JP3328424B2 - Mold cleaning resin composition - Google Patents
Mold cleaning resin compositionInfo
- Publication number
- JP3328424B2 JP3328424B2 JP10739194A JP10739194A JP3328424B2 JP 3328424 B2 JP3328424 B2 JP 3328424B2 JP 10739194 A JP10739194 A JP 10739194A JP 10739194 A JP10739194 A JP 10739194A JP 3328424 B2 JP3328424 B2 JP 3328424B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cleaning
- resin
- molding
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は硬化性樹脂成形材料の自
動成形において、自動成形機の金型表面の汚れを清掃す
る金型清掃用樹脂組成物に関し、特に広範囲の成形条件
で良好な金型清掃効果を示す金型清掃用樹脂組成物に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for cleaning a mold surface of an automatic molding machine in the automatic molding of a curable resin molding material. The present invention relates to a resin composition for cleaning a mold that exhibits a mold cleaning effect.
【0002】[0002]
【従来の技術】従来、エポキシ樹脂等の硬化性樹脂によ
る集積回路等の封止成形物(以下IC・LSIと略記す
る)の成形は、一回に数百個の成形品をトランスファー
成形する方法が一般的であり、数百個取りの大きな金型
を使用して、大きなタブレット状成形材料を用い、手動
で成形していた。2. Description of the Related Art Conventionally, molding of an encapsulated molded product such as an integrated circuit (hereinafter abbreviated as IC / LSI) using a curable resin such as an epoxy resin is performed by transfer molding several hundred molded products at a time. In general, a large tablet-shaped molding material was used and manually molded using a large mold of several hundred pieces.
【0003】しかしながら長時間成形を続けると金型内
部表面が汚れ、そのまま連続して成形を続けると、成形
品の表面が汚れたり、成形品が金型に付着して成形作業
が続けられなくなる場合が多々あった。そのため、金型
を定期的に清掃する必要があり、成形材料数百ショット
成形する毎に数ショットの割合で金型清掃用樹脂を成形
して金型清掃を行う方法が提案されている。However, if molding is continued for a long time, the inner surface of the mold becomes dirty. If the molding is continued continuously, the surface of the molded product becomes dirty, or the molded product adheres to the mold and the molding operation cannot be continued. There were many. Therefore, it is necessary to periodically clean the mold, and a method has been proposed in which the mold cleaning resin is molded at a rate of several shots every several hundred shots of the molding material.
【0004】例えば特公昭52-788号公報には「硬化性樹
脂成形材料(但しアミノ系樹脂成形材料を除く)の成形
時における金型表面の汚れをアミノ系樹脂を主体とする
材料で成形することによって、清掃する方法」が提案さ
れ、アミノ系樹脂、有機質基材及び/又は無機質基材、
離型剤からなる金型清掃用樹脂組成物が開示されてい
る。また特公昭64-10162号公報にはアミノ系樹脂とフェ
ノール樹脂の共縮合樹脂と新モース硬度6〜15の鉱物性
粉体を含有してなる金型清掃用樹脂組成物が開示されて
いる。[0004] For example, Japanese Patent Publication No. 52-788 discloses that "stain on a mold surface during molding of a curable resin molding material (excluding an amino resin molding material) is molded with a material mainly composed of an amino resin. By doing so, a "cleaning method" is proposed, amino-based resin, organic substrate and / or inorganic substrate,
A mold cleaning resin composition comprising a release agent is disclosed. JP-B-64-10162 discloses a resin composition for cleaning a mold, comprising a co-condensation resin of an amino resin and a phenol resin and a mineral powder having a new Mohs hardness of 6 to 15.
【0005】これらの金型清掃用樹脂組成物は、成形材
料と同一サイズのタブレット状で用いられることが多
く、タブレットの内温が90℃〜110℃になるように予熱
した後、成形することによって金型全体に充填され、硬
化時に金型表面の汚れを取り込むことにより金型表面を
清掃するのである。[0005] These resin compositions for mold cleaning are often used in the form of tablets having the same size as the molding material, and are pre-heated so that the internal temperature of the tablets is 90 ° C to 110 ° C, and then molded. Thus, the entire surface of the mold is filled, and the surface of the mold is cleaned by taking in stains on the surface of the mold during curing.
【0006】近年、成形の無人化、クリーン化の要請に
より、硬化性樹脂自動成形機が開発され、成形の自動化
が広く行われるようになってきた。この自動成形機は、
IC・LSI等を、数個〜十数個取りの小さな金型で成
形するのであるが、ミニタブレットをポットに供給し、
ポット内において予熱されながら成形が行われ、その後
成形品を自動的に取り出すという一連の工程を自動的に
繰り返す成形方法をとっている。[0006] In recent years, in response to a demand for unmanned and clean molding, an automatic curable resin molding machine has been developed, and automation of molding has been widely performed. This automatic molding machine
ICs and LSIs are molded in small molds that take several to several tens of pieces.
