KR20090084669A - Resin composition for cleaning molds and recovering the release properties of molds and method for cleaning molds and recovering the release properties of molds - Google Patents

Abstract

A resin composition for cleaning molds and recovering the release properties of molds which can remove not only stains of a cavity, a runner and a gate but also stains of an air vent and a parting area of a mold and can impart release properties to the surface of a mold. The composition comprises a melamine resin, at least one metal soap type mold-releasing agent, and preferably mannitol and/or a mold-releasing agent other than metal soaps. The composition is a compression-type one which has both the ability to clean a mold and the ability to recover the release properties of a mold and thus dispenses with the release properties recovering step which was to be conducted after the completion of the mold cleaning step in the prior art. ® KIPO & WIPO 2009

Description

RESIN COMPOSITION FOR CLEANING MOLDS AND RECOVERING THE RELEASE PROPERTIES OF MOLDS AND METHOD FOR CLEANING MOLDS AND RECOVERING THE RELEASE PROPERTIES OF MOLDS}

The present invention relates to a resin composition for cleaning and releasing a mold of a compression type having both cleanability and releasability, which removes dirt on the surface of the mold and impart releasability to the mold surface during molding of the curable resin molding material. It relates to a mold cleaning and mold release recovery method using a resin composition.

Conventionally, during molding of a sealed molding such as an integrated circuit made of a thermosetting resin such as an epoxy resin, if the molding is continued for a long time, the inner surface of the mold is soiled. If the mold is continued continuously, the surface of the sealing molding is dirty or the sealing molding is formed. There have been many cases in which it is attached to a mold and the molding operation cannot be continued. For this reason, it is necessary to clean the mold regularly, and a method of forming a mold cleaning resin by molding a resin for cleaning the mold at a ratio of several shots every time several hundred shot molding of molding materials has been proposed.

For example, Japanese Patent Application Laid-open No. 52-788 discloses that dirt on the surface of a mold during molding of a curable resin molding material (except an amino resin molding material) is formed of a material mainly composed of an amino resin. By a method of cleaning ”, and a resin composition for metal mold cleaning comprising an amino resin, an organic substrate and / or an inorganic substrate, and a release agent is disclosed.

In recent years, along with high integration, thinning, and surface mount of integrated circuits (abbreviated as IC and LSI), various shapes and structures of molded articles have been diversified, and for this purpose, high flexibility of semiconductor sealing materials has been achieved.

For this reason, in the high fluidization type epoxy sealant, resin clogging is likely to occur in the air vent portion, and when such clogging occurs, air escapes and the resin does not flow. Molding becomes difficult. Therefore, in order to avoid such situations, it is necessary to perform cleaning, but it is difficult to remove the resin blocked in the air vent because the resin does not flow normally with the transfer type cleaning material.

On the other hand, after cleaning using the resin composition for mold cleaning, the surface of the mold is clean, whereas the mold release agent on the surface of the mold is also removed, so that the mold formed immediately after cleaning has an extremely bad mold release property. Therefore, it was necessary to shape | mold the mold release recovery resin composition after using the resin composition for metal mold | die cleaning, and to transfer mold release agent in a mold release recovery resin composition to the mold surface, and to recover mold release property.

This mold release recovery resin composition transfers a mold release agent to the mold surface, and recovers mold release property quickly. Conventionally, as a mold release recovery resin composition, what consists of components, such as an epoxy resin, a phenol resin, a hardening accelerator, carnauba wax, and a silica, is used, for example.

In this mold release recovery resin composition, as described above, it was difficult to recover the release in the air vent part because the resin cannot flow into the entire air vent due to the resin clogging in the air vent part.

