JP2017035881A - Resin composition for mold cleaning - Google Patents
Resin composition for mold cleaning Download PDFInfo
- Publication number
- JP2017035881A JP2017035881A JP2016143701A JP2016143701A JP2017035881A JP 2017035881 A JP2017035881 A JP 2017035881A JP 2016143701 A JP2016143701 A JP 2016143701A JP 2016143701 A JP2016143701 A JP 2016143701A JP 2017035881 A JP2017035881 A JP 2017035881A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- mold
- mass
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 186
- 238000004140 cleaning Methods 0.000 title claims abstract description 139
- 239000000344 soap Substances 0.000 claims abstract description 60
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 59
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 43
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 43
- 239000011122 softwood Substances 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims description 72
- 239000002184 metal Substances 0.000 claims description 72
- 239000000835 fiber Substances 0.000 claims description 62
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 20
- 229940105125 zinc myristate Drugs 0.000 claims description 14
- GBFLQPIIIRJQLU-UHFFFAOYSA-L zinc;tetradecanoate Chemical compound [Zn+2].CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O GBFLQPIIIRJQLU-UHFFFAOYSA-L 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 12
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 11
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 10
- 239000000194 fatty acid Substances 0.000 claims description 10
- 229930195729 fatty acid Natural products 0.000 claims description 10
- 150000004665 fatty acids Chemical class 0.000 claims description 10
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- JYIZNFVTKLARKT-UHFFFAOYSA-N phenol;1,3,5-triazine-2,4,6-triamine Chemical compound OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 JYIZNFVTKLARKT-UHFFFAOYSA-N 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 claims description 6
- 229940098697 zinc laurate Drugs 0.000 claims description 4
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 claims description 4
- 229940057977 zinc stearate Drugs 0.000 claims description 3
- 239000004640 Melamine resin Substances 0.000 abstract description 28
- 238000000465 moulding Methods 0.000 description 59
- 238000000034 method Methods 0.000 description 29
- 239000000356 contaminant Substances 0.000 description 27
- 238000007789 sealing Methods 0.000 description 24
- 230000000694 effects Effects 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 19
- 230000008569 process Effects 0.000 description 19
- 239000012778 molding material Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 14
- 150000001875 compounds Chemical class 0.000 description 13
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000005452 bending Methods 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 239000011121 hardwood Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 7
- 239000003063 flame retardant Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 150000003918 triazines Chemical class 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- 239000000314 lubricant Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 150000001299 aldehydes Chemical class 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 3
- 241000218631 Coniferophyta Species 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- -1 methylol groups Chemical group 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000218657 Picea Species 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 235000013877 carbamide Nutrition 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 150000002366 halogen compounds Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 150000002611 lead compounds Chemical class 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000003826 tablet Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 150000003672 ureas Chemical class 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- NLSFWPFWEPGCJJ-UHFFFAOYSA-N 2-methylprop-2-enoyloxysilicon Chemical compound CC(=C)C(=O)O[Si] NLSFWPFWEPGCJJ-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 235000018782 Dacrydium cupressinum Nutrition 0.000 description 1
- 240000006055 Dacrydium cupressinum Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 240000000731 Fagus sylvatica Species 0.000 description 1
- 235000010099 Fagus sylvatica Nutrition 0.000 description 1
- 241000218652 Larix Species 0.000 description 1
- 235000005590 Larix decidua Nutrition 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 244000082204 Phyllostachys viridis Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 235000013697 Pinus resinosa Nutrition 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- NJYZCEFQAIUHSD-UHFFFAOYSA-N acetoguanamine Chemical compound CC1=NC(N)=NC(N)=N1 NJYZCEFQAIUHSD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 229940078456 calcium stearate Drugs 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- CGXBXJAUUWZZOP-UHFFFAOYSA-N formaldehyde;phenol;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 CGXBXJAUUWZZOP-UHFFFAOYSA-N 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 229940057948 magnesium stearate Drugs 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000008185 minitablet Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- WGOROJDSDNILMB-UHFFFAOYSA-N octatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O WGOROJDSDNILMB-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229940012185 zinc palmitate Drugs 0.000 description 1
- GJAPSKMAVXDBIU-UHFFFAOYSA-L zinc;hexadecanoate Chemical compound [Zn+2].CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O GJAPSKMAVXDBIU-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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Abstract
Description
本発明は金型清掃用樹脂組成物に関する。 The present invention relates to a resin composition for mold cleaning.
熱硬化性樹脂組成物を含む封止成形材料を用いて封止成形する場合において、集積回路やＬＥＤ素子などの封止成形作業を長時間続けると、封止成形材料に由来する汚染物質（汚れ）が成形金型の内部表面上に付着しやすい。このような汚染物質が成形金型の内部表面上に放置されると、集積回路やＬＥＤ素子などの封止成形物の表面に汚染物質が付着する不具合や、封止成形材料が成形金型から剥離できないという不具合が発生する。そのため、封止成形する場合は、成形金型の内部表面上に存在する汚染物質を取り除くことが求められる。具体的には、封止成形する場合に、数百ショットの封止成形をするごとに数ショットの割合で、封止成形材料の代わりに金型清掃用樹脂組成物を成形することが望ましい。金型清掃用樹脂組成物を成形することで、樹脂組成物と汚染物質とが接着し、成形金型から汚染物質を含む樹脂組成物を取り除くことで金型清掃が可能である。 In the case of sealing molding using a sealing molding material containing a thermosetting resin composition, if sealing molding operations such as integrated circuits and LED elements are continued for a long time, contaminants (dirt) derived from the sealing molding material ) Easily adheres to the inner surface of the mold. If such pollutants are left on the inner surface of the molding die, the contaminants adhere to the surface of the sealing molding such as integrated circuits and LED elements, and the sealing molding material is removed from the molding die. The trouble that it cannot peel is generated. Therefore, when sealing molding is performed, it is required to remove contaminants existing on the inner surface of the molding die. Specifically, in the case of sealing molding, it is desirable to mold the mold cleaning resin composition instead of the sealing molding material at a rate of several shots every time hundreds of shots are sealed. By molding the resin composition for mold cleaning, the resin composition and the contaminant are bonded, and the mold cleaning can be performed by removing the resin composition containing the contaminant from the mold.
このような金型清掃用樹脂組成物は、従来から提案されている。
たとえば、特許文献１には、金属石鹸及び脂肪酸アミド系滑剤を含有する金型清掃用アミノ系樹脂組成物が記載されている。
特許文献１によれば、金属石鹸は溶融樹脂の金型内での流動性に関与する。また、この金型清掃用アミノ系樹脂組成物は、樹脂組成物の成形時におけるタブレット性の向上、すなわちミニタブレットが金型より抜けにくさを改善し、抜き出し時のきしみ音や割れ、欠け等の不良が抑制できるとされている。
Such a mold cleaning resin composition has been conventionally proposed.
For example, Patent Document 1 describes an amino resin composition for mold cleaning containing a metal soap and a fatty acid amide lubricant.
According to Patent Document 1, the metal soap is involved in the fluidity of the molten resin in the mold. In addition, this amino resin composition for mold cleaning improves the tablet properties at the time of molding of the resin composition, that is, the mini tablet improves the difficulty of being pulled out from the mold, and squeaks, cracks, chips, etc. at the time of extraction It is said that this defect can be suppressed.
特許文献２には、メラミン系樹脂と、平均繊維長、平均繊維径およびアスペクト比がそれぞれ特定の範囲である繊維状無機化合物を含有する金型清掃用樹脂組成物が記載されている。
特許文献２によれば、この金型清掃用樹脂組成物は金型清掃の作業性を向上でき、ビフェニル系エポキシ樹脂や多官能系エポキシ樹脂に代表される多種多様の汚染成分も洗浄できるとされている。
さらに、この金型清掃用樹脂組成物は、滑剤としてミリスチン酸亜鉛に代表される金属石鹸を含めば金型離型性を良好に保てること、金属石鹸の含有量が金型清掃用樹脂組成物１００質量部に対して１．５質量部以下が好ましいことがそれぞれ記載されている。
Patent Document 2 describes a mold cleaning resin composition containing a melamine-based resin and a fibrous inorganic compound whose average fiber length, average fiber diameter, and aspect ratio are in specific ranges.
According to Patent Document 2, this mold cleaning resin composition can improve mold cleaning workability and can also clean a wide variety of contaminating components typified by biphenyl epoxy resins and polyfunctional epoxy resins. ing.
Furthermore, the mold cleaning resin composition can maintain good mold releasability if a metal soap typified by zinc myristate is included as a lubricant, and the metal soap content is a resin composition for mold cleaning. It is described that 1.5 parts by mass or less is preferable with respect to 100 parts by mass.
近年、環境保護のため、鉛、アンチモン、ハロゲン化合物に代表される、環境負荷が大きい配合物を含む従来の封止成形材料から、これらの配合物を含まないグリーンコンパウンドと呼ばれる封止成形材料へと置き換わりつつある。具体的には、従来の難燃剤から金属水酸化物系難燃剤、有機リン系難燃剤に置き換えた封止成形材料や、エポキシ樹脂設計や配合で難燃化を達成できる封止成形材料がグリーンコンパウンドと呼ばれる。
また、リードフレームとの密着性を改善した封止成形材料も普及しつつある。
このようなグリーンコンパウンドや金属との密着性を改善した封止成形材料を用いた封止成形工程では、成形金型の内部表面上が汚れやすい。そのため、清掃性能がより高い金型清掃用樹脂組成物の開発が望まれている。
In recent years, in order to protect the environment, from conventional sealing molding materials containing a compound with a large environmental load, such as lead, antimony, and halogen compounds, to a sealing molding material called green compound that does not contain these compounds. Is being replaced. Specifically, green is a sealing molding material that replaces conventional flame retardants with metal hydroxide flame retardants and organophosphorous flame retardants, and sealing molding materials that can achieve flame retardant by epoxy resin design and blending. It is called a compound.
In addition, sealing molding materials with improved adhesion to the lead frame are becoming widespread.
In such a sealing molding process using a sealing molding material with improved adhesion to a green compound or metal, the inner surface of the molding die tends to become dirty. Therefore, development of the resin composition for metal mold | die cleaning with higher cleaning performance is desired.
