CN106433021B - Resin composition for cleaning mold - Google Patents
Resin composition for cleaning mold Download PDFInfo
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- CN106433021B CN106433021B CN201610634425.7A CN201610634425A CN106433021B CN 106433021 B CN106433021 B CN 106433021B CN 201610634425 A CN201610634425 A CN 201610634425A CN 106433021 B CN106433021 B CN 106433021B
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- resin composition
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- resin
- mold
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- 239000011342 resin composition Substances 0.000 title claims abstract description 220
- 238000004140 cleaning Methods 0.000 title claims abstract description 143
- 229910052751 metal Inorganic materials 0.000 claims abstract description 71
- 239000002184 metal Substances 0.000 claims abstract description 71
- 239000000344 soap Substances 0.000 claims abstract description 65
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 57
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 47
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 47
- 239000011122 softwood Substances 0.000 claims abstract description 46
- 239000004640 Melamine resin Substances 0.000 claims abstract description 34
- 239000000835 fiber Substances 0.000 claims description 62
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 229940105125 zinc myristate Drugs 0.000 claims description 14
- GBFLQPIIIRJQLU-UHFFFAOYSA-L zinc;tetradecanoate Chemical compound [Zn+2].CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O GBFLQPIIIRJQLU-UHFFFAOYSA-L 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 12
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 11
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 10
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 10
- 239000000194 fatty acid Substances 0.000 claims description 10
- 229930195729 fatty acid Natural products 0.000 claims description 10
- 150000004665 fatty acids Chemical class 0.000 claims description 10
- JYIZNFVTKLARKT-UHFFFAOYSA-N phenol;1,3,5-triazine-2,4,6-triamine Chemical compound OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 JYIZNFVTKLARKT-UHFFFAOYSA-N 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 238000009833 condensation Methods 0.000 claims description 6
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 claims description 6
- 229940098697 zinc laurate Drugs 0.000 claims description 4
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 claims description 4
- 229940057977 zinc stearate Drugs 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 67
- 239000000356 contaminant Substances 0.000 description 25
- 230000000694 effects Effects 0.000 description 22
- 239000012778 molding material Substances 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 18
- 239000000203 mixture Substances 0.000 description 18
- 238000007789 sealing Methods 0.000 description 15
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000011121 hardwood Substances 0.000 description 10
- 230000009471 action Effects 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 239000002131 composite material Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 238000005452 bending Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000000314 lubricant Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- 235000014466 Douglas bleu Nutrition 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000534018 Larix kaempferi Species 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 241000218657 Picea Species 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 240000001416 Pseudotsuga menziesii Species 0.000 description 2
- 235000005386 Pseudotsuga menziesii var menziesii Nutrition 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 2
- 239000007859 condensation product Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 150000002366 halogen compounds Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- -1 methylol group Chemical group 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
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- 238000002360 preparation method Methods 0.000 description 2
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
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- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
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- NLSFWPFWEPGCJJ-UHFFFAOYSA-N 2-methylprop-2-enoyloxysilicon Chemical compound CC(=C)C(=O)O[Si] NLSFWPFWEPGCJJ-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
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- 150000003739 xylenols Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229940012185 zinc palmitate Drugs 0.000 description 1
- GJAPSKMAVXDBIU-UHFFFAOYSA-L zinc;hexadecanoate Chemical compound [Zn+2].CCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCC([O-])=O GJAPSKMAVXDBIU-UHFFFAOYSA-L 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F3/00—Compounds containing elements of Groups 2 or 12 of the Periodic Table
- C07F3/06—Zinc compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
A resin composition for mold cleaning, comprising a melamine resin, a metal soap, a fibrous inorganic compound, and softwood pulp, wherein the content of the metal soap is 1.6 parts by mass or more and 5.0 parts by mass or less with respect to 100 parts by mass of the resin composition for mold cleaning.
Description
Technical Field
The present invention relates to a resin composition for cleaning a mold.
