TWI551417B - Resin composition for mold cleaning - Google Patents

Description

Resin composition for mold cleaning

The present invention relates to a resin composition for mold cleaning. More specifically, the present invention relates to a resin composition for mold cleaning which is a transfer type for removing dirt from the inner surface of a molding die of a thermosetting resin composition.

In the case of performing sealing molding using a sealing molding material containing a thermosetting resin composition, it is easy to cause dirt from the sealing molding material when the sealing forming operation of the integrated circuit or the LED element or the like is continued for a long period of time. Due to the generation of such dirt, there is a problem that the mold is dirty. When such a stain is placed in a mold, there is a problem that dirt adheres to the surface of the sealed product such as an integrated circuit or an LED element. Therefore, it is required to perform the sealing forming to remove the dirt in the forming mold. Specifically, in the case of performing the sealing molding, it is preferable to form the resin composition for mold cleaning in place of the sealing molding material in a ratio of the number of times of sealing formation for several hundred shots. The dirt on the inner surface of the forming mold can be removed by forming the resin composition for mold cleaning.

Such a resin composition for mold cleaning has been proposed in the past. For example, the resin composition for mold cleaning described in Patent Document 1 contains 10 to 70% by mass of an epoxy-denatured melamine resin based on the total amount of the amine-based resin, which can improve the heat of the molded article obtained by molding the mold. Time toughness and improve the workability of mold cleaning.

In recent years, in order to improve the performance of the equipment to be used, the shape and structure of the seal forming of an integrated circuit or an LED element are diversified and refined. Therefore, the shape and structure of the molding die used for the sealing forming step are gradually diversified and refined. The cleaning of such a forming mold is required to remove dirt including corners which are easily left by dirt and corners of the cavity of the mold.

Patent Document 1 discloses a resin composition for cleaning a mold, wherein the maximum particle diameter is 180 μm or less and the mineral powder having a particle diameter of 100 μm or more is 1% by mass based on the total amount of the mineral powder. By. The resin composition for mold cleaning disclosed in Patent Document 1 discloses that the resin composition for mold cleaning is distributed in various corners of the inside of the gap, and has an effect of improving the cleaning workability obtained by clogging the narrow gate portion. However, the effect is not sufficient and there is room for improvement. Further, the resin composition for mold cleaning described in Patent Document 1 also has room for improvement in the dirt removal performance in the mold.

When the mold is cleaned, if the resin composition for mold cleaning for granulating the filler is used, clogging of the narrow gate portion in the finished mold cavity can be suppressed. However, when the filler is granulated, the physical polishing effect of the filler is lowered, and in particular, the corner dirt removal performance is deteriorated. In addition, when the resin composition for mold cleaning for granulating the filler is cleaned, the flow of the resin composition for mold cleaning becomes excessive. Therefore, the resin composition for mold cleaning does not properly stay in the mold, so that there is a problem that the scale cannot be sufficiently removed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-62835

The present invention has been made in view of the above circumstances. In other words, based on the above-mentioned situation, there is a resin composition for mold cleaning which is capable of obtaining a good cleaning effect such as a corner portion of the mold cavity until the fineness is obtained, and which has improved dirt removal performance.

The resin composition for mold cleaning according to the present invention is a salt containing a melamine resin, an inorganic filler, a curing catalyst, a saturated fatty acid, and a metal, wherein the inorganic filler is spherical, and the inorganic filler has a maximum particle diameter of 1 μm to 70 μm. The hardening catalyst is at least one selected from the group consisting of myristic acid and stearic acid, and the salt of the saturated fatty acid and the metal is zinc myristate.

Further, in the resin composition for cleaning a mold according to the present invention, the inorganic filler has an average particle diameter of 4 μm to 10 μm, a standard deviation of particle diameters of 7 μm or less, and an average aspect ratio of the particle diameter of 1 to 1.2, and a cross direction. It is preferable that the standard deviation of the ratio is 0.3 or less.