金属石鹸を多量に含有する金型清掃用樹脂組成物は、成形金型の内部表面上に存在する汚染物質への親和性が高まることで清掃性能の向上が期待できる。本発明者は、金型清掃用樹脂組成物に添加する金属石鹸の含有量を金型清掃用樹脂組成物１００質量部に対しステアリン酸亜鉛０．５質量部からミリスチン酸亜鉛２．０質量部へと替え、かつ広葉樹パルプを混入したメラミンフェノール−ホルムアルデヒド樹脂粉末を用いて、国際公開第２００２／３０６４８号パンフレット（特許文献２）の実施例１に記載の組成に基づいて金型清掃用樹脂組成物を作製し、その清掃性能を評価した。その結果、この金型清掃用樹脂組成物は、優れた清掃性能を示すものの、金型清掃用樹脂組成物自身の内部強度が極端に低下し、金型清掃時、清掃後に樹脂組成物を成形金型から除去する工程で、チッピング（欠け）が生じ、除去が十分に行えないという不具合を示した。つまり、この金型清掃用樹脂組成物を用いた金型清掃工程は、作業性が極めて悪く、改善の余地がある。 The mold cleaning resin composition containing a large amount of metal soap can be expected to improve the cleaning performance by increasing the affinity for contaminants present on the inner surface of the mold. The present inventor sets the content of the metal soap to be added to the mold cleaning resin composition from 0.5 parts by mass of zinc stearate to 2.0 parts by mass of zinc myristate with respect to 100 parts by mass of the resin composition for mold cleaning. Resin composition for mold cleaning based on the composition described in Example 1 of WO 2002/30648 pamphlet (patent document 2) using melamine phenol-formaldehyde resin powder mixed with hardwood pulp. An object was prepared and its cleaning performance was evaluated. As a result, the resin composition for mold cleaning exhibits excellent cleaning performance, but the internal strength of the resin composition for mold cleaning itself is extremely lowered, and the resin composition is molded after cleaning during mold cleaning. In the process of removing from the mold, chipping (chips) occurred and the removal was not sufficiently performed. That is, the mold cleaning process using this mold cleaning resin composition has extremely poor workability, and there is room for improvement.
本発明者は、鋭意検討した結果、メラミン系樹脂と特定の量の金属石鹸と繊維状無機化合物と針葉樹パルプとを含む金型清掃用樹脂組成物が金型清掃性能を良好に維持し、かつ清掃後の成形金型からの除去工程での樹脂組成物のチッピングを抑制できることを見いだした。 As a result of intensive studies, the present inventors have found that a mold cleaning resin composition containing a melamine-based resin, a specific amount of metal soap, a fibrous inorganic compound, and softwood pulp maintains good mold cleaning performance, and It has been found that the chipping of the resin composition in the removing process from the molding die after cleaning can be suppressed.
本発明は、上記のような事情に鑑みなされたものであり、金型清掃性能が良好、かつ清掃後の成形金型からの除去工程での作業性を改善できる金型清掃用樹脂組成物の提供を目的とする。 The present invention has been made in view of the circumstances as described above, and is a mold cleaning resin composition that has good mold cleaning performance and can improve workability in a removal process from a molded mold after cleaning. For the purpose of provision.
前記課題を達成するための具体的手段は、以下のとおりである。
＜１＞メラミン系樹脂と、金属石鹸と、繊維状無機化合物と、針葉樹パルプとを含み、
前記金属石鹸の含有量が、前記金型清掃用樹脂組成物１００質量部に対して１．６質量部以上５．０質量部以下である金型清掃用樹脂組成物である。
Specific means for achieving the above object are as follows.
<1> including a melamine-based resin, a metal soap, a fibrous inorganic compound, and softwood pulp,
The mold cleaning resin composition has a content of the metal soap of 1.6 parts by mass or more and 5.0 parts by mass or less with respect to 100 parts by mass of the mold cleaning resin composition.
＜２＞前記金属石鹸が脂肪酸亜鉛である＜１＞に記載の金型清掃用樹脂組成物である。
＜３＞前記脂肪酸亜鉛がミリスチン酸亜鉛、ラウリン酸亜鉛及びステアリン酸亜鉛からなる群より選択される少なくとも一つを含む＜２＞に記載の金型清掃用樹脂組成物である。
<2> The mold cleaning resin composition according to <1>, wherein the metal soap is fatty acid zinc.
<3> The mold cleaning resin composition according to <2>, wherein the fatty acid zinc includes at least one selected from the group consisting of zinc myristate, zinc laurate, and zinc stearate.
＜４＞前記繊維状無機化合物がセラミックス繊維である＜１＞〜＜３＞のいずれか一つに記載の金型清掃用樹脂組成物である。 <4> The mold cleaning resin composition according to any one of <1> to <3>, wherein the fibrous inorganic compound is a ceramic fiber.
＜５＞前記セラミックス繊維がチタン酸カリウム繊維及びホウ酸アルミニウム繊維からなる群より選択される少なくとも一つを含む＜４＞に記載の金型清掃用樹脂組成物である。
＜６＞前記メラミン系樹脂がメラミン−ホルムアルデヒド樹脂及びメラミン−フェノール共縮合樹脂からなる群より選択される少なくとも一つを含む＜１＞〜＜５＞のいずれか一つに記載の金型清掃用樹脂組成物である。
＜７＞前記メラミン系樹脂が前記針葉樹パルプに含浸している＜１＞〜＜６＞のいずれか一つに記載の金型清掃用樹脂組成物である。
<5> The mold cleaning resin composition according to <4>, wherein the ceramic fiber includes at least one selected from the group consisting of potassium titanate fibers and aluminum borate fibers.
<6> For mold cleaning according to any one of <1> to <5>, wherein the melamine-based resin includes at least one selected from the group consisting of a melamine-formaldehyde resin and a melamine-phenol cocondensation resin. It is a resin composition.
<7> The mold cleaning resin composition according to any one of <1> to <6>, wherein the softwood pulp is impregnated with the melamine resin.
本発明によれば、金型清掃性能が良好、かつ清掃後の成形金型からの除去工程での作業性を改善できる金型清掃用樹脂組成物を提供できる。 ADVANTAGE OF THE INVENTION According to this invention, the resin composition for metal mold | die cleaning which has favorable metal mold | die cleaning performance and can improve workability | operativity in the removal process from the metal mold | die after cleaning can be provided.
以下、本発明の具体的な実施形態について詳細に説明する。なお、本発明は、以下の実施形態に限定されるものではなく、本発明の目的の範囲内において、適宜変更を加えて実施できる。 Hereinafter, specific embodiments of the present invention will be described in detail. The present invention is not limited to the following embodiments, and can be implemented with appropriate modifications within the scope of the object of the present invention.
本明細書において「〜」を用いて示された数値範囲は、「〜」の前後に記載される数値をそれぞれ最小値および最大値として含む範囲を示す。また、組成物中の各成分の量は、特に断らない限り、各成分に複数の種類の物質が含まれる場合に複数の種類の物質を合計した量で表す。
また、本明細書において、「金型清掃用樹脂組成物」を、単に「樹脂組成物」と称する場合がある。
さらに、本明細書において、「成形金型の内部表面」とは、成形金型により成形される被成形物と接する領域を意味する。なお、本明細書中では、「成形金型」を、単に「金型」と称する場合がある。
In the present specification, a numerical range indicated by using “to” indicates a range including the numerical values described before and after “to” as the minimum value and the maximum value, respectively. In addition, unless otherwise specified, the amount of each component in the composition is expressed as a total amount of a plurality of types of substances when each component includes a plurality of types of substances.
In the present specification, the “mold cleaning resin composition” may be simply referred to as “resin composition”.
Further, in the present specification, the “inner surface of the molding die” means a region in contact with a workpiece to be molded by the molding die. In the present specification, the “molding mold” may be simply referred to as “mold”.
［金型清掃用樹脂組成物］
本発明の金型清掃用樹脂組成物は、メラミン系樹脂と、金属石鹸と、繊維状無機化合物と、針葉樹パルプとを含み、前記金属石鹸の含有量が前記金型清掃用樹脂組成物１００質量部に対して１．６質量部以上５．０質量部以下である。本発明の金型清掃用樹脂組成物は、必要に応じて、更に他の成分を用いて構成されてもよい。
[Resin composition for mold cleaning]
The mold cleaning resin composition of the present invention includes a melamine resin, a metal soap, a fibrous inorganic compound, and a softwood pulp, and the content of the metal soap is 100 masses of the mold cleaning resin composition. 1.6 parts by mass or more and 5.0 parts by mass or less with respect to parts. The resin composition for mold cleaning of the present invention may be configured using other components as necessary.
本発明の樹脂組成物は、メラミン系樹脂と特定の量の金属石鹸と繊維状無機化合物と針葉樹パルプとを含むため、流動性と金型清掃性能とを良好に維持し、かつ清掃後に成形金型から汚染物質が付着した樹脂組成物を除去する工程でのチッピングの抑制が期待される。これは、例えば以下のように考えることができる。 Since the resin composition of the present invention contains a melamine-based resin, a specific amount of metal soap, a fibrous inorganic compound, and softwood pulp, the fluidity and mold cleaning performance are maintained well, and the mold is formed after cleaning. It is expected to suppress chipping in the process of removing the resin composition to which contaminants adhere from the mold. This can be considered as follows, for example.
