WO2013111709A1 - Resin composition for cleaning die - Google Patents

Resin composition for cleaning die Download PDF

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Publication number
WO2013111709A1
WO2013111709A1 PCT/JP2013/051107 JP2013051107W WO2013111709A1 WO 2013111709 A1 WO2013111709 A1 WO 2013111709A1 JP 2013051107 W JP2013051107 W JP 2013051107W WO 2013111709 A1 WO2013111709 A1 WO 2013111709A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
mold
cleaning
inorganic filler
mold cleaning
Prior art date
Application number
PCT/JP2013/051107
Other languages
French (fr)
Japanese (ja)
Inventor
野村　弘明
吉村　勝則
太地 佐藤
Original Assignee
日本カーバイド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本カーバイド工業株式会社 filed Critical 日本カーバイド工業株式会社
Priority to SG11201404265PA priority Critical patent/SG11201404265PA/en
Priority to KR1020147019489A priority patent/KR102019456B1/en
Priority to JP2013555249A priority patent/JP5991997B2/en
Priority to CN201380006009.7A priority patent/CN104066563B/en
Publication of WO2013111709A1 publication Critical patent/WO2013111709A1/en
Priority to PH12014501669A priority patent/PH12014501669A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C33/722—Compositions for cleaning moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/10—Melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Definitions