A molding method is employed in which molding is performed while being preheated in a pot, and then a series of steps of automatically removing a molded product are automatically repeated.
【0007】一方IC・LSI等の高集積化、薄型化、
表面実装化に伴い、成形品の形状、構造の多様化が進ん
でおり、多品種の各成形品に最適な成形温度条件、成形
時間の組み合せも多様化している。自動成形機において
は設定した成形条件を無人で繰り返し効率良く成形する
ことが特徴であり、成形の中断、条件変更等は極力避け
なければならない課題であった。On the other hand, high integration and thinning of IC / LSI, etc.
Along with the surface mounting, the shapes and structures of molded products have been diversified, and combinations of molding temperature conditions and molding times optimal for various types of molded products have also been diversified. An automatic molding machine is characterized in that the set molding conditions are repeatedly and efficiently molded by unmanned operation, and interruption of the molding and changing of the conditions are problems that must be avoided as much as possible.
【0008】このような状況下では、金型清掃作業を実
施するために自動成形機を止め、金型清掃用樹脂組成物
の成形条件を再設定して金型清掃作業を行うことは極め
て不合理かつ不経済であり、成形用硬化性樹脂ミニタブ
レットと同一の成形条件で清掃用樹脂ミニタブレットの
成形を行うことにより金型清掃作業を実施する必要がで
てきた。[0008] Under such circumstances, it is extremely difficult to stop the automatic molding machine in order to carry out the mold cleaning operation and reset the molding conditions of the resin composition for mold cleaning to carry out the mold cleaning operation. It is rational and uneconomical, and it has become necessary to carry out a mold cleaning operation by molding the cleaning resin mini-tablet under the same molding conditions as the molding curable resin mini-tablet.
【0009】そこで、特公昭52-788号公報等に記載され
ているような、従来知られている金型清掃用樹脂組成物
をミニタブレット化し、自動成形機の金型清掃用に用い
ることが一般に行われている。しかしながらこれらの金
型清掃用樹脂組成物では、一般に大きなタブレットを予
熱成形した場合の成形性向上や清掃作業時間の短縮を目
的として組成が決定されているため、ミニタブレット無
予熱成形という自動成形機特有の条件下で、良好にな金
型清掃効果を示す成形範囲が限られ、清掃効果が不十分
である成形条件で清掃作業を実施する場合には、清掃シ
ョット数を増やすことによって対応せざるを得なかっ
た。Therefore, it is possible to convert a conventionally known resin composition for cleaning a mold into a mini-tablet as described in Japanese Patent Publication No. 52-788 and use it for cleaning a mold in an automatic molding machine. Generally done. However, in these resin compositions for mold cleaning, since the composition is generally determined for the purpose of improving the moldability and shortening the cleaning work time when preheating a large tablet, an automatic molding machine called mini tablet no preheating molding is used. Under specific conditions, the molding range that shows good mold cleaning effect is limited, and when performing cleaning work under molding conditions where cleaning effect is insufficient, it is necessary to increase the number of cleaning shots to respond Did not get.
【0010】例えば特公昭52-788号公報で例示されてい
るような金型清掃用樹脂組成物をミニタブレット化し金
型清掃に使用した場合には、硬化が遅すぎて、低温の成
形条件下で清掃用樹脂のふくれが発生し、低温自動成形
時の金型清掃には使用できなかった。For example, when a resin composition for mold cleaning as exemplified in Japanese Patent Publication No. 52-788 is mini-tablet and used for mold cleaning, curing is too slow and molding conditions at low temperature are required. As a result, swelling of the cleaning resin occurred, and the resin could not be used for cleaning the mold during low-temperature automatic molding.
【0011】また特公昭64-10162等に例示されている金
型清掃用樹脂組成物をミニタブレット化して使用した場
合には、硬化が速すぎ、硬化性樹脂成形条件が比較的低
温の条件では清掃効果があるものの、高温自動成形の条
件下では通常の2倍のショット数清掃しても自動成形機
金型を好適に清掃することはできなかった。When a resin composition for mold cleaning exemplified in JP-B-64-10162 is used in the form of mini-tablets, the curing is too fast and the molding conditions of the curable resin are relatively low. Although it has a cleaning effect, under the conditions of high-temperature automatic molding, even if the number of shots is twice as large as that of a normal case, the mold of the automatic molding machine cannot be suitably cleaned.
