JP3301870B2 - Mold cleaning resin composition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for cleaning a mold by molding under the same conditions when molding a curable resin.
The present invention relates to a mold cleaning resin composition exhibiting good fluidity.

[0002]

2. Description of the Related Art Conventionally, if molding of an encapsulation molded product such as an integrated circuit (hereinafter abbreviated as IC / LSI) using a curable resin such as an epoxy resin is continued for a long time, the inner surface of a mold becomes dirty, and the mold continues. If the molding is continued, the surface of the molded product is often stained, or the molded product adheres to the mold and the molding operation cannot be continued in many cases. Therefore, it is necessary to periodically clean the mold, and a method has been proposed in which the mold cleaning resin is molded at a rate of several shots every several hundred shots of the molding material.

[0003] For example, Japanese Patent Publication No. 52-788 discloses that "stain on a mold surface during molding of a curable resin molding material (excluding an amino resin molding material) is molded with a material mainly composed of an amino resin. A method of cleaning by means of an amino resin, an organic substrate and / or an inorganic substrate,
A mold cleaning resin composition comprising a release agent is disclosed. JP-B-64-10162 discloses a resin composition for cleaning a mold, comprising a co-condensation resin of an amino resin and a phenol resin and a mineral powder having a new Mohs hardness of 6 to 15.

[0004] These mold cleaning resin compositions are often used in the form of tablets having the same size as the molding material. The tablets are preheated to an internal temperature of 90 ° C to 110 ° C and then molded. This fills the entire mold. At that time, a part of the surface of the mold filled with the contained inorganic filler having a specific hardness is partially removed, and the surface of the mold is cleaned by taking in the stain when the cleaning resin is cured.

In recent years, high integration and thinning of IC / LSI, etc.
Along with surface mounting, the shape and structure of molded products are becoming more complicated. On the other hand, hundreds of molds with larger molds are also used to improve productivity, so it is easy to fill every corner of large molds with complicated structures and mold cleaning is good. There is a need for a mold cleaning resin.

As means for improving the fluidity of the resin composition for cleaning a mold, for example, as disclosed in JP-B-64-10162 and JP-B-1-32050, other resins are mixed or mixed. Although a method of condensing is known,
Although it has a certain effect, it is not always sufficient when used in a complicated mold, a large mold and the like.

[Problems to be solved by the invention]

In order to fill every corner of a complicated mold or a large mold and to show good cleaning properties, it is important to balance the initial fluidity at the time of resin melting and the affinity with each of the mold and dirt. Element.

The inventors of the present invention have conducted research to solve the above-mentioned problems, and as a result, have found that an HLB value of a lubricant in an amino-based resin composition for mold cleaning of a curable resin molding material for removing stains on the mold surface. However, they have found that there is a close relationship between fluidity, filling property, mold release property and cleaning property, and completed the present invention.

[0009]

Means for Solving the Problems The present invention has been made to solve the above-mentioned problems, and has been made of a curable resin molding material.
The present invention relates to a resin composition for cleaning a mold, which comprises a lubricant having an HLB value of 1.5 to 8, which is a melamine-based resin composition for cleaning a mold surface.

Hereinafter, the present invention will be described in detail.

In the present invention, the amino resin composition refers to a melamine resin or a melamine-urea co-condensate. The melamine-urea co-condensation resin includes triazines such as melamine, ureas, and aldehydes. Is co-condensed from

The melamine resin is obtained by condensing a triazine such as melamine and an aldehyde, and the urea resin is obtained by condensing a urea and an aldehyde. As the above triazines, besides melamine, based on 100% by weight of the triazines,
For example, triazines other than melamine such as benzoguanidine and acetoguanamine may be contained in an amount of 30% by weight or less.

Further, the above aldehydes may contain, in addition to formaldehyde, for example, formaldehydes such as paraform and acetaldehyde.

Further, the resin composition used in the present invention can be blended with other resins which can be blended therewith in an amount which does not adversely affect the above-mentioned improved properties of the composition of the present invention. . Examples of such a resin include an alkyd resin, a polyester resin, an acrylic resin, an epoxy resin, and rubbers.

The lubricant used in the present invention has an HLB value of 1.
It is good to use a lubricant which has 5-8, preferably 2-6, most preferably 2.5-5. The HLB value described here is calculated by the following formula.