Moreover, it is preferable that the resin composition for mold cleaning of the present invention is a resin composition for mold cleaning for a transfer type of a transfer molding machine. That is, the resin composition for mold cleaning of the present invention can be suitably used for transfer molding.

According to the present invention, by specifying the shape of the inorganic filler, the range of the particle diameter, and the use of a specific hardening catalyst and a salt of a specific saturated fatty acid and a metal, it is possible to provide a corner of the mold cavity which can be obtained until the detail is obtained. A resin composition for mold cleaning which has a good cleaning effect and is improved in dirt removal performance.

Hereinafter, an embodiment of the resin composition for mold cleaning of the present invention will be described.

The resin composition for mold cleaning of the present invention is at least a melamine resin, a spherical inorganic filler having a maximum particle diameter of 1 μm to 70 μm, a hardening catalyst selected from myristic acid and stearic acid, and a saturated fatty acid and a metal. The salt of the meat consists of zinc myristic acid. The resin composition for mold cleaning of the present invention may be further composed of other components as needed.

-melamine resin -

The resin composition for mold cleaning of the present invention contains at least one type of melamine-based resin.

The melamine resin is a melamine resin, a melamine-phenol cocondensate, or a melamine-urea cocondensate.

The melamine resin is a condensate of a triazine and an aldehyde. Examples of the triazines include melamine, benzoguanamine, and oxazine. Examples of the aldehydes include formaldehyde, paraformaldehyde, and acetaldehyde.

The melamine-phenol cocondensate is a cocondensate of a triazine, a phenol, and an aldehyde. Examples of the phenols include phenol, cresol, xylenol, ethylphenol, and butylphenol.

The melamine-urea cocondensate is a cocondensate of a triazine, a urea, and an aldehyde.

In addition to the melamine-based resin, the resin composition for mold cleaning of the present invention may contain other resin compositions such as an alkyd resin, a polyester resin, an acrylic resin, an epoxy resin, or the like insofar as the effects of the present invention are not impaired. And rubber.

Since the resin composition for mold cleaning of the present invention contains a melamine-based resin, it exhibits excellent cleaning properties against dirt on the inner surface of the molding die. Although the reason for this is not clearly understood, it is considered that the melamine-based resin has a high polarity of a methylol group, and can be used for sealing the molding material which is generated during molding and adheres to the inner surface of the molding die ( In other words, the resin composition for the mold for cleaning the mold of the present invention acts on the resin composition for cleaning the mold of the present invention. Therefore, the resin composition for mold cleaning containing the melamine resin can exhibit excellent performance. . Further, since the melamine-based resin is generally stable to heat, it is considered to be stable even in the vicinity of 160 to 190 ° C at the time of cleaning the mold, and to exhibit excellent cleanability.

-Inorganic filler -

The resin composition for mold cleaning of the present invention contains at least one spherical inorganic filler having a maximum particle diameter of from 1 μm to 70 μm.

The inorganic filler used in the present invention has a spherical shape. The spherical shape is preferably one in which the average aspect ratio of the inorganic filler to be described later is from 1 to 1.5, and in addition to the complete spherical shape, the cross-sectional ellipse having a different diameter of the cross-section may be included. The shape of the ball is slightly spherical.

The average aspect ratio of the particle diameter of the inorganic filler is preferably from 1 to 1.2. Therefore, the resin composition for mold cleaning of the present invention can maintain the fluidity of the resin composition for mold cleaning during cleaning. Further, the resin composition for mold cleaning of the present invention can be expected to have a good cleaning effect of the corner portion of the mold cavity until the fineness, and further, it is possible to suppress abrasion and scratches on the inner surface of the mold and the gate portion.

When the average aspect ratio of the particle diameter of the inorganic filler of the resin composition for mold cleaning is 1.5 or less, the fluidity of the resin composition for mold cleaning can be favorably maintained during cleaning, and the cavity of the mold can be secured until the mold cavity is refined. Good cleanliness of the corners. Further, it is possible to suppress the occurrence of abrasion and scratches on the inner surface of the molding die and the gate portion.

In the present invention, the aspect ratio of the particle diameter of the inorganic filler is obtained as follows.

