 200910159413 Active CN101656215B (zh) | 2008-10-23 | 2009-07-02 | 横向双扩散金属氧化物半导体晶体管及其制造方法 |
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US (2) | US8119507B2 (zh) |
CN (1) | CN101656215B (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102157385A (zh) * | 2011-03-15 | 2011-08-17 | 上海宏力半导体制造有限公司 | 横向双扩散金属氧化物半导体器件及其制造方法 |
CN102194860A (zh) * | 2010-03-05 | 2011-09-21 | 中芯国际集成电路制造(上海)有限公司 | 绿色晶体管 |
CN102263126A (zh) * | 2010-05-27 | 2011-11-30 | 新电元工业株式会社 | 短路型闸流晶体管 |
CN102386225A (zh) * | 2010-08-27 | 2012-03-21 | 旺宏电子股份有限公司 | 一种横向双扩散金属氧化物半导体装置及其制造方法 |
CN102569397A (zh) * | 2010-12-31 | 2012-07-11 | 旺宏电子股份有限公司 | 高电压半导体元件 |
CN102623354A (zh) * | 2012-04-17 | 2012-08-01 | 上海华力微电子有限公司 | P-ldmos的制造方法 |
CN102651318A (zh) * | 2011-02-23 | 2012-08-29 | 旺宏电子股份有限公司 | 高压晶体管的制造方法 |
CN102790087A (zh) * | 2012-07-18 | 2012-11-21 | 电子科技大学 | 一种具有ESD保护功能的nLDMOS器件 |
CN103021852A (zh) * | 2011-09-22 | 2013-04-03 | 上海华虹Nec电子有限公司 | 高压p型ldmos的制造方法 |
US9627513B2 (en) | 2014-09-23 | 2017-04-18 | Silergy Semiconductor Technology (Hangzhou) Ltd. | Method for manufacturing lateral double-diffused metal oxide semiconductor transistor |
CN109346525A (zh) * | 2018-11-21 | 2019-02-15 | 无锡市晶源微电子有限公司 | 一种n型ldmos器件及其制作方法 |
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JP5437602B2 (ja) * | 2008-07-29 | 2014-03-12 | セイコーインスツル株式会社 | 半導体装置およびその製造方法 |
US9484454B2 (en) | 2008-10-29 | 2016-11-01 | Tower Semiconductor Ltd. | Double-resurf LDMOS with drift and PSURF implants self-aligned to a stacked gate “bump” structure |
US9330979B2 (en) * | 2008-10-29 | 2016-05-03 | Tower Semiconductor Ltd. | LDMOS transistor having elevated field oxide bumps and method of making same |
TWI503893B (zh) * | 2008-12-30 | 2015-10-11 | Vanguard Int Semiconduct Corp | 半導體結構及其製作方法 |
US8138049B2 (en) | 2009-05-29 | 2012-03-20 | Silergy Technology | Fabrication of lateral double-diffused metal oxide semiconductor (LDMOS) devices |
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US8575692B2 (en) * | 2011-02-11 | 2013-11-05 | Freescale Semiconductor, Inc. | Near zero channel length field drift LDMOS |
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KR101755718B1 (ko) | 2011-11-22 | 2017-07-07 | 현대자동차주식회사 | 수평형 디모스 소자 및 그 제조 방법 |
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Also Published As
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US20120091527A1 (en) | 2012-04-19 |
US8912600B2 (en) | 2014-12-16 |
US8119507B2 (en) | 2012-02-21 |
US20100102386A1 (en) | 2010-04-29 |
CN101656215B (zh) | 2012-10-31 |
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