HLB value = (molecular weight of hydrophilic group part) / (molecular weight of hydrophilic group part + molecular weight of hydrophobic group part) × (100 /
5)

For example, esters or partial esters of fatty acids such as triesters of trimethylolpropane / decanoic acid, polyoxyethylene monooleate and stearyl stearate with polyhydric alcohols, polyglycols, aliphatic alcohols, etc., for example, n-octyl Lubricants such as alcohols such as alcohol, trimethylolpropane and polyethylene glycol or polyglycols can be exemplified.

When the HLB value is 1.5 or less, the outer lubricity is too strong, so that in a large-sized mold, the filling property is poor and the filling is poor, so that the portion not filled with the cleaning resin cannot be cleaned. On the other hand, when the HLB value is 8 or more, the inner lubricity is too strong, so that the dirt taking-in force is weak, and the cleaning property is poor.

The resin composition for cleaning a mold of the present invention contains a mineral powder in addition to the resin described above. For example, natural materials such as corundum, emery, garnet, and silica and silicon, iron, titanium, sodium, calcium, magnesium, aluminum, chromium, oxides or carbides such as boron are preferable, and as these compounds, silicon oxide, Examples thereof include magnesium oxide, aluminum oxide, silicon carbide, and boron carbide.

The particle size of the mineral powder is not particularly limited, but is generally # 10 to # 8000, preferably # 10 to # 8000.
50 to 4000, more preferably # 100 to # 2000
It is good. If the particle size is smaller than # 8000, the cleaning effect is deteriorated, dusts are generated during handling, and the working environment is likely to be deteriorated. If the particle size is larger than # 10, defects such as damage to the mold and uneven cleaning are caused. Tends to occur.

The amount of the mineral powder used is not particularly limited, but the resin composition 1 for cleaning a mold according to the present invention.
The amount is 10 parts by weight to 90 parts by weight, preferably 10 parts by weight to 30 parts by weight, more preferably 17 parts by weight to 29 parts by weight with respect to 00 parts by weight.

The composition of the present invention contains, in addition to the above-mentioned mineral powder, other inorganic or organic fillers, coloring agents, curing catalysts,
Other additives such as antioxidants may be included. Examples of such additives include, for example, pulp, wood flour, vinylon fiber, glass powder, glass fiber, untreated calcium carbonate, talc, aluminum hydroxide, barium sulfate, other inorganic or organic fillers such as zinc sulfide. Agents; for example, inorganic pigments such as titanium oxide, carbon black, zinc white, cadmium yellow, red iron oxide, phthalocyanine-based, azo-based, diazo-based organic pigments, benzoxazole-based, naphthotriazole-based, and comarin-based fluorescent pigments; Colorants such as anthraquinone-based, indico-based, and azo-based dyes; for example, organic acids such as phthalic anhydride, oxalic acid, sulfamic acid, and paratoluenesulfonic acid; inorganic acids such as hydrochloric acid and sulfuric acid; these acids and triethylamine; Triethanolamine, β-dimethylaminoethanol, 2-methyl-2
Curing catalysts such as salts with amino-1-propanol; and antioxidants such as naphthylamine antioxidants, p-phenylenediamine antioxidants, and thiobisphenol antioxidants.

As the pulp, straw pulp, bamboo pulp, wood pulp (conifer pulp, hardwood pulp) and the like are used, and any of chemical pulp and mechanical pulp may be used. The size of the cellulose filler such as pulp and wood flour is not particularly limited, but is generally 5 μm to 100 μm.
0μ, preferably about 10μ to 200μ. The amount of cellulose is generally 15 to 70 parts by weight, preferably 20 to 60 parts by weight, based on 100 parts by weight of the amino resin.

In preparing the composition of the present invention, any means capable of uniformly mixing the amino resin, the mineral powder, and, if desired, other secondary amounts of the resin and additives can be employed. For example, kneaders, ribbon blenders, Henschel mixers,
Examples thereof include a ball mill, roll kneading, a grinder, a tumbler and the like.