【0012】多種多様の成形品に対応する多種多様な成
形条件毎に、それぞれ好適な清掃効果を示す金型清掃用
樹脂組成物を使い分けることなど、作業性、経済性の面
から不可能であり、自動成形機金型の清掃作業において
広範囲の成形条件で好適な金型清掃効果を示す金型清掃
用樹脂組成物が要求されていたのである。In terms of workability and economy, it is not possible to use a resin composition for cleaning a mold which shows a suitable cleaning effect for each of a variety of molding conditions corresponding to a variety of molded articles. In addition, there has been a demand for a resin composition for mold cleaning that exhibits a suitable mold cleaning effect under a wide range of molding conditions in a cleaning operation of a mold of an automatic molding machine.
【0013】本発明者らは、前記課題を解決すべく研究
を進めた結果、キュラストメータにおける硬化挙動が清
掃用樹脂組成物の好適清掃範囲に密接な関係があるこ
と、特定範囲の硬化速度の清掃用樹脂組成物が広範囲の
成形条件で好適な金型清掃効果を示すことを見い出し、
本発明を完成した。The inventors of the present invention have conducted research to solve the above-mentioned problems. As a result, it was found that the curing behavior in a curast meter is closely related to a preferable cleaning range of the cleaning resin composition, and that the curing speed in a specific range is determined. It has been found that the cleaning resin composition exhibits a suitable mold cleaning effect over a wide range of molding conditions,
The present invention has been completed.
【0014】[0014]
【課題を解決するための手段】本発明は、前記課題を解
決すべくなされたものであり、硬化性樹脂成形材料の自
動成形時、金型表面の汚れを取り除くことを特徴とする
メラミン系樹脂組成物において、キュラストメーターに
おける硬化速度が金型表面温度145℃でのT90値が2
80秒〜420秒であることを特徴とする金型清掃用樹
脂組成物に関するものである。DISCLOSURE OF THE INVENTION The present invention has been made to solve the above problems, and is characterized in that a dirt on a mold surface is removed during automatic molding of a curable resin molding material. In the composition, the curing rate in the curast meter was 2 at the T90 value at the mold surface temperature of 145 ° C.
The present invention relates to a resin composition for cleaning a mold, which is 80 seconds to 420 seconds.
【0015】以下本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【0016】本発明における樹脂組成物とはメラミン樹
脂、メラミン−フェノール共縮合物またはメラミン−ユ
リア共縮合物等を示すものであって、メラミン−フェノ
ール共縮合物は、メラミン等のトリアジン類、フェノー
ル類、ホルムアルデヒド等のアルデヒド類等から共縮合
されてなるものであり、メラミン−ユリア共縮合樹脂
は、メラミン等のトリアジン類、ユリア類、アルデヒド
類から共縮合されてなるものである。In the present invention, the resin composition refers to a melamine resin, a melamine-phenol co-condensate or a melamine-urea co-condensate, and the melamine-phenol co-condensate includes triazines such as melamine, phenol, and the like. Melamine-urea co-condensation resin is obtained by co-condensation of triazines such as melamine, ureas, and aldehydes.
【0017】また上記メラミン樹脂は、メラミン等のト
リアジン類とアルデヒド類とを縮合して得られるもので
あり、ユリア樹脂はユリア類とアルデヒド類とを縮合し
て得られるものである。上記トリアジン類としては、メ
ラミンの他に、該トリアジン類100重量%に対して、
例えば、ベンゾグアニジン、アセトグアナミン等のメラ
ミン以外のトリアジン類を30重量%以下含有していて
もよい。The melamine resin is obtained by condensing a triazine such as melamine and an aldehyde, and the urea resin is obtained by condensing a urea with an aldehyde. As the above triazines, besides melamine, based on 100% by weight of the triazines,
For example, triazines other than melamine such as benzoguanidine and acetoguanamine may be contained in an amount of 30% by weight or less.
【0018】また上記もフェノール類としては、フェノ
ールのほかに、該フェノール類100重量%に対して、
例えば、クレゾール、キシレノール、エチルフェノー
ル、ブチルフェノール等のフェノール以外のフェノール
類を30重量%以下含有していてもよい。さらに上記の
アルデヒド類としては、ホルムアルデヒドのほかに、例
えば、パラホルム、アセトアルデヒドなどのホルムアル
デヒド類を含有していてもよい。The above-mentioned phenols also include, in addition to phenol, 100% by weight of the phenol.
For example, phenols other than phenols such as cresol, xylenol, ethylphenol and butylphenol may be contained in an amount of 30% by weight or less. Further, the above-mentioned aldehydes may contain, in addition to formaldehyde, for example, formaldehydes such as paraform and acetaldehyde.