In other words, the aspect ratio of the particle diameter of the inorganic filler is obtained by an electron microscope in the same manner as the method of determining the particle diameter described later. In the present specification, the major axis (X) of one inorganic filler and the minor axis (Y) orthogonal to the major axis (X) are measured five times. From the obtained measured values, the aspect ratio of the particle diameter of one inorganic filler was determined by the following formula. However, the long diameter (X) ≧ short diameter (Y).

Aspect ratio of particle size = (average of 5 measurements of X) / (average of 5 measurements of Y)

Further, the above aspect ratio was measured for 150 inorganic fillers, and the average of the obtained measured values was determined as the aspect ratio of the inorganic filler particles.

According to the definition of the present invention, in the case where the major axis (X) and the minor axis (Y) are equal, the aspect ratio of the particle diameter is 1. In the definition of the present invention, the aspect ratio of the particle size does not take a value less than one. The shape of the inorganic filler is spherical, and the closer to the spherical shape, the closer the aspect ratio of the particle diameter is to 1. It is assumed that the inorganic filler has an aspect ratio of the particle diameter when the image of the electron microscope is square, and the shape of the inorganic filler used in the present invention is any spherical shape (including a slightly spherical shape), and the aspect ratio of the particle diameter in the present invention. A ratio closer to 1 indicates a more spherical shape.

In the present invention, the average aspect ratio of the particle diameter of the inorganic filler is an average value of the aspect ratio of the 150 inorganic fillers measured by the above method. Moreover, the standard deviation of the aspect ratio of the inorganic filler mentioned later is the standard deviation of the aspect ratio of the 150 inorganic filler particle diameter measured by the above-mentioned method.

The inorganic filler is, for example, one or more selected from the group consisting of cerium carbide, cerium oxide, titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, and calcium oxide. These inorganic fillers may be used singly or in combination of plural kinds.

The inorganic filler of the present invention is preferably silica or titania, and particularly preferably cerium oxide. Depending on the material and the state of the mold, the inorganic filler used in the present invention is silica or silica from the viewpoint of appropriate hardness and suppression of abrasion and scratches on the inner surface of the mold and the gate portion. Titanium oxide is preferred. The inventors of the present invention believe that the inorganic filler can remove dirt from the surface of the mold by physical grinding when cleaning the refined mold cavity. Further, it is preferable that silica or titanium oxide is thermally stable even in the vicinity of 160 to 190 ° C when the mold is cleaned.

In the resin composition for mold cleaning of the present invention, it is preferable that the standard deviation of the aspect ratio of the inorganic filler is 0.3 or less. When the standard deviation of the aspect ratio of the particle size of the inorganic filler of the resin composition for mold cleaning of the present invention is 0.3 or less, since the fluidity of the resin composition for mold cleaning can be easily maintained during cleaning, it can be easily obtained until the mold The cleaning property of the corner portion of the cavity can suppress the wear and scratches on the inner surface of the forming mold and the gate portion.

Among them, the standard deviation of the aspect ratio of the inorganic filler is preferably 0.15 to 0.3.

The term "refinement of the mold cavity" as used herein refers to the cavity pair by miniaturizing the cavity. The arrangement of the entire surface of the forming mold is optimally arranged in a dense manner. The meticulous mold cavity is made smaller by the miniaturization of the cavity, and the gate portion is also narrower than the past, and the narrowest portion is 100 μm.

The inorganic filler used in the present invention has a maximum particle diameter of from 1 μm to 70 μm. In the resin composition for mold cleaning of the present invention, since the maximum particle diameter of the inorganic filler to be contained is in the range of 1 μm to 70 μm, it is possible to obtain a good cleaning effect of the corner portion of the mold cavity which is refined. In the present specification, the maximum particle diameter of 1 μm or more means that the inorganic filler has a physical effect on the dirt on the surface of the mold. In addition, when the maximum particle diameter exceeds 70 μm, the particles of the inorganic filler are likely to be clogged with each other in the cavity portion, and the fluidity is lowered, and as a result, the cleaning effect is lowered.