通常、メラミン系樹脂を含む金型清掃用樹脂組成物において、金属石鹸を多量に加えると、金型清掃用樹脂組成物の内部強度が極端に低下し、金型清掃後の金型清掃用樹脂組成物の取り出し作業時に金型清掃用樹脂組成物が脆くなる（チッピングが起きる）ため、作業性が著しく低下する。樹脂組成物の内部強度の低下は、パルプ等の添加物により抑制できることが知られている。しかしながら、たとえばパルプ単独または繊維状無機化合物単独で用いた場合では、金型清掃用樹脂組成物内でパルプまたは繊維状無機化合物の絡み合いが不十分であり内部強度が依然として低い。さらに、広葉樹パルプと繊維状無機化合物とを組み合わせて用いた場合、広葉樹パルプの繊維が短く細いため、これらを組み合わせて用いても互いの絡み合いが不十分であり内部強度が依然として低い。詳細なメカニズムは不明だが、本発明の樹脂組成物は、針葉樹パルプと繊維状無機化合物とを組み合わせて用いるため、針葉樹パルプと繊維状無機化合物とが金型清掃用樹脂組成物内で互いに絡み合い、金型清掃用樹脂組成物１００質量部に対して１．６質量部以上という多量の金属石鹸を含んでも内部強度が十分となり、清掃後の成形金型からの除去工程でのチッピングの発生を抑制できる。
なお、樹脂組成物の内部強度は、たとえばテンシロンを用いて樹脂組成物の曲げ強度を測定することで評価できる。
Usually, in a mold cleaning resin composition containing a melamine resin, when a large amount of metal soap is added, the internal strength of the mold cleaning resin composition is extremely reduced, and the mold cleaning resin after mold cleaning Since the resin composition for mold cleaning becomes brittle (chipping occurs) at the time of taking out the composition, workability is remarkably lowered. It is known that the decrease in internal strength of the resin composition can be suppressed by additives such as pulp. However, when using, for example, pulp alone or fibrous inorganic compound alone, the entanglement of pulp or fibrous inorganic compound is insufficient in the resin composition for mold cleaning, and the internal strength is still low. Furthermore, when hardwood pulp and a fibrous inorganic compound are used in combination, the fibers of the hardwood pulp are short and thin, so even if they are used in combination, the entanglement between them is insufficient and the internal strength is still low. Although the detailed mechanism is unknown, since the resin composition of the present invention is used in combination with a softwood pulp and a fibrous inorganic compound, the softwood pulp and the fibrous inorganic compound are entangled with each other in the mold cleaning resin composition, Even if it contains a large amount of metal soap of 1.6 parts by mass or more with respect to 100 parts by mass of the resin composition for mold cleaning, the internal strength is sufficient, and the occurrence of chipping in the removal process from the molding die after cleaning is suppressed. it can.
The internal strength of the resin composition can be evaluated by measuring the bending strength of the resin composition using, for example, Tensilon.
［メラミン系樹脂］
本発明の樹脂組成物は、メラミン系樹脂を含む。
メラミン系樹脂とは、メラミン樹脂、メラミン−フェノール共縮合樹脂、またはメラミン−ユリア共縮合樹脂をいう。
本発明では、これらの中から１種以上を選択して用いる。
[Melamine resin]
The resin composition of the present invention contains a melamine resin.
The melamine-based resin refers to a melamine resin, a melamine-phenol cocondensation resin, or a melamine-urea cocondensation resin.
In the present invention, one or more of these are selected and used.
前記メラミン樹脂は、トリアジン類と、アルデヒド類との縮合物である。前記トリアジン類は、たとえばメラミン、ベンゾグアナミンおよびアセトグアナミンが挙げられる。前記アルデヒド類は、たとえばホルムアルデヒド、パラホルムアルデヒドおよびアセトアルデヒドが挙げられる。
なお、本明細書において、メラミンとホルムアルデヒドとの縮合物を、メラミン−ホルムアルデヒド樹脂と称する。
The melamine resin is a condensate of triazines and aldehydes. Examples of the triazines include melamine, benzoguanamine, and acetoguanamine. Examples of the aldehydes include formaldehyde, paraformaldehyde, and acetaldehyde.
In the present specification, a condensate of melamine and formaldehyde is referred to as melamine-formaldehyde resin.
前記メラミン−フェノール共縮合樹脂は、トリアジン類と、フェノール類と、アルデヒド類との共縮合物である。前記フェノール類は、たとえばフェノール、クレゾール、キシレノール、エチルフェノールおよびブチルフェノールが挙げられる。 The melamine-phenol cocondensation resin is a cocondensate of triazines, phenols and aldehydes. Examples of the phenols include phenol, cresol, xylenol, ethylphenol, and butylphenol.
前記メラミン−ユリア共縮合樹脂は、トリアジン類と、ユリア類と、アルデヒド類との共縮合物である。
前記メラミン−フェノール共縮合樹脂及び前記メラミン−ユリア共縮合樹脂においては、原料中のトリアジン類とフェノール類との合計量、あるいは原料中のトリアジン類とユリア類との合計量のうち、トリアジン類は例えば３０質量％以上、４０質量％以上、５０質量％以上、６０質量％以上、７０質量％以上、８０質量％以上、又は９０質量％以上であり、１００質量％未満である。
本発明の金型清掃用樹脂組成物は、メラミン系樹脂以外に、本発明の効果を損なわない範囲で他の種類の樹脂、例えば、アルキッド樹脂、ポリエステル樹脂、アクリル系樹脂、エポキシ樹脂、及びゴム類からなる群より選択される一つ以上を含むことができる。
The melamine-urea cocondensation resin is a cocondensate of triazines, ureas, and aldehydes.
In the melamine-phenol co-condensation resin and the melamine-urea co-condensation resin, among the total amount of triazines and phenols in the raw material, or the total amount of triazines and ureas in the raw material, the triazines are For example, 30 mass% or more, 40 mass% or more, 50 mass% or more, 60 mass% or more, 70 mass% or more, 80 mass% or more, or 90 mass% or more, and less than 100 mass%.
In addition to the melamine resin, the mold cleaning resin composition of the present invention is not limited to the effects of the present invention, but other types of resins such as alkyd resins, polyester resins, acrylic resins, epoxy resins, and rubbers. One or more selected from the group consisting of a group can be included.
本発明の樹脂組成物は、メラミン系樹脂を含むため、成形金型の内部表面上に存在する汚染物質に対し優れた金型清掃性能を発揮する。メラミン系樹脂は、極性の高いメチロール基を有している。本発明の樹脂組成物は、極性の高いメチロール基が、熱硬化性樹脂組成物を含む封止成形材料に由来する汚染物質に作用して、優れた金型清掃性能を示す。
また、メラミン系樹脂が熱に対して安定なため、金型清掃時の成形金型の一般的な温度である１６０〜１９０℃付近においても、本発明の樹脂組成物は、安定した金型清掃性能を示す。
Since the resin composition of the present invention contains a melamine resin, it exhibits excellent mold cleaning performance against contaminants present on the inner surface of the mold. Melamine resins have highly polar methylol groups. In the resin composition of the present invention, a highly polar methylol group acts on a contaminant derived from a sealing molding material containing a thermosetting resin composition, and exhibits excellent mold cleaning performance.
In addition, since the melamine resin is stable against heat, the resin composition of the present invention is capable of stable mold cleaning even in the vicinity of 160 to 190 ° C. which is a general temperature of a mold during mold cleaning. Show performance.
［金属石鹸］
本発明の樹脂組成物は、金属石鹸を含む。
金属石鹸とは、炭素数１２〜２０の脂肪酸と、アルミニウム、カルシウム、亜鉛およびマグネシウムから選択される金属と、から構成される脂肪酸の金属塩である。
本発明の樹脂組成物が含む金属石鹸は、清掃時に樹脂組成物の流動性が向上しメラミン系樹脂が成形金型の内部表面上に存在する汚染物質に作用しやすくなる滑剤としての効果と、成形金型の内部表面上に存在する汚染物質との親和性を高め、汚染物質に直接作用する洗浄剤としての効果とを示す。
[Metal soap]
The resin composition of the present invention contains a metal soap.
The metal soap is a metal salt of a fatty acid composed of a fatty acid having 12 to 20 carbon atoms and a metal selected from aluminum, calcium, zinc and magnesium.
The metal soap contained in the resin composition of the present invention has an effect as a lubricant that improves the fluidity of the resin composition at the time of cleaning, and the melamine resin easily acts on contaminants present on the inner surface of the molding die, The affinity with the contaminant which exists on the internal surface of a shaping | molding metal mold | die is raised, and the effect as a cleaning agent which acts on a contaminant directly is shown.
本発明の樹脂組成物が含む金属石鹸は、たとえばステアリン酸亜鉛、ミリスチン酸亜鉛、ラウリン酸亜鉛、パルミチン酸亜鉛、ステアリン酸カルシウム、ステアリン酸アルミニウム、ステアリン酸マグネシウムが挙げられる。 Examples of the metal soap contained in the resin composition of the present invention include zinc stearate, zinc myristate, zinc laurate, zinc palmitate, calcium stearate, aluminum stearate, and magnesium stearate.
本発明の樹脂組成物が含む金属石鹸の含有量は、樹脂組成物１００質量部に対して１．６質量部以上５．０質量部以下である。より好ましくは、樹脂組成物１００質量部に対して１．８質量部以上３質量部以下であり、さらに好ましくは１．８質量部以上２．３質量部以下である。
樹脂組成物が含有する金属石鹸の量が過剰であると、金型清掃工程において、成形金型の内部表面上に金属石鹸が過剰に付着、残存し、新たな汚染物質となる。つまり、金属石鹸が過剰である樹脂組成物は、清掃とは逆の作用、つまり成形金型の内部表面上を汚染する作用を示す。
本発明の樹脂組成物は、金属石鹸の含有量が１．６質量部以上のため、前述した滑剤効果と洗浄剤効果とにより従来の樹脂組成物よりも格段に優れた清掃性能を示し、また５．０質量部以下のため、金型清掃時に金属石鹸が成形金型の内部表面上に残存せず、清掃性能が良好であるとともに、樹脂組成物の内部強度が低下せず、清掃後にチッピングが起きない。
Content of the metal soap which the resin composition of this invention contains is 1.6 mass parts or more and 5.0 mass parts or less with respect to 100 mass parts of resin compositions. More preferably, they are 1.8 mass parts or more and 3 mass parts or less with respect to 100 mass parts of resin compositions, More preferably, they are 1.8 mass parts or more and 2.3 mass parts or less.
When the amount of the metal soap contained in the resin composition is excessive, the metal soap is excessively adhered and remains on the inner surface of the molding die in the mold cleaning step, and becomes a new contaminant. That is, the resin composition in which the metal soap is excessive exhibits an action opposite to cleaning, that is, an action of contaminating the inner surface of the molding die.
Since the resin composition of the present invention has a metal soap content of 1.6 parts by mass or more, the above-mentioned lubricant effect and cleaning agent effect show cleaning performance far superior to conventional resin compositions, and Since it is 5.0 parts by mass or less, the metal soap does not remain on the inner surface of the mold when cleaning the mold, the cleaning performance is good, the internal strength of the resin composition does not decrease, and chipping is performed after cleaning. Does not happen.