【0019】更に又、本発明で用いる樹脂組成物は、こ
れとブレンド可能な副次量の他の樹脂類を、本発明組成
物の前記改善性質に悪影響を与えない量で配合すること
ができる。このような樹脂の例としては、アルキッド樹
脂、ポリエステル樹脂、アクリル系樹脂、エポキシ樹
脂、ゴム類などを例示できる。Further, the resin composition used in the present invention can be blended with other resins which can be blended therewith in an amount which does not adversely affect the above-mentioned improved properties of the composition of the present invention. . Examples of such a resin include an alkyd resin, a polyester resin, an acrylic resin, an epoxy resin, and rubbers.
【0020】本発明の金型清掃用樹脂組成物は、既述の
樹脂の他に鉱物性粉体を含有してなる。例えばコランダ
ム、エメリー、ざくろ石、ケイ石等の天然材及びケイ
素、鉄、チタン、ナトリウム、カルシウム、マグネシウ
ム、アルミニウム、クロム、ホウ素等の酸化物もしくは
炭化物が好ましく、これらの化合物としては、酸化ケイ
素、酸化マグネシウム、酸化アルミニウム、炭化ケイ
素、炭化ホウ素等を挙げることができる。The resin composition for cleaning a mold of the present invention contains a mineral powder in addition to the resin described above. For example, natural materials such as corundum, emery, garnet, and silica and silicon, iron, titanium, sodium, calcium, magnesium, aluminum, chromium, oxides or carbides such as boron are preferable, and as these compounds, silicon oxide, Examples thereof include magnesium oxide, aluminum oxide, silicon carbide, and boron carbide.
【0021】上記鉱物質粉体の粒度は特に限定されるわ
けではないが一般に#10〜#8000、好ましくは#
50〜4000、更に好ましくは#100〜#2000
であるのがよい。#8000より粒度が小さくなると清
掃効果が悪くなり、取扱い時粉塵が発生し作業環境が悪
化する等の欠点が生じやすく、#10より粒度が大きく
なると金型の損傷、清掃の不均一等の欠点が生じ易い。The particle size of the mineral powder is not particularly limited, but is generally from # 10 to # 8000, preferably from # 10 to # 8000.
50 to 4000, more preferably # 100 to # 2000
It is good. If the particle size is smaller than # 8000, the cleaning effect is deteriorated, dusts are generated during handling, and the working environment is likely to be deteriorated. If the particle size is larger than # 10, defects such as damage to the mold and uneven cleaning are caused. Tends to occur.
【0022】また、前記鉱物質粉体の使用量は特に限定
されるわけではないが本発明の金型清掃用樹脂組成物1
00重量部に対して10重量部〜90重量部、好ましく
は10重量部〜30重量部、更に好ましくは17重量部
〜29重量部である。The amount of the mineral powder used is not particularly limited, but the resin composition 1 for cleaning a mold according to the present invention.
The amount is 10 parts by weight to 90 parts by weight, preferably 10 parts by weight to 30 parts by weight, more preferably 17 parts by weight to 29 parts by weight with respect to 00 parts by weight.
【0023】本発明組成物は、既述の鉱物質粉体の他
に、他の無機もしくは有機充填剤、着色剤、硬化触媒、
滑剤、抗酸化剤などの他の添加物を含有していてよい。
そのような添加剤の例としては、例えば、パルプ、木
粉、ビニロン繊維、ガラス粉、ガラス繊維、無処理炭酸
カルシウム、タルク、水酸化アルミニウム、硫酸バリウ
ム、硫化亜鉛の如き他の無機もしくは有機充填剤;例え
ば、酸化チタン、カーボンブラック、亜鉛華、カドミウ
ムイエロー、ベンガラ等の無機顔料、フタロシアニン
系、アゾ系、ジアゾ系等の有機顔料、ベンゾオキサゾー
ル系、ナフトトリアゾール系、コーマリン系等の蛍光顔
料、アンスラキノン系、インジコ系、アゾ系等の染料の
如き着色剤;例えば、無水フタル酸、蓚酸、スルファミ
ン酸、パラトルエンスルホン酸等の有機酸、塩酸、硫酸
等の無機酸、これら酸類とトリエチルアミン、トリエタ
ノールアミン、β−ジメチルアミノエタノール、2−メ
チル−2−アミノ−1−プロパノール等との塩類の如き
硬化触媒;例えばステアリン酸カルシウム、ステアリン
酸亜鉛、ステアロアミド、メチロールステアロアミド、
メチレンビスステアロアミド、パラトルエンスルホン酸
アミド、セチルアルコール、パラフィン、シリコンオイ
ルの如き滑剤;例えばナフチルアミン系抗酸化剤、p−
フェニレンジアミン系抗酸化剤、チオビスフェノール系
抗酸化剤の如き抗酸化剤などをあげることができる。The composition of the present invention contains, in addition to the above-mentioned mineral powder, other inorganic or organic fillers, coloring agents, curing catalysts,
Other additives such as lubricants, antioxidants and the like may be included.