Patent Document 1: Japanese Patent Application Publication No. 52-788

As described above, the present invention solves the blockage of the resin in the air vent portion accompanying the high fluidization of the semiconductor sealing material, the difficulty of cleaning by the resin composition for mold cleaning, and the recovery of mold release recovery by the mold release recovery resin composition. I would like to. In addition, the present invention can easily perform cleaning of the air vent portion and recovery of mold release, and furthermore, after cleaning the mold surface dirt, the mold release recovery resin composition is used to supply the mold release component removed together with the dirt. Rather than the conventional method of performing a complicated two-step operation, it provides a resin composition for compression mold cleaning and release recovery that combines cleaning and release recovery, which enables cleaning and release of molds in one step. I would like to.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and when forming a curable resin molding material, it is a resin composition which removes dirt on the surface of the mold and at the same time provides a mold release property. The resin composition for metal mold | die cleaning and metal mold | die release recovery which comprises the system mold release agent is contained.

The resin composition for mold cleaning and mold release recovery of the present invention preferably further contains a release agent other than mannitol or metal soap.

Effect of the Invention

The resin composition for mold cleaning and mold release recovery of the present invention combines both the mold cleaning effect and the mold release recovery effect. The resin composition for mold cleaning and mold release recovery can be used. As a resin composition of the compression type which can remove dirts, and in particular, the air vent part can be easily cleaned and recovery of mold release, mold cleaning operation by a resin composition for cleaning mold and mold release by resin composition for mold release recovery. The mold cleaning and mold release recovery can be performed in one step without having to perform a complicated two-step work of recovery work.

Hereinafter, the resin composition for metal mold | die cleaning and metal mold | die mold release recovery of this invention is demonstrated in detail.

The melamine resin used in this invention can be manufactured by a well-known method.

For example, an initial condensate aqueous solution is prepared by reacting formaldehyde and melamine crystals in an aqueous solution at a molar ratio of 1: 1 to 4: 1, advantageously from 1.5: 1 to 3: 1. Melamine crystal concentration 20 ~ 60%, reaction temperature 70 ~ 100 ℃, can be reacted with weakly alkaline, the reaction is completed in 10 to 100 minutes. Part of the formaldehyde can be replaced by aliphatic aldehydes such as aldehyde components other than paraformaldehyde and formaldehyde, such as acetaldehyde.

The resin composition for mold cleaning and mold release recovery of the present invention contains a metal soap-based mold release agent in addition to the melamine resin.

As an example of a metal soap type mold release agent, calcium stearate, zinc stearate, zinc myristic acid, etc. can be illustrated, for example. As the addition amount, the metal soap-based mold release agent is preferably 0.2 to 1.0 part by weight, more preferably 0.4 to 0.8 part by weight based on 100 parts by weight of the melamine resin. If the amount of the metal soap-based releasing agent is insufficient, the mold release property and the cleaning property are lowered. If the amount is too large, the mold release property is good, but the cleaning property is lowered.

The resin composition for mold cleaning and mold release recovery of the present invention preferably further contains mannitol in addition to the melamine resin and the metal soap-based mold release agent. By containing mannitol, it becomes possible to reduce heat discoloration while maintaining mold release property.

As mannitol, D-mannitol is preferable.

When it contains mannitol, it is preferable to make it contain so that the content ratio of a metal soap type mold release agent and mannitol will be 90: 10-30: 70 by weight ratio, especially 80: 20-40: 60. If the ratio of mannitol is excessive, the cleaning property is deteriorated.

As addition amount of mannitol, it is 0.2-1.0 weight part more preferably with respect to 100 weight part of melamine resin, More preferably, it is 0.3-0.8 weight part. If the addition amount of mannitol is insufficient, there is no addition effect. If too large, the releasability is good, but the cleaning property is lowered.

In addition, the resin composition for mold cleaning and mold release recovery of the present invention may preferably contain a mold release agent other than metal soap in addition to the melamine resin and the metal soap-based mold release agent. By containing mold release agents other than metal soap, mold release property can be exhibited without being influenced by the mold release component in an epoxy sealing material.