Background
When a sealing molding material containing a thermosetting resin composition is used for sealing molding, when the sealing molding operation of an integrated circuit, an LED element, or the like is continued for a long time, contaminants (dirt) derived from the sealing molding material are likely to adhere to the inner surface of a molding die. When such contaminants remain on the inner surface of the molding die, there is a problem that contaminants adhere to the surface of the molded product for sealing an integrated circuit, an LED element, or the like, or the molded product cannot be peeled off from the molding die. Therefore, in the case of seal molding, it is required to remove contaminants present on the inner surface of the molding die. Specifically, in the case of seal molding, it is desirable to mold the resin composition for mold cleaning in place of the seal molding material at a rate such that several injections are performed every several hundreds of injections. The resin composition for mold cleaning is bonded to the contaminant by the resin composition for mold cleaning, and the mold cleaning can be performed by removing the resin composition containing the contaminant from the mold.
Such resin compositions for cleaning molds have been proposed.
For example, jp-a 8-57865 discloses an amino resin composition for mold cleaning containing a metal soap and a fatty acid amide lubricant.
According to Japanese patent laid-open No. 8-57865, a metal soap is involved in the fluidity of a molten resin in a mold. Further, the amino resin composition for mold cleaning improves the sheet properties at the time of molding the resin composition, that is, improves (reduces) the difficulty of pushing out from the mold at the time of forming the resin composition into small pieces (mini-tablets), and can suppress the occurrence of troubles such as squeaking, cracking, and chipping at the time of pushing out the small pieces.
International publication No. 2002/30648 discloses a resin composition for mold cleaning, which contains a melamine resin and a fibrous inorganic compound having an average fiber length, an average fiber diameter, and an aspect ratio (aspect ratio) each in a specific range.
According to the pamphlet of international publication No. 2002/30648, the resin composition for mold cleaning can improve the workability of mold cleaning and can clean the mold surface contamination components caused by repeated molding using various molding materials such as biphenyl-based epoxy resins and polyfunctional epoxy resins.
It is described that the mold-releasing property of the resin composition for mold cleaning can be satisfactorily maintained by including a metal soap represented by zinc myristate as a lubricant, and the content of the metal soap is preferably 1.5 parts by mass or less based on 100 parts by mass of the resin composition for mold cleaning.
Disclosure of Invention
Problems to be solved by the invention
In recent years, for environmental protection, a conventional seal molding material containing a mixture having a large environmental load, such as lead, antimony, and a halogen compound, has been replaced with a seal molding material called "green composite" which does not contain the mixture. Specifically, a sealing molding material in which a conventional flame retardant is substituted for a metal hydroxide flame retardant or an organic phosphorus flame retardant, or a sealing molding material designed or blended with an epoxy resin to achieve flame retardancy is referred to as an "eco-friendly composite material".
Further, a sealing molding material having improved adhesion to a lead frame (lead frame) is also becoming widespread.
In the seal molding step using such an eco-friendly composite material or a seal molding material having improved adhesion to metal, the inner surface of the molding die is easily soiled. Therefore, it is desired to develop a resin composition for mold cleaning having better cleaning performance.
The resin composition for cleaning a mold containing a large amount of metal soap is expected to have improved cleaning performance by improving affinity for contaminants present on the inner surface of a molding mold. The present inventors prepared a resin composition for mold cleaning based on the composition described in example 1 of wo 2002/30648 pamphlet by replacing the content of the metal soap added to the resin composition for mold cleaning with 2.0 parts by mass of zinc myristate from 0.5 parts by mass of zinc stearate per 100 parts by mass of the resin composition for mold cleaning, and using melamine phenol-formaldehyde resin powder mixed with hardwood pulp as melamine resin-impregnated pulp, and evaluated the cleaning performance. As a result, the resin composition for cleaning a mold exhibits excellent cleaning performance. However, the resin composition for mold cleaning itself has an extremely low internal strength, and chipping (chipping of the resin composition) occurs in the step of removing the resin composition from the molding die after the mold cleaning, and there is a problem that the resin composition cannot be sufficiently removed from the molding die. That is, the mold cleaning step using the resin composition for mold cleaning has room for improvement from the viewpoint of workability.