  • the present invention relates to a mold cleaning resin composition. More specifically, the present invention relates to a transfer-type mold cleaning resin composition that removes dirt on the inner surface of a molding die derived from a thermosetting resin composition.
  • the resin composition for mold cleaning described in Patent Document 1 contains 10 to 70% by mass of an epoxy-modified melamine resin based on the total amount of amino resin, and was obtained by molding at the time of mold cleaning.
  • the hot toughness of the molded product is improved and the workability of mold cleaning is improved.
  • Patent Document 1 discloses a resin composition for mold cleaning in which a mineral powder having a maximum particle size of 180 ⁇ m or less and a particle size of 100 ⁇ m or more is 1% by mass with respect to the total amount of mineral powder. Things are listed.
  • the resin composition for mold cleaning described in Patent Document 1 has an effect of improving the cleaning workability due to clogging in a narrow gate portion, because the resin composition for mold cleaning spreads every corner inside the gap. Yes. However, the effect is not sufficient and there is room for improvement. Furthermore, the mold cleaning resin composition described in Patent Document 1 has room for improvement in the removal performance of dirt in the mold.
  • the present invention has been made in view of the above situation. That is, under the above circumstances, there is a need for a mold cleaning resin composition that can provide a good cleaning effect, for example, to a corner portion of a fine mold cavity, and has improved dirt removal performance. Yes.
  • the mold cleaning resin composition of the present invention is a mold cleaning resin composition containing a melamine-based resin, an inorganic filler, a curing catalyst, a salt of a saturated fatty acid and a metal,
  • the inorganic filler is spherical,
  • the maximum particle size of the inorganic filler is in the range of 1 ⁇ m to 70 ⁇ m,
  • the curing catalyst is at least one selected from myristic acid and stearic acid,
  • the salt of the saturated fatty acid and the metal is zinc myristate.
  • the inorganic filler has an average particle diameter of 4 ⁇ m to 10 ⁇ m, a standard deviation of particle diameter of 7 ⁇ m or less, and an average aspect ratio of particle diameter of 1 to An embodiment in which the standard deviation of the aspect ratio is 1.2 or less is preferable.
  • the mold cleaning resin composition of the present invention is a transfer type mold cleaning resin composition used in a transfer molding machine. That is, the mold cleaning resin composition of the present invention is suitably used for transfer molding.
  • the shape of the inorganic filler is specified, and the range of the particle diameter is specified, and the corner of the fine mold cavity is obtained by using a specific curing catalyst, a specific saturated fatty acid, and a metal salt.
  • a mold cleaning resin composition having a good cleaning effect up to the portion and improved dirt removal performance is provided.
  • the mold cleaning resin composition of the present invention comprises at least a melamine-based resin, a spherical inorganic filler having a maximum particle size of 1 ⁇ m to 70 ⁇ m, a curing catalyst selected from myristic acid and stearic acid, a saturated fatty acid, And zinc myristate which is a salt with metal.
  • the resin composition for mold cleaning of the present invention may be configured using other components as necessary.
  • the mold cleaning resin composition of the present invention contains at least one melamine-based resin.
  • the melamine resin refers to a melamine resin, a melamine-phenol cocondensate, or a melamine-urea cocondensate.
  • the melamine resin is a condensate of triazines and aldehydes.
  • triazines include melamine, benzoguanamine, and acetoguanamine.
  • aldehydes include formaldehyde, paraformaldehyde, and acetaldehyde.
  • the melamine-phenol cocondensate is a cocondensate of triazines, phenols and aldehydes.
  • phenols include phenol, cresol, xylenol, ethylphenol, and butylphenol.
  • the melamine-urea cocondensate is a cocondensate of triazines, ureas, and aldehydes.
  • the resin composition for mold cleaning of the present invention is not limited to the melamine resin, and other resin compositions, for example, alkyd resins, polyester resins, acrylic resins, epoxy resins, and rubbers, as long as the effects of the present invention are not impaired. Can be included.
  • the resin composition for mold cleaning of the present invention contains a melamine resin, it exhibits excellent cleaning properties against dirt on the inner surface of the molding mold.
  • the methylol group of melamine resin has high polarity, and it is generated during molding and is a stain derived from a sealing molding material that adheres to the inner surface of the molding die (that is, a thermosetting resin composition).
  • the mold cleaning resin composition of the present invention can act, so that the mold cleaning resin composition containing a melamine resin has excellent performance. I think to show.
  • the melamine-based resin is thermally stable, it is considered that excellent cleaning properties can be stably exhibited even in the vicinity of 160 to 190 ° C., which is a temperature at the time of mold cleaning.
  • the resin composition for mold cleaning of the present invention contains at least one spherical inorganic filler having a maximum particle size of 1 ⁇ m to 70 ⁇ m.
  • the inorganic filler used in the present invention has a spherical shape.
  • Spherical shape means that the average aspect ratio of the particle size of the inorganic filler described later is 1 to 1.5.
  • spheres that can be regarded as spheres such as cross-sectional ellipses with non-uniform cross-sectional diameters.
  • a substantially spherical shape that is close to the shape is also included.
  • the average aspect ratio of the particle size of the inorganic filler is preferably 1 to 1.2. Therefore, the mold cleaning resin composition of the present invention can maintain the fluidity of the mold cleaning resin composition during cleaning. Furthermore, the resin composition for mold cleaning of the present invention is expected to have a good cleaning effect up to the corner portion of the densified mold cavity, and further suppresses wear and damage to the inner surface of the mold and the gate portion. Can do. When the average aspect ratio of the particle size of the inorganic filler is 1.5 or less, the mold cleaning resin composition can maintain the fluidity of the mold cleaning resin composition at the time of cleaning. Good cleaning performance can be ensured up to the corner of the mold cavity. In addition, wear and damage to the inner surface of the molding die and the gate portion can be suppressed.
  • the aspect ratio of the particle size of the inorganic filler is determined as follows. That is, the aspect ratio of the particle size of the inorganic filler can be obtained using an electron microscope in the same manner as the method for obtaining the particle size described later.
  • the major axis (X) of one inorganic filler and the minor axis (Y) orthogonal to the major axis (X) are each measured five times. From the measured value obtained, the aspect ratio of the particle diameter of one inorganic filler is determined by the following formula. However, the major axis (X) ⁇ the minor axis (Y).
  • Aspect ratio of particle size (average value of five measured values of X) / (average value of five measured values of Y) And said aspect ratio was measured about each of 150 inorganic fillers, the average of the obtained measured value was calculated
  • the aspect ratio of the particle size when the major axis (X) and the minor axis (Y) are equal, the aspect ratio of the particle size is 1.
  • the aspect ratio of the particle size does not take a value less than 1.
  • the shape of the inorganic filler is spherical, but the closer the spherical shape is, the closer the particle diameter aspect ratio is to 1. Even if the image of the inorganic filler in the electron microscope has a square shape, the aspect ratio of the particle size is 1, but the inorganic filler used in the present invention has a spherical shape (including a substantially spherical shape). In the present invention, when the aspect ratio of the particle size is close to 1, it indicates that it is close to a sphere.
  • the average aspect ratio of the particle size of the inorganic filler is an average value of the aspect ratios of 150 inorganic fillers measured by the above method.
  • the standard deviation of the aspect ratio of the inorganic filler described later is the standard deviation of the aspect ratio of the particle diameters of 150 inorganic fillers measured by the above method.
  • the inorganic filler is, for example, one or more selected from the group consisting of silicon carbide, silicon oxide (silica), titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, and calcium oxide. These inorganic fillers may be used alone or in combination.
  • the inorganic filler in the present invention is preferably silicon oxide (silica) or titanium oxide, and particularly preferably silicon oxide.
  • silicon oxide (silica) and titanium oxide are suitable in hardness, and the inner surface of the mold and the gate part are worn and damaged. It is preferable in that it can be suppressed.
  • the inventor of the present invention considers that the inorganic filler is removed by physically polishing dirt on the surface of the mold when the densified mold cavity is cleaned. Silicon oxide (silica) and titanium oxide are preferable because they are thermally stable even in the vicinity of 160 to 190 ° C. when the mold is cleaned.
  • the standard deviation of the aspect ratio of the inorganic filler is 0.3 or less. Since the mold cleaning resin composition of the present invention has a standard deviation of the particle diameter aspect ratio of the inorganic filler of 0.3 or less, the fluidity of the mold cleaning resin composition is easily maintained during cleaning. Further, it becomes easy to obtain cleaning properties up to the corner of the mold cavity, and it is possible to further suppress wear and damage to the inner surface of the molding die and the gate portion. Among them, the standard deviation of the aspect ratio of the inorganic filler is more preferably 0.15 to 0.3.
  • the “miniaturized mold cavity” means that the arrangement of the cavities with respect to the entire surface of the molding mold is densely and optimally arranged by reducing the size of the cavity.
  • the fine mold cavity has a gate portion narrower than the conventional one due to the miniaturization of the cavity, and its narrowest is 100 ⁇ m.
  • the maximum particle size of the inorganic filler used in the present invention is 1 ⁇ m to 70 ⁇ m.
  • the maximum particle size of the inorganic filler contained is in the range of 1 ⁇ m to 70 ⁇ m, a good cleaning effect can be obtained up to the corner portion of the densified mold cavity.
  • the maximum particle size being 1 ⁇ m or more means that the inorganic filler has a shape that physically acts on the mold surface dirt.
  • the maximum particle diameter exceeds 70 ⁇ m, the particles of the inorganic filler are easily clogged in the cavity portion, the fluidity is lowered, and as a result, the cleaning effect is lowered.
  • the maximum particle size of the inorganic filler is more preferably 10 ⁇ m to 50 ⁇ m, particularly preferably 20 ⁇ m to 45 ⁇ m, and most preferably 45 ⁇ m.
  • the average particle size of the inorganic filler used in the present invention is desirably 4 ⁇ m to 10 ⁇ m.
  • the inventor of the present invention believes that the inorganic filler having a remarkably small average particle size has a small mass and surface area, and therefore it is difficult to exhibit the cleaning performance of the mold cavity.
  • the mold cleaning resin composition of the present invention when the average particle size of the inorganic filler is 4 ⁇ m or more, the cleaning property of the entire molding die is further obtained.
  • the average particle size of the inorganic filler is 10 ⁇ m or less, the cleaning properties up to the corner portion of the densified mold cavity can be further obtained.
  • the average particle size of the inorganic filler in the present invention is 10 ⁇ m or less, it is possible to further suppress wear and damage to the inner surface of the molding die and the gate portion.
  • the average particle size of the inorganic filler is more preferably 5 ⁇ m to 8 ⁇ m.
  • the standard deviation of the particle size of the inorganic filler used in the present invention is desirably 7 ⁇ m or less.
  • the fluidity of the resin composition for mold cleaning can be maintained at the time of cleaning. More cleanability up to the corners is obtained.
  • the standard deviation of the particle size of the inorganic filler is more preferably 1 ⁇ m to 7 ⁇ m.
  • the particle size of the inorganic filler is determined as follows. That is, using an electron microscope (product name: JSM-5510, manufactured by JEOL Ltd.), the inorganic filler is photographed at 1500 times so that approximately 30 inorganic fillers are included in one field of view. The diameters of the inorganic fillers in each of the five fields were measured. Subsequently, the major axis (X) of the inorganic filler and the minor axis (Y) orthogonal to the major axis (X) were measured, and the average value of five measurements was obtained.
  • the particle size of one inorganic filler is determined by the following formula, and the particle size (calculated value) of 150 inorganic fillers is averaged, The particle size of the inorganic filler was determined.
  • Particle size ((average value of five measured values of X) + (average value of five measured values of Y)) / 2