Examples of release agents other than metal soaps include ester release agents such as montanic acid partial saponification esters and polymer composite esters, synthetic waxes such as modified hydrocarbon waxes and mineral oil synthetic waxes. Specifically, Licowax OP (Clant Japan Co., Ltd. Montan acid partial saponification ester), Loxyol G78 (Cognis Japan Co., Ltd. polymer composite ester), Ricolub H- Commercially available products such as 4 (modified hydrocarbon produced by Clariant Japan) and Roxyol VPN881 (mineral oil-based synthetic wax manufactured by Cogness Japan) can be preferably used. As a mold release agent other than a metal soap, ester type mold release agent and synthetic wax here are preferable, and when a mold release agent other than this is used, cleaning property may worsen.

When a release agent other than such a metal soap is contained, it is preferable to contain it so that the content ratio of a metal soap type | system | group release agent and a release agent other than a metal soap may be 90: 10-30: 70, especially 80: 20-40: 60 by weight ratio. Do. If the ratio of mold release agents other than metal soap is excessive, cleaning property will worsen.

As addition amount of mold release agents other than a metal soap, Preferably it is 0.02-0.7 weight part with respect to 100 weight part of melamine resin, More preferably, it is 0.1-0.5 weight part. If the addition amount of the release agent other than the metal soap is insufficient, there is no addition effect. If the amount is too large, the release property is good, but the cleaning property is lowered.

It is preferable that the resin composition for mold cleaning and mold release recovery of the present invention contains pulp for improving the cleaning effect. As the pulp, straw pulp, bamboo pulp, wood pulp (softwood pulp, hardwood pulp) and the like may be used, and any of chemical pulp and mechanical pulp may be used.

The pulp is a form (resin-impregnated pulp) in which the melamine resin, which is an essential component of the resin composition for mold cleaning and mold release recovery of the present invention, is impregnated into the pulp, which is contained in the resin composition for mold cleaning and mold release recovery of the present invention. It is preferable. The resin impregnated pulp can be prepared by impregnating and drying the pulp in an aqueous solution of melamine-formaldehyde resin. Moreover, you may replace part or all of the said pulp with powder pulp, and can improve a fluidity further by doing so.

Although the size of the said pulp is not specifically limited, Generally 5-1000 micrometers, Preferably about 10-200 micrometers is good. Moreover, content of the said pulp is 5-70 weight part generally with respect to 100 weight part of melamine resin, Preferably it is 20-60 weight part. If the content of the pulp is less than 5 parts by weight, there is no addition effect, and if the content of the pulp is more than 70 parts by weight, the fluidity is deteriorated, so that no contaminants remain in the mold and no contaminants remain.

Moreover, it is preferable to contain a hardening catalyst in the resin composition for metal mold | die cleaning and mold release recovery of this invention. Examples of the curing catalyst include organic acids such as phthalic anhydride, oxalic acid, sulfamic acid and paratoluenesulfonic acid, inorganic acids such as hydrochloric acid and sulfuric acid, these acids and triethylamine, triethanolamine, β-dimethylaminoethanol and 2-methyl-2-amino-. Salts, such as 1-propanol, are mentioned. As addition amount of a curing catalyst, it is good to set it as 1.5 weight part or less 0.05 weight part or more normally with respect to 100 weight part of melamine resin, Preferably it is set to 1 weight part or less 0.1 weight part or more.

It is preferable that the resin composition for metal mold | die cleaning and metal mold | die release recovery of this invention contains 1 or more types chosen from said pulp and hardening catalyst.

In addition, coloring materials, such as a pigment, fibrous fillers other than pulp, fillers of a low hardness small particle, etc. can be added suitably to the resin composition for metal mold | die cleaning and mold release recovery of this invention.

In preparing the resin composition for mold cleaning and mold release recovery of the present invention, any additive capable of uniformly mixing melamine resin, metal soap-based mold release agent, and other additives such as mannitol, metal soap, and other additives such as pulp. Means can be employed.

For example, a kneader, a ribbon blender, a Henschel mixer, a ball mill, a roll mill, a stone mill, a tumbler, etc. can be illustrated.