The inventors of the present invention conducted intensive studies and found that: a resin composition for mold cleaning comprising a melamine resin, a specific amount of a metal soap, a fibrous inorganic compound, and softwood pulp, which can maintain good mold cleaning performance and can suppress chipping of the resin composition in a step of removing the resin composition from a molding mold after cleaning.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a resin composition for mold cleaning which is excellent in mold cleaning performance and can improve workability in a step of removing a mold from a cleaned mold.
Means for solving the problems
Specific means for solving the problems are as follows.
[ claim 1] A resin composition for mold cleaning, which comprises a melamine resin, a metal soap, a fibrous inorganic compound, and softwood pulp, wherein the content of the metal soap is 1.6 parts by mass or more and 5.0 parts by mass or less relative to 100 parts by mass of the resin composition for mold cleaning.
<2> the resin composition for mold cleaning as stated in <1>, wherein the metal soap is fatty acid zinc.
<3> the resin composition for mold cleaning as stated in <2>, wherein the fatty acid zinc comprises at least one selected from the group consisting of zinc myristate, zinc laurate and zinc stearate.
<4> the resin composition for mold cleaning according to any one of <1> to <3>, wherein the fibrous inorganic compound is a ceramic fiber.
<5> the resin composition for mold cleaning according to <4>, wherein the ceramic fibers comprise at least one selected from the group consisting of potassium titanate fibers and aluminum borate fibers.
<6> the resin composition for mold cleaning according to any one of <1> to <5>, wherein the melamine resin contains at least one selected from the group consisting of a melamine-formaldehyde resin and a melamine-phenol co-condensation resin.
<7> the resin composition for mold cleaning according to any one of <1> to <6>, wherein the melamine resin is impregnated in the softwood pulp.
Effects of the invention
According to the present invention, a resin composition for mold cleaning which has excellent mold cleaning performance and can improve workability in a step of removing a mold from a cleaned mold can be provided.
Detailed Description
Hereinafter, specific embodiments of the present invention will be described in detail. The present invention is not limited to the following embodiments, and can be implemented with appropriate modifications within the scope of the object of the present invention.
In the present specification, the numerical range represented by "to" means a range in which the numerical values described before and after "to" are included as the minimum value and the maximum value, respectively. In addition, the amount of each component in the composition is expressed in terms of an amount obtained by adding a plurality of substances in the case where a plurality of substances is contained in each component, unless otherwise specified.
In the present specification, the "resin composition for mold cleaning" may be simply referred to as a "resin composition".
In the present specification, the term "inner surface of the molding die" refers to a region that is in contact with a material to be molded by the molding die. In the present specification, the "forming mold" may be simply referred to as a "mold".
[ resin composition for cleaning mold ]
The resin composition for cleaning a mold comprises a melamine resin, a metal soap, a fibrous inorganic compound, and softwood pulp, wherein the content of the metal soap is 1.6 parts by mass or more and 5.0 parts by mass or less with respect to 100 parts by mass of the resin composition for cleaning a mold. The resin composition for mold cleaning of the present invention may be further composed of other components as needed.
The resin composition of the present invention contains a melamine resin, a specific amount of a metal soap, a fibrous inorganic compound, and softwood pulp, and therefore, it is expected that the resin composition can maintain good fluidity and mold cleaning performance, and can suppress chipping in the step of removing the resin composition to which contaminants have adhered from the molding die after cleaning. For example, the following can be considered.