Among them, the maximum particle diameter of the inorganic filler is preferably from 10 μm to 50 μm, more preferably from 20 μm to 45 μm, and most preferably 45 μm.

The inorganic filler used in the present invention preferably has an average particle diameter of 4 μm to 10 μm. The inventors of the present invention considered that the inorganic filler having a significantly small average particle diameter has a small mass or surface area, so that it is difficult to exhibit the cleaning performance of the mold cavity. In the resin composition for mold cleaning of the present invention, when the average particle diameter of the inorganic filler is 4 μm or more, the cleanability of the entire mold can be obtained. In addition, when the average particle diameter of the inorganic filler is 10 μm or less, the cleaning property of the corner portion of the mold cavity to be refined can be obtained more. Further, in the present invention, when the average particle diameter of the inorganic filler is 10 μm or less, abrasion and scratches on the inner surface of the molding die and the gate portion can be more suppressed.

Among them, the average particle diameter of the inorganic filler is preferably from 5 μm to 8 μm.

The standard deviation of the particle diameter of the inorganic filler used in the present invention is preferably 7 μm or less. In the resin composition for mold cleaning of the present invention, if the standard deviation of the particle diameter of the inorganic filler is 7 μm or less, since the fluidity of the resin composition for mold cleaning can be maintained during cleaning, it is possible to obtain a cavity up to the mold. The cleanliness of the corners.

Among them, the standard deviation of the particle diameter of the inorganic filler is preferably from 1 μm to 7 μm.

In the present invention, the particle diameter of the inorganic filler is determined as follows.

In other words, an electron microscope (product name; JSM-5510, manufactured by JEOL Ltd.) is used. The inorganic filler was photographed at 1500 times so that approximately 30 inorganic fillers were contained in one field of view, and the particle diameters of the inorganic fillers in each of five different fields of view were measured. The long diameter (X) of the inorganic filler and the short diameter (Y) orthogonal to the long diameter (X) were continuously measured, and the average value of the measured values of each of the five times was obtained. X and Y were measured for a total of 150 inorganic fillers, and the particle diameter of one inorganic filler was determined by the following formula, and the particle diameters (calculated values) of 150 inorganic fillers were averaged. The particle size of the inorganic filler material is obtained.

Particle size = ((the average of 5 measurements of X) + (the average of 5 measurements of Y)) / 2

In the present invention, the average particle diameter is an average value of the particle diameters of 150 inorganic fillers measured by the above method. Further, the standard deviation of the particle diameter is the standard deviation of the particle diameter of 150 inorganic fillers measured by the above method.

The inorganic filler to be used in the present invention is, for example, an amorphous spherical cerium oxide, and specifically, a product manufactured by Nippon Steel & Metal Materials Co., Ltd. MICRON (Nippon Steel Materials Co., Ltd.) Names "S440-4", "HS-202", "HS-204", "UF-320", etc.

- hardening catalyst -

The resin composition for mold cleaning of the present invention contains at least one selected from myristic acid and stearic acid as a curing catalyst.

When the resin composition for mold cleaning is spherical (including a spherical shape) and the inorganic filler having a maximum particle diameter of 1 μm to 70 μm is used for the resin composition for mold cleaning, when the fine mold cavity is cleaned, there will be Since the flow of the resin composition for mold cleaning becomes excessive, the resin composition for mold cleaning does not properly stay in the mold, and the dirt cannot be sufficiently removed. The inventors of the present invention have found that the use of myristic acid and/or stearic acid as a hardening catalyst can prevent the flow of the resin composition for mold cleaning from becoming excessive when the fined mold cavity is cleaned.

Therefore, the resin composition for mold cleaning of the present invention can clean the corner portion of the fined mold cavity by appropriately holding the resin composition for mold cleaning in the mold, and can also improve the dirt removal performance.