Examples of the curable resin molding material capable of cleaning and releasing the mold using the resin composition for mold cleaning and mold release recovery of the present invention include epoxy resin molding materials, phenol resin molding materials, and the like. Preferably it is an epoxy resin molding material, and especially an epoxy resin molding material for semiconductor sealing. The resin composition for mold cleaning and mold release recovery of the present invention can be used for any mold as long as it is a mold used when automatically molding the curable resin molding material, but is generally suitable for a mold made of iron, chromium, or the like. Applicable

By molding the resin composition for mold cleaning and mold release recovery of the present invention into a mold, mold release can be applied to the surface of the mold while removing the dirt on the surface of the mold. The molding conditions of the resin composition for mold cleaning and mold release recovery of the present invention are preferably a mold temperature of 160 to 190 ° C, a molding pressure of 10 to 20 MPa, and a curing time of 2 to 3 minutes.

<Example>

Although an Example etc. are given to the following and this invention is demonstrated in more detail, this invention is not limited at all by these Examples.

 (Manufacture example 1)

480 parts by weight of melamine, 520 parts by weight of formalin (37% aqueous solution) and 350 parts by weight of water were heated to form a melamine-formaldehyde resin by a known method, and 257 parts by weight of pulp was added to the obtained aqueous solution of melamine and kneaded, followed by drying under reduced pressure. A pulp mixed melamine-formaldehyde resin powder (melamine resin impregnated pulp) having a resin content of about 72% was obtained.

(Manufacture example 2)

The melamine resin aqueous solution (solid content of about 60 weight%) obtained by the manufacture example 1 was dried at about 200 degreeC by the spray dryer apparatus, and powdery melamine resin was obtained.

Example 1

The resin composition A for mold cleaning and mold release recovery was prepared by mixing a pulp-blended melamine-formaldehyde resin powder having a resin content of about 72% obtained in Production Example 1, 0.5 parts by weight of phthalic anhydride and 6.0 parts by weight of zinc stearate with a ball mill. Got it. Mold cleaning property and mold release property were evaluated about the obtained resin composition A by the following test method. The results are shown in Table 1. As shown in Table 1, the resin composition A exhibited excellent mold cleaning properties. In addition, when the epoxy sealing material was molded without using the mold release recovery resin composition after the mold cleaning by the resin composition A, the mold release property was inferior to that of the conventional mold release recovery resin composition. .

Example 2

1000 parts by weight of the melamine-formaldehyde resin powder in pulp with a resin content of about 72% obtained in Production Example 1, 30 parts by weight of the powdered melamine resin obtained in Production Example 2, 30 parts by weight of powdered pulp, 0.5 parts by weight of phthalic anhydride, stearic acid 2.5 parts by weight of zinc and 3.5 parts by weight of calcium stearate were mixed with a ball mill to obtain a resin composition B for mold cleaning and mold release recovery. About the obtained resin composition B, the mold cleaning property and mold release property were evaluated like Example 1. The results are shown in Table 1. As shown in Table 1, the resin composition B exhibited excellent mold cleaning properties. In addition, when the epoxy sealing material was molded without using the mold release recovery resin composition after the mold cleaning by the resin composition B, the mold release property was inferior to that of the conventional mold release recovery resin composition. .

[Test Methods]

Cleaning  exam

Using a commercially available biphenyl epoxy resin molding material (EME-7351T manufactured by Sumitomo Bakelite Co., Ltd.), a mold of TQFP was realized by molding 500 shots to realize mold dirt. Using this soiled mold, evaluation was performed by repeatedly molding the resin composition for mold cleaning and mold release recovery until the mold surface was cleanly cleaned.

Release recovery test

After the cleaning test was completed, mold release property was confirmed by a continuous molding test using a commercially available biphenyl epoxy resin molding material (EME-7351T manufactured by Sumitomo Bakelite Co., Ltd.). In addition, the mold release recovery test was not performed about the resin composition for metal mold | die cleaning and metal mold release recovery which mold cleaning property is bad and cleaning is not completed.