なお、特開平８−５７８６５号（特許文献１）には、清掃性能の向上のため、金属石鹸に代表される滑剤の含有量が、樹脂組成物１００質量部に対し１．５質量部以下が好ましいと記載されている。本発明者は、本発明の樹脂組成物が含む金属石鹸の含有量が、たとえば樹脂組成物１００質量部に対し１．６質量部以上であっても、十分に金型清掃が行える理由を以下のように考えている。
本発明の樹脂組成物は、針葉樹パルプと繊維状無機化合物とを含むため、前述したようにこれらの絡み合いの効果により内部強度が十分である。そのため、内部強度を弱める方向に作用する金属石鹸を多量に含んでも内部強度が低下しない。
In JP-A-8-57865 (Patent Document 1), the content of a lubricant typified by metal soap is 1.5 parts by mass or less with respect to 100 parts by mass of the resin composition in order to improve cleaning performance. Preferred is described. The present inventor described below why metal molds can be sufficiently cleaned even when the content of the metal soap contained in the resin composition of the present invention is 1.6 parts by mass or more with respect to 100 parts by mass of the resin composition, for example. I think like that.
Since the resin composition of the present invention contains softwood pulp and a fibrous inorganic compound, as described above, the internal strength is sufficient due to the effect of these entanglements. Therefore, even if a large amount of metal soap that acts in the direction of weakening the internal strength is included, the internal strength does not decrease.
本発明の樹脂組成物が含む金属石鹸は、ステアリン酸亜鉛、ミリスチン酸亜鉛に代表される脂肪酸亜鉛であることが好ましい。前記金属石鹸が脂肪酸亜鉛であれば、成形金型の内部表面上に存在する汚染物質への親和性が高く、金型清掃性能が高いため好ましい。 The metal soap contained in the resin composition of the present invention is preferably fatty acid zinc represented by zinc stearate and zinc myristate. If the metallic soap is fatty acid zinc, it is preferable because of its high affinity for contaminants present on the inner surface of the molding die and high mold cleaning performance.
なお、本発明の樹脂組成物が含む金属石鹸の種類および含有量は、蛍光Ｘ線分析法およびガスクロマトグラフィー質量分析法により金属種および脂肪酸を確認し求められる。 In addition, the kind and content of the metal soap which the resin composition of this invention contains are calculated | required by confirming a metal seed | species and a fatty acid by a fluorescent X ray analysis method and a gas chromatography mass spectrometry.
［繊維状無機化合物］
本発明の樹脂組成物は、繊維状無機化合物を含む。
繊維状無機化合物とは、たとえばガラス繊維、金属繊維、セラミックス繊維のような繊維状の無機化合物（無機繊維）である。
前記金属繊維は、たとえばスチールファイバー、ステンレスファイバーが挙げられる。
前記セラミックス繊維は、たとえばアルミナ繊維、シリカ繊維、チタン酸カリウム繊維、炭酸カルシウム繊維、ケイ酸カルシウム繊維、ホウ酸アルミニウム繊維、炭化ケイ素繊維、ジルコニア繊維、窒化ケイ素繊維、硫酸マグネシウム繊維、酸化亜鉛繊維が挙げられる。
前記繊維状無機化合物の形状は、特に限定されないが、断面が真円状でも扁平状でもよい。また、代表的な前記繊維状無機化合物の平均繊維長は５μｍ〜３０μｍの範囲であり、平均繊維径は０．１μｍ〜１．０μｍの範囲であり、アスペクト比は１０〜６０の範囲である。なお、繊維状無機化合物の繊維長、繊維径、及びアスペクト比は、電子顕微鏡を用いて確認できる。
前記繊維状無機化合物は、単独で用いてもよく、複数の種類の繊維状無機化合物を組み合わせて用いてもよい。
[Fibrous inorganic compound]
The resin composition of the present invention contains a fibrous inorganic compound.
The fibrous inorganic compound is a fibrous inorganic compound (inorganic fiber) such as glass fiber, metal fiber, or ceramic fiber.
Examples of the metal fibers include steel fibers and stainless fibers.
Examples of the ceramic fibers include alumina fibers, silica fibers, potassium titanate fibers, calcium carbonate fibers, calcium silicate fibers, aluminum borate fibers, silicon carbide fibers, zirconia fibers, silicon nitride fibers, magnesium sulfate fibers, and zinc oxide fibers. Can be mentioned.
The shape of the fibrous inorganic compound is not particularly limited, but the cross section may be a perfect circle or a flat shape. Moreover, the average fiber length of the typical fibrous inorganic compound is in the range of 5 to 30 μm, the average fiber diameter is in the range of 0.1 to 1.0 μm, and the aspect ratio is in the range of 10 to 60. The fiber length, fiber diameter, and aspect ratio of the fibrous inorganic compound can be confirmed using an electron microscope.
The fibrous inorganic compound may be used alone or in combination of a plurality of types of fibrous inorganic compounds.
本発明の樹脂組成物が含む繊維状無機化合物は、清掃時に成形金型の内部表面上に存在する汚染物質へ作用し、樹脂組成物と汚染物質とが接着する作用効果と、樹脂組成物中の内部強度を高める作用効果とを示す。 The fibrous inorganic compound contained in the resin composition of the present invention acts on the contaminants present on the inner surface of the molding die during cleaning, and has the effect that the resin composition and the contaminants adhere to each other. The effect which raises the internal strength of is shown.
本発明の樹脂組成物が含む繊維状無機化合物（無機繊維）は、セラミックス繊維が好ましい。
前記繊維状無機化合物がセラミックス繊維であれば、前述した作用効果が特に優れ、かつ清掃時の繊維状無機化合物による清掃金型表面への傷つきが極めて小さいため好ましい。
なお、前記セラミックス繊維の表面は、たとえばエポキシシラン系、アミノシラン系、メタクリロキシシラン系等のシランカップリング剤や各種樹脂を用いて表面処理されることが好ましい。本発明の樹脂組成物は、表面処理されたセラミックス繊維を含むことで、繊維状無機化合物とメラミン系樹脂との密着性が向上し、樹脂組成物の内部強度がより一層向上する。
The fibrous inorganic compound (inorganic fiber) contained in the resin composition of the present invention is preferably a ceramic fiber.
If the fibrous inorganic compound is a ceramic fiber, the above-described action and effect are particularly excellent, and scratches on the surface of the cleaning mold by the fibrous inorganic compound at the time of cleaning are preferable.
In addition, it is preferable that the surface of the ceramic fiber is surface-treated using a silane coupling agent such as epoxy silane, amino silane, or methacryloxy silane, or various resins. By including the surface-treated ceramic fiber, the resin composition of the present invention improves the adhesion between the fibrous inorganic compound and the melamine resin, and further improves the internal strength of the resin composition.
前記セラミックス繊維は、たとえばホウ酸アルミニウム繊維である四国化成工業株式会社製 商品名アルボレックスＹ、アルボレックスＭ２０、アルボレックスＹＳ３Ａ、アルボレックスＹＳ２Ｂ、アルボレックスＹＳ４、チタン酸カリウム繊維である大塚化学ホールディングス株式会社製 商品名ティスモＤ、ティスモＬ、ティスモＤ１０１、ティスモＤ１０２、硫酸マグネシウム繊維である宇部興産株式会社製 商品名モスハイジ、炭酸カルシウム繊維である丸尾カルシウム株式会社製、商品名ウイスカルＡ、アルミナ−シリカ繊維である株式会社ＩＴＭ製、商品名ＦＸＬバルクファイバーがそれぞれ市販されている。 The ceramic fibers are, for example, aluminum borate fibers manufactured by Shikoku Kasei Kogyo Co., Ltd. Trade names Arborex Y, Arborex M20, Arborex YS3A, Arborex YS2B, Arborex YS4, Otsuka Chemical Holdings Co., Ltd., which is a potassium titanate fiber Product name Tismo D, Tismo L, Tismo D101, Tismo D102, Magnesium sulfate fiber Ube Industries, Ltd. Trade name Moshei, calcium carbonate fiber Maruo Calcium Co., Ltd., trade name Wiscal A, alumina-silica fiber The product name FXL bulk fiber manufactured by ITM Co., Ltd. is commercially available.
本発明の樹脂組成物が含む繊維状無機化合物は、チタン酸カリウム繊維及びホウ酸アルミニウム繊維からなる群より選択される少なくとも一つを含むことが特に好ましい。すなわち、本発明の樹脂組成物は、前記セラミックス繊維として、チタン酸カリウム繊維及びホウ酸アルミニウム繊維からなる群より選択される少なくとも一つを含むことが好ましい。
前記繊維状無機化合物がチタン酸カリウム繊維及びホウ酸アルミニウム繊維からなる群より選択される少なくとも一つを含めば、前述した作用効果、特に内部強度の向上によるチッピング発生の抑制効果が極めて優れる。また、化学的、熱的に安定であるため、樹脂組成物の製造時、貯蔵時および樹脂組成物を用いた清掃時に安定した作用効果を奏する。さらに、チタン酸カリウム繊維及びホウ酸アルミニウム繊維はいずれも針葉樹パルプとの絡み合いが十分であり、樹脂組成物の内部強度がより一層向上するため好ましい。
The fibrous inorganic compound contained in the resin composition of the present invention particularly preferably contains at least one selected from the group consisting of potassium titanate fibers and aluminum borate fibers. That is, the resin composition of the present invention preferably contains at least one selected from the group consisting of potassium titanate fibers and aluminum borate fibers as the ceramic fibers.
If the fibrous inorganic compound includes at least one selected from the group consisting of potassium titanate fibers and aluminum borate fibers, the above-described operational effects, particularly the effect of suppressing the occurrence of chipping due to the improvement of internal strength, are extremely excellent. Moreover, since it is chemically and thermally stable, it has a stable effect at the time of production of the resin composition, storage, and cleaning using the resin composition. Furthermore, both potassium titanate fibers and aluminum borate fibers are preferable because they are sufficiently entangled with softwood pulp and the internal strength of the resin composition is further improved.