The content of myristic acid and stearic acid in the composition of the present invention is preferably 0.1 parts by mass to 3.0 parts by mass, and 0.5 parts by mass to 2.0 parts by mass, based on 100 parts by mass of the melamine-based resin. More preferably, it is preferably 1.0 part by mass to 2.0 parts by mass. When the content of the myristic acid is 0.1 part by mass or more, the resin composition for mold cleaning of the present invention is easily cured at the time of cleaning, and the fineness of the fine mold cavity can be more effectively removed. In addition, when the amount of myristic acid is 3.0 parts by mass or less, the resin composition for mold cleaning of the present invention is more excellent in storage stability.

- salts of saturated fatty acids with metals -

The resin composition for mold cleaning of the present invention contains zinc myristate as a salt of a saturated fatty acid and a metal. The inventors of the present invention believe that the salt of saturated fatty acid and metal acts on the soil during the cleaning of the refined mold cavity, and can be easily peeled off from the surface of the forming mold, for example, by swelling the dirt. That is, the inventors of the present invention have found that by selectively using a salt of a saturated fatty acid and a metal, particularly zinc myristate, it is possible to prevent the resin composition for mold cleaning of the present invention from being cleaned when the mold cavity is cleaned. The flow has become excessive.

The melting point of zinc myristate is 123 ° C ~ 130 ° C. Further, the temperature at which the mold cavity using the seal molding material containing the thermosetting resin composition is cleaned is usually 160 ° C to 190 ° C.

The inventors of the present invention have considered that the zinc crotonate contained in the resin composition for mold cleaning of the present invention exhibits appropriate fluidity in the range of 160 ° C to 190 ° C in the cleaning working environment temperature, so the mold of the present invention The flow of the cleaning resin composition is suitable for cleaning.

Therefore, the resin composition for mold cleaning of the present invention can clean the corner portion of the fined mold cavity by appropriately holding the resin composition for mold cleaning in the mold, and can improve the removal performance of the dirt.

The content of the zinc myristate used as the salt of the saturated fatty acid and the metal is preferably 0.1 parts by mass to 3.0 parts by mass, more preferably 0.5 parts by mass to 2.0 parts by mass, per 100 parts by mass of the melamine-based resin. It is particularly preferably 1.0 part by mass to 2.0 parts by mass. When the content of the zinc myristate is 0.1 parts by mass or more, the resin composition for mold cleaning of the present invention is easily hardened during cleaning, and the fineness of the fine mold cavity can be favorably removed. Moreover, if the content of zinc myristate is 3.0 parts by mass or less, then The flow of the resin composition for mold cleaning of the present invention does not become excessive, which is preferable.

-Other additives -

The resin composition for mold cleaning of the present invention may contain other additives. As another additive, a coloring agent, an antioxidant, a slip agent, etc. are mentioned, for example.

The slip agent may, for example, be a fatty amide-based slip agent, and more specifically, it may be saturated or not like lauric acid, myristylamine, mesamine, ceramide or stearylamine. A saturated monoamine-type slip agent, such as methylenebisstearylamine, ethyl bis-stearylamine, ethyl bis-indoleamine-like saturated or unsaturated biguanide-type slipper, and the like.

The resin composition for mold cleaning of the present invention is suitable for removal from the surface inside the mold: from a thermosetting resin composition typified by an epoxy resin, a polyoxymethylene resin, a phenol resin, and a polyimide resin. Seals the dirt from the forming material.

The resin composition for mold cleaning of the present invention can be prepared by uniformly mixing a melamine resin, an inorganic filler, a curing catalyst, a salt of a saturated fatty acid and a metal, and other additives as needed. As a method for roughly uniformly mixing, for example, a method using a kneader, a ribbon blender, a Henschel mixer, a ball mill, a roll mill, a kneader, and a drum can be mentioned.

The resin composition for mold cleaning of the present invention is suitable for a resin composition for mold cleaning of a transfer type used in a transfer type molding machine.

The resin composition for mold cleaning of the present invention is processed into a general ingot shape and used for cleaning work in a usual molding die. Specifically, after the lead frame is placed on the mold, the ingot-shaped mold cleaning resin composition is inserted into the groove portion, and after being locked, the piston is pushed by the piston. At this time, the resin flows from the groove portion through the flow path portion into the inside of the mold cavity from the gate portion. The cleaning operation is performed after the predetermined molding time has elapsed, the mold is opened, and the molded product including the resin composition for mold cleaning and the dirt integrated with the lead frame is removed.