Examples of such additives include, for example, pulp, wood flour, vinylon fiber, glass powder, glass fiber, untreated calcium carbonate, talc, aluminum hydroxide, barium sulfate, other inorganic or organic fillers such as zinc sulfide. Agents; for example, inorganic pigments such as titanium oxide, carbon black, zinc white, cadmium yellow, and red iron; organic pigments such as phthalocyanine, azo, and diazo; Coloring agents such as anthraquinone-based, indico-based, and azo-based dyes; for example, organic acids such as phthalic anhydride, oxalic acid, sulfamic acid, and paratoluenesulfonic acid; inorganic acids such as hydrochloric acid and sulfuric acid; these acids and triethylamine; Triethanolamine, β-dimethylaminoethanol, 2-methyl-2-amino-1 Such curing catalyst salts with propanol and the like; for example calcium stearate, zinc stearate, stearamide, methylol stearamide,
Lubricants such as methylenebisstearamide, paratoluenesulfonic acid amide, cetyl alcohol, paraffin, silicone oil; for example, naphthylamine antioxidants, p-
Examples include antioxidants such as phenylenediamine antioxidants and thiobisphenol antioxidants.
【0024】また前記パルプとしては藁パルプ、竹パル
プ、木材パルプ(針葉樹パルプ、広葉樹パルプ)等が使
用され、また化学パルプ、機械パルプのいずれを使用し
てもよい。また前記パルプ、木粉等のセルロース充填材
のサイズは特に限定されないが、一般には5μ〜100
0μ、好ましくは10μ〜200μ程度がよい。またセ
ルロースの量は、前記のアミノ系樹脂100重量部に対
して、15重量部〜70重量部、好ましくは20重量部
〜60重量部が一般に使用される。As the pulp, straw pulp, bamboo pulp, wood pulp (conifer pulp, hardwood pulp) and the like may be used, and any of chemical pulp and mechanical pulp may be used. The size of the cellulose filler such as pulp and wood flour is not particularly limited, but is generally 5 μm to 100 μm.
0μ, preferably about 10μ to 200μ. The amount of cellulose is generally 15 to 70 parts by weight, preferably 20 to 60 parts by weight, based on 100 parts by weight of the amino resin.
【0025】本発明組成物の調整に際してはアミノ系樹
脂、鉱物質類粉体、所望により他の副次量の樹脂、添加
剤類を均一に混合し得る任意の手段が採用できる。例え
ばニーダー、リボンブレンダー、ヘンシェルミキサー、
ボールミル、ロール練り、らいかい機、タンブラー等を
例示できる。In preparing the composition of the present invention, any means capable of uniformly mixing the amino resin, mineral powder, and, if desired, other secondary amounts of resin and additives can be employed. For example, kneaders, ribbon blenders, Henschel mixers,
Examples thereof include a ball mill, roll kneading, a grinder, a tumbler and the like.
【0026】前記の原料物質を配合し、前記の方法で製
造することにより、キュラストメーターによるT90値が
金型表面温度145℃で280秒〜420秒好ましくは
300秒〜400秒であるような金型清掃用樹脂組成
物を製造する。T90値が大き過ぎる組成物では、自動成
形が低温で実施されると、成形時間によっては、成形時
にふくれが発生し、清掃材料自身が金型に残存して清掃
効果が悪くなる。一方T90値が小さ過ぎる材料では自動
成形が高温条件で実施されると清掃効果が低下するた
め、好適に清掃するためにショット数を増やさなければ
ならない。By blending the above-mentioned raw materials and producing by the above-mentioned method, the T90 value by a curast meter is 280 to 420 seconds at a mold surface temperature of 145 ° C., preferably 300 to 400 seconds. A resin composition for cleaning a mold is produced. In a composition having a T90 value that is too large, if automatic molding is performed at a low temperature, blisters will occur during molding, depending on the molding time, and the cleaning material itself will remain in the mold, resulting in a poor cleaning effect. On the other hand, for a material having a T90 value that is too small, the cleaning effect is reduced when automatic molding is performed under high temperature conditions. Therefore, the number of shots must be increased in order to properly clean the material.