  • the average particle diameter is an average value of the particle diameters of 150 inorganic fillers measured by the above method.
  • the standard deviation of a particle size is a standard deviation of the particle size of 150 inorganic fillers measured by said method.
  • An inorganic filler that can be suitably used in the present invention is, for example, amorphous spherical silica, and specifically, a product name manufactured by Nippon Steel & Sumikin Materials Co., Ltd., Sakai Micron (Nippon Steel Materials Co., Ltd., Sakai Micron). “S440-4”, “HS-202”, “HS-204”, “UF-320” and the like.
  • the resin composition for mold cleaning of the present invention contains at least one selected from myristic acid and stearic acid as a curing catalyst.
  • the mold cleaning resin cavity is made finer.
  • the flow of the mold cleaning resin composition becomes excessive, and the mold cleaning resin composition does not stay properly in the mold, so that the dirt may not be sufficiently removed.
  • myristic acid and / or stearic acid as a curing catalyst, the inventors of the present invention can prevent the flow of the mold cleaning resin composition from becoming excessive when the fine mold cavity is cleaned. I found out. Therefore, the mold cleaning resin composition of the present invention can clean the corners of the fine mold cavity and remove the dirt by appropriately retaining the mold cleaning resin composition in the mold. Performance is also improved.
  • the content of myristic acid and stearic acid used in the present invention in the composition is preferably 0.1 parts by mass to 3.0 parts by mass, and 0.5 parts by mass to 100 parts by mass of the melamine resin.
  • the amount is more preferably 2.0 parts by weight, particularly preferably 1.0 part by weight to 2.0 parts by weight.
  • the mold cleaning resin composition of the present invention is easily cured at the time of cleaning, and finer mold cavity dirt is better removed. .
  • the resin composition for mold cleaning of the present invention contains zinc myristate as a salt of a saturated fatty acid and a metal.
  • the inventor of the present invention believes that when a fine mold cavity is cleaned, a salt of a saturated fatty acid and a metal acts on the dirt, and for example, the dirt swells to facilitate separation from the surface of the mold. . That is, the inventor of the present invention selectively uses zinc myristate as a salt of a saturated fatty acid and a metal, so that the resin composition for cleaning a mold of the present invention can be used for cleaning a densified mold cavity. It was found that the flow of the is prevented from becoming excessive.
  • the melting point of zinc myristate is 123 ° C to 130 ° C.
  • the temperature at the time of cleaning the mold cavity using the sealing molding material containing the thermosetting resin composition is 160 ° C. to 190 ° C.
  • the inventor of the present invention shows that the zinc myristate contained in the mold cleaning resin composition of the present invention exhibits appropriate fluidity within the cleaning work environment temperature range of 160 ° C. to 190 ° C.
  • the flow of the mold cleaning resin composition is considered to be in a range suitable for cleaning. Therefore, the mold cleaning resin composition of the present invention can clean the corners of the fine mold cavity and remove dirt by appropriately maintaining the mold cleaning resin composition in the mold. Performance is improved.
  • the content of zinc myristate used as a salt of a saturated fatty acid and a metal is preferably 0.1 part by mass to 3.0 parts by mass, preferably 0.5 parts by mass to 100 parts by mass of the melamine resin.
  • the amount is more preferably 2.0 parts by weight, particularly preferably 1.0 part by weight to 2.0 parts by weight.
  • the mold cleaning resin composition of the present invention is easily cured at the time of cleaning, and dirt in the fine mold cavity is well removed. .
  • content of zinc myristate is 3.0 mass parts or less, since the flow of the resin composition for metal mold
  • the mold cleaning resin composition of the present invention may further contain other additives.
  • other additives include colorants, antioxidants, lubricants, and the like.
  • the lubricant include fatty acid amide type lubricants, specifically, saturated or unsaturated monoamide type lubricants such as lauric acid amide, myristic acid amide, erucic acid amide, oleic acid amide, stearic acid amide, methylenebis stearic acid amide, ethylene
  • saturated or unsaturated bisamide type lubricants such as bisstearic acid amide and ethylene bisoleic acid amide.
  • the resin composition for mold cleaning according to the present invention is used to remove dirt derived from a sealing molding material containing a thermosetting resin composition typified by epoxy resin, silicone resin, phenol resin, and polyimide resin. Suitable for removing from the surface.
  • the mold cleaning resin composition of the present invention is prepared by almost uniformly mixing a melamine resin, an inorganic filler, a curing catalyst, a salt of a saturated fatty acid and a metal, and, if necessary, other additives. be able to.
  • Examples of the method for mixing almost uniformly include a method using a kneader, a ribbon blender, a Henschel mixer, a ball mill, a roll kneading machine, a raking machine, a tumbler, and the like.
  • the mold cleaning resin composition of the present invention is suitable for a transfer type mold cleaning resin composition used in a transfer molding machine.
  • the resin composition for mold cleaning of the present invention is usually processed into a tablet shape and used for cleaning work in a normal mold. Specifically, after arranging the lead frame on the mold, the tablet-shaped mold cleaning resin composition is inserted into the pot portion, and after the mold is clamped, it is pushed away with a plunger. At this time, the resin flows from the gate portion into the mold cavity from the pot portion through the runner portion. The cleaning operation is performed by opening the mold after a predetermined molding time has elapsed, and removing the molded product including the mold cleaning resin composition and dirt integrated with the lead frame.
  • the resin composition for mold cleaning of the present invention is suitably used for removing dirt in a molding die in a sealing molding operation such as an integrated circuit.
  • the material of the molding die is, for example, iron or chrome.
  • the inside of the molding die is usually plated.
  • micron-sized scratches are generated in the molding die, and the die is worn. Occurrence of such scratches and wear causes a lack of a plated surface in the molding die and a rough surface state. Due to the occurrence of internal flaws, the lack of plating surface on the inner surface of the molding die and the rough surface condition, the molding die suffers from deterioration of moldability and releasability during sealing molding operations and poor surface appearance. appear.
  • produces.
  • the mold cleaning resin composition of the present invention by appropriately selecting the maximum particle size of the spherical (including substantially spherical) inorganic filler, it is possible to suppress damage in the molding die during cleaning.
  • Example 1 As a melamine-based resin, 21.3 parts by mass of a melamine-phenol cocondensate and 50 parts by mass of a melamine resin prepared by pulverizing a product that has been heated and reacted by a known method and then dried under reduced pressure, and an amorphous filler as an inorganic filler Quality spherical silica (product name: S440-4, inorganic filler manufactured by Nippon Steel & Sumikin Materials Co., Ltd. Micron Co., Ltd. (Micron Co., Ltd.)) and hardwood pulp 7.8 as an organic filler.
  • S440-4 inorganic filler manufactured by Nippon Steel & Sumikin Materials Co., Ltd. Micron Co., Ltd. (Micron Co., Ltd.)
  • the average aspect ratio of the particle size of S440-4 was 1.16 (spherical).
  • the average aspect ratio of any particle size of other inorganic fillers described later used in the examples was spherical in the range of 1 to 1.5.
  • Table 1 summarizes the composition and amount (parts by mass) of the mold cleaning resin composition prepared in Example 1, the average particle size, the maximum particle size, and the average aspect ratio of the inorganic filler.
  • the standard deviation of the particle size of the inorganic filler was 7 ⁇ m, and the standard deviation of the aspect ratio of the inorganic filler was 0.23.
  • the cleaning property of the produced resin composition for mold cleaning was evaluated by the following test method.
  • the produced mold cleaning resin composition is a transfer type.
  • the number of shots is recorded when the number of completed shots is 10 times or less, and dirt is removed even after 10 times of cleaning. When it was not possible, it was determined as “NG”.
  • Example 2 In Example 1, except that myristic acid used as the curing catalyst was replaced with stearic acid, a resin composition for mold cleaning was prepared and the cleaning property was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.
  • Example 5 A resin composition for mold cleaning was prepared in the same manner as in Example 1 except that the inorganic filler was changed as shown in Table 1 below, and the cleaning property was evaluated. The evaluation results are shown in Table 1.
  • Example 1 In Example 1, except that benzoic acid was used as the curing catalyst, a mold cleaning resin composition was prepared and the cleaning property was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.
  • Example 2 In Example 1, except that zinc stearate was used as a salt of a saturated fatty acid and a metal, a mold cleaning resin composition was prepared and the cleaning property was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.
  • Example 3 a resin composition for mold cleaning was used in the same manner as in Example 1 except that crystalline silica (product name: R-1) manufactured by Yamamori Civil Engineering Co., Ltd. was used as the inorganic filler. A product was prepared and the cleaning property was evaluated. The evaluation results are shown in Table 1.
  • the inorganic filler used in Comparative Example 3 has the particle size and aspect ratio shown in Table 1, and the shape of the inorganic filler was indeterminate when confirmed using an electron microscope. It was.
  • Example 4 a resin composition for mold cleaning was used in the same manner as in Example 1 except that crystalline silica (product name: pure meteorite powder) manufactured by Seto Ceramics Co., Ltd. was used as the inorganic filler. Were prepared and the cleaning property was evaluated. The evaluation results are shown in Table 1.
  • the inorganic filler used in Comparative Example 4 has a particle size and an aspect ratio shown in Table 1.
  • Example 5 A resin composition for mold cleaning was prepared in the same manner as in Example 1 except that the inorganic filler was changed as shown in Table 1 below, and the cleaning property was evaluated. The evaluation results are shown in Table 1.
  • S440-4 Amorphous spherical silica manufactured by Nippon Steel & Sumikin Materials Co., Ltd. Micron (Nippon Steel Materials Co., Ltd.) HS-202: Nippon Steel & Sumikin Materials Co., Ltd. Micron (Nippon Steel Materials Co., Ltd. Micron) ) Amorphous spherical silica R-1: Crystalline silica manufactured by Yamamori Civil Engineering Co., Ltd. HS-302: Amorphous manufactured by Nippon Steel & Sumikin Materials Co., Ltd.
  • the mold cleaning resin composition of the present invention was able to satisfactorily clean up to the corners of the densified mold cavity and improved the dirt removal performance.
  • the mold cleaning resin compositions of Examples 1 to 5 include melamine-based resins, spherical inorganic fillers having a maximum particle size of 1 ⁇ m to 70 ⁇ m, and myristic acid or a curing catalyst. Since stearic acid and zinc myristic acid as a salt of saturated fatty acid and metal are included, the narrowest part of the gate part can be cleaned well to the corner part with a mold of 100 ⁇ m, and the number of cleaning completed shots is 4 Excellent dirt removal performance that can be done only once. Furthermore, when the mold surface after cleaning was observed, the mold cleaning resin compositions of Examples 1 to 5 did not damage the mold surface.
  • the mold cleaning resin composition of Comparative Example 2 contained zinc stearate as a salt of a saturated fatty acid and a metal, and therefore the flow of the mold cleaning resin composition was excessive, resulting in an increase in the number of cleaning completed shots. Therefore, the dirt removal performance was inferior to that of Example 1.
  • the maximum particle size of the inorganic filler is 75 ⁇ m, and there is a tendency that the particles tend to be clogged with each other, and good fluidity cannot be secured. The part could not be cleaned well. Therefore, the dirt removal performance of the mold was also inferior.
  • the mold cleaning is performed by appropriately selecting the curing catalyst and the salt of the saturated fatty acid and the metal.
  • the flow at the time of cleaning with the resin composition can be controlled, and a good cleaning effect is exhibited up to the corner portion of the densified mold cavity.
  • the mold cleaning resin composition remained properly in the mold, and the performance of removing dirt in the mold was improved.
  • the mold cleaning resin composition of the present invention is a mold cleaning resin composition that removes dirt on a mold surface derived from a thermosetting resin composition, and is suitably used for transfer molding in a transfer mold molding machine. .