The resin composition for mold cleaning of the present invention is suitably used for removing dirt in a molding die in a sealing molding operation such as an integrated circuit. The material of the molding die may, for example, be iron or chromium. The forming mold is generally subjected to electroplating treatment. Through the repeated sealing forming operation and the surface cleaning operation inside the forming mold, micron-sized scratches are generated in the forming mold, and the mold is worn. Due to such occurrence of scratches or abrasions, peeling of the plated surface or cracking of the surface state occurs in the molding die. In the molding die, the occurrence of internal flaws and the peeling of the plated surface of the inner surface of the molding die or the cracking of the surface state cause a decrease in moldability and mold release property at the time of the sealing molding operation or a poor surface appearance. Therefore, the problem of the cleaning workability loss in the forming mold is further caused. The resin composition for mold cleaning of the present invention can suppress the flaw in the molding die at the time of cleaning by appropriately selecting the maximum particle diameter of the spherical filler (including a substantially spherical shape).

"Embodiment"

Hereinafter, the present invention will be further described in detail by way of examples and comparative examples. Further, the invention is not limited to the embodiments.

(Example 1)

21.3 parts by mass of a melamine-phenol cocondensate and 50 parts by mass of a melamine resin produced by pulverizing a melamine resin by a well-known method and then pulverized by a vacuum drying, amorphous spherical oxidation as an inorganic filler制品 (product name: S440-4, inorganic filler material manufactured by MICRON Co., Ltd. (Nippon Steel Co., Ltd. MICRON)), 20 parts by mass, 7.8 parts by mass of broadleaf pulp as organic filler 0.5 parts by mass of zinc myristate as a salt of a saturated fatty acid and a metal, and 0.05 parts by mass of myristic acid as a curing catalyst were added to a ball mill and then pulverized. Then, 0.35 parts by mass of stearic acid amine as a slip agent was added to a conical mixer (Nauta Mixer). In this way, a resin composition for mold cleaning is produced.

The inorganic filler was observed under an electron microscope, and the average aspect ratio of the S440-4 particle diameter was 1.16 (spherical). Moreover, the average aspect ratio of the particle diameter of any other inorganic filler used later in the examples is also a spherical shape in the range of 1 to 1.5.

In the following Table 1, the composition and amount (parts by mass) of the resin composition for mold cleaning produced in Example 1, the average particle diameter of the inorganic filler, the maximum particle diameter, and the average aspect ratio are shown.

Further, the standard deviation of the particle diameter of the inorganic filler was 7 μm, and the standard deviation of the aspect ratio of the inorganic filler was 0.23.

Moreover, the cleanability of the resin composition for mold cleaning produced was evaluated by the following test method. Further, the resin composition for mold cleaning produced was of a transfer type.

- Cleanup -

An automatic molding machine using a QFP (Quad Flat Package) mold was used, and EME-G700L (manufactured by Sumitomo Bakelite Co., Ltd.), which is a commercially available epoxy resin molding material, was used to perform 400 shots at a mold temperature of 175 ° C. Forming causes dirt to appear on the surface inside the forming mold. Using the mold, the resin composition for mold cleaning prepared above is repeatedly molded until the dirt on the inner surface thereof can be removed to perform the cleaning operation. The repetitive molding of the resin composition for mold cleaning was carried out at a temperature of 175 ° C which was the same as that at the time of molding the epoxy resin molding material.

Further, the gate portion of the mold cavity used for evaluation was 800 μm in width and 300 μm in height. Further, the gate portion of the mold cavity has a narrowest portion of 100 μm.

The clean evaluation is particularly focused on whether it can be cleaned to the gate portion or the corner portion of the mold cavity, by determining the removal of the dirt at the corner of the mold cavity, and the gate portion and corner of the cavity of the cleaning mold. It is necessary to shoot the number of parts. The smaller the cleaning system, the better the number of shots. Table 1 summarizes the evaluation results of the respective examples and comparative examples.