【0027】本発明の組成物を用いて金型を清掃できる
硬化性樹脂成形材料としては、例えば、エポキシ樹脂成
形材料、フェノール樹脂成形材料等、好ましくは、エポ
キシ樹脂成形材料であり、特に半導体封止用エポキシ樹
脂成形材料である。また、本発明の金型清掃用樹脂組成
物が適用される金型としては、該硬化樹脂成形材料を自
動成形する際に使用する金型ならいかなる金型にも使用
できるが、一般には鉄、クロム等よりなる金型が適用で
きる。The curable resin molding material which can clean the mold using the composition of the present invention is, for example, an epoxy resin molding material, a phenol resin molding material or the like, preferably an epoxy resin molding material, and especially a semiconductor sealing material. It is an epoxy resin molding material for stopping. Further, as the mold to which the resin composition for mold cleaning of the present invention is applied, any mold can be used as long as it is a mold used for automatically molding the cured resin molding material. A mold made of chrome or the like can be applied.
【0028】本発明の組成を有する金型清掃用樹脂組成
物は、これを硬化性樹脂成形材料の自動成形金型の清掃
に使用すると、従来の清掃用材料と比較して、広範囲の
温度条件、硬化時間範囲で良好な清掃効果を示す。When the resin composition for cleaning a mold having the composition of the present invention is used for cleaning an automatic molding die for a curable resin molding material, it can be used in a wide range of temperature conditions as compared with a conventional cleaning material. And shows a good cleaning effect in the curing time range.
【0029】[0029]
【実施例】以下に本発明を実施例により具体的に説明す
る。なお、硬化速度の測定は以下の方法によって実施し
た。The present invention will be specifically described below with reference to examples. The measurement of the curing speed was performed by the following method.
【0030】(1)キュラストメーターによる硬化速度
(T90値)の測定 市販のJSR型キュラストメーターにて、金型表面温度
145℃とし、一定振幅の振動変形を与え、硬化時間に
対する金型清掃用樹脂組成物の発生応力変化を検出す
る。応力変化がほぼ一定となった最高値を100%と
し、硬化開始から応力最高値の90%にあたる発生応力
になるまでの時間をT90値(秒)とする。(1) Measurement of curing speed (T90 value) using a curast meter A commercially available JSR type curast meter is used to set the mold surface temperature to 145 ° C, apply vibration deformation with a constant amplitude, and clean the mold with respect to the curing time. The change in stress generated in the resin composition for use is detected. The maximum value at which the stress change becomes substantially constant is defined as 100%, and the time from the start of hardening to the generated stress corresponding to 90% of the maximum stress is defined as T90 value (second).
【0031】実施例1 メラミン346重量部とフェノール131重量部とホル
マリン(37%水溶液)522重量部、水酸化カリウム
4重量部を攪拌機付きの反応槽中で加熱反応し、公知の
方法でメラミンーフェノール共縮合樹脂液を作る。この
樹脂液を減圧乾燥し、粉末化したもの70重量部、粒度
#200の硅石粉20重量部、更に粉末パルプ9.5重
量部に、安息香酸を0.05重量部、ステアリン酸亜鉛
を0.5重量部加え、ボールミルにて粉砕して金型清掃
用樹脂組成物Aを得た。得られた金型清掃用樹脂組成物
のT90値は、金型表面温度145℃で355秒であっ
た。清掃効果の試験結果を表−1、に記す。試験結果か
ら判るように、広範囲の清掃成形条件で良好な清掃効果
が得られた。Example 1 346 parts by weight of melamine, 131 parts by weight of phenol, 522 parts by weight of formalin (37% aqueous solution), and 4 parts by weight of potassium hydroxide were heated and reacted in a reaction vessel equipped with a stirrer, and melamine was produced by a known method. Make a phenol co-condensation resin solution. The resin solution was dried under reduced pressure to obtain 70 parts by weight of a powder, 20 parts by weight of silica powder having a particle size of # 200, 9.5 parts by weight of pulp, 0.05 parts by weight of benzoic acid and 0 parts by weight of zinc stearate. The mixture was pulverized with a ball mill to obtain a resin composition A for cleaning a mold. The T90 value of the obtained resin composition for cleaning a mold was 355 seconds at a mold surface temperature of 145 ° C. Table 1 shows the test results of the cleaning effect. As can be seen from the test results, a good cleaning effect was obtained under a wide range of cleaning molding conditions.