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  • Mechanical Engineering (AREA)
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Abstract

The present invention provides a resin composition for cleaning dies, which contains a melamine resin, a spherical inorganic filler that has a maximum particle diameter of 1-70 μm, a curing catalyst that is selected from among myristic acid and stearic acid, and zinc myristate that is a salt of a saturated fatty acid and a metal.

Description

金型清掃用樹脂組成物Mold cleaning resin composition
　本発明は、金型清掃用樹脂組成物に関する。より詳しくは、本発明は、熱硬化性樹脂組成物由来の成形金型内部表面の汚れを取り除く、トランスファータイプの金型清掃用樹脂組成物に関する。 The present invention relates to a mold cleaning resin composition. More specifically, the present invention relates to a transfer-type mold cleaning resin composition that removes dirt on the inner surface of a molding die derived from a thermosetting resin composition.
　熱硬化性樹脂組成物を含む封止成形材料を用いて封止成形する場合において、集積回路やＬＥＤ素子等の封止成形作業を長時間続けると、封止成形材料に由来する汚れが生じやすい。このような汚れの発生により、成形金型内が汚れる不具合がある。このような汚れが金型内に放置されると、集積回路やＬＥＤ素子等の封止成形物の表面に汚れが付着する不具合を発生させる。そのため、封止成形する場合は、成形金型内の汚れを取り除くことが求められる。具体的には、封止成形する場合に、数百ショットの封止成形をするごとに数ショットの割合で、封止成形材料の代わりに金型清掃用樹脂組成物を成形することが望ましい。金型清掃用樹脂組成物を成形することで、成形金型内部表面の汚れを取り除くことが可能である。 In the case of sealing molding using a sealing molding material containing a thermosetting resin composition, if sealing molding operations such as integrated circuits and LED elements are continued for a long period of time, stains derived from the sealing molding material are likely to occur. . Due to the occurrence of such dirt, there is a problem that the inside of the molding die becomes dirty. If such dirt is left in the mold, a problem occurs in which dirt adheres to the surface of a molded product such as an integrated circuit or an LED element. Therefore, when sealing molding is performed, it is required to remove dirt in the molding die. Specifically, in the case of sealing molding, it is desirable to mold the mold cleaning resin composition instead of the sealing molding material at a rate of several shots every time hundreds of shots are sealed. By molding the mold cleaning resin composition, it is possible to remove stains on the inner surface of the molding die.
　このような金型清掃用樹脂組成物は、従来から提案されている。たとえば、特許文献１に記載の金型清掃用樹脂組成物は、アミノ系樹脂の全量に対して１０～７０質量％のエポキシ変性メラミン樹脂を含有しており、金型清掃時に成形して得た成形品の熱時靭性が向上し、金型清掃の作業性が向上する。 Such a resin composition for mold cleaning has been conventionally proposed. For example, the resin composition for mold cleaning described in Patent Document 1 contains 10 to 70% by mass of an epoxy-modified melamine resin based on the total amount of amino resin, and was obtained by molding at the time of mold cleaning. The hot toughness of the molded product is improved and the workability of mold cleaning is improved.
　近年、使用する機器の高性能化に対応するため、集積回路やＬＥＤ素子等の封止成形形状及び構造は、多様化、精密化しつつある。そのため、封止成形工程に用いる成形金型の形状及び構造も、多様化、精密化が求められている。このような成形金型の清掃は、汚れが残りやすいコーナー部も含め、金型キャビティの隅々まで汚れを除去することが求められる。 In recent years, in order to cope with the high performance of the equipment used, the shape and structure of sealing molding such as integrated circuits and LED elements have been diversified and refined. Therefore, diversification and refinement are also required for the shape and structure of the molding die used in the sealing molding process. Such cleaning of the molding die is required to remove the dirt to every corner of the mold cavity including the corner portion where the dirt tends to remain.
　特許文献１には、鉱物質類粉体として最大粒径が１８０μｍ以下であり、かつ粒径１００μｍ以上のものを、鉱物質類粉体全量に対して１質量％にした金型清掃用樹脂組成物が記載されている。特許文献１に記載の金型清掃用樹脂組成物は、空隙内部の隅々に金型清掃用樹脂組成物が行き渡り、狭小なゲート部分での詰まりによる清掃作業性を改善する効果が開示されている。しかし、その効果は十分ではなく、改善の余地がある。さらに、特許文献１に記載の金型清掃用樹脂組成物は、金型内の汚れの除去性能にも改善の余地がある。 Patent Document 1 discloses a resin composition for mold cleaning in which a mineral powder having a maximum particle size of 180 μm or less and a particle size of 100 μm or more is 1% by mass with respect to the total amount of mineral powder. Things are listed. The resin composition for mold cleaning described in Patent Document 1 has an effect of improving the cleaning workability due to clogging in a narrow gate portion, because the resin composition for mold cleaning spreads every corner inside the gap. Yes. However, the effect is not sufficient and there is room for improvement. Furthermore, the mold cleaning resin composition described in Patent Document 1 has room for improvement in the removal performance of dirt in the mold.
　金型を清掃するに際し、充填材を小粒化した金型清掃用樹脂組成物を用いると、細密化された金型キャビティの狭小なゲート部分の詰まりを抑制することができる。ところが、充填材を小粒化すると、充填材の物理的研磨効果が低減し、特にコーナー部の汚れの除去性能が低下する不具合がある。また、充填材を小粒化した金型清掃用樹脂組成物は、清掃時に金型清掃用樹脂組成物のフローが過剰になる。そのため、金型内に金型清掃用樹脂組成物が適切に留まらないことにより、汚れを十分に除去できないという不具合がある。 When the mold is cleaned, if a mold cleaning resin composition with a small filler is used, clogging of a narrow gate portion of the densified mold cavity can be suppressed. However, when the size of the filler is reduced, the physical polishing effect of the filler is reduced, and in particular, there is a problem in that the performance of removing dirt at the corner portion is lowered. Moreover, the mold cleaning resin composition in which the filler is reduced in size causes an excessive flow of the mold cleaning resin composition during cleaning. Therefore, there is a problem that the dirt cannot be sufficiently removed because the mold cleaning resin composition does not properly remain in the mold.
特開２００３－６２８３５号公報JP 2003-62835 A
　本発明は、上記状況に鑑みてなされたものである。すなわち、上記状況のもと、例えば細密化された金型キャビティのコーナー部等まで良好な清掃効果が得られ、かつ汚れの除去性能が改善された金型清掃用樹脂組成物が必要とされている。 The present invention has been made in view of the above situation. That is, under the above circumstances, there is a need for a mold cleaning resin composition that can provide a good cleaning effect, for example, to a corner portion of a fine mold cavity, and has improved dirt removal performance. Yes.
　本発明の金型清掃用樹脂組成物は、メラミン系樹脂と、無機充填材と、硬化触媒と、飽和脂肪酸と金属との塩と、を含む金型清掃用樹脂組成物であり、
　前記無機充填材を、球形とし、
　前記無機充填材の最大粒径を、１μｍ～７０μｍの範囲とし、
　前記硬化触媒を、ミリスチン酸及びステアリン酸より選ばれる少なくとも一方とし、
　前記飽和脂肪酸と金属との塩を、ミリスチン酸亜鉛とする。 The mold cleaning resin composition of the present invention is a mold cleaning resin composition containing a melamine-based resin, an inorganic filler, a curing catalyst, a salt of a saturated fatty acid and a metal,
The inorganic filler is spherical,
The maximum particle size of the inorganic filler is in the range of 1 μm to 70 μm,
The curing catalyst is at least one selected from myristic acid and stearic acid,
The salt of the saturated fatty acid and the metal is zinc myristate.
　また、本発明の金型清掃用樹脂組成物において、前記無機充填材は、平均粒径が４μｍ～１０μｍで、粒径の標準偏差が７μｍ以下であり、かつ粒径の平均アスペクト比が１～１．２で、アスペクト比の標準偏差が０．３以下である態様が好ましい。 In the mold cleaning resin composition of the present invention, the inorganic filler has an average particle diameter of 4 μm to 10 μm, a standard deviation of particle diameter of 7 μm or less, and an average aspect ratio of particle diameter of 1 to An embodiment in which the standard deviation of the aspect ratio is 1.2 or less is preferable.
　また、本発明の金型清掃用樹脂組成物は、トランスファー型成形機に用いられるトランスファータイプの金型清掃用樹脂組成物である態様が好ましい。すなわち、本発明の金型清掃用樹脂組成物は、トランスファー成形に好適に用いられる。 In addition, it is preferable that the mold cleaning resin composition of the present invention is a transfer type mold cleaning resin composition used in a transfer molding machine. That is, the mold cleaning resin composition of the present invention is suitably used for transfer molding.
　本発明によれば、無機充填材の形状、粒径の範囲を特定し、かつ特定の硬化触媒と特定の飽和脂肪酸と金属との塩とを用いることで、細密化された金型キャビティのコーナー部まで良好な清掃効果が得られ、かつ汚れの除去性能が改善された金型清掃用樹脂組成物が提供される。 According to the present invention, the shape of the inorganic filler is specified, and the range of the particle diameter is specified, and the corner of the fine mold cavity is obtained by using a specific curing catalyst, a specific saturated fatty acid, and a metal salt. A mold cleaning resin composition having a good cleaning effect up to the portion and improved dirt removal performance is provided.
　以下、本発明の金型清掃用樹脂組成物の実施形態について説明する。
　本発明の金型清掃用樹脂組成物は、少なくとも、メラミン系樹脂と、最大粒径が１μｍ～７０μｍである球形の無機充填材と、ミリスチン酸及びステアリン酸より選ばれる硬化触媒と、飽和脂肪酸と金属との塩であるミリスチン酸亜鉛と、を用いて構成されている。本発明の金型清掃用樹脂組成物は、必要に応じて、更に他の成分を用いて構成されてもよい。 Hereinafter, embodiments of the resin composition for mold cleaning of the present invention will be described.
The mold cleaning resin composition of the present invention comprises at least a melamine-based resin, a spherical inorganic filler having a maximum particle size of 1 μm to 70 μm, a curing catalyst selected from myristic acid and stearic acid, a saturated fatty acid, And zinc myristate which is a salt with metal. The resin composition for mold cleaning of the present invention may be configured using other components as necessary.
－メラミン系樹脂－
　本発明の金型清掃用樹脂組成物は、メラミン系樹脂の少なくとも一種を含む。
　メラミン系樹脂とは、メラミン樹脂、メラミン-フェノール共縮合物、又はメラミン-ユリア共縮合物を示す。 -Melamine resin-
The mold cleaning resin composition of the present invention contains at least one melamine-based resin.
The melamine resin refers to a melamine resin, a melamine-phenol cocondensate, or a melamine-urea cocondensate.
　前記メラミン樹脂は、トリアジン類と、アルデヒド類との縮合物である。トリアジン類は、たとえばメラミン、ベンゾグアナミン及びアセトグアナミンなどが挙げられる。アルデヒド類は、たとえばホルムアルデヒド、パラホルムアルデヒド、及びアセトアルデヒドが挙げられる。 The melamine resin is a condensate of triazines and aldehydes. Examples of triazines include melamine, benzoguanamine, and acetoguanamine. Examples of aldehydes include formaldehyde, paraformaldehyde, and acetaldehyde.
　前記メラミン-フェノール共縮合物は、トリアジン類と、フェノール類と、アルデヒド類との共縮合物である。フェノール類は、たとえばフェノール、クレゾール、キシレノール、エチルフェノール、及びブチルフェノールが挙げられる。 The melamine-phenol cocondensate is a cocondensate of triazines, phenols and aldehydes. Examples of phenols include phenol, cresol, xylenol, ethylphenol, and butylphenol.
　前記メラミン-ユリア共縮合物は、トリアジン類と、ユリア類と、アルデヒド類との共縮合物である。 The melamine-urea cocondensate is a cocondensate of triazines, ureas, and aldehydes.
　本発明の金型清掃用樹脂組成物は、メラミン系樹脂以外に、本発明の効果を損なわない範囲で他の樹脂組成物、例えば、アルキッド樹脂、ポリエステル樹脂、アクリル系樹脂、エポキシ樹脂、及びゴム類を含むことができる。 The resin composition for mold cleaning of the present invention is not limited to the melamine resin, and other resin compositions, for example, alkyd resins, polyester resins, acrylic resins, epoxy resins, and rubbers, as long as the effects of the present invention are not impaired. Can be included.
　本発明の金型清掃用樹脂組成物は、メラミン系樹脂を含むため、成形金型内部表面の汚れに対し優れたクリーニング性を発揮する。その理由については必ずしも明らかではないが、メラミン系樹脂が有するメチロール基の極性が高く、成形時に発生し成形金型内部表面に付着する封止成形材料に由来の汚れ（すなわち熱硬化性樹脂組成物を含む封止成形材料に由来する汚れ）と、本発明の金型清掃用樹脂組成物と、が作用することができるため、メラミン系樹脂を含む金型清掃用樹脂組成物が優れた性能を示すと考えている。また、メラミン系樹脂が熱的に安定なため、金型の清掃時の温度である１６０～１９０℃付近においても安定して優れたクリーニング性が発揮されると考えている。 Since the resin composition for mold cleaning of the present invention contains a melamine resin, it exhibits excellent cleaning properties against dirt on the inner surface of the molding mold. The reason for this is not necessarily clear, but the methylol group of melamine resin has high polarity, and it is generated during molding and is a stain derived from a sealing molding material that adheres to the inner surface of the molding die (that is, a thermosetting resin composition). And the mold cleaning resin composition of the present invention can act, so that the mold cleaning resin composition containing a melamine resin has excellent performance. I think to show. Further, since the melamine-based resin is thermally stable, it is considered that excellent cleaning properties can be stably exhibited even in the vicinity of 160 to 190 ° C., which is a temperature at the time of mold cleaning.