The removal of the corners of the corners was visually confirmed by the presence or absence of dirt in the corners of the cavity of the mold. In the evaluation, the resin composition for mold cleaning can be satisfactorily passed through the gate portion of the mold cavity, and there is no dirt or dirt, and it is judged as "A". If the dirt remains and the defect occurs during molding, it is judged as "B". "."

In addition, the number of shots required to be cleaned up to the gate portion or the corner portion of the mold cavity is evaluated, and when the number of shots is 10 or less, the number of shots is counted, and if the number of shots is not removed 10 times, the stain is judged as "NG". "."

(Example 2)

A resin composition for mold cleaning was prepared in the same manner as in Example 1 except that the myristic acid used as the curing catalyst in Example 1 was replaced with stearic acid, and the cleanability was evaluated. The evaluation results are shown in Table 1.

(Examples 3 to 5)

A resin composition for mold cleaning was prepared in the same manner as in Example 1 except that the inorganic filler in the first embodiment was changed to the one shown in the following Table 1, and the cleanability was evaluated. The evaluation results are shown in Table 1.

(Comparative Example 1)

A resin composition for mold cleaning was prepared in the same manner as in Example 1 except that benzoic acid was used as the curing catalyst in Example 1, and the cleanability was evaluated. The evaluation results are shown in Table 1.

(Comparative Example 2)

A resin composition for mold cleaning was prepared in the same manner as in Example 1 except that zinc stearate was used as the salt of the saturated fatty acid and the metal in Example 1, and the cleanability was evaluated. The evaluation results are shown in Table 1.

(Comparative Example 3)

A resin composition for mold cleaning was prepared and evaluated in the same manner as in Example 1 except that the crystalline cerium oxide (product name: R-1) manufactured by Yamamoto Engineering Co., Ltd. was used as the inorganic filler in Example 1. Clean up. The evaluation results are shown in Table 1.

Further, the inorganic filler used in Comparative Example 3 had the particle diameter and the aspect ratio shown in Table 1, and the shape of the inorganic filler was confirmed to be amorphous after confirmation using an electron microscope.

(Comparative Example 4)

A resin composition for mold cleaning was prepared and evaluated in the same manner as in Example 1 except that the crystalline cerium oxide (product name: pure vermiculite powder) manufactured by Kawasaki Materials Co., Ltd. was used as the inorganic filler in Example 1. Clean up. The evaluation results are shown in Table 1.

Further, the inorganic filler used in Comparative Example 4 had the particle diameter and the aspect ratio shown in Table 1.

(Comparative Example 5)

A resin composition for mold cleaning was prepared in the same manner as in Example 1 except that the inorganic filler in the first embodiment was changed to the following Table 1, and the cleanability was evaluated. The evaluation results are shown in Table 1.

The details of the inorganic filler in Table 1 are as follows.

. S440-4: Amorphous spherical cerium oxide produced by MICRON Corporation (Nippon Steel Materials Co., Ltd. MICRON) of Nippon Steel & Sumitomo Metal Materials Co., Ltd.

. HS-202: Amorphous spherical cerium oxide produced by MICRON Corporation (Nippon Steel Materials Co., Ltd. MICRON Corporation) of Nippon Steel & Sumitomo Metal Materials Co., Ltd.

. R-1: Crystalline bismuth oxide produced by Shansen Civil Engineering Co., Ltd.

. HS-302: Amorphous spherical cerium oxide produced by MICRON Corporation (Nippon Steel Materials Co., Ltd. MICRON) of Nippon Steel & Sumitomo Metal Materials Co., Ltd.

. UF-320: Amorphous spherical cerium oxide produced by Tokuyama Co., Ltd.

. HS-204: Amorphous spherical cerium oxide manufactured by New Japan Railway Materials Co., Ltd. MICRON (Nippon Steel Materials Co., Ltd. MICRON)

. Pure vermiculite powder: crystalline cerium oxide produced by Hao Kiln Raw Materials Co., Ltd.