The curable resin molding material which can be used to clean a mold using the composition of the present invention is, for example, an epoxy resin molding material, a phenol resin molding material or the like, preferably an epoxy resin molding material, especially a semiconductor sealing material. It is an epoxy resin molding material for stopping. Further, as the mold to which the resin composition for mold cleaning of the present invention is applied, any mold can be used as long as it is a mold used for automatically molding the cured resin molding material. A mold made of chrome or the like can be applied.

The resin composition for cleaning a mold having the composition of the present invention has a better cleaning effect for cleaning a complicated mold or a large mold as compared with a conventional resin composition for cleaning a mold. Is shown.

Hereinafter, the present invention will be described specifically with reference to Examples and Comparative Examples. The test method was based on the following test method.

1. Cleaning Effect Using a commercially available epoxy resin molding material (Nitron MP manufactured by Nitto Denko Corporation) tablet, 400 shot transfer molding of the sealing molded product was performed to contaminate the mold, and then the resin composition for cleaning the mold was prepared. Molding was performed, and the mold surface was observed to evaluate the cleaning effect as follows. 5: There is no fogging etc. 4: There is almost no fogging 3: There is some fogging 2: There is fogging 1: There is much dirt

2. Fluidity evaluation In the cleaning property test, the filling state when the mold cleaning resin composition was filled in the mold was observed. ○: Completely filled to the corner △: Slightly unfilled part ×: Partially unfilled

3. Evaluation of Releasability In the cleaning property test, the mold after molding the resin for cleaning the mold was observed, and the residual state of the cured resin for cleaning was observed. ：: No residual cured product △: Slight residual residue at corners ×: Part of cured product remaining

Reference Example 1 490 parts by weight of melamine and formalin (37% aqueous solution) 5
17 parts by weight were heated and reacted to prepare a melamine resin liquid by a known method, and dried under reduced pressure to obtain a melamine resin powder.

Example 1 75 parts by weight of the melamine resin powder of Reference Example 1 and a particle size of # 200
16 parts by weight of silica powder, 8.2 parts by weight of powdered pulp, 0.1 part by weight of benzoic acid, 0.5 part by weight of zinc stearate, and triester of trimethylolpropane / decanoic acid (capric acid). 2 parts by weight were added and pulverized by a ball mill to obtain a resin composition A for cleaning a mold. Table 1 shows the HLB value of the triester of trimethylolpropane / decanoic acid (capric acid) and the test results of the fluidity, mold release properties, and cleaning effect of the obtained resin composition for mold cleaning. As can be seen from the test results, a very good cleaning effect was obtained.

Example 2 190 parts by weight of the melamine resin liquid obtained in Reference Example 1 and 50 parts by weight of sheet pulp were kneaded in a kneader, dried and pulverized to obtain a melamine resin compound. 30 parts by weight of this compound and a commercially available melamine resin (Nikaresin S-17 manufactured by Nippon Carbide Industry Co., Ltd.)
6) 50 parts by weight, 20 parts by weight of silica powder having a particle size of # 200, 0.2 parts by weight of benzoic acid, 0.5 parts by weight of zinc myristate and 0.15 parts by weight of trimethylolpropane / oleic acid triester are added. The mixture was pulverized with a ball mill to obtain a resin composition B for cleaning a mold. Table 1 shows the HLB value of the triester of trimethylolpropane / oleic acid and the test results of the fluidity, mold release properties, and cleaning effect of the obtained resin composition for cleaning a mold. As can be seen from the test results, a very good cleaning effect was obtained.

Example 3 The procedure of Example 2 was repeated, except that 0.15 parts by weight of a block copolymer of polyethylene glycol and polypropylene glycol was used instead of 0.15 parts by weight of trimethylolpropane oleate triester. The obtained product was designated as a resin composition C for cleaning a mold. Table 1 shows the HLB value of the block copolymer of polyethylene glycol and polypropylene glycol and the test results of the fluidity, mold release properties, and cleaning effect of the obtained resin composition for cleaning a mold.

Example 4 A urea resin solution was prepared by a known method using 45 parts by weight of urea and 90 parts by weight of formalin (37% aqueous solution) and dried under reduced pressure to obtain a powder, 20 parts by weight and the melamine resin of Reference Example 1 40 parts by weight of powder, quartz powder of particle size # 1000 19.3
Parts by weight, powder pulp 20 parts by weight, phthalic anhydride 0.1 part by weight.
A resin composition D for mold cleaning was obtained by adding 05 parts by weight, 0.5 parts by weight of zinc stearate, and 0.2 parts by weight of stearyl stearate and pulverizing the mixture with a ball mill. Table 1 shows the HLB value of stearyl stearate and the test results of the fluidity, releasability, and cleaning effect of the obtained resin composition for mold cleaning.