－無機充填材－
　本発明の金型清掃用樹脂組成物は、最大粒径が１μｍ～７０μｍである球形の無機充填材の少なくとも一種を含む。 -Inorganic filler-
The resin composition for mold cleaning of the present invention contains at least one spherical inorganic filler having a maximum particle size of 1 μm to 70 μm.
　本発明に用いられる無機充填材は、球形を有している。球形とは、後述する無機充填材の粒径の平均アスペクト比が１～１．５のものをいい、完全な球形のほか、断面の直径が一様でない断面楕円など、球形と見なせる程度の球に近い形状である略球形も含む。 The inorganic filler used in the present invention has a spherical shape. Spherical shape means that the average aspect ratio of the particle size of the inorganic filler described later is 1 to 1.5. In addition to perfect spheres, spheres that can be regarded as spheres, such as cross-sectional ellipses with non-uniform cross-sectional diameters. A substantially spherical shape that is close to the shape is also included.
　無機充填材の粒径の平均アスペクト比は、好ましくは１～１．２である。したがって、本発明の金型清掃用樹脂組成物は、清掃時に金型清掃用樹脂組成物の流動性を保つことができる。さらに、本発明の金型清掃用樹脂組成物は、細密化された金型キャビティのコーナー部まで良好な清掃効果が期待され、さらに成形金型内部表面及びゲート部分の磨耗、傷つきを抑制することができる。
　金型清掃用樹脂組成物は、無機充填材の粒径の平均アスペクト比が１．５以下であると、清掃時に金型清掃用樹脂組成物の流動性を良好に保つことができ、細密化された金型キャビティのコーナー部まで良好なクリーニング性を確保することができる。また、成形金型内部表面及びゲート部分の磨耗、傷つきの発生も抑えられる。 The average aspect ratio of the particle size of the inorganic filler is preferably 1 to 1.2. Therefore, the mold cleaning resin composition of the present invention can maintain the fluidity of the mold cleaning resin composition during cleaning. Furthermore, the resin composition for mold cleaning of the present invention is expected to have a good cleaning effect up to the corner portion of the densified mold cavity, and further suppresses wear and damage to the inner surface of the mold and the gate portion. Can do.
When the average aspect ratio of the particle size of the inorganic filler is 1.5 or less, the mold cleaning resin composition can maintain the fluidity of the mold cleaning resin composition at the time of cleaning. Good cleaning performance can be ensured up to the corner of the mold cavity. In addition, wear and damage to the inner surface of the molding die and the gate portion can be suppressed.
　本発明において、無機充填材の粒径のアスペクト比は、以下のように求められる。
　すなわち、無機充填材の粒径のアスペクト比は、後述する粒径の求め方と同様に、電子顕微鏡を用いて求められる。ここで、１つの無機充填材の長径（Ｘ）と、長径（Ｘ）に直交する短径（Ｙ）と、をそれぞれ５回計測する。得られる計測値から、１つの無機充填材の粒径のアスペクト比を下記式により求める。但し、長径（Ｘ）≧短径（Ｙ）である。
　粒径のアスペクト比＝（Ｘの５回の計測値の平均値）／（Ｙの５回の計測値の平均値）
　そして、上記のアスペクト比を、１５０個の無機充填材それぞれについて計測し、得られた計測値の平均を求めて無機充填材の粒子のアスペクト比とした。 In the present invention, the aspect ratio of the particle size of the inorganic filler is determined as follows.
That is, the aspect ratio of the particle size of the inorganic filler can be obtained using an electron microscope in the same manner as the method for obtaining the particle size described later. Here, the major axis (X) of one inorganic filler and the minor axis (Y) orthogonal to the major axis (X) are each measured five times. From the measured value obtained, the aspect ratio of the particle diameter of one inorganic filler is determined by the following formula. However, the major axis (X) ≧ the minor axis (Y).
Aspect ratio of particle size = (average value of five measured values of X) / (average value of five measured values of Y)
And said aspect ratio was measured about each of 150 inorganic fillers, the average of the obtained measured value was calculated | required, and it was set as the aspect ratio of the particle | grains of an inorganic filler.
　本発明における定義によれば、長径（Ｘ）と短径（Ｙ）とが等しい場合、粒径のアスペクト比は１となる。本発明における定義において、粒径のアスペクト比は、１未満の値をとらない。無機充填材の形状は球形であるが、球形に近いほど粒径のアスペクト比は１に近い。仮に無機充填材の電子顕微鏡での画像が正方形の形状である場合も粒径のアスペクト比は１となるが、本発明に用いられる無機充填材の形状は、いずれも球形（略球形を含む）であり、本発明においては粒径のアスペクト比が１に近いことは球形に近いことを示す。 According to the definition in the present invention, when the major axis (X) and the minor axis (Y) are equal, the aspect ratio of the particle size is 1. In the definition in the present invention, the aspect ratio of the particle size does not take a value less than 1. The shape of the inorganic filler is spherical, but the closer the spherical shape is, the closer the particle diameter aspect ratio is to 1. Even if the image of the inorganic filler in the electron microscope has a square shape, the aspect ratio of the particle size is 1, but the inorganic filler used in the present invention has a spherical shape (including a substantially spherical shape). In the present invention, when the aspect ratio of the particle size is close to 1, it indicates that it is close to a sphere.
　本発明において、無機充填材の粒径の平均アスペクト比は、上記の方法で測定した１５０個の無機充填材のアスペクト比の平均値である。また、後述する無機充填材のアスペクト比の標準偏差は、上記の方法で測定した１５０個の無機充填材の粒径のアスペクト比の標準偏差である。 In the present invention, the average aspect ratio of the particle size of the inorganic filler is an average value of the aspect ratios of 150 inorganic fillers measured by the above method. In addition, the standard deviation of the aspect ratio of the inorganic filler described later is the standard deviation of the aspect ratio of the particle diameters of 150 inorganic fillers measured by the above method.
　無機充填材は、例えば、炭化ケイ素、酸化ケイ素（シリカ）、炭化チタン、酸化チタン、炭化ホウ素、酸化ホウ素、酸化アルミニウム、酸化マグネシウム、及び酸化カルシウムからなる群から選択される１種以上である。これらの無機充填材は、単独でも、また複数組み合わせて用いてもよい。 The inorganic filler is, for example, one or more selected from the group consisting of silicon carbide, silicon oxide (silica), titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, and calcium oxide. These inorganic fillers may be used alone or in combination.
　本発明における無機充填材は、好ましくは、酸化ケイ素（シリカ）、酸化チタンであり、特に好ましくは酸化ケイ素である。金型の材質、状態にもよるが、本発明に用いられる無機充填材として、酸化ケイ素（シリカ）や酸化チタンは、硬度が適当であり、成形金型内部表面及びゲート部分の磨耗、傷つきを抑制できる点で好ましい。本発明の発明者は、細密化された金型キャビティの清掃時、無機充填材が金型表面の汚れを物理的に研磨することで除去するものと考えている。また、酸化ケイ素（シリカ）や酸化チタンは、金型の清掃時である１６０～１９０℃付近においても熱的に安定であるため好ましい。 The inorganic filler in the present invention is preferably silicon oxide (silica) or titanium oxide, and particularly preferably silicon oxide. Although depending on the material and condition of the mold, as the inorganic filler used in the present invention, silicon oxide (silica) and titanium oxide are suitable in hardness, and the inner surface of the mold and the gate part are worn and damaged. It is preferable in that it can be suppressed. The inventor of the present invention considers that the inorganic filler is removed by physically polishing dirt on the surface of the mold when the densified mold cavity is cleaned. Silicon oxide (silica) and titanium oxide are preferable because they are thermally stable even in the vicinity of 160 to 190 ° C. when the mold is cleaned.
　本発明の金型清掃用樹脂組成物は、前記無機充填材のアスペクト比の標準偏差が０．３以下であることが望ましい。本発明の金型清掃用樹脂組成物は、前記無機充填材の粒径のアスペクト比の標準偏差が０．３以下であると、清掃時に金型清掃用樹脂組成物の流動性を保ちやすいため、金型キャビティのコーナー部までのクリーニング性が得られやすくなり、成形金型内部表面及びゲート部分の磨耗、傷つきをより抑制できる。
　中でも、無機充填材のアスペクト比の標準偏差としては、０．１５～０．３がより好ましい。 In the mold cleaning resin composition of the present invention, it is desirable that the standard deviation of the aspect ratio of the inorganic filler is 0.3 or less. Since the mold cleaning resin composition of the present invention has a standard deviation of the particle diameter aspect ratio of the inorganic filler of 0.3 or less, the fluidity of the mold cleaning resin composition is easily maintained during cleaning. Further, it becomes easy to obtain cleaning properties up to the corner of the mold cavity, and it is possible to further suppress wear and damage to the inner surface of the molding die and the gate portion.
Among them, the standard deviation of the aspect ratio of the inorganic filler is more preferably 0.15 to 0.3.
　上記において「細密化された金型キャビティ」とは、キャビティが小型化することにより成形金型表面全体に対するキャビティの配列が緻密に最適配置されていることをいう。細密化された金型キャビティは、キャビティの小型化によりゲート部分も従来のものより狭くなり、その最も狭いものは１００μｍである。 In the above, the “miniaturized mold cavity” means that the arrangement of the cavities with respect to the entire surface of the molding mold is densely and optimally arranged by reducing the size of the cavity. The fine mold cavity has a gate portion narrower than the conventional one due to the miniaturization of the cavity, and its narrowest is 100 μm.
　本発明に用いられる無機充填材の最大粒径は、１μｍ～７０μｍである。本発明の金型清掃用樹脂組成物では、含有される無機充填材の最大粒径が１μｍ～７０μｍの範囲にあるため、細密化された金型キャビティのコーナー部まで良好な清掃効果が得られる。ここで、最大粒径が１μｍ以上であることは、無機充填材が金型表面の汚れに物理的に作用するだけの形状をそなえることを意味する。また、最大粒径が７０μｍを越えると、無機充填剤の粒子同士がキャビティ部に詰まりやすくなり、流動性が低下し、結果、清掃効果が低下する。
　中でも、無機充填材の最大粒径としては、１０μｍ～５０μｍがより好ましく、特に好ましくは２０μｍ～４５μｍであり、最も好ましくは４５μｍである。 The maximum particle size of the inorganic filler used in the present invention is 1 μm to 70 μm. In the resin composition for mold cleaning of the present invention, since the maximum particle size of the inorganic filler contained is in the range of 1 μm to 70 μm, a good cleaning effect can be obtained up to the corner portion of the densified mold cavity. . Here, the maximum particle size being 1 μm or more means that the inorganic filler has a shape that physically acts on the mold surface dirt. On the other hand, when the maximum particle diameter exceeds 70 μm, the particles of the inorganic filler are easily clogged in the cavity portion, the fluidity is lowered, and as a result, the cleaning effect is lowered.
Among these, the maximum particle size of the inorganic filler is more preferably 10 μm to 50 μm, particularly preferably 20 μm to 45 μm, and most preferably 45 μm.
　本発明に用いられる無機充填材の平均粒径は、４μｍ～１０μｍであることが望ましい。本発明の発明者は、平均粒径が著しく小さい無機充填材では質量や表面積が小さいため、金型キャビティのクリーニング性能を発揮しにくいと考えている。本発明の金型清掃用樹脂組成物において、前記無機充填材の平均粒径が４μｍ以上であると、成形金型全体のクリーニング性がより得られる。また、前記無機充填材の平均粒径が１０μｍ以下であると、細密化された金型キャビティのコーナー部までのクリーニング性がより得られる。さらに、本発明における無機充填材の平均粒径が１０μｍ以下であると、成形金型内部表面及びゲート部分の磨耗、傷つきをより抑制できる。
　中でも、無機充填材の平均粒径としては、５μｍ～８μｍがより好ましい。 The average particle size of the inorganic filler used in the present invention is desirably 4 μm to 10 μm. The inventor of the present invention believes that the inorganic filler having a remarkably small average particle size has a small mass and surface area, and therefore it is difficult to exhibit the cleaning performance of the mold cavity. In the mold cleaning resin composition of the present invention, when the average particle size of the inorganic filler is 4 μm or more, the cleaning property of the entire molding die is further obtained. In addition, when the average particle size of the inorganic filler is 10 μm or less, the cleaning properties up to the corner portion of the densified mold cavity can be further obtained. Furthermore, when the average particle size of the inorganic filler in the present invention is 10 μm or less, it is possible to further suppress wear and damage to the inner surface of the molding die and the gate portion.
In particular, the average particle size of the inorganic filler is more preferably 5 μm to 8 μm.
