MY170065A - Resin composition for cleaning die - Google Patents

Resin composition for cleaning die

Info

Publication number
MY170065A
MY170065A MYPI2014701951A MYPI2014701951A MY170065A MY 170065 A MY170065 A MY 170065A MY PI2014701951 A MYPI2014701951 A MY PI2014701951A MY PI2014701951 A MYPI2014701951 A MY PI2014701951A MY 170065 A MY170065 A MY 170065A
Authority
MY
Malaysia
Prior art keywords
resin composition
cleaning die
die
cleaning
acid
Prior art date
Application number
MYPI2014701951A
Inventor
Hiroaki Nomura
Katsunori Yoshimura
Taichi Sato
Original Assignee
Nippon Carbide Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kk filed Critical Nippon Carbide Kogyo Kk
Publication of MY170065A publication Critical patent/MY170065A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C33/722—Compositions for cleaning moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/10—Melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention is to provide a resin composition for cleaning a die, including a melamine-based resin, an inorganic filler that has a maximum particle diameter of from 1 to 70 ?m and has a spherical shape, a curing catalyst selected from myristic acid or stearic acid, and zinc myristate, which is a salt of a saturated fatty acid and a metal.
MYPI2014701951A 2012-01-23 2013-01-21 Resin composition for cleaning die MY170065A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012011544 2012-01-23

Publications (1)

Publication Number Publication Date
MY170065A true MY170065A (en) 2019-07-02

Family

ID=48873429

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014701951A MY170065A (en) 2012-01-23 2013-01-21 Resin composition for cleaning die

Country Status (8)

Country Link
JP (1) JP5991997B2 (en)
KR (1) KR102019456B1 (en)
CN (1) CN104066563B (en)
MY (1) MY170065A (en)
PH (1) PH12014501669B1 (en)
SG (1) SG11201404265PA (en)
TW (1) TWI551417B (en)
WO (1) WO2013111709A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6803165B2 (en) * 2015-08-07 2020-12-23 日本カーバイド工業株式会社 Resin composition for mold cleaning
JP2017177623A (en) * 2016-03-31 2017-10-05 日本カーバイド工業株式会社 Resin composition for cleaning die
JP2020001336A (en) * 2018-06-29 2020-01-09 Ｔｏｙｏ Ｔｉｒｅ株式会社 Vent sleeve for tire vulcanization mold and tire vulcanization mold

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0473574B1 (en) * 1989-05-15 1994-12-28 E.I. Du Pont De Nemours And Company Process for molding target electrode used in the application of electrostatic charge to a fibrous structure
JP3781445B2 (en) * 1994-08-24 2006-05-31 日本カーバイド工業株式会社 Mold cleaning resin composition
KR100545249B1 (en) * 2000-10-11 2006-01-24 닛뽕 카바이도 고교 가부시키가이샤 Resin composition for mold cleaning
TWI223657B (en) * 2000-10-18 2004-11-11 Chang Chun Plastics Co Ltd Amino resin composition for the cleaning of the mold
JP4529280B2 (en) * 2000-11-28 2010-08-25 住友ベークライト株式会社 Mold cleaning material for semiconductor encapsulation
JP3809781B2 (en) 2001-08-28 2006-08-16 松下電工株式会社 Mold cleaning resin composition and transfer press mold cleaning molding material
JP4781908B2 (en) * 2006-05-24 2011-09-28 日本ユニカー株式会社 Resin composition for cleaning plastic molding machines
JP4948541B2 (en) * 2006-10-27 2012-06-06 日本カーバイド工業株式会社 Resin composition for mold cleaning and release recovery, and mold cleaning and mold release recovery method
JP5972266B2 (en) * 2011-07-15 2016-08-17 日本カーバイド工業株式会社 Mold cleaning resin composition

Also Published As

Publication number Publication date
PH12014501669A1 (en) 2014-10-20
KR102019456B1 (en) 2019-09-06
JP5991997B2 (en) 2016-09-14
KR20140117405A (en) 2014-10-07
TW201341146A (en) 2013-10-16
PH12014501669B1 (en) 2014-10-20
JPWO2013111709A1 (en) 2015-05-11
TWI551417B (en) 2016-10-01
WO2013111709A1 (en) 2013-08-01
CN104066563B (en) 2016-12-14
CN104066563A (en) 2014-09-24
SG11201404265PA (en) 2014-10-30

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