As shown in the above Table 1, the resin composition for mold cleaning of the present invention can be cleaned well until the corner portion of the finished mold cavity, and the dirt removal performance can be improved.

In addition, as shown in Table 1, the resin composition for mold cleaning of Examples 1 to 5 each contains a melamine-based resin, an inorganic filler having a spherical shape and a maximum particle diameter of 1 μm to 70 μm, or myristic acid as a hardening catalyst. Stearic acid, and zinc myristic acid, which is a salt of a saturated fatty acid and a metal, can be cleaned up to the corners of the mold at a position where the narrowest part of the gate is 100 μm, and the number of shots is 4 Excellent dirt removal performance that can be completed in a second time. Further, the surface of the mold after cleaning was observed, and the resin composition for mold cleaning of Examples 1 to 5 did not damage the surface of the mold.

On the other hand, since the resin composition for mold cleaning of Comparative Example 1 contains benzoic acid as a curing catalyst, the flow of the resin composition for mold cleaning is excessive, and the number of shots at the end of cleaning is increased. Thus, the dirt removal performance was inferior to that of Example 1.

The resin composition for mold cleaning of Comparative Example 2 contains as a saturated fatty acid and metal The zinc stearate of the salt is excessively flowed by the resin composition for mold cleaning, and the number of shots at the end of the cleaning is increased. Thus, the dirt removal performance was inferior to that of Example 1.

In the resin composition for mold cleaning of Comparative Example 3, since the maximum particle diameter of the inorganic filler was 352 μm and it was amorphous, the corner portion of the mold cavity could not be cleaned, and the mold removal performance of the mold was also inferior.

In the resin composition for mold cleaning of Comparative Example 4, since the maximum particle diameter of the inorganic filler is 100 μm, the flow of the resin composition for mold cleaning is appropriate, but the cleaning of the corner portion of the mold cavity is difficult. Moreover, the dirt removal performance of the mold is also poor.

The resin composition for mold cleaning of Comparative Example 5 was observed from the tendency that the maximum particle diameter of the inorganic filler was 75 μm and the particles were easily clogged with the cavity portion, and good fluidity could not be ensured, and the mold cavity could not be cleaned well. The corner of the horn. Therefore, the dirt removal performance of the mold is also poor.

As shown in the above examples and comparative examples, it has been found that when the maximum particle diameter of the inorganic filler is from 1 μm to 70 μm, it is possible to control the use of the mold cleaning by appropriately selecting the hardening catalyst and the salt of the saturated fatty acid and the metal. The flow of the resin composition at the time of cleaning, and a good cleaning effect of the corner portion of the mold cavity until the fineness is obtained. Further, the resin composition for mold cleaning is appropriately retained in the mold, and the dirt removal performance in the mold can be improved.

"Utilization possibilities in industry"

The resin composition for mold cleaning of the present invention is a resin composition for mold cleaning for removing dirt on the surface of a mold from the thermosetting resin composition, and can be suitably used for transfer molding of a transfer molding machine.

The entire disclosure of Japanese Patent Application No. 2012-011544 is incorporated herein by reference.

All the documents, patent applications, and technical specifications described in the specification are incorporated herein by reference to the same extent as the same as the description of each of the documents, patent applications, and technical specifications. .

Claims (3)

A resin composition for mold cleaning comprising a melamine resin, a spherical inorganic filler having a maximum particle diameter of 1 μm to 70 μm, a hardening catalyst selected from myristic acid and stearic acid, and a salt of a saturated fatty acid and a metal Zinc myristate. The resin composition for mold cleaning according to the first aspect of the invention, wherein the inorganic filler has an average particle diameter of 4 μm to 10 μm, a standard deviation of particle diameters of 7 μm or less, and an average aspect ratio of the particle diameter of 1 to 1.2, and The standard deviation of the aspect ratio is 0.3 or less. The resin composition for mold cleaning according to the first or second aspect of the patent application is used for a transfer molding machine.