　本発明に用いられる無機充填材の粒径の標準偏差は、７μｍ以下であることが望ましい。本発明の金型清掃用樹脂組成物において、無機充填材の粒径の標準偏差が７μｍ以下であると、清掃時に金型清掃用樹脂組成物の流動性を保つことができるため、金型キャビティのコーナー部までのクリーニング性がより得られる。
　中でも、無機充填材の粒径の標準偏差としては、１μｍ～７μｍがより好ましい。 The standard deviation of the particle size of the inorganic filler used in the present invention is desirably 7 μm or less. In the resin composition for mold cleaning of the present invention, when the standard deviation of the particle size of the inorganic filler is 7 μm or less, the fluidity of the resin composition for mold cleaning can be maintained at the time of cleaning. More cleanability up to the corners is obtained.
In particular, the standard deviation of the particle size of the inorganic filler is more preferably 1 μm to 7 μm.
　本発明において、前記無機充填材の粒径は、以下のように求められる。
　すなわち、電子顕微鏡（製品名；ＪＳＭ-５５１０、日本電子株式会社製）を用いて、１つの視野におよそ３０個の無機充填材が含まれるように、無機充填材を１５００倍で撮影し、異なる５視野の各々の無機充填材の径をそれぞれ測定した。続いて、無機充填材の長径（Ｘ）と、長径（Ｘ）に直交する短径（Ｙ）と、を計測し、それぞれ５回の計測値の平均値を求めた。合計１５０個の無機充填材について、Ｘ及びＹを測定し、１つの無機充填材の粒径を下記の式により求め、１５０個の無機充填材の粒径（計算値）を平均することで、無機充填材の粒径を求めた。
　　粒径＝（（Ｘの５回の計測値の平均値）＋（Ｙの５回の計測値の平均値））／２ In the present invention, the particle size of the inorganic filler is determined as follows.
That is, using an electron microscope (product name: JSM-5510, manufactured by JEOL Ltd.), the inorganic filler is photographed at 1500 times so that approximately 30 inorganic fillers are included in one field of view. The diameters of the inorganic fillers in each of the five fields were measured. Subsequently, the major axis (X) of the inorganic filler and the minor axis (Y) orthogonal to the major axis (X) were measured, and the average value of five measurements was obtained. For a total of 150 inorganic fillers, X and Y are measured, the particle size of one inorganic filler is determined by the following formula, and the particle size (calculated value) of 150 inorganic fillers is averaged, The particle size of the inorganic filler was determined.
Particle size = ((average value of five measured values of X) + (average value of five measured values of Y)) / 2
　本発明において、平均粒径は、上記の方法で測定した１５０個の無機充填材の粒径の平均値である。また、粒径の標準偏差は、上記の方法で測定した１５０個の無機充填材の粒径の標準偏差である。 In the present invention, the average particle diameter is an average value of the particle diameters of 150 inorganic fillers measured by the above method. Moreover, the standard deviation of a particle size is a standard deviation of the particle size of 150 inorganic fillers measured by said method.
　本発明に好適に用いることができる無機充填材は、例えば非晶質の球形シリカであり、具体的には、新日鉄住金マテリアルズ株式会社 マイクロン社（新日鉄マテリアルズ株式会社 マイクロン社）製の製品名「Ｓ４４０－４」、「ＨＳ－２０２」、「ＨＳ－２０４」、「ＵＦ－３２０」などが挙げられる。 An inorganic filler that can be suitably used in the present invention is, for example, amorphous spherical silica, and specifically, a product name manufactured by Nippon Steel & Sumikin Materials Co., Ltd., Sakai Micron (Nippon Steel Materials Co., Ltd., Sakai Micron). “S440-4”, “HS-202”, “HS-204”, “UF-320” and the like.
－硬化触媒－
　本発明の金型清掃用樹脂組成物は、硬化触媒として、ミリスチン酸及びステアリン酸より選ばれる少なくとも一方を含む。
　金型清掃用樹脂組成物は、球形（略球形を含む）で、かつ最大粒径が１μｍ～７０μｍの前記無機充填材を金型清掃用樹脂組成物に用いると、細密化された金型キャビティの清掃時、金型清掃用樹脂組成物のフローが過剰になり、金型内に金型清掃用樹脂組成物が適切にとどまらないため、汚れを十分に除去できない場合がある。本発明の発明者は、硬化触媒としてミリスチン酸及び／又はステアリン酸を用いることで、細密化された金型キャビティの清掃時、金型清掃用樹脂組成物のフローが過剰になることが防止されることを見出した。
　したがって、本発明の金型清掃用樹脂組成物は、金型内に金型清掃用樹脂組成物が適切にとどまることで、細密化された金型キャビティのコーナー部を清掃できると共に、汚れの除去性能も改善される。 -Curing catalyst-
The resin composition for mold cleaning of the present invention contains at least one selected from myristic acid and stearic acid as a curing catalyst.
When the inorganic filler having a spherical shape (including a substantially spherical shape) and a maximum particle size of 1 μm to 70 μm is used for the mold cleaning resin composition, the mold cleaning resin cavity is made finer. When cleaning the mold, the flow of the mold cleaning resin composition becomes excessive, and the mold cleaning resin composition does not stay properly in the mold, so that the dirt may not be sufficiently removed. By using myristic acid and / or stearic acid as a curing catalyst, the inventors of the present invention can prevent the flow of the mold cleaning resin composition from becoming excessive when the fine mold cavity is cleaned. I found out.
Therefore, the mold cleaning resin composition of the present invention can clean the corners of the fine mold cavity and remove the dirt by appropriately retaining the mold cleaning resin composition in the mold. Performance is also improved.
　本発明に用いられるミリスチン酸及びステアリン酸の組成物中における含有量は、前記メラミン系樹脂１００質量部に対して、０．１質量部～３．０質量部が好ましく、０．５質量部～２．０質量部がより好ましく、特に好ましくは１．０質量部～２．０質量部である。前記ミリスチン酸の含有量が０．１質量部以上であると、本発明の金型清掃用樹脂組成物が清掃時に硬化しやすく、細密化された金型キャビティの汚れがより良好に除去される。また、前記ミリスチン酸が３．０質量部以下であると、本発明の金型清掃用樹脂組成物の貯蔵安定性により優れる。 The content of myristic acid and stearic acid used in the present invention in the composition is preferably 0.1 parts by mass to 3.0 parts by mass, and 0.5 parts by mass to 100 parts by mass of the melamine resin. The amount is more preferably 2.0 parts by weight, particularly preferably 1.0 part by weight to 2.0 parts by weight. When the content of myristic acid is 0.1 parts by mass or more, the mold cleaning resin composition of the present invention is easily cured at the time of cleaning, and finer mold cavity dirt is better removed. . Moreover, it is more excellent in the storage stability of the resin composition for metal mold | die cleaning of this invention as the said myristic acid is 3.0 mass parts or less.
－飽和脂肪酸と金属との塩－
　本発明の金型清掃用樹脂組成物は、飽和脂肪酸と金属との塩として、ミリスチン酸亜鉛を含む。本発明の発明者は、細密化された金型キャビティの清掃時、飽和脂肪酸と金属との塩が汚れに作用し、例えば汚れが膨潤することで成形金型表面から剥離しやすくなると考えている。すなわち、本発明の発明者は、飽和脂肪酸と金属との塩として特にミリスチン酸亜鉛を選択的に用いることで、細密化された金型キャビティの清掃時、本発明の金型清掃用樹脂組成物のフローが過剰になることを防ぐことを見出した。 -Salts of saturated fatty acids and metals-
The resin composition for mold cleaning of the present invention contains zinc myristate as a salt of a saturated fatty acid and a metal. The inventor of the present invention believes that when a fine mold cavity is cleaned, a salt of a saturated fatty acid and a metal acts on the dirt, and for example, the dirt swells to facilitate separation from the surface of the mold. . That is, the inventor of the present invention selectively uses zinc myristate as a salt of a saturated fatty acid and a metal, so that the resin composition for cleaning a mold of the present invention can be used for cleaning a densified mold cavity. It was found that the flow of the is prevented from becoming excessive.
　ミリスチン酸亜鉛の融点は１２３℃～１３０℃である。また、通常、熱硬化性樹脂組成物を含む封止成形材料を用いる金型キャビティの清掃時の温度は、１６０℃～１９０℃である。
　本発明の発明者は、本発明の金型清掃用樹脂組成物に含まれるミリスチン酸亜鉛が清掃作業環境温度である１６０℃～１９０℃の範囲において適切な流動性を示すため、本発明の金型清掃用樹脂組成物のフローが清掃に適した範囲になると考えている。
　したがって、本発明の金型清掃用樹脂組成物は、金型内に金型清掃用樹脂組成物が適切にとどまることで、細密化された金型キャビティのコーナー部を清掃でき、かつ汚れの除去性能が改善される。 The melting point of zinc myristate is 123 ° C to 130 ° C. In general, the temperature at the time of cleaning the mold cavity using the sealing molding material containing the thermosetting resin composition is 160 ° C. to 190 ° C.
The inventor of the present invention shows that the zinc myristate contained in the mold cleaning resin composition of the present invention exhibits appropriate fluidity within the cleaning work environment temperature range of 160 ° C. to 190 ° C. The flow of the mold cleaning resin composition is considered to be in a range suitable for cleaning.
Therefore, the mold cleaning resin composition of the present invention can clean the corners of the fine mold cavity and remove dirt by appropriately maintaining the mold cleaning resin composition in the mold. Performance is improved.
　飽和脂肪酸と金属との塩として用いられるミリスチン酸亜鉛の含有量としては、前記メラミン系樹脂１００質量部に対して、０．１質量部～３．０質量部が好ましく、０．５質量部～２．０質量部がより好ましく、特に好ましくは１．０質量部～２．０質量部である。ミリスチン酸亜鉛の含有量が０．１質量部以上であると、本発明の金型清掃用樹脂組成物が清掃時に硬化しやすくなり、細密化された金型キャビティの汚れが良好に除去される。また、ミリスチン酸亜鉛の含有量が３．０質量部以下であると、本発明の金型清掃用樹脂組成物のフローが過剰にならないため好ましい。 The content of zinc myristate used as a salt of a saturated fatty acid and a metal is preferably 0.1 part by mass to 3.0 parts by mass, preferably 0.5 parts by mass to 100 parts by mass of the melamine resin. The amount is more preferably 2.0 parts by weight, particularly preferably 1.0 part by weight to 2.0 parts by weight. When the content of zinc myristate is 0.1 parts by mass or more, the mold cleaning resin composition of the present invention is easily cured at the time of cleaning, and dirt in the fine mold cavity is well removed. . Moreover, since content of zinc myristate is 3.0 mass parts or less, since the flow of the resin composition for metal mold | die cleaning of this invention does not become excess, it is preferable.
－他の添加剤－
　本発明の金型清掃用樹脂組成物は、他の添加剤をさらに含有していてもよい。他の添加剤としては、例えば、着色剤、抗酸化剤、滑剤などが挙げられる。
　滑剤としては、例えば、脂肪酸アミド系滑剤、詳しくはラウリン酸アミド、ミリスチン酸アミド、エルカ酸アミド、オレイン酸アミド、ステアリン酸アミドのような飽和あるいは不飽和モノアミド型滑剤、メチレンビスステアリン酸アミド、エチレンビスステアリン酸アミド、エチレンビスオレイン酸アミドのような飽和あるいは不飽和ビスアミド型滑剤などが挙げられる。 -Other additives-
The mold cleaning resin composition of the present invention may further contain other additives. Examples of other additives include colorants, antioxidants, lubricants, and the like.
Examples of the lubricant include fatty acid amide type lubricants, specifically, saturated or unsaturated monoamide type lubricants such as lauric acid amide, myristic acid amide, erucic acid amide, oleic acid amide, stearic acid amide, methylenebis stearic acid amide, ethylene Examples thereof include saturated or unsaturated bisamide type lubricants such as bisstearic acid amide and ethylene bisoleic acid amide.
　本発明の金型清掃用樹脂組成物は、エポキシ樹脂、シリコーン樹脂、フェノール樹脂、及びポリイミド樹脂に代表される熱硬化性樹脂組成物を含む封止成形材料に由来する汚れを、成形金型内部の表面から取り除くのに適している。 The resin composition for mold cleaning according to the present invention is used to remove dirt derived from a sealing molding material containing a thermosetting resin composition typified by epoxy resin, silicone resin, phenol resin, and polyimide resin. Suitable for removing from the surface.
　本発明の金型清掃用樹脂組成物は、メラミン系樹脂、無機充填材、硬化触媒、飽和脂肪酸と金属との塩、及び必要に応じて他の添加剤をほぼ均一に混合することにより調製することができる。ほぼ均一に混合するための方法として、例えば、ニーダー、リボンブレンダー、ヘンシェルミキサー、ボールミル、ロール練り、らいかい機、及びタンブラー等を用いた方法が挙げられる。 The mold cleaning resin composition of the present invention is prepared by almost uniformly mixing a melamine resin, an inorganic filler, a curing catalyst, a salt of a saturated fatty acid and a metal, and, if necessary, other additives. be able to. Examples of the method for mixing almost uniformly include a method using a kneader, a ribbon blender, a Henschel mixer, a ball mill, a roll kneading machine, a raking machine, a tumbler, and the like.
　本発明の金型清掃用樹脂組成物は、トランスファー型成形機に用いられるトランスファータイプの金型清掃用樹脂組成物に好適である。 The mold cleaning resin composition of the present invention is suitable for a transfer type mold cleaning resin composition used in a transfer molding machine.
