CN101626878B - 模具脱模恢复用树脂组合物及模具脱模恢复方法 - Google Patents
模具脱模恢复用树脂组合物及模具脱模恢复方法 Download PDFInfo
- Publication number
- CN101626878B CN101626878B CN2008800069300A CN200880006930A CN101626878B CN 101626878 B CN101626878 B CN 101626878B CN 2008800069300 A CN2008800069300 A CN 2008800069300A CN 200880006930 A CN200880006930 A CN 200880006930A CN 101626878 B CN101626878 B CN 101626878B
- Authority
- CN
- China
- Prior art keywords
- mold releasability
- resin combination
- releasing agent
- recovers
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
- B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007090384 | 2007-03-30 | ||
JP090385/2007 | 2007-03-30 | ||
JP090384/2007 | 2007-03-30 | ||
JP2007090385 | 2007-03-30 | ||
PCT/JP2008/055413 WO2008120597A1 (ja) | 2007-03-30 | 2008-03-24 | 金型離型回復用樹脂組成物及び金型離型回復方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101626878A CN101626878A (zh) | 2010-01-13 |
CN101626878B true CN101626878B (zh) | 2012-12-26 |
Family
ID=39808179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800069300A Active CN101626878B (zh) | 2007-03-30 | 2008-03-24 | 模具脱模恢复用树脂组合物及模具脱模恢复方法 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5242555B2 (ko) |
KR (1) | KR101436809B1 (ko) |
CN (1) | CN101626878B (ko) |
HK (1) | HK1139898A1 (ko) |
MY (1) | MY154931A (ko) |
TW (1) | TWI406750B (ko) |
WO (1) | WO2008120597A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101691472B (zh) * | 2009-09-22 | 2011-10-12 | 东莞光群雷射科技有限公司 | 镭射烫金用三聚氰胺离型剂 |
CN103555127A (zh) * | 2013-10-28 | 2014-02-05 | 武汉天诚防伪技术有限公司 | 镭射烫金电化铝改性离型材料 |
JP6803165B2 (ja) * | 2015-08-07 | 2020-12-23 | 日本カーバイド工業株式会社 | 金型清掃用樹脂組成物 |
CN105590534A (zh) * | 2016-02-14 | 2016-05-18 | 余启佳 | 一种仿真白萝卜模具制作方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4879849A (ko) * | 1972-01-27 | 1973-10-26 | ||
JPS57178814A (en) * | 1981-04-30 | 1982-11-04 | Kuraray Co Ltd | Manufacture of molded resin molding and mold therefor |
JPS62132964A (ja) * | 1985-12-04 | 1987-06-16 | Matsushita Electric Works Ltd | 成形材料の製造方法 |
JPH0381111A (ja) * | 1989-08-24 | 1991-04-05 | Matsushita Electric Works Ltd | 金型清掃用成形材料および金型清掃方法 |
JP3651018B2 (ja) * | 1994-05-18 | 2005-05-25 | 日立化成工業株式会社 | 金型表面離型処理用樹脂組成物及び該組成物を用いた金型表面の離型処理法並びに該組成物で離型処理した金型を用いた熱硬化性樹脂成形品の成形方法 |
JP3783042B2 (ja) * | 1995-08-23 | 2006-06-07 | 日本カーバイド工業株式会社 | 金型清掃用樹脂組成物 |
JPH09290424A (ja) * | 1996-04-26 | 1997-11-11 | Hoechst Ind Kk | 離型剤組成物 |
JP2000143995A (ja) * | 1998-11-13 | 2000-05-26 | Mitsui Chemicals Inc | 樹脂組成物 |
JP2001247755A (ja) * | 2000-03-08 | 2001-09-11 | Teijin Ltd | コネクター用樹脂ペレット混合物 |
-
2008
- 2008-03-24 MY MYPI20093059A patent/MY154931A/en unknown
- 2008-03-24 WO PCT/JP2008/055413 patent/WO2008120597A1/ja active Application Filing
- 2008-03-24 CN CN2008800069300A patent/CN101626878B/zh active Active
- 2008-03-24 KR KR1020097016236A patent/KR101436809B1/ko active IP Right Grant
- 2008-03-24 JP JP2009507467A patent/JP5242555B2/ja active Active
- 2008-03-27 TW TW097111061A patent/TWI406750B/zh active
-
2010
- 2010-07-12 HK HK10106730.0A patent/HK1139898A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI406750B (zh) | 2013-09-01 |
TW200902274A (en) | 2009-01-16 |
MY154931A (en) | 2015-08-28 |
KR101436809B1 (ko) | 2014-09-03 |
CN101626878A (zh) | 2010-01-13 |
HK1139898A1 (en) | 2010-09-30 |
WO2008120597A1 (ja) | 2008-10-09 |
JPWO2008120597A1 (ja) | 2010-07-15 |
JP5242555B2 (ja) | 2013-07-24 |
KR20100014372A (ko) | 2010-02-10 |
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