HK1139898A1 - Resin composition for recovering mold releasability amd method for recovering mold releasability - Google Patents

Resin composition for recovering mold releasability amd method for recovering mold releasability

Info

Publication number
HK1139898A1
HK1139898A1 HK10106730.0A HK10106730A HK1139898A1 HK 1139898 A1 HK1139898 A1 HK 1139898A1 HK 10106730 A HK10106730 A HK 10106730A HK 1139898 A1 HK1139898 A1 HK 1139898A1
Authority
HK
Hong Kong
Prior art keywords
mold releasability
recovering
recovering mold
resin composition
amd method
Prior art date
Application number
HK10106730.0A
Inventor
Kiyohito Hiromitsu
Hiroaki Nomura
Kenichi Hamaura
Original Assignee
Nippon Carbide Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kk filed Critical Nippon Carbide Kogyo Kk
Publication of HK1139898A1 publication Critical patent/HK1139898A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/58—Applying the releasing agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
HK10106730.0A 2007-03-30 2010-07-12 Resin composition for recovering mold releasability amd method for recovering mold releasability HK1139898A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007090384 2007-03-30
JP2007090385 2007-03-30
PCT/JP2008/055413 WO2008120597A1 (en) 2007-03-30 2008-03-24 Resin composition for recovering mold releasability amd method for recovering mold releasability

Publications (1)

Publication Number Publication Date
HK1139898A1 true HK1139898A1 (en) 2010-09-30

Family

ID=39808179

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10106730.0A HK1139898A1 (en) 2007-03-30 2010-07-12 Resin composition for recovering mold releasability amd method for recovering mold releasability

Country Status (7)

Country Link
JP (1) JP5242555B2 (en)
KR (1) KR101436809B1 (en)
CN (1) CN101626878B (en)
HK (1) HK1139898A1 (en)
MY (1) MY154931A (en)
TW (1) TWI406750B (en)
WO (1) WO2008120597A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101691472B (en) * 2009-09-22 2011-10-12 东莞光群雷射科技有限公司 Melamine mold release agent for laser bronzing
CN103555127A (en) * 2013-10-28 2014-02-05 武汉天诚防伪技术有限公司 Laser bronzing electrochemical aluminum modified release material
JP6803165B2 (en) * 2015-08-07 2020-12-23 日本カーバイド工業株式会社 Resin composition for mold cleaning
CN105590534A (en) * 2016-02-14 2016-05-18 余启佳 Manufacturing method of simulated white radish die

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4879849A (en) * 1972-01-27 1973-10-26
JPS57178814A (en) * 1981-04-30 1982-11-04 Kuraray Co Ltd Manufacture of molded resin molding and mold therefor
JPS62132964A (en) * 1985-12-04 1987-06-16 Matsushita Electric Works Ltd Production of molding compound
JPH0381111A (en) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd Molding material and method for cleaning of die
JP3651018B2 (en) * 1994-05-18 2005-05-25 日立化成工業株式会社 Resin composition for mold surface release treatment, mold release method for mold surface using the composition, and molding method for thermosetting resin molded article using mold subjected to mold release treatment with the composition
JP3783042B2 (en) * 1995-08-23 2006-06-07 日本カーバイド工業株式会社 Mold cleaning resin composition
JPH09290424A (en) * 1996-04-26 1997-11-11 Hoechst Ind Kk Mold-releasing agent composition
JP2000143995A (en) * 1998-11-13 2000-05-26 Mitsui Chemicals Inc Resin composition
JP2001247755A (en) * 2000-03-08 2001-09-11 Teijin Ltd Resin pellet mixture for connector

Also Published As

Publication number Publication date
TWI406750B (en) 2013-09-01
TW200902274A (en) 2009-01-16
MY154931A (en) 2015-08-28
KR101436809B1 (en) 2014-09-03
CN101626878A (en) 2010-01-13
WO2008120597A1 (en) 2008-10-09
JPWO2008120597A1 (en) 2010-07-15
CN101626878B (en) 2012-12-26
JP5242555B2 (en) 2013-07-24
KR20100014372A (en) 2010-02-10

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170324