In general, in a resin composition for mold cleaning containing a melamine resin, when a metal soap is added in a large amount, the internal strength of the resin composition for mold cleaning is extremely reduced, and when the resin composition for mold cleaning after mold cleaning is taken out, the resin composition for mold cleaning becomes brittle (easily chipped), and thus workability is significantly reduced. It is known that the decrease in the internal strength of the resin composition can be suppressed by an additive such as pulp. However, for example, when pulp or a fibrous inorganic compound is used alone as an additive, entanglement of the pulp or the fibrous inorganic compound in the resin composition for mold cleaning is insufficient, and the internal strength of the resin composition is still low. Further, when hardwood pulp and a fibrous inorganic compound are used in combination, since hardwood pulp has short and fine fibers, entanglement between hardwood pulp and the fibrous inorganic compound is insufficient, and the internal strength of the resin composition is still low. Although the detailed mechanism is not clear, since the resin composition of the present invention uses the softwood pulp and the fibrous inorganic compound in combination, the softwood pulp and the fibrous inorganic compound are entangled with each other in the resin composition for mold cleaning, and even if the metal soap is contained in a large amount, that is, 1.6 parts by mass or more of the metal soap is contained per 100 parts by mass of the resin composition for mold cleaning, the internal strength of the resin composition is sufficient, and the occurrence of chipping of the resin composition in the step of removing the resin composition from the molding mold after cleaning can be suppressed.
The internal strength of the resin composition can be evaluated by measuring the flexural strength of the resin composition using, for example, a universal material tester (tensilon).
[ Melamine resin ]
The resin composition of the present invention contains a melamine resin.
The "melamine resin" refers to a melamine resin, a melamine-phenol cocondensate resin, or a melamine-urea cocondensate resin.
In the present invention, one or more of these are selected and used.
The melamine resin is a condensate of triazine and aldehyde. Examples of the triazine include melamine, benzoguanamine, and acetoguanamine. Examples of the aldehydes include formaldehyde, paraformaldehyde, and acetaldehyde.
In the present specification, a condensate of melamine and formaldehyde is referred to as a melamine-formaldehyde resin.
The melamine-phenol co-condensation resin is a co-condensation product of triazines, phenols and aldehydes. Examples of the phenol include phenol, cresol, xylenol, ethylphenol, and butylphenol.
The melamine-urea co-condensation resin is a co-condensation product of triazine, urea and aldehyde.
In the melamine-phenol cocondensate resin and the melamine-urea cocondensate resin, the amount of triazine is, for example, 30 mass% or more, 40 mass% or more, 50 mass% or more, 60 mass% or more, 70 mass% or more, 80 mass% or more, or 90 mass% or more and less than 100 mass% of the total amount of triazine and phenol in the raw materials or the total amount of triazine and urea in the raw materials.
The resin composition for mold cleaning of the present invention may contain, in addition to the melamine-based resin, other types of resins, for example, at least one selected from the group consisting of alkyd resins, polyester resins, acrylic resins, epoxy resins, and rubbers, within a range in which the effects of the present invention are not impaired.
The resin composition of the present invention contains a melamine resin, and therefore exhibits excellent mold cleaning performance with respect to contaminants present on the inner surface of a molding mold. Although the reason for this is not necessarily clear, it is considered that the methylol group contained in the melamine resin has a high polarity and therefore can act on the fouling derived from the sealing molding material adhering to the inner surface of the molding die (i.e., the fouling derived from the sealing molding material containing the thermosetting resin composition) generated at the time of molding, and therefore, the resin composition of the present invention exhibits excellent die cleaning performance. Further, it is considered that the melamine resin is stable against heat, and therefore the resin composition of the present invention exhibits stable mold cleaning performance even at a temperature around 160 to 190 ℃ which is a general temperature of a molding mold during mold cleaning.
[ Metal soap ]
The resin composition of the present invention contains a metal soap.
The "metal soap" is a metal salt of a fatty acid comprising a fatty acid having 12 to 20 carbon atoms and a metal selected from the group consisting of aluminum, calcium, zinc and magnesium.
The metal soap contained in the resin composition of the present invention exhibits the following effects: the effect of the lubricant is to improve the fluidity of the resin composition during cleaning, and to facilitate the action of the melamine resin on contaminants present on the inner surface of the molding die; and an effect as a cleaning agent, which acts directly on the contaminating substance by virtue of its high affinity with the contaminating substance present on the inner surface of the molding die.
The metal soap contained in the resin composition of the present invention is preferably fatty acid zinc such as zinc stearate or zinc myristate. If the metal soap is a fatty acid zinc, it is preferable because it has high affinity for contaminants present on the inner surface of the molding die and high die cleaning performance.