発明の樹脂組成物が含む繊維状無機化合物の含有量は、樹脂組成物１００質量部に対して１．０質量部以上３０．０質量部以下の範囲が好ましく、１．０質量部以上１０．０質量部以下の範囲がより好ましく、３．０質量部以上６．０質量部以下の範囲がさらに好ましい。前記範囲が１．０質量部以上であれば、清掃時に成形金型の内部表面上に存在する汚染物質へ作用し、樹脂組成物と汚染物質とが接着する作用効果と、樹脂組成物中の内部強度を高める作用効果を十分に奏するため好ましく、また３０．０質量部以下であれば、樹脂組成物の流動性が十分となり、金型のパッケージの隅々まで充填するため好ましい。 The content of the fibrous inorganic compound contained in the resin composition of the invention is preferably in the range of 1.0 to 30.0 parts by mass with respect to 100 parts by mass of the resin composition, and 1.0 to 10 parts by mass. A range of 0 parts by mass or less is more preferable, and a range of 3.0 parts by mass or more and 6.0 parts by mass or less is more preferable. If the range is 1.0 part by mass or more, it acts on the contaminants present on the inner surface of the molding die at the time of cleaning, and the effect of bonding the resin composition and the contaminants, It is preferable for sufficiently exhibiting the effect of increasing the internal strength, and if it is 30.0 parts by mass or less, the fluidity of the resin composition becomes sufficient, and it is preferable to fill every corner of the mold package.
［針葉樹パルプ］
本発明の樹脂組成物は、針葉樹パルプを含む。
針葉樹パルプとは、アカマツ、エゾマツ、トドマツ、ベイマツ、モミ、カラマツ、パイン、ベイツガ、ベイトウヒなどの針葉樹を原料とするパルプである。
針葉樹パルプは繊維が太く長く、強い強度をもつという特徴がある。一方、広葉樹パルプは、繊維が短く細く表面が滑らかとの特徴がある。従来の金型清掃用樹脂組成物は、流動性を向上させるために、広葉樹パルプが広く用いられている。
本発明の樹脂組成物は、前述したように針葉樹パルプと繊維状無機化合物とを含むため、針葉樹パルプと繊維状無機化合物との絡み合いにより内部強度が向上し、内部強度を弱める方向に作用する金属石鹸を多量に含んでも内部強度が低下せず、清掃後の成形金型からの除去工程でのチッピング発生を抑制できる。
前記針葉樹パルプは市販品が入手可能であり、たとえば日本製紙株式会社製のＮＳＰＰ１（商品名）等が挙げられる。
[Coniferous pulp]
The resin composition of the present invention contains softwood pulp.
The conifer pulp is a pulp made from conifers such as red pine, spruce, todomatsu, pine, fir, larch, pine, batesga, and beech spruce.
Softwood pulp is characterized by thick and long fibers and strong strength. On the other hand, hardwood pulp is characterized by short and thin fibers and a smooth surface. In the conventional mold cleaning resin composition, hardwood pulp is widely used in order to improve fluidity.
As described above, the resin composition of the present invention contains a softwood pulp and a fibrous inorganic compound, so that the internal strength is improved by the entanglement between the softwood pulp and the fibrous inorganic compound, and the metal acts in the direction of weakening the internal strength. Even if a large amount of soap is contained, the internal strength does not decrease, and the occurrence of chipping in the removal process from the molding die after cleaning can be suppressed.
The said softwood pulp can obtain a commercial item, for example, NSPP1 (brand name) by Nippon Paper Industries Co., Ltd. is mentioned.
なお、本発明の樹脂組成物は、本発明の優れた作用効果が失われない範囲で、針葉樹パルプに加えて、広葉樹パルプ、藁パルプ、竹パルプ、コットンパルプなどの繊維状有機化合物を含んでもよい。 The resin composition of the present invention may contain fibrous organic compounds such as hardwood pulp, straw pulp, bamboo pulp, and cotton pulp in addition to the softwood pulp as long as the excellent effects of the present invention are not lost. Good.
本発明の樹脂組成物において、前記針葉樹パルプは、メラミン系樹脂が含浸したパルプとして用いることが、樹脂組成物中での分散性が向上し、金型清掃性能のばらつき、内部強度のばらつきが低下するため好ましい。ここで、メラミン系樹脂が含浸したパルプとは、メラミン系樹脂量の少なくとも一部が針葉樹パルプの繊維間の間隙に入り込んだ状態；及びメラミン系樹脂量の少なくとも一部が針葉樹パルプの繊維の表面の一部または全部を被覆した状態からなる群より選択される少なくとも一つにあることを指す。
パルプをメラミン系樹脂で含浸処理する場合、ここで「メラミン系樹脂の少なくとも一部」とは、メラミン系樹脂が複数種類のメラミン系樹脂からなる混合物である場合は、当該混合物の全体に比しての一部を意味し、当該混合物全体と同じ組成を有するものである。
メラミン系樹脂は水溶液の状態で使用するのが好ましい。たとえば、前記メラミン系樹脂含浸パルプは、パルプをメラミン系樹脂水溶液に含浸した後に乾燥して得られる。
In the resin composition of the present invention, the softwood pulp is used as a pulp impregnated with a melamine resin, so that dispersibility in the resin composition is improved, variation in mold cleaning performance, and variation in internal strength is reduced. Therefore, it is preferable. Here, the pulp impregnated with the melamine-based resin is a state in which at least a part of the amount of the melamine-based resin has entered the gap between the fibers of the softwood pulp; and at least a part of the amount of the melamine-based resin is the surface of the fiber of the softwood pulp It exists in at least one selected from the group which consists of the state which coat | covered one part or all part.
When the pulp is impregnated with a melamine resin, “at least a part of the melamine resin” means that the melamine resin is a mixture of a plurality of types of melamine resins compared to the entire mixture. And has the same composition as the whole mixture.
The melamine resin is preferably used in the form of an aqueous solution. For example, the melamine resin-impregnated pulp can be obtained by impregnating a pulp with a melamine resin aqueous solution and then drying.
前記針葉樹パルプのサイズは、特に限定されないが、樹脂組成物の内部強度がより一層向上するため、繊維長で５μｍ〜１０００μｍの範囲が好ましく、１０μｍ〜２００μｍの範囲がより好ましい。パルプの繊維長は、例えばＩＳＯ１６０６５−２に対応するＪＩＳ Ｐ８２２６−２の規定に準拠した方法で測定することができる。
また、前記針葉樹パルプの含有量は、金型清掃工程での樹脂組成物の流動性が向上するため、樹脂組成物１００質量部に対して、２質量部以上５０質量部以下が好ましく、２質量部以上１０質量部以下がより好ましい。
なお、本発明の樹脂組成物が含む針葉樹パルプおよび繊維状無機化合物は、樹脂組成物の内部強度を高める作用効果に加え、金型清掃工程で成形金型の内部表面上に存在する汚染物質に物理的に作用する、いわゆる研磨効果による清掃性能も示す。特に、本発明の樹脂組成物は、針葉樹パルプおよび繊維状無機化合物が適度に絡みあっているため、前述した研磨効果が従来の樹脂組成物よりも優れる。
The size of the softwood pulp is not particularly limited, but the fiber strength is preferably in the range of 5 μm to 1000 μm and more preferably in the range of 10 μm to 200 μm because the internal strength of the resin composition is further improved. The fiber length of the pulp can be measured by a method based on, for example, the standard of JIS P8226-2 corresponding to ISO16065-2.
Further, the content of the softwood pulp is preferably 2 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the resin composition because the fluidity of the resin composition in the mold cleaning process is improved. More preferred is 10 parts by mass or more.
The softwood pulp and the fibrous inorganic compound contained in the resin composition of the present invention, in addition to the effect of increasing the internal strength of the resin composition, in addition to the contaminants present on the internal surface of the molding die in the mold cleaning process. The cleaning performance by the so-called polishing effect that acts physically is also shown. In particular, since the resin composition of the present invention is appropriately entangled with the softwood pulp and the fibrous inorganic compound, the above-mentioned polishing effect is superior to the conventional resin composition.
［その他の添加剤］
本発明の樹脂組成物は、本発明の優れた作用効果が失われない範囲で、その他の添加剤を含んでもよい。
具体的には、本発明の樹脂組成物は、必要に応じて、更に、アルキッド樹脂、ポリエステル樹脂、アクリル系樹脂、エポキシ樹脂等の樹脂類、ゴム類を含んでもよい。また、たとえば、金属石鹸以外の滑剤、着色剤、抗酸化剤に代表される各種の添加剤を含んでもよい。
[Other additives]
The resin composition of the present invention may contain other additives as long as the excellent effects of the present invention are not lost.
Specifically, the resin composition of the present invention may further contain resins such as alkyd resin, polyester resin, acrylic resin, and epoxy resin, and rubber as necessary. Further, for example, various additives represented by lubricants, colorants, and antioxidants other than metal soaps may be included.
本発明の樹脂組成物は、硬化触媒を含んでもよい。前記硬化触媒は、無水フタル酸、ミリスチン酸、ステアリン酸、スルファミン酸、蓚酸、安息香酸、トリメリット酸、ｐ−トルエンスルホン酸からなる群より選ばれる少なくとも一つの有機酸であれば、メラミン系樹脂との反応性の観点から好ましい。 The resin composition of the present invention may contain a curing catalyst. If the curing catalyst is at least one organic acid selected from the group consisting of phthalic anhydride, myristic acid, stearic acid, sulfamic acid, succinic acid, benzoic acid, trimellitic acid, and p-toluenesulfonic acid, a melamine resin From the viewpoint of reactivity.
本発明の樹脂組成物は、研磨効果により金型清掃性能を改善できるため、繊維状無機化合物以外の無機充填材を含んでもよい。
前記無機充填材は、炭化ケイ素、酸化ケイ素（シリカ）、炭化チタン、酸化チタン、炭化ホウ素、酸化ホウ素、酸化アルミニウム、酸化マグネシウム、酸化カルシウム、炭酸カルシウムを例示できる。特に研磨効果が優れるため、酸化ケイ素が好ましい。
なお、これらの無機充填材の組成は、前記繊維状無機化合物の組成と同一であってもよい。
Since the resin composition of the present invention can improve the mold cleaning performance due to the polishing effect, it may contain an inorganic filler other than the fibrous inorganic compound.
Examples of the inorganic filler include silicon carbide, silicon oxide (silica), titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, calcium oxide, and calcium carbonate. In particular, silicon oxide is preferable because of its excellent polishing effect.