Example 5 A benzoguanamine resin solution was prepared by a known method using 490 parts by weight of benzoguanamine and 517 parts by weight of formalin (37% aqueous solution) and dried under reduced pressure to obtain 20 parts by weight of a powder and the melamine resin of Reference Example 1. 50 parts by weight of powder, particle size #
200 parts by weight of silica powder, 9.5 parts by weight of powdered pulp, 0.1 parts by weight of benzoic acid, 0.5 parts by weight of zinc stearate and 0.2 parts by weight of polyoxyethylene monooleate were added to a ball mill. The resin composition E for pulverization was used as the mold cleaning resin composition E. Table 1 shows the HLB value of polyoxyethylene monooleate and the test results of the fluidity, mold release properties, and cleaning effect of the obtained resin composition for mold cleaning.

COMPARATIVE EXAMPLE 1 A resin composition obtained in the same manner as in Example 1 except that the triester of trimethylolpropane / decanoic acid (capric acid) was not added, and F was used as the resin composition. Table 1 shows the test results of the fluidity, mold release property, and cleaning effect of the resin composition for mold cleaning.

Comparative Example 2 Same as Example 1 except that 0.2 part by weight of behenyl behenate was used instead of 0.2 part by weight of the triester of trimethylolpropane / decanoic acid (capric acid) in Example 1. The resulting resin composition was designated as G. Table 1 shows the HLB value of behenyl behenate and the test results of the flowability, mold release properties, and cleaning effect of the obtained resin composition for mold cleaning.
Write it in 1.

Comparative Example 3 The procedure of Example 1 was repeated except that 0.2 parts by weight of oleic acid was used instead of 0.2 part by weight of the triester of trimethylolpropane / decanoic acid (capric acid). The obtained resin composition was designated as H. Table 1 shows the HLB value of oleic acid and the test results of the fluidity, mold release properties, and cleaning effect of the obtained resin composition for mold cleaning.

Comparative Example 4 Polyethylene glycol monostearate was used in Example 1 instead of 0.2 parts by weight of triester of trimethylolpropane / decanoic acid (capric acid).
A resin composition obtained in the same manner as in Example 1 except that parts by weight was used was designated as I. Table 1 shows the HLB value of polyethylene glycol monostearate and the test results of the fluidity, mold release properties, and cleaning effect of the obtained resin composition for mold cleaning.

Comparative Example 5 Example 1 was repeated except that 0.2 parts by weight of polyethylene glycol distearate was used instead of 0.2 part by weight of the triester of trimethylolpropane / decanoic acid (capric acid). The resin composition obtained in the same manner was designated as J. Table 1 shows the HLB value of polyethylene glycol distearate and the test results of the fluidity, mold release properties, and cleaning effect of the obtained resin composition for mold cleaning.

Comparative Example 6 A resin composition obtained in the same manner as in Example 1 except that 1.2 parts by weight of a triester of trimethylolpropane / decanoic acid (capric acid) was used was designated as K. Fluidity, mold release properties of the obtained mold cleaning resin composition,
Table 1 shows the cleaning effect test results.

[0043]

[Table 1]

[0044]

The resin composition for cleaning a mold of the present invention has a specific H content.
By containing a lubricant having an LB value, it is characterized in that it has excellent fluidity and releasability and exhibits a good cleaning effect especially in a large and complicated mold.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-175210 (JP, A) JP-A-55-123669 (JP, A) JP-A-3-81111 (JP, A) JP-A-5-123111 131460 (JP, A) JP-A-58-113243 (JP, A) JP-A-59-126426 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B29C 33/72 B29C 33 / 56 C11D 7/32

Claims (1)

(57) [Claims] An amino-based resin composition for cleaning a mold, which removes stains on a mold surface of a curable resin molding material, comprising:
100 parts by weight of a mold cleaning resin with a lubricant having an LB value of 1.5 to 8
0.1 to 1 part by weight of the resin composition for cleaning a mold.