【0032】実施例2 実施例1と同様な方法でホルマリンの添加量を730重
量部として樹脂粉末を製造し、粉末化したもの70重量
部、粒度#200の硅石粉20重量部、更に粉末パルプ
9.5重量部、ステアリン酸亜鉛を0.5重量部加え、ボ
ールミルにて粉砕して金型清掃用樹脂組成物Bを得た。
得られた金型清掃用樹脂組成物のT90値は、金型表面温
度145℃で362秒であった。清掃効果の試験結果を
表−1に記す。試験結果から判るように、広範囲の清掃
成形条件で良好な清掃効果が得られた。Example 2 A resin powder was produced in the same manner as in Example 1 except that formalin was added in an amount of 730 parts by weight, and 70 parts by weight of the resin powder, 20 parts by weight of silica powder having a particle size of # 200, and further powder pulp 9.5 parts by weight and 0.5 part by weight of zinc stearate were added, and the mixture was pulverized by a ball mill to obtain a resin composition B for mold cleaning.
The T90 value of the obtained resin composition for cleaning a mold was 362 seconds at a mold surface temperature of 145 ° C. Table 1 shows the cleaning effect test results. As can be seen from the test results, a good cleaning effect was obtained under a wide range of cleaning molding conditions.
【0033】実施例3 メラミン360重量部とユリア90重量部とホルマリン
(37%水溶液)550重量部を用いて、公知の方法に
てメラミン−ユリア共縮合樹脂液を作り、減圧乾燥させ
粉末としたもの60重量部、粒度#1000の石英粉2
0重量部、更に粉末パルプ20重量部に無水フタル酸
0.04重量部、ステアリン酸亜鉛0.5重量部を加え、
ボールミルで粉砕して金型清掃用樹脂組成物Cを得た。
得られた金型清掃用樹脂組成物のT90値は、金型表面温
度145℃で318秒であった。清掃効果の試験結果を
表1に記す。試験結果から判るように、広範囲の清掃成
形条件で良好な清掃効果が得られた。Example 3 A melamine-urea cocondensation resin solution was prepared by a known method using 360 parts by weight of melamine, 90 parts by weight of urea, and 550 parts by weight of formalin (37% aqueous solution), and dried under reduced pressure to obtain a powder. 60 parts by weight, quartz powder 2 of particle size # 1000
0 parts by weight, further 20 parts by weight of powdered pulp, 0.04 parts by weight of phthalic anhydride and 0.5 parts by weight of zinc stearate,
The mixture was pulverized with a ball mill to obtain a resin composition C for cleaning a mold.
The T90 value of the obtained resin composition for cleaning a mold was 318 seconds at a mold surface temperature of 145 ° C. Table 1 shows the test results of the cleaning effect. As can be seen from the test results, a good cleaning effect was obtained under a wide range of cleaning molding conditions.
【0034】実施例4 実施例1と同様な方法で、メラミンフェノール共縮合樹
脂粉末を製造し、粉末70重量部、粒度#600の硅石
粉20部に安息香酸を0.015重量部、更に木粉12
重量部、ステアリン酸亜鉛を0.5重量部加え、ボール
ミルにて粉砕して金型清掃用樹脂組成物Dを得た。得ら
れた金型清掃用樹脂組成物のT90値は、金型表面温度1
45℃で402秒であった。清掃効果の試験結果を表−
1に記す。試験結果から判るように、広範囲の清掃成形
条件で良好な清掃効果が得られた。Example 4 A melamine phenol co-condensation resin powder was prepared in the same manner as in Example 1, and 70 parts by weight of the powder, 20 parts of silica powder having a particle size of # 600, 0.015 parts by weight of benzoic acid, and wood Powder 12
By weight, 0.5 part by weight of zinc stearate was added, and the mixture was pulverized with a ball mill to obtain a resin composition D for cleaning a mold. The T90 value of the obtained resin composition for cleaning a mold is a mold surface temperature of 1
It was 402 seconds at 45 ° C. Table-Test result of cleaning effect
Write it in 1. As can be seen from the test results, a good cleaning effect was obtained under a wide range of cleaning molding conditions.
【0035】比較例1 実施例1と同様な方法で、安息香酸の添加量を0.15
重量部とし、金型表面温度145℃でのT90値が210
秒である金型清掃用樹脂組成物Eを製造した。Comparative Example 1 In the same manner as in Example 1, the amount of benzoic acid added was 0.15.
Parts by weight and a T90 value of 210 at a mold surface temperature of 145 ° C.
A second mold cleaning resin composition E was prepared.
【0036】比較例2 実施例1と同様な方法で、安息香酸の添加量を0とし、
金型表面温度145℃でのT90値が460秒である金型
清掃用樹脂組成物Fを製造した。Comparative Example 2 In the same manner as in Example 1, the amount of benzoic acid was
A mold cleaning resin composition F having a T90 value of 460 seconds at a mold surface temperature of 145 ° C. was produced.