In addition, the composition of these inorganic fillers may be the same as the composition of the fibrous inorganic compound.
［樹脂組成物の調製方法］
本発明の樹脂組成物は、たとえば、前記メラミン系樹脂、前記金属石鹸、前記繊維状無機化合物、前記針葉樹パルプ、必要に応じて用いるその他の添加物を、ニーダー、リボンブレンダー、ヘンシェルミキサー、ボールミル、ロール練り機、らいかい機、タンブラー等を用いて、ほぼ均一に混合することにより、調製する。
[Method for Preparing Resin Composition]
The resin composition of the present invention includes, for example, a kneader, a ribbon blender, a Henschel mixer, a ball mill, the melamine resin, the metal soap, the fibrous inorganic compound, the softwood pulp, and other additives used as necessary. It is prepared by mixing almost uniformly using a roll kneader, a rough machine, a tumbler or the like.
［樹脂組成物の使用方法］
本発明の金型清掃用樹脂組成物は、トランスファー型成形機に用いられるトランスファータイプの金型清掃用樹脂組成物に好適である。
本発明の樹脂組成物は、通常、タブレット状に加工して、成形金型の内部表面上（成形金型内）の清掃作業に用いられる。詳しくは、成形金型の上にリードフレームを配置した後、タブレット状の樹脂組成物をポット部に挿入し、型締めした後、プランジャーで押し流す。この際、ポット部の樹脂組成物は、ランナー部を経由し、ゲート部を通り、キャビティ内部に流れ込む。所定の成形時間が経過した後、金型を開き、リードフレームと一体となった成形物、すなわち、汚染物質を含む樹脂組成物の成形物を取り除くことで行われる。
本発明の樹脂組成物は、集積回路等の封止成形作業における成形金型の内部表面上に存在する汚染物質を除去するのに好適に用いられる。なお、前記成形金型の材質は、例えば、鉄やクロムなどである。
[Usage method of resin composition]
The mold cleaning resin composition of the present invention is suitable for a transfer type mold cleaning resin composition used in a transfer molding machine.
The resin composition of the present invention is usually processed into a tablet shape and used for cleaning work on the inner surface of the molding die (inside the molding die). Specifically, after arranging the lead frame on the molding die, the tablet-like resin composition is inserted into the pot portion, clamped, and then pushed away with a plunger. At this time, the resin composition in the pot part flows through the runner part, the gate part, and flows into the cavity. After a predetermined molding time has elapsed, the mold is opened, and the molded product integrated with the lead frame, that is, the molded product of the resin composition containing contaminants is removed.
The resin composition of the present invention is suitably used for removing contaminants present on the inner surface of a molding die in sealing molding operations such as integrated circuits. The material of the molding die is, for example, iron or chrome.
本発明の樹脂組成物は、エポキシ樹脂、シリコーン樹脂、フェノール樹脂、及びポリイミド樹脂に代表される熱硬化性樹脂組成物を含む封止成形材料に由来する汚染物質を、成形金型の内部表面上から取り除くのに適している。
特に、鉛、アンチモン、ハロゲン化合物に代表される、環境負荷が大きい配合物を含まないグリーンコンパウンドと呼ばれる封止成形材料を用いた成形後の成形金型内の清掃においても、本発明の樹脂組成物は優れた清掃性能を発揮する。
The resin composition of the present invention has a contaminant derived from a sealing molding material containing a thermosetting resin composition represented by an epoxy resin, a silicone resin, a phenol resin, and a polyimide resin on the inner surface of the molding die. Suitable for removing from.
In particular, the resin composition of the present invention is also used for cleaning inside a molding die after molding using a green molding compound called green compound which does not contain a compound with a large environmental load, such as lead, antimony and halogen compounds. Goods exhibit excellent cleaning performance.
グリーンコンパウンドと呼ばれる金属水酸化物系難燃剤、有機リン系難燃剤を含む封止成形材料またはエポキシ樹脂設計や配合で難燃化を達成できる封止成形材料は、従来の封止成形材料よりも金型への密着性が高く、金型清掃がより困難であった。
本発明の樹脂組成物は、樹脂組成物１００質量部に対して金属石鹸を１．６質量部以上含むことにより、清掃性能と作業性とが共に優れるため、グリーンコンパウンドと呼ばれる封止成形材料の封止成形後の成形金型内清掃に適している。
Sealing molding materials containing metal hydroxide flame retardants and organic phosphorus flame retardants called green compounds, or sealing molding materials that can achieve flame retardants by epoxy resin design and blending, are more than conventional sealing molding materials The adhesion to the mold was high, and the mold cleaning was more difficult.
Since the resin composition of the present invention contains 1.6 parts by mass or more of metal soap with respect to 100 parts by mass of the resin composition, both the cleaning performance and workability are excellent, and therefore the sealing molding material called green compound is used. Suitable for cleaning inside the mold after sealing molding.
［実施例］
以下、本発明を実施例により更に具体的に説明するが、本発明はその主旨を超えない限り、以下の実施例に限定されるものではない。
[Example]
EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples unless it exceeds the gist thereof.
［針葉樹パルプとメラミン−ホルムアルデヒド樹脂とを含むメラミン系樹脂の調製］
（製造例１）
メラミン４８０質量部と、ホルムアルデヒド（３７質量％水溶液）５２２質量部とを加熱反応し、公知の方法でメラミン−ホルムアルデヒド樹脂を作り、得られた樹脂液に針葉樹パルプ（日本製紙株式会社製 商品名ＮＳＰＰ１）２４８質量部を加えて混練した後、減圧乾燥、粉末化して、針葉樹パルプ含有メラミン−ホルムアルデヒド樹脂を得た。
[Preparation of Melamine Resin Containing Softwood Pulp and Melamine-Formaldehyde Resin]
(Production Example 1)
Melting 480 parts by mass of melamine and 522 parts by mass of formaldehyde (37% by mass aqueous solution) to produce melamine-formaldehyde resin by a known method, and conifer pulp (made by Nippon Paper Industries Co., Ltd., trade name NSPP1) ) After adding 248 parts by mass and kneading, drying under reduced pressure and pulverization yielded a softwood pulp-containing melamine-formaldehyde resin.
（製造例２）
メラミン３４６質量部とホルムアルデヒド（３７質量％水溶液）５２２質量部及びフェノール１３１質量部とを加熱反応し、公知の方法でメラミン−フェノール共縮合樹脂を作り、得られた樹脂液に針葉樹パルプ２４８質量部（日本製紙株式会社製 商品名：ＮＳＰＰ１）を加えて混練した後、減圧乾燥、粉末化して、針葉樹パルプ含有メラミン−フェノール共縮合樹脂を得た。
(Production Example 2)
Melting 346 parts by weight of melamine, 522 parts by weight of formaldehyde (37% by weight aqueous solution) and 131 parts by weight of phenol, a melamine-phenol cocondensation resin is made by a known method, and 248 parts by weight of softwood pulp is obtained in the obtained resin liquid. (Product name: NSPP1 manufactured by Nippon Paper Industries Co., Ltd.) was added and kneaded, and then dried under reduced pressure and pulverized to obtain a softwood pulp-containing melamine-phenol cocondensation resin.
（製造例３）
メラミン４８０質量部と、ホルムアルデヒド（３７質量％水溶液）５２２質量部とを加熱反応し、公知の方法でメラミン−ホルムアルデヒド樹脂を作り、得られた樹脂液に広葉樹パルプ（日本製紙株式会社製 商品名ＬＤＰＴ）２４８質量部を加えて混練した後、減圧乾燥、粉末化して、広葉樹パルプ含有メラミン−ホルムアルデヒド樹脂を得た。
(Production Example 3)
Melting 480 parts by mass of melamine and 522 parts by mass of formaldehyde (37% by mass aqueous solution) to produce a melamine-formaldehyde resin by a known method, and using the resulting resin solution hardwood pulp (trade name LDPT manufactured by Nippon Paper Industries Co., Ltd.) ) After adding 248 parts by mass and kneading, drying under reduced pressure and pulverization yielded a hardwood pulp-containing melamine-formaldehyde resin.
［金型清掃用樹脂組成物の調製］
（実施例１）
製造例１の針葉樹パルプとメラミン−ホルムアルデヒド樹脂とを含むメラミン系樹脂３０質量部（うちメラミン−ホルムアルデヒド樹脂として２２質量部、針葉樹パルプとして８質量部）およびメラミン系樹脂（製品名：ニカレヂンＳ−１６６、日本カーバイド工業株式会社製）５０質量部と、シリカ（製品名：純硅石粉、瀬戸窯業原料株式会社製）２０質量部と、チタン酸カリウム繊維（製品名：ティスモＤ、大塚化学株式会社製）５．０質量部と、ミリスチン酸亜鉛１．８質量部と、をボールミルに仕込み、粉砕した。次いで、エチレンビスステアリン酸アミド０．４質量部をナウターミキサーにて加え、実施例１の樹脂組成物を得た。このようにして得た樹脂組成物をタブレット成形して、金型清掃評価に用いた。
なお、樹脂組成物１００質量部に対する金属石鹸の量は、１．７質量部である。
[Preparation of resin composition for mold cleaning]
Example 1
30 parts by mass of melamine resin (including 22 parts by mass as melamine-formaldehyde resin and 8 parts by mass as softwood pulp) and melamine resin (product name: Nicoledin S-166) containing the softwood pulp of Production Example 1 and melamine-formaldehyde resin 50 parts by mass of Nippon Carbide Industries Co., Ltd., 20 parts by mass of silica (product name: pure meteorite powder, manufactured by Seto Ceramics Co., Ltd.), and potassium titanate fiber (product name: Tismo D, manufactured by Otsuka Chemical Co., Ltd.) ) 5.0 parts by mass and 1.8 parts by mass of zinc myristate were charged into a ball mill and pulverized. Next, 0.4 parts by mass of ethylenebisstearic acid amide was added using a Nauter mixer to obtain a resin composition of Example 1. The resin composition thus obtained was tablet-molded and used for mold cleaning evaluation.
In addition, the quantity of the metal soap with respect to 100 mass parts of resin compositions is 1.7 mass parts.