　本発明の金型清掃用樹脂組成物は、通常タブレット状に加工して、通常成形金型内の清掃作業に用いられる。詳しくは、金型上にリードフレームを配置後、タブレット状の金型清掃用樹脂組成物はポット部へ挿入され、型締めした後にプランジャーで押し流す。この際に、ポット部よりランナー部を経由し、ゲート部分から金型キャビティ内部に樹脂が流れ込む。清掃作業は、所定の成形時間経過後、金型を開き、リードフレームと一体となった金型清掃用樹脂組成物と汚れとを含む成形物を取り除くことで行なわれる。 The resin composition for mold cleaning of the present invention is usually processed into a tablet shape and used for cleaning work in a normal mold. Specifically, after arranging the lead frame on the mold, the tablet-shaped mold cleaning resin composition is inserted into the pot portion, and after the mold is clamped, it is pushed away with a plunger. At this time, the resin flows from the gate portion into the mold cavity from the pot portion through the runner portion. The cleaning operation is performed by opening the mold after a predetermined molding time has elapsed, and removing the molded product including the mold cleaning resin composition and dirt integrated with the lead frame.
　本発明の金型清掃用樹脂組成物は、集積回路等の封止成形作業における成形金型内の汚れを除去するのに好適に用いられる。前記成形金型の材質は、例えば、鉄やクロムなどである。成形金型内は、通常めっき処理されている。封止成形作業、及び成形金型内部の表面の清掃作業を繰り返すことにより、成形金型内にミクロンサイズの傷が発生し、金型が磨耗する。このような傷や摩耗の発生により、成形金型内のめっき処理面の欠落や表面状態の荒れが起きる。成形金型は、内部の傷の発生、及び成形金型内部表面のめっき処理面の欠落や表面状態の荒れにより、封止成形作業時の成形性及び離型性の低下や、表面外観不良が発生する。これにより、さらに成形金型内の清掃作業性が失われる不具合が発生する。本発明の金型清掃用樹脂組成物では、球形（略球形を含む）の無機充填材の最大粒径を適切に選ぶことで、清掃時の成形金型内の傷つきも抑制することができる。 The resin composition for mold cleaning of the present invention is suitably used for removing dirt in a molding die in a sealing molding operation such as an integrated circuit. The material of the molding die is, for example, iron or chrome. The inside of the molding die is usually plated. By repeating the sealing molding operation and the cleaning operation of the surface inside the molding die, micron-sized scratches are generated in the molding die, and the die is worn. Occurrence of such scratches and wear causes a lack of a plated surface in the molding die and a rough surface state. Due to the occurrence of internal flaws, the lack of plating surface on the inner surface of the molding die and the rough surface condition, the molding die suffers from deterioration of moldability and releasability during sealing molding operations and poor surface appearance. appear. Thereby, the malfunction which the cleaning workability | operativity in a shaping die loses further generate | occur | produces. In the mold cleaning resin composition of the present invention, by appropriately selecting the maximum particle size of the spherical (including substantially spherical) inorganic filler, it is possible to suppress damage in the molding die during cleaning.
　以下、本発明について実施例及び比較例を挙げて更に詳しく説明する。なお、本発明はこれら実施例に限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples. The present invention is not limited to these examples.
（実施例１）
　メラミン系樹脂として、公知の方法で加熱反応させた後に減圧乾燥したものを粉末化して作製したメラミン－フェノール共縮合物２１．３質量部及びメラミン樹脂５０質量部と、無機充填材として、非晶質の球形シリカ（製品名：Ｓ４４０－４、新日鉄住金マテリアルズ株式会社 マイクロン社（新日鉄マテリアルズ株式会社 マイクロン社）製の無機充填材）２０質量部と、有機充填材として、広葉樹パルプ７．８質量部と、飽和脂肪酸と金属との塩としてミリスチン酸亜鉛０．５質量部と、硬化触媒としてミリスチン酸０．０５質量部と、をボールミルに加えて粉砕した。その後、滑剤としてステアリン酸アミドをナウターミキサーにて０．３５質量部加えた。このようにして、金型清掃用樹脂組成物を作製した。 (Example 1)
As a melamine-based resin, 21.3 parts by mass of a melamine-phenol cocondensate and 50 parts by mass of a melamine resin prepared by pulverizing a product that has been heated and reacted by a known method and then dried under reduced pressure, and an amorphous filler as an inorganic filler Quality spherical silica (product name: S440-4, inorganic filler manufactured by Nippon Steel & Sumikin Materials Co., Ltd. Micron Co., Ltd. (Micron Co., Ltd.)) and hardwood pulp 7.8 as an organic filler. 0.5 parts by mass of zinc myristic acid as a salt of saturated fatty acid and metal, and 0.05 parts by mass of myristic acid as a curing catalyst were added to a ball mill and pulverized. Thereafter, stearamide as a lubricant was added by 0.35 parts by mass with a Nauter mixer. In this way, a mold cleaning resin composition was prepared.
　無機充填材を電子顕微鏡で観察したところ、Ｓ４４０－４の粒径の平均アスペクト比は１．１６（球形）であった。また、実施例に用いた後述する他の無機充填材のいずれの粒径の平均アスペクト比も１～１．５の範囲の球形であった。 When the inorganic filler was observed with an electron microscope, the average aspect ratio of the particle size of S440-4 was 1.16 (spherical). In addition, the average aspect ratio of any particle size of other inorganic fillers described later used in the examples was spherical in the range of 1 to 1.5.
　下記の表１には、実施例１で作製した金型清掃用樹脂組成物の組成及び量（質量部）、無機充填材の平均粒径、最大粒径、及び平均アスペクト比をまとめて示す。
　なお、無機充填材の粒径の標準偏差は７μｍであり、無機充填材のアスペクト比の標準偏差は０．２３であった。 Table 1 below summarizes the composition and amount (parts by mass) of the mold cleaning resin composition prepared in Example 1, the average particle size, the maximum particle size, and the average aspect ratio of the inorganic filler.
The standard deviation of the particle size of the inorganic filler was 7 μm, and the standard deviation of the aspect ratio of the inorganic filler was 0.23.
　また、作製した金型清掃用樹脂組成物に対して、以下に示す試験方法によりクリーニング性を評価した。なお、作製した金型清掃用樹脂組成物は、トランスファータイプである。 Further, the cleaning property of the produced resin composition for mold cleaning was evaluated by the following test method. The produced mold cleaning resin composition is a transfer type.
－クリーニング性－
　ＱＦＰ（Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）金型を用いた自動成形機を用意し、市販のエポキシ樹脂成形材料であるＥＭＥ-Ｇ７００Ｌ（住友ベークライト株式会社製）を用いて、金型温度１７５℃にて４００ショットの成形を行ない、成形金型内部の表面に汚れを発現させた。この金型を用い、その内部表面の汚れが除去できるまで上記で作製した金型清掃用樹脂組成物を繰り返し成形することによって、清掃作業を行なった。金型清掃用樹脂組成物の繰り返し成形は、エポキシ樹脂成形材料の成形時と同様に金型温度を１７５℃にして行なった。
　なお、評価に使用した金型キャビティのゲート部分は、幅が８００μｍであり、高さが３００μｍであった。さらに、この金型キャビティのゲート部分は、最も狭い部位で１００μｍであった。 -Cleanability-
An automatic molding machine using a QFP (Quad Flat Package) mold was prepared, and 400 shots were performed at a mold temperature of 175 ° C. using a commercially available epoxy resin molding material EME-G700L (manufactured by Sumitomo Bakelite Co., Ltd.). Molding was performed, and stains were developed on the surface inside the molding die. Using this mold, a cleaning operation was performed by repeatedly molding the mold cleaning resin composition prepared above until the dirt on the inner surface could be removed. The mold cleaning resin composition was repeatedly molded at a mold temperature of 175 ° C. in the same manner as the molding of the epoxy resin molding material.
The gate portion of the mold cavity used for the evaluation had a width of 800 μm and a height of 300 μm. Further, the gate portion of this mold cavity was 100 μm at the narrowest portion.
　クリーニング性の評価は、特に金型キャビティのゲート部分やコーナー部までクリーニングができているかに注目し、金型キャビティのコーナー部の汚れの除去性と、金型キャビティのゲート部分及びコーナー部をクリーニングするのに必要なショット数と、を判定することにより行なった。クリーニング性は、ショット数が小さいほど優れている。表１は、実施例及び比較例それぞれの評価結果をまとめたものである。
　コーナー部の汚れの除去性は、金型キャビティのコーナー部における汚れの有無を目視により確認し、評価した。評価は、金型キャビティのゲート部分を金型清掃用樹脂組成物が良好に通過し、汚れがなく又は汚れが少なく良好であったものを「Ａ」とし、汚れが残存し、成形に不具合を来すものを「Ｂ」と判定した。
　また、金型キャビティのゲート部分やコーナー部までクリーニングするのに必要なショット数の評価は、完了ショット数が１０回以下である場合はショット数を記録し、１０回クリーニングしても汚れが除去できない場合を「ＮＧ」と判定した。 In the evaluation of cleaning performance, paying particular attention to whether the gate part and corner part of the mold cavity can be cleaned, the removal of dirt at the corner part of the mold cavity and the gate part and corner part of the mold cavity are cleaned. This was done by determining the number of shots necessary to do this. The cleaning performance is better as the number of shots is smaller. Table 1 summarizes the evaluation results of the examples and comparative examples.
The removal of dirt at the corner was evaluated by visually confirming the presence or absence of dirt at the corner of the mold cavity. In the evaluation, the resin composition for mold cleaning passed well through the gate part of the mold cavity, and “A” was defined as “A” when there was no dirt or good with little dirt. The incoming one was judged as “B”.
In addition, when evaluating the number of shots required to clean the gate and corner of the mold cavity, the number of shots is recorded when the number of completed shots is 10 times or less, and dirt is removed even after 10 times of cleaning. When it was not possible, it was determined as “NG”.
（実施例２）
　実施例１において、硬化触媒として用いたミリスチン酸をステアリン酸に代えたこと以外は、実施例１と同様にして、金型清掃用樹脂組成物を作製し、クリーニング性を評価した。評価結果は、表１に示す。 (Example 2)
In Example 1, except that myristic acid used as the curing catalyst was replaced with stearic acid, a resin composition for mold cleaning was prepared and the cleaning property was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.
（実施例３～５）
　実施例１において、無機充填材を下記の表１に示すように変更したこと以外は、実施例１と同様にして、金型清掃用樹脂組成物を作製し、クリーニング性を評価した。評価結果は、表１に示す。 (Examples 3 to 5)
A resin composition for mold cleaning was prepared in the same manner as in Example 1 except that the inorganic filler was changed as shown in Table 1 below, and the cleaning property was evaluated. The evaluation results are shown in Table 1.
（比較例１）
　実施例１において、硬化触媒として安息香酸を用いた以外は、実施例１と同様にして、金型清掃用樹脂組成物を作製し、クリーニング性を評価した。評価結果は、表１に示す。 (Comparative Example 1)
In Example 1, except that benzoic acid was used as the curing catalyst, a mold cleaning resin composition was prepared and the cleaning property was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.
（比較例２）
　実施例１において、飽和脂肪酸と金属との塩としてステアリン酸亜鉛を用いた以外は、実施例１と同様にして、金型清掃用樹脂組成物を作製し、クリーニング性を評価した。評価結果は、表１に示す。 (Comparative Example 2)
In Example 1, except that zinc stearate was used as a salt of a saturated fatty acid and a metal, a mold cleaning resin composition was prepared and the cleaning property was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.
（比較例３）
　実施例１において、無機充填材として、株式会社山森土木鉱業所製の結晶質シリカ（製品名：Ｒ－１）を用いたこと以外は、実施例１と同様にして、金型清掃用樹脂組成物を作製し、クリーニング性を評価した。評価結果は、表１に示す。
　なお、比較例３で用いた無機充填材は、表１に示す粒径及びアスペクト比を有しており、またこの無機充填材の形状は、電子顕微鏡を用いて確認したところ、不定形であった。 (Comparative Example 3)
In Example 1, a resin composition for mold cleaning was used in the same manner as in Example 1 except that crystalline silica (product name: R-1) manufactured by Yamamori Civil Engineering Co., Ltd. was used as the inorganic filler. A product was prepared and the cleaning property was evaluated. The evaluation results are shown in Table 1.
The inorganic filler used in Comparative Example 3 has the particle size and aspect ratio shown in Table 1, and the shape of the inorganic filler was indeterminate when confirmed using an electron microscope. It was.
（比較例４）
　実施例１において、無機充填材として、瀬戸窯業原料株式会社製の結晶質シリカ（製品名：純硅石粉）を用いたこと以外は、実施例１と同様にして、金型清掃用樹脂組成物を作製し、クリーニング性を評価した。評価結果は、表１に示す。
　なお、比較例４で用いた無機充填材は、表１に示す粒径及びアスペクト比を有している。 (Comparative Example 4)
In Example 1, a resin composition for mold cleaning was used in the same manner as in Example 1 except that crystalline silica (product name: pure meteorite powder) manufactured by Seto Ceramics Co., Ltd. was used as the inorganic filler. Were prepared and the cleaning property was evaluated. The evaluation results are shown in Table 1.
In addition, the inorganic filler used in Comparative Example 4 has a particle size and an aspect ratio shown in Table 1.
（比較例５）
　実施例１において、無機充填材を下記の表１に示すように変更したこと以外は、実施例１と同様にして、金型清掃用樹脂組成物を作製し、クリーニング性を評価した。評価結果は、表１に示す。 (Comparative Example 5)
A resin composition for mold cleaning was prepared in the same manner as in Example 1 except that the inorganic filler was changed as shown in Table 1 below, and the cleaning property was evaluated. The evaluation results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000001
 