Examples of the metal soap contained in the resin composition of the present invention include zinc stearate, zinc myristate, zinc laurate, zinc palmitate, calcium stearate, aluminum stearate, and magnesium stearate.
The content of the metal soap contained in the resin composition of the present invention is 1.6 parts by mass or more and 5.0 parts by mass or less with respect to 100 parts by mass of the resin composition. The amount is preferably 1.8 parts by mass or more and 3 parts by mass or less, and more preferably 1.8 parts by mass or more and 2.3 parts by mass or less, per 100 parts by mass of the resin composition.
If the amount of the metal soap contained in the resin composition is excessive, the metal soap adheres excessively to the inner surface of the molding die and remains on the inner surface of the molding die in the die cleaning step, and becomes a new contaminant. That is, the resin composition with excess metal soap exhibits an action opposite to the cleaning, that is, an action of staining the inner surface of the molding die.
The resin composition of the present invention has a metal soap content of 1.6 parts by mass or more per 100 parts by mass of the resin composition, and therefore exhibits cleaning performance superior to that of conventional resin compositions due to the above-described effects as a lubricant and cleaning agent. Further, since the content of the metal soap is 5.0 parts by mass or less with respect to 100 parts by mass of the resin composition, the metal soap does not remain on the inner surface of the molding die after the resin composition is used for die cleaning, the cleaning performance is good, the internal strength of the resin composition is not lowered, and chipping does not occur after cleaning.
In Japanese patent application laid-open No. 8-57865, it is described that the content of a lubricant represented by a metal soap is preferably 1.5 parts by mass or less per 100 parts by mass of the resin composition in order to improve the cleaning performance. The inventors of the present invention considered the following for the reason that the die cleaning can be sufficiently performed even when the content of the metal soap contained in the resin composition of the present invention is 1.6 parts by mass or more per 100 parts by mass of the resin composition.
Since the resin composition of the present invention contains softwood pulp and the fibrous inorganic compound, the internal strength is made sufficient by the effect of entanglement of them as described above. Therefore, even if the resin composition of the present invention contains a large amount of the metal soap acting in a direction of weakening the internal strength, the internal strength is not lowered.
The type and content of the metal soap contained in the resin composition of the present invention can be confirmed by X-ray fluorescence analysis and gas chromatography-mass spectrometry to determine the type of the metal and the fatty acid.
[ fibrous inorganic Compound ]
The resin composition of the present invention contains a fibrous inorganic compound.
The "fibrous inorganic compound" is, for example, a fibrous inorganic compound (inorganic fiber) such as a glass fiber, a metal fiber, or a ceramic fiber.
Examples of the metal fibers include steel fibers and stainless steel fibers.
Examples of the ceramic fiber include alumina fiber, silica fiber, potassium titanate fiber, calcium carbonate fiber, calcium silicate fiber, aluminum borate fiber, silicon carbide fiber, zirconia fiber, silicon nitride fiber, magnesium sulfate fiber, and zinc oxide fiber.
The fibrous inorganic compound may have a cross section of a perfect circle (perfect circle) or a flat shape, although the shape is not particularly limited. The representative fibrous inorganic compound has an average fiber length of 5 to 30 μm, an average fiber diameter of 0.1 to 1.0 μm, and an aspect ratio of 10 to 60. The fiber length, fiber diameter, and specific length to diameter of the fibrous inorganic compound can be confirmed by an electron microscope.
The fibrous inorganic compound may be used alone, or may be used in combination with a plurality of fibrous inorganic compounds.
The fibrous inorganic compound contained in the resin composition of the present invention exhibits an action effect of acting on the contaminants present on the inner surface of the molding die, bonding the resin composition and the contaminants at the time of cleaning, and an action effect of improving the internal strength in the resin composition.
The fibrous inorganic compound (inorganic fiber) contained in the resin composition of the present invention is preferably a ceramic fiber.
The fibrous inorganic compound is preferably a ceramic fiber because the above-mentioned action and effect are particularly excellent and the surface of the cleaning mold