Resin composition Mold cleaning Mold release Cleaning finished Short number Upper mold / Lower mold Example 1 A 5 times / 4 times Good Example 2 B 6 times / 4 times Good

Example 3

Mold cleaning and mold by mixing a pulp-blended melamine-formaldehyde resin powder with a resin content of about 72% obtained in Production Example 1, 0.5 parts by weight of phthalic anhydride, 3.0 parts by weight of zinc stearate and 2.0 parts by weight of D-mannitol with a ball mill. Resin composition C for release recovery was obtained. About the obtained resin composition C, the mold cleaning property and mold release property were evaluated like Example 1. The results are shown in Table 2. As shown in Table 2, the resin composition C exhibited excellent mold cleaning properties. In addition, when the epoxy sealing material was molded without using the mold release recovery resin composition after the mold cleaning by the resin composition C, the mold release property was inferior to that of the conventional mold release recovery resin composition. .

Example 4

Mold cleaning and mold by mixing a pulp-blended melamine-formaldehyde resin powder of about 72% of the resin content obtained in Production Example 1, 0.5 parts by weight of phthalic anhydride, 1.5 parts by weight of zinc stearate and 3.0 parts by weight of D-mannitol with a ball mill. Resin composition D for release recovery was obtained. Mold cleaning property and mold release property were evaluated similarly to Example 1 about the obtained resin composition D. FIG. The results are shown in Table 2. As shown in Table 2, the resin composition D exhibited excellent mold cleaning properties. In addition, when the epoxy sealant was molded without using the mold release recovery resin composition after the mold cleaning by the resin composition D, the mold release property was inferior to that of the conventional mold release recovery resin composition. .

Resin composition Mold cleaning Mold release Cleaning finished Short number Upper mold / Lower mold Example 3 C 5 times / 4 times Good Example 4 D 6 times / 4 times Good

Example 5

Pulp-blended melamine-formaldehyde resin powder containing about 72% of the resin content obtained in Production Example 1, 0.5 parts by weight of phthalic anhydride, 2.5 parts by weight of zinc stearate, and lycowax OP (Montanic acid produced by Clariant Japan Co., Ltd.). Ester) The resin composition E for metal mold | die cleaning and mold release recovery was obtained by mixing 3.5 weight part with a ball mill. Mold cleaning property and mold release property were evaluated like Example 1 about obtained resin composition E. FIG. The results are shown in Table 3. Resin composition E showed the outstanding mold cleaning property as shown in Table 3. In addition, when the epoxy sealing material was molded without using the mold release recovery resin composition after the mold cleaning by the resin composition E, the mold release property was inferior to that of the conventional mold release recovery resin composition. .

Example 6

Pulp-incorporated melamine-formaldehyde resin powder with a resin content of about 72% obtained in Production Example 1, 0.5 parts by weight of phthalic anhydride, 2.5 parts by weight of zinc stearate and oxyol G78 (Kognis Japan Co., Ltd. polymer composite ester) ) 1.0 part by weight was mixed in a ball mill to obtain a resin composition F for mold cleaning and mold release recovery. About the obtained resin composition F, the mold cleaning property and mold release property were evaluated like Example 1. The results are shown in Table 3. As shown in Table 3, the resin composition F exhibited excellent mold cleaning property. In addition, when the epoxy sealing material was molded without using the mold release recovery resin composition after the mold cleaning by the resin composition F, the mold release property was inferior to that of the conventional mold release recovery resin composition. .

Example 7

1000 parts by weight of the melamine-formaldehyde resin powder in pulp with a resin content of about 72% obtained in Production Example 1, 30 parts by weight of the powdered melamine resin obtained in Production Example 2, 30 parts by weight of powdered pulp, 0.5 parts by weight of phthalic anhydride, stearic acid A resin composition G for mold cleaning and mold release recovery was obtained by mixing 2.5 parts by weight of zinc and 3.5 parts by weight of Licorub H-4 (modified hydrocarbon produced by Client Japan) with a ball mill. Mold cleaning property and mold release property were evaluated like obtained Example 1 about obtained resin composition G. FIG. The results are shown in Table 3. Resin composition G showed the outstanding metal mold | die cleaning property as shown in Table 3. In addition, when the epoxy sealant was molded without using the mold release recovery resin composition after the mold cleaning by the resin composition G, the mold release property was inferior to that of the conventional mold release recovery resin composition. .