Figure JPOXMLDOC01-appb-T000001
 
　表１中の無機充填材の詳細は、下記の通りである。
・Ｓ４４０－４：新日鉄住金マテリアルズ株式会社 マイクロン社（新日鉄マテリアルズ株式会社 マイクロン社）製の非晶質球形シリカ
・ＨＳ－２０２：新日鉄住金マテリアルズ株式会社 マイクロン社（新日鉄マテリアルズ株式会社 マイクロン社）製の非晶質球形シリカ
・Ｒ－１：株式会社山森土木鉱業所製の結晶質シリカ
・ＨＳ－３０２：新日鉄住金マテリアルズ株式会社 マイクロン社（新日鉄マテリアルズ株式会社 マイクロン社）製の非晶質球形シリカ
・ＵＦ－３２０：株式会社トクヤマ製の非晶質球形シリカ
・ＨＳ－２０４：新日鉄住金マテリアルズ株式会社 マイクロン社（新日鉄マテリアルズ株式会社 マイクロン社）製の非晶質球形シリカ
・純硅石粉：瀬戸窯業原料株式会社製の結晶質シリカ The details of the inorganic filler in Table 1 are as follows.
S440-4: Amorphous spherical silica manufactured by Nippon Steel & Sumikin Materials Co., Ltd. Micron (Nippon Steel Materials Co., Ltd.) HS-202: Nippon Steel & Sumikin Materials Co., Ltd. Micron (Nippon Steel Materials Co., Ltd. Micron) ) Amorphous spherical silica R-1: Crystalline silica manufactured by Yamamori Civil Engineering Co., Ltd. HS-302: Amorphous manufactured by Nippon Steel & Sumikin Materials Co., Ltd. Micron (Nippon Steel Materials Micron) Spherical silica UF-320: Amorphous spherical silica manufactured by Tokuyama Corporation HS-204: Amorphous spherical silica manufactured by Nippon Steel & Sumikin Materials Co., Ltd. (Micron Corporation) Powder: Crystalline silica manufactured by Seto Ceramics Co., Ltd.
　前記表１に示すように、本発明の金型清掃用樹脂組成物は、細密化された金型キャビティのコーナー部まで良好に清掃することができ、かつ汚れの除去性能を改善できた。 As shown in Table 1, the mold cleaning resin composition of the present invention was able to satisfactorily clean up to the corners of the densified mold cavity and improved the dirt removal performance.
　また、表１に示すように、実施例１～５の金型清掃用樹脂組成物は、メラミン系樹脂と、球形かつ最大粒径が１μｍ～７０μｍの無機充填材と、硬化触媒としてミリスチン酸又はステアリン酸と、飽和脂肪酸と金属との塩としてミリスチン酸亜鉛と、をそれぞれ含むため、ゲート部分で最も狭い部位が１００μｍの金型に対し、コーナー部まで良好に清掃でき、クリーニング完了ショット数も４回で済むという優れた汚れの除去性能を示した。さらに、清掃後の金型表面を観察したところ、実施例１～５の金型清掃用樹脂組成物は、金型表面を傷つけていなかった。 In addition, as shown in Table 1, the mold cleaning resin compositions of Examples 1 to 5 include melamine-based resins, spherical inorganic fillers having a maximum particle size of 1 μm to 70 μm, and myristic acid or a curing catalyst. Since stearic acid and zinc myristic acid as a salt of saturated fatty acid and metal are included, the narrowest part of the gate part can be cleaned well to the corner part with a mold of 100 μm, and the number of cleaning completed shots is 4 Excellent dirt removal performance that can be done only once. Furthermore, when the mold surface after cleaning was observed, the mold cleaning resin compositions of Examples 1 to 5 did not damage the mold surface.
　一方、比較例１の金型清掃用樹脂組成物は、硬化触媒として安息香酸を含むため、金型清掃用樹脂組成物のフローが過剰で、クリーニング完了ショット数が多くなった。したがって、汚れの除去性能が実施例１よりも劣っていた。 On the other hand, since the mold cleaning resin composition of Comparative Example 1 contained benzoic acid as a curing catalyst, the flow of the mold cleaning resin composition was excessive, and the number of shots for cleaning completion increased. Therefore, the dirt removal performance was inferior to that of Example 1.
　比較例２の金型清掃用樹脂組成物では、飽和脂肪酸と金属との塩としてステアリン酸亜鉛を含むため、金型清掃用樹脂組成物のフローが過剰で、クリーニング完了ショット数が多くなった。したがって、汚れの除去性能が実施例１よりも劣っていた。 The mold cleaning resin composition of Comparative Example 2 contained zinc stearate as a salt of a saturated fatty acid and a metal, and therefore the flow of the mold cleaning resin composition was excessive, resulting in an increase in the number of cleaning completed shots. Therefore, the dirt removal performance was inferior to that of Example 1.
　比較例３の金型清掃用樹脂組成物では、無機充填材の最大粒径が３５２μｍでかつ不定形であるため、金型キャビティのコーナー部の清掃ができず、さらに金型の汚れの除去性能も劣っていた。 In the resin composition for mold cleaning of Comparative Example 3, since the maximum particle size of the inorganic filler is 352 μm and is indefinite, the corner of the mold cavity cannot be cleaned, and the mold dirt removal performance Was also inferior.
　比較例４の金型清掃用樹脂組成物では、無機充填材の最大粒径が１００μｍであるため、金型清掃用樹脂組成物のフローは適切であっても、金型キャビティのコーナー部の清掃が困難であった。また、金型の汚れの除去性能も劣っていた。 In the mold cleaning resin composition of Comparative Example 4, since the maximum particle size of the inorganic filler is 100 μm, even if the flow of the mold cleaning resin composition is appropriate, the corner of the mold cavity is cleaned. It was difficult. In addition, the mold removal performance was inferior.
　比較例５の金型清掃用樹脂組成物では、無機充填材の最大粒径が７５μｍで粒子同士がキャビティ部に詰まりやすい傾向が観られ、良好な流動性が確保できず、金型キャビティのコーナー部を良好に清掃し得なかった。したがって、金型の汚れの除去性能も劣っていた。 In the mold cleaning resin composition of Comparative Example 5, the maximum particle size of the inorganic filler is 75 μm, and there is a tendency that the particles tend to be clogged with each other, and good fluidity cannot be secured. The part could not be cleaned well. Therefore, the dirt removal performance of the mold was also inferior.
　以上の実施例及び比較例に示されるように、無機充填材の最大粒径が１μｍ～７０μｍである場合に、硬化触媒及び飽和脂肪酸と金属との塩を適切に選択することで、金型清掃用樹脂組成物による清掃時のフローを制御することができ、細密化された金型キャビティのコーナー部まで良好な清掃効果が発現した。また、金型内に金型清掃用樹脂組成物が適切に留まり、金型内の汚れの除去性能も改善された。 As shown in the above examples and comparative examples, when the maximum particle size of the inorganic filler is 1 μm to 70 μm, the mold cleaning is performed by appropriately selecting the curing catalyst and the salt of the saturated fatty acid and the metal. The flow at the time of cleaning with the resin composition can be controlled, and a good cleaning effect is exhibited up to the corner portion of the densified mold cavity. In addition, the mold cleaning resin composition remained properly in the mold, and the performance of removing dirt in the mold was improved.
　本発明の金型清掃用樹脂組成物は、熱硬化性樹脂組成物由来の金型表面の汚れを取り除く金型清掃用樹脂組成物であり、トランスファー型成形機でのトランスファー成形に好適に用いられる。 The mold cleaning resin composition of the present invention is a mold cleaning resin composition that removes dirt on a mold surface derived from a thermosetting resin composition, and is suitably used for transfer molding in a transfer mold molding machine. .
　日本出願２０１２－０１１５４４の開示はその全体が参照により本明細書に取り込まれる。
　本明細書に記載された全ての文献、特許出願、および技術規格は、個々の文献、特許出願、および技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。 The disclosure of Japanese application 2012-011544 is incorporated herein by reference in its entirety.
All documents, patent applications, and technical standards mentioned in this specification are to the same extent as if each individual document, patent application, and technical standard were specifically and individually described to be incorporated by reference, Incorporated herein by reference.

Claims (3)

  1. 　メラミン系樹脂と、最大粒径が１μｍ～７０μｍである球形の無機充填材と、ミリスチン酸及びステアリン酸より選ばれる硬化触媒と、飽和脂肪酸と金属との塩であるミリスチン酸亜鉛と、を含む金型清掃用樹脂組成物。 Gold containing a melamine resin, a spherical inorganic filler having a maximum particle size of 1 μm to 70 μm, a curing catalyst selected from myristic acid and stearic acid, and zinc myristate which is a salt of a saturated fatty acid and a metal Resin composition for mold cleaning.
  2. 　前記無機充填材は、平均粒径が４μｍ～１０μｍであり、粒径の標準偏差が７μｍ以下であり、粒径の平均アスペクト比が１～１．２で、アスペクト比の標準偏差が０．３以下である請求項１に記載の金型清掃用樹脂組成物。 The inorganic filler has an average particle diameter of 4 μm to 10 μm, a standard deviation of particle diameter of 7 μm or less, an average aspect ratio of particle diameter of 1 to 1.2, and a standard deviation of aspect ratio of 0.3. The resin composition for mold cleaning according to claim 1, wherein:
  3. 　トランスファー型成形機に用いられる請求項１又は請求項２に記載の金型清掃用樹脂組成物。 The resin composition for mold cleaning according to claim 1 or 2, which is used in a transfer mold molding machine.
PCT/JP2013/051107 2012-01-23 2013-01-21 Resin composition for cleaning die WO2013111709A1 (en)

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SG11201404265PA SG11201404265PA (en) 2012-01-23 2013-01-21 Resin composition for cleaning die
KR1020147019489A KR102019456B1 (en) 2012-01-23 2013-01-21 Resin composition for cleaning die
JP2013555249A JP5991997B2 (en) 2012-01-23 2013-01-21 Mold cleaning resin composition
CN201380006009.7A CN104066563B (en) 2012-01-23 2013-01-21 Resin composition for cleaning mold
PH12014501669A PH12014501669A1 (en) 2012-01-23 2014-07-22 Resin composition for cleaning die

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JP2012011544 2012-01-23

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JP6803165B2 (en) * 2015-08-07 2020-12-23 日本カーバイド工業株式会社 Resin composition for mold cleaning
JP2017177623A (en) * 2016-03-31 2017-10-05 日本カーバイド工業株式会社 Resin composition for cleaning die
JP2020001336A (en) * 2018-06-29 2020-01-09 Ｔｏｙｏ Ｔｉｒｅ株式会社 Vent sleeve for tire vulcanization mold and tire vulcanization mold

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JP2002128988A (en) * 2000-10-18 2002-05-09 Choshun Jinzo Jushisho Kofun Yugenkoshi Amino resin composition for metal mold cleaning
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TW201341146A (en) 2013-10-16
CN104066563A (en) 2014-09-24
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KR20140117405A (en) 2014-10-07

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