（実施例２）
表１に記載した組成のとおり、金属石鹸であるミリスチン酸亜鉛を２．０質量部用いて、樹脂組成物１００質量部に対する金属石鹸の量を１．９質量部にした以外は、実施例１と同様にして樹脂組成物を得た。
(Example 2)
Example 1 except that the amount of the metal soap was changed to 1.9 parts by mass with respect to 100 parts by mass of the resin composition using 2.0 parts by mass of zinc myristate as the metal soap as shown in Table 1. In the same manner, a resin composition was obtained.
（実施例３）
表１に記載した組成のとおり、金属石鹸であるミリスチン酸亜鉛を５．０質量部用いて、樹脂組成物１００質量部に対する金属石鹸の量を４．５質量部にした以外は、実施例１と同様にして樹脂組成物を得た。
(Example 3)
Example 1 except that the amount of metal soap was changed to 4.5 parts by mass with respect to 100 parts by mass of resin composition using 5.0 parts by mass of zinc myristate, which is a metal soap, as shown in Table 1. In the same manner, a resin composition was obtained.
（実施例４）
表１に記載した組成のとおり、金属石鹸であるラウリン酸亜鉛を２．０質量部用いて、樹脂組成物１００質量部に対する金属石鹸の量を１．９質量部にした以外は、実施例１と同様にして樹脂組成物を得た。
Example 4
Example 1 except that 2.0 parts by mass of zinc laurate, which is a metal soap, was used as the composition described in Table 1, and the amount of metal soap was 1.9 parts by mass relative to 100 parts by mass of the resin composition. In the same manner, a resin composition was obtained.
（実施例５）
表１に記載した組成のとおり、金属石鹸であるステアリン酸亜鉛を２．０質量部用いた以外は、実施例１と同様にして樹脂組成物を得た。
(Example 5)
As the composition described in Table 1, a resin composition was obtained in the same manner as in Example 1 except that 2.0 parts by mass of zinc stearate, which was a metal soap, was used.
（実施例６）
表１に記載した組成のとおり、ホウ酸アルミニウム繊維（四国化成工業株式会社製 商品名アルボレックスＹ）を用い、金属石鹸であるミリスチン酸亜鉛を２．０質量部用い、硬化触媒である安息香酸を０．１質量部用いた以外は、実施例１と同様にして樹脂組成物を得た。
(Example 6)
As shown in Table 1, aluminum borate fibers (trade name Arbolex Y, manufactured by Shikoku Kasei Kogyo Co., Ltd.) are used, 2.0 parts by mass of zinc myristate, which is a metal soap, and benzoic acid, which is a curing catalyst. A resin composition was obtained in the same manner as in Example 1 except that 0.1 part by mass was used.
（実施例７）
表１に記載した組成のとおり、製造例２のメラミン系樹脂３０質量部を用い、ホウ酸アルミニウム繊維（四国化成工業株式会社製 商品名アルボレックスＹ）を用い、金属石鹸であるミリスチン酸亜鉛を２．０質量部用いた以外は、実施例１と同様にして樹脂組成物を得た。
(Example 7)
As shown in Table 1, using 30 parts by mass of the melamine resin of Production Example 2, using aluminum borate fibers (trade name Arborex Y, manufactured by Shikoku Kasei Kogyo Co., Ltd.), the metal soap zinc myristate A resin composition was obtained in the same manner as in Example 1 except that 2.0 parts by mass was used.
（実施例８）
表１に記載した組成のとおり、繊維状無機化合物であるホウ酸アルミニウム繊維（四国化成工業株式会社製 商品名：アルボレックスＹ）を用い、金属石鹸であるミリスチン酸亜鉛を２．０質量部用いた以外は、実施例１と同様にして樹脂組成物を得た。
(Example 8)
As shown in Table 1, aluminum borate fibers (trade name: Arborex Y, manufactured by Shikoku Kasei Kogyo Co., Ltd.), which is a fibrous inorganic compound, are used, and 2.0 parts by mass of zinc myristate, which is a metal soap, is used. A resin composition was obtained in the same manner as in Example 1 except that.
（比較例１）
表１に記載した組成のとおり、金属石鹸であるミリスチン酸亜鉛を１．６質量部用いて、樹脂組成物１００質量部に対する金属石鹸の量を１．５質量部にした以外は、実施例１と同様にして樹脂組成物を得た。
(Comparative Example 1)
Example 1 except that the amount of metal soap with respect to 100 parts by mass of the resin composition was changed to 1.5 parts by mass using 1.6 parts by mass of zinc myristate, which is a metal soap, as described in Table 1. In the same manner, a resin composition was obtained.
（比較例２）
表１に記載した組成のとおり、金属石鹸であるミリスチン酸亜鉛を５．７質量部用いて、樹脂組成物１００質量部に対する金属石鹸の量を５．１質量部にした以外は、実施例１と同様にして樹脂組成物を得た。
(Comparative Example 2)
Example 1 except that the amount of metal soap was changed to 5.1 parts by mass with respect to 100 parts by mass of the resin composition using 5.7 parts by mass of zinc myristate, which is a metal soap, as shown in Table 1. In the same manner, a resin composition was obtained.
（比較例３）
表１に記載した組成のとおり、製造例３のメラミン系樹脂すなわち広葉樹パルプを含むメラミン系樹脂を用いた以外は、実施例７と同様にして樹脂組成物を得た。
(Comparative Example 3)
As in the composition described in Table 1, a resin composition was obtained in the same manner as in Example 7 except that the melamine resin of Production Example 3, that is, the melamine resin containing hardwood pulp was used.
（比較例４）
表１に記載した組成のとおり、繊維状無機化合物を用いない以外は、実施例２と同様にして樹脂組成物を得た。
(Comparative Example 4)
As the composition described in Table 1, a resin composition was obtained in the same manner as in Example 2 except that the fibrous inorganic compound was not used.
［評価］
実施例および比較例のそれぞれの樹脂組成物について、金型清掃性能と金型離型性とを以下に示す方法で評価した。
実施例および比較例の樹脂組成物の組成と評価とを表１にまとめた。
グリーンコンパウンドと呼ばれるエポキシ樹脂成形材料（日立化成株式会社製、商品名ＣＥＬ−９２４０ＨＦ１０）を用い、トランスファー型自動成形機（金型温度：１７５℃、トランスファー圧：８．７ＭＰａ、トランスファー時間：６．５秒、硬化時間：８０秒）で、ＱＦＰ（Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）を５００ショット成形し、成形金型の内部表面上を汚れさせた。
内部表面上に汚染物質が存在するこの成形金型を用い、硬化時間を１８０秒とした以外は上記のエポキシ樹脂成形材料の成形条件と同様にして、各実施例または各比較例の樹脂組成物を繰り返し成形し、金型清掃をおこなった。そして、成形金型の内部表面上に存在する汚染物質が完全に除去できるまでに要したショット数を測定し、このショット数を、樹脂組成物の金型清掃性能を評価するための指標とした。汚染物質が完全に除去できたか否かは、目視にて判断した。
評価に際しては、特に、成形金型のキャビティのゲート部やコーナー部に付着した汚染物質が除去できているかに注目した。今回の評価に用いた成形金型のゲート部は、幅が８００μｍで、高さが３００μｍであった。ショット数は、小さいほど金型清掃性能が優れていることを示す。また、１〜３ショットを合格とした。
あわせて、樹脂組成物を用いた清掃工程で、１ショット後に、樹脂組成物のチッピングの有無を目視にて確認し、作業性を評価した。成形後の樹脂組成物の成形金型からの除去工程で、樹脂組成物のチッピング（欠け）が無く金型清掃の作業性が良好であれば「無」とし、チッピングが有り作業性に難が生じれば「有」とした。
[Evaluation]
About each resin composition of an Example and a comparative example, the mold cleaning performance and mold release property were evaluated by the method shown below.
Table 1 summarizes the compositions and evaluations of the resin compositions of Examples and Comparative Examples.
A transfer type automatic molding machine (mold temperature: 175 ° C., transfer pressure: 8.7 MPa, transfer time: 6.5) using an epoxy resin molding material (product name: CEL-9240HF10, manufactured by Hitachi Chemical Co., Ltd.) called green compound. Second, curing time: 80 seconds), 500 shots of QFP (Quad Flat Package) were molded to stain the inner surface of the molding die.
The resin composition of each example or each comparative example was the same as the molding conditions of the above-mentioned epoxy resin molding material except that this molding die having contaminants on the inner surface was used and the curing time was 180 seconds. Was repeatedly molded and the mold was cleaned. Then, the number of shots required to completely remove the contaminants present on the inner surface of the molding die was measured, and this number of shots was used as an index for evaluating the mold cleaning performance of the resin composition. . It was judged visually whether or not the contaminant was completely removed.
In the evaluation, we paid particular attention to whether or not contaminants attached to the gate and corner portions of the cavity of the molding die could be removed. The gate part of the molding die used for this evaluation had a width of 800 μm and a height of 300 μm. The smaller the number of shots, the better the mold cleaning performance. Moreover, 1 to 3 shots were accepted.
In addition, in the cleaning process using the resin composition, after one shot, the presence or absence of chipping of the resin composition was visually confirmed to evaluate workability. In the process of removing the resin composition after molding from the molding die, if there is no chipping (chip) of the resin composition and the mold cleaning workability is good, it is judged as “No”, and there is chipping and the workability is difficult. “Yes” if it occurs.
実施例および比較例のそれぞれの樹脂組成物について、上記の評価方法で金型清掃性能を評価した。実施例１〜８、比較例２〜４のそれぞれの樹脂組成物において、清掃完了までに必要なショット数は３回以下であった。したがって、すべての実施例および比較例２〜４の樹脂組成物は優れた清掃性能を示した。
一方、比較例１の樹脂組成物のショット数は４回であり、いずれの実施例よりも多かった。
この結果からわかるように、本発明の樹脂組成物は、メラミン系樹脂と金属石鹸と繊維状無機化合物と針葉樹パルプを含み、なおかつ金属石鹸の含有量が金型清掃用樹脂組成物１００質量部に対して１．６質量部以上５．０質量部以下であるため、優れた清掃性能を示す。
About each resin composition of an Example and a comparative example, metal mold | die cleaning performance was evaluated with said evaluation method. In each of the resin compositions of Examples 1 to 8 and Comparative Examples 2 to 4, the number of shots required to complete the cleaning was 3 times or less. Therefore, the resin compositions of all Examples and Comparative Examples 2 to 4 exhibited excellent cleaning performance.