【0037】A〜Fの金型清掃用樹脂組成物を用いて下
記の試験方法により金型清掃試験を実施した結果を表−
1に示す。The results of a mold cleaning test performed using the mold cleaning resin compositions A to F according to the following test methods are shown in the following Table.
It is shown in FIG.
【0038】試験方法 市販のエポキシ樹脂成形材料(日東電工(株)社製ニト
ロンMP)ミニタブレットを用い、自動成形機用の金型
で封止成形品を400ショットトランスファー成形し、
金型を汚染させた。次に金型を試験温度とし、硬化時間
を変えて、金型清掃用樹脂組成物を用いて5ショット成
形を行った後、金型表面を観察し、清掃効果を下記のよ
うに評価した。 5:くもり等全くなし 4:くもり等ほぼなし 3:ややくもりあり 2:くもりあり 1:汚れ多いTest Method Using a commercially available epoxy resin molding material (Nitron MP manufactured by Nitto Denko Corporation) mini-tablet, a sealed molded product was subjected to 400 shot transfer molding with a mold for an automatic molding machine.
The mold was contaminated. Next, the mold was used as a test temperature, the curing time was changed, and after performing five-shot molding using the mold cleaning resin composition, the mold surface was observed and the cleaning effect was evaluated as follows. 5: There is no fogging etc. 4: There is almost no fogging 3: There is some fogging 2: There is fogging 1: There is much dirt
【0039】[0039]
【表1】 [Table 1]
【0040】[0040]
【発明の効果】上記のように硬化性樹脂成形材料の自動
成形時、金型表面の汚れを取り除く金型清掃用樹脂組成
物のキュラストメーターにおける硬化速度を、金型表面
温度145℃でのT90値を280秒〜420秒とするこ
とにより、様々なエポキシ樹脂成形品の自動成形条件に
おいて、広範囲で好適な清掃効果を示すことができる。As described above, during the automatic molding of the curable resin molding material, the curing speed of the resin composition for cleaning the mold to remove stains on the surface of the mold with a curast meter at a mold surface temperature of 145 ° C. By setting the T90 value to 280 seconds to 420 seconds, a wide range of suitable cleaning effects can be exhibited under various automatic molding conditions for epoxy resin molded products.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平2−175210(JP,A) 特開 平3−140214(JP,A) (58)調査した分野(Int.Cl.7,DB名) B29C 33/72 C08L 1/00 - 101/16 C08K 3/00 - 13/08 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-175210 (JP, A) JP-A-3-140214 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B29C 33/72 C08L 1/00-101/16 C08K 3/00-13/08
Claims (1)
表面の汚れを取り除く金型清掃用樹脂組成物において、
該金型清掃用樹脂組成物がメラミン系樹脂、鉱物質粉
体、セルロース充填材、硬化触媒及び滑剤を含有し、キ
ュラストメーターにおける硬化速度が、金型表面温度1
45℃でのT90値が280秒〜420秒であることを特
徴とする金型清掃用樹脂組成物。1. A resin composition for cleaning a mold, which removes stains on the surface of the mold during automatic molding of the curable resin molding material.
The resin composition for cleaning a mold is a melamine resin or a mineral powder.
Body, a cellulose filler, a curing catalyst, and a lubricant.
A resin composition for cleaning a mold, wherein the T90 value at 45 ° C. is 280 to 420 seconds.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10739194A JP3328424B2 (en) | 1994-04-25 | 1994-04-25 | Mold cleaning resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10739194A JP3328424B2 (en) | 1994-04-25 | 1994-04-25 | Mold cleaning resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07292262A JPH07292262A (en) | 1995-11-07 |
JP3328424B2 true JP3328424B2 (en) | 2002-09-24 |
Family
ID=14457950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10739194A Expired - Lifetime JP3328424B2 (en) | 1994-04-25 | 1994-04-25 | Mold cleaning resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3328424B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100545249B1 (en) * | 2000-10-11 | 2006-01-24 | 닛뽕 카바이도 고교 가부시키가이샤 | Resin composition for mold cleaning |
WO2002090077A1 (en) * | 2001-04-25 | 2002-11-14 | Nippon Carbide Kogyo Kabushiki Kaisha | Resin composition for cleaning mold |
JP2010208131A (en) * | 2009-03-10 | 2010-09-24 | Daicel Polymer Ltd | Resin composition for cleaning of resin molding processing machine |
JP2017177623A (en) * | 2016-03-31 | 2017-10-05 | 日本カーバイド工業株式会社 | Resin composition for cleaning die |
-
1994
- 1994-04-25 JP JP10739194A patent/JP3328424B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH07292262A (en) | 1995-11-07 |
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