WO2008120597A1 - Resin composition for recovering mold releasability amd method for recovering mold releasability - Google Patents

Resin composition for recovering mold releasability amd method for recovering mold releasability Download PDF

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Publication number
WO2008120597A1
WO2008120597A1 PCT/JP2008/055413 JP2008055413W WO2008120597A1 WO 2008120597 A1 WO2008120597 A1 WO 2008120597A1 JP 2008055413 W JP2008055413 W JP 2008055413W WO 2008120597 A1 WO2008120597 A1 WO 2008120597A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
mold releasability
resin composition
recovering
releasability
Prior art date
Application number
PCT/JP2008/055413
Other languages
French (fr)
Japanese (ja)
Inventor
Kiyohito Hiromitsu
Hiroaki Nomura
Kenichi Hamaura
Original Assignee
Nippon Carbide Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kabushiki Kaisha filed Critical Nippon Carbide Kogyo Kabushiki Kaisha
Priority to CN2008800069300A priority Critical patent/CN101626878B/en
Priority to KR1020097016236A priority patent/KR101436809B1/en
Priority to JP2009507467A priority patent/JP5242555B2/en
Publication of WO2008120597A1 publication Critical patent/WO2008120597A1/en
Priority to HK10106730.0A priority patent/HK1139898A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/58—Applying the releasing agents

Abstract

Disclosed is a resin composition for recovering mold releasability, which provides the surface of a mold with releasability after removing dirt on the mold surface during molding of a curable resin molding material. This resin composition contains a melamine resin, while further containing at least one metallic soap-based mold release agent and an organic fatty acid ester-based mold release agent or/and a synthetic wax. This resin composition for recovering mold releasability enables to recover excellent mold releasability which lasts for a long time, and thus enables to continuously mold a sealing article for a long time.
PCT/JP2008/055413 2007-03-30 2008-03-24 Resin composition for recovering mold releasability amd method for recovering mold releasability WO2008120597A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800069300A CN101626878B (en) 2007-03-30 2008-03-24 Resin composition for recovering mold releasability and method for recovering mold releasability
KR1020097016236A KR101436809B1 (en) 2007-03-30 2008-03-24 Resin composition for recovering mold releasability and method for recovering mold releasability
JP2009507467A JP5242555B2 (en) 2007-03-30 2008-03-24 Mold release recovery resin composition and mold release recovery method
HK10106730.0A HK1139898A1 (en) 2007-03-30 2010-07-12 Resin composition for recovering mold releasability amd method for recovering mold releasability

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007090384 2007-03-30
JP2007-090384 2007-03-30
JP2007-090385 2007-03-30
JP2007090385 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008120597A1 true WO2008120597A1 (en) 2008-10-09

Family

ID=39808179

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055413 WO2008120597A1 (en) 2007-03-30 2008-03-24 Resin composition for recovering mold releasability amd method for recovering mold releasability

Country Status (7)

Country Link
JP (1) JP5242555B2 (en)
KR (1) KR101436809B1 (en)
CN (1) CN101626878B (en)
HK (1) HK1139898A1 (en)
MY (1) MY154931A (en)
TW (1) TWI406750B (en)
WO (1) WO2008120597A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101691472B (en) * 2009-09-22 2011-10-12 东莞光群雷射科技有限公司 Melamine mold release agent for laser bronzing
CN103555127A (en) * 2013-10-28 2014-02-05 武汉天诚防伪技术有限公司 Laser bronzing electrochemical aluminum modified release material
JP2017035881A (en) * 2015-08-07 2017-02-16 日本カーバイド工業株式会社 Resin composition for mold cleaning

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105590534A (en) * 2016-02-14 2016-05-18 余启佳 Manufacturing method of simulated white radish die

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4879849A (en) * 1972-01-27 1973-10-26
JPS62132964A (en) * 1985-12-04 1987-06-16 Matsushita Electric Works Ltd Production of molding compound
JPH0381111A (en) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd Molding material and method for cleaning of die
JPH07309998A (en) * 1994-05-18 1995-11-28 Hitachi Chem Co Ltd Mold surface release treatment resin composition, release treatment of surface of mold using the composition, production of thermosetting resin molded product using mold release-treated with the composition
JPH0957762A (en) * 1995-08-23 1997-03-04 Nippon Carbide Ind Co Inc Resin composition for cleaning mold
JPH09290424A (en) * 1996-04-26 1997-11-11 Hoechst Ind Kk Mold-releasing agent composition
JP2000143995A (en) * 1998-11-13 2000-05-26 Mitsui Chemicals Inc Resin composition
JP2001247755A (en) * 2000-03-08 2001-09-11 Teijin Ltd Resin pellet mixture for connector

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178814A (en) * 1981-04-30 1982-11-04 Kuraray Co Ltd Manufacture of molded resin molding and mold therefor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4879849A (en) * 1972-01-27 1973-10-26
JPS62132964A (en) * 1985-12-04 1987-06-16 Matsushita Electric Works Ltd Production of molding compound
JPH0381111A (en) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd Molding material and method for cleaning of die
JPH07309998A (en) * 1994-05-18 1995-11-28 Hitachi Chem Co Ltd Mold surface release treatment resin composition, release treatment of surface of mold using the composition, production of thermosetting resin molded product using mold release-treated with the composition
JPH0957762A (en) * 1995-08-23 1997-03-04 Nippon Carbide Ind Co Inc Resin composition for cleaning mold
JPH09290424A (en) * 1996-04-26 1997-11-11 Hoechst Ind Kk Mold-releasing agent composition
JP2000143995A (en) * 1998-11-13 2000-05-26 Mitsui Chemicals Inc Resin composition
JP2001247755A (en) * 2000-03-08 2001-09-11 Teijin Ltd Resin pellet mixture for connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101691472B (en) * 2009-09-22 2011-10-12 东莞光群雷射科技有限公司 Melamine mold release agent for laser bronzing
CN103555127A (en) * 2013-10-28 2014-02-05 武汉天诚防伪技术有限公司 Laser bronzing electrochemical aluminum modified release material
JP2017035881A (en) * 2015-08-07 2017-02-16 日本カーバイド工業株式会社 Resin composition for mold cleaning

Also Published As

Publication number Publication date
CN101626878B (en) 2012-12-26
HK1139898A1 (en) 2010-09-30
KR20100014372A (en) 2010-02-10
MY154931A (en) 2015-08-28
KR101436809B1 (en) 2014-09-03
JP5242555B2 (en) 2013-07-24
TW200902274A (en) 2009-01-16
TWI406750B (en) 2013-09-01
CN101626878A (en) 2010-01-13
JPWO2008120597A1 (en) 2010-07-15

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