Example 8

1000 parts by weight of the melamine-formaldehyde resin powder in pulp with a resin content of about 72% obtained in Production Example 1, 30 parts by weight of the powdered melamine resin obtained in Production Example 2, 30 parts by weight of powdered pulp, 0.5 parts by weight of phthalic anhydride, stearic acid A resin composition H for mold cleaning and mold release recovery was obtained by mixing 2.5 parts by weight of zinc and 3.0 parts by weight of oxyol VPN881 (mineral oil-based synthetic wax manufactured by Cogness Japan). Mold cleaning property and mold release property were evaluated like Example 1 about obtained resin composition H. FIG. The results are shown in Table 3. Resin composition H showed the outstanding mold cleaning property as shown in Table 3. In addition, when the epoxy sealant was molded without using the mold release recovery resin composition after the mold cleaning by the resin composition H, the mold release property was inferior to that of the conventional mold release recovery resin composition. .

Resin composition Mold cleaning Mold release Cleaning finished Short number Upper mold / Lower mold Example 5 E 5 times / 5 times Good Example 6 F 5 times / 5 times Good Example 7 G 4/4 times Good Example 8 H 6 times / 6 times Good

By using the resin composition for mold cleaning and mold release recovery of the present invention, it is possible to remove remarkable dirts such as cavity parts, air vents, etc., which have caused high functionalization of recent epoxy sealing resins and high functionalization of semiconductor devices. It becomes possible to give mold release property to a metal mold | die without performing the mold release recovery operation | work which was necessary after completion | finish of the conventional mold cleaning operation | work. As a result, a very complicated series of mold cleaning operations and mold release recovery operations can be reduced, thereby reducing the work time. In addition, since a member such as a lead frame, a dummy frame, and the like necessary for transfer molding is no longer needed, it is possible to reduce costs associated with a series of mold cleaning operations and mold release recovery operations.

Claims (13)

As a resin composition which removes dirt on the surface of the mold and imparts releasability to the surface of the mold during molding of the curable resin molding material, A resin composition for mold cleaning and mold release recovery, comprising a melamine resin and at least one metal soap-based mold release agent. The method of claim 1, Resin composition for mold cleaning and mold release recovery, characterized in that the metal soap-based release agent containing 0.2 to 1.0 parts by weight based on 100 parts by weight of melamine resin. The method according to claim 1 or 2, A resin composition for mold cleaning and mold release recovery, further comprising mannitol. The method of claim 3, Resin composition for mold cleaning and mold release recovery, characterized in that the mannitol is D-mannitol. The method according to claim 3 or 4, The resin composition for mold cleaning and mold release recovery, characterized in that the content ratio of the metal soap-based mold release agent and the mannitol is 90:10 to 30:70 by weight ratio. The method according to any one of claims 1 to 5, A resin composition for mold cleaning and mold release recovery, further comprising a mold release agent other than metal soap. The method of claim 6, A mold composition for cleaning the mold and restoring mold release, wherein the mold release agent other than the metal soap is an ester-based mold release agent or a synthetic wax. The method of claim 7, wherein Resin composition for mold cleaning and mold release recovery, characterized in that the ester-based release agent is montan acid partial saponification ester or polymer composite ester. The method of claim 7, wherein Resin composition for mold cleaning and mold release recovery, characterized in that the synthetic wax is a modified hydrocarbon wax or mineral oil-based wax. The method according to any one of claims 6 to 9, The resin composition for mold cleaning and mold release recovery, characterized in that the content ratio of the metal soap-based release agent and the release agent other than the metal soap is 90:10 to 30:70 by weight. The method according to any one of claims 1 to 10, A resin composition for mold cleaning and mold release recovery, further comprising at least one of a pulp and a curing catalyst. The method according to any one of claims 1 to 11, The resin composition for mold cleaning and mold release recovery, characterized in that the resin composition is a compression type (compression type). The metal mold | die cleaning and metal mold release recovery method using the resin composition for metal mold | die cleaning and metal mold release recovery of any one of Claims 1-12.