On the other hand, the shot number of the resin composition of Comparative Example 1 was 4 times, which was larger than any of the Examples.
As can be seen from the results, the resin composition of the present invention contains a melamine resin, a metal soap, a fibrous inorganic compound, and softwood pulp, and the content of the metal soap is 100 parts by mass of the mold cleaning resin composition. On the other hand, since it is 1.6 mass parts or more and 5.0 mass parts or less, the outstanding cleaning performance is shown.
また、実施例および比較例のそれぞれの樹脂組成物について、上記の評価方法でチッピングの有無を評価した。すべての実施例および比較例１の樹脂組成物を用いた金型清掃工程では、成形後の樹脂組成物にチッピングが無く、作業性が良好であった。一方、比較例２〜４のそれぞれの樹脂組成物を用いた金型清掃工程では、チッピングが生じ作業性が低下した。
つまり、グリーンコンパウンドの成形後の金型清掃において、すべての実施例の樹脂組成物は清掃性能と清掃後の成形金型からの除去工程での作業性とが優れていた。また、比較例の樹脂組成物は、清掃性能と清掃後の成形金型からの除去工程での作業性との少なくとも一方が劣っていた。
この結果からわかるように、本発明の樹脂組成物は、メラミン系樹脂と金属石鹸とを含み、なおかつ繊維状無機化合物と針葉樹パルプとを含むため、金属石鹸の含有量が樹脂組成物１００質量部に対して１．６質量部以上５．０質量部以下と比較的多量であっても清掃後の成形金型からの除去工程における作業性が良好である。
Moreover, the presence or absence of chipping was evaluated by the above evaluation method for each of the resin compositions of Examples and Comparative Examples. In the mold cleaning process using the resin compositions of all Examples and Comparative Example 1, the resin composition after molding had no chipping and the workability was good. On the other hand, in the mold cleaning process using the resin compositions of Comparative Examples 2 to 4, chipping occurred and workability was lowered.
That is, in the mold cleaning after the molding of the green compound, the resin compositions of all the examples were excellent in the cleaning performance and the workability in the removing process from the molding mold after the cleaning. Moreover, at least one of the cleaning performance and the workability | operativity in the removal process from the molding die after cleaning was inferior in the resin composition of the comparative example.
As can be seen from the results, the resin composition of the present invention contains a melamine-based resin and a metal soap, and further contains a fibrous inorganic compound and a softwood pulp, so that the content of the metal soap is 100 parts by mass of the resin composition. On the other hand, the workability in the removal step from the molding die after cleaning is good even when the amount is relatively large, 1.6 parts by mass or more and 5.0 parts by mass or less.
実施例２、実施例３及び比較例２のそれぞれの樹脂組成物を用いた清掃時の作業性について、より詳細に評価した。
清掃におけるチッピングは、樹脂組成物が硬化してなる成形物の内部強度が弱いことに起因している。成形物の内部強度は、曲げ強さで表すことができ、また曲げ強さとチッピングの有無とには強い相関関係がある。
それぞれの成形物の曲げ強さはＪＩＳ Ｋ ６９１１ 熱硬化性プラスチック一般試験方法にしたがい、以下の手順で測定した。まず、トランスファー成形機と試験片成形用金型を用い、成形温度１７０℃、成形時間３分で金型清掃用樹脂組成物を成形し、高さ（ｈ）４ｍｍ、幅（Ｗ）１０ｍｍ、長さ８０ｍｍの試験片を得た。引張圧縮試験機を用いて、支点間距離（Ｌｖ）６４ｍｍ、荷重速度２ｍｍ／ｍｉｎで試験片に荷重を加え、試験片が折れたときの荷重Ｐを測定した。式 σｆＢ＝３ＰＬｖ／２Ｗｈ２より、曲げ強さ（σｆＢ）を計算した。その結果、実施例２、実施例３及び比較例２の成形物の曲げ強さは、それぞれ１８０ＭＰａ、１４０ＭＰａ、１０５ＭＰａであった。
上記の結果によれば、清掃時にチッピングが生じない実施例２、実施例３の成形物は、曲げ強さが適度に大きいのに対し、清掃時にチッピングを生じた比較例２の成形物は、曲げ強さが小さい値を示した。また、実施例２の成形物は、実施例３の成形物よりも大きい曲げ強さを示した。
The workability during cleaning using the resin compositions of Example 2, Example 3 and Comparative Example 2 was evaluated in more detail.
Chipping in cleaning is caused by a weak internal strength of a molded product obtained by curing the resin composition. The internal strength of the molded product can be expressed by bending strength, and there is a strong correlation between bending strength and the presence or absence of chipping.
The bending strength of each molded product was measured according to the following procedure in accordance with JIS K 6911 General Test Method for Thermosetting Plastics. First, using a transfer molding machine and a test piece molding die, a mold cleaning resin composition was molded at a molding temperature of 170 ° C. and a molding time of 3 minutes. The height (h) was 4 mm, the width (W) was 10 mm, and the length was long. A test piece having a thickness of 80 mm was obtained. Using a tensile and compression tester, a load was applied to the test piece at a fulcrum distance (L v ) of 64 mm and a load speed of 2 mm / min, and the load P when the test piece was broken was measured. The bending strength (σ fB ) was calculated from the formula σ fB = 3PL v / 2Wh 2 . As a result, the bending strengths of the molded products of Example 2, Example 3, and Comparative Example 2 were 180 MPa, 140 MPa, and 105 MPa, respectively.
According to the above results, the moldings of Example 2 and Example 3 in which chipping does not occur during cleaning are moderately large in bending strength, whereas the molding of Comparative Example 2 in which chipping occurs during cleaning is The bending strength showed a small value. Further, the molded product of Example 2 showed a higher bending strength than the molded product of Example 3.
以上、実施例および比較例で示したとおり、清掃性能と清掃後の成形金型からの除去工程での作業性とが共に優れる金型清掃用樹脂組成物を提供できた。特に、清掃が困難であるグリーンコンパウンドの成形後の金型清掃においても、本発明の樹脂組成物は優れた性能を示した。 As described above, as shown in the Examples and Comparative Examples, it was possible to provide a mold cleaning resin composition that is excellent in both cleaning performance and workability in the removal process from the molded mold after cleaning. In particular, the resin composition of the present invention also showed excellent performance in mold cleaning after molding a green compound, which is difficult to clean.
本発明の金型清掃用樹脂組成物は、熱硬化性樹脂組成物由来の成形金型の内部表面上に存在する汚染物質を取り除くためのトランスファータイプの金型清掃用樹脂組成物であり、清掃性能と清掃後の成形金型からの除去工程での作業性とが共に優れる。 The mold cleaning resin composition of the present invention is a transfer type mold cleaning resin composition for removing contaminants present on the inner surface of a molding die derived from a thermosetting resin composition, Both performance and workability in the removal process from the mold after cleaning are excellent.
Claims (7)
前記金属石鹸の含有量が、金型清掃用樹脂組成物１００質量部に対して１．６質量部以上５．０質量部以下である金型清掃用樹脂組成物。 Including melamine-based resin, metal soap, fibrous inorganic compound, and softwood pulp,
The resin composition for metal mold | die cleaning whose content of the said metal soap is 1.6 to 5.0 mass parts with respect to 100 mass parts of resin composition for metal mold | die cleaning.
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| KR1020160096381A KR102525580B1 (en) | 2015-08-07 | 2016-07-28 | Resin composition for cleaning die |
| TW105124278A TWI702131B (en) | 2015-08-07 | 2016-08-01 | Resin composition for cleaning die |
| SG10201606440PA SG10201606440PA (en) | 2015-08-07 | 2016-08-04 | Resin Composition For Cleaning Die |
| SG10201912415WA SG10201912415WA (en) | 2015-08-07 | 2016-08-04 | Resin Composition For Cleaning Die |
| CN201610634425.7A CN106433021B (en) | 2015-08-07 | 2016-08-04 | Resin composition for cleaning mold |
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| JPH0857865A (en) * | 1994-08-24 | 1996-03-05 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
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| WO2002030648A1 (en) * | 2000-10-11 | 2002-04-18 | Nippon Carbide Kogyo Kabushiki Kaisha | Resin composition for mold cleaning |
| JP2002128988A (en) * | 2000-10-18 | 2002-05-09 | Choshun Jinzo Jushisho Kofun Yugenkoshi | Amino resin composition for metal mold cleaning |
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| JP2014019861A (en) * | 2012-07-24 | 2014-02-03 | Nikougiken Co Ltd | Composite crystalline polymer and composite crystalline polymer product |
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| KR100905843B1 (en) * | 2002-01-21 | 2009-07-02 | 닛뽕 카바이도 고교 가부시키가이샤 | Resin composition for mold cleaning |
| CN101466515B (en) * | 2006-10-27 | 2012-07-04 | 日本碳化物工业株式会社 | Resin composition and method for mould clean and demould recovery |
| WO2013111709A1 (en) * | 2012-01-23 | 2013-08-01 | 日本カーバイド工業株式会社 | Resin composition for cleaning die |
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| JPH01139649A (en) * | 1987-11-27 | 1989-06-01 | Toshiba Corp | Composition for mold cleaning |
| JPH0857865A (en) * | 1994-08-24 | 1996-03-05 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH09117918A (en) * | 1995-10-24 | 1997-05-06 | Nippon Carbide Ind Co Inc | Resin composition tablet for mold cleaning |
| WO2002030648A1 (en) * | 2000-10-11 | 2002-04-18 | Nippon Carbide Kogyo Kabushiki Kaisha | Resin composition for mold cleaning |
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| JP2014019861A (en) * | 2012-07-24 | 2014-02-03 | Nikougiken Co Ltd | Composite crystalline polymer and composite crystalline polymer product |
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| TW201707920A (en) | 2017-03-01 |
| CN106433021A (en) | 2017-02-22 |
| CN106433021B (en) | 2020-08-14 |
| KR102525580B1 (en) | 2023-04-25 |
| SG10201606440PA (en) | 2017-03-30 |
| TWI702131B (en) | 2020-08-21 |
| KR20170017732A (en) | 2017-02-15 |
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| JP6803165B2 (en) | 2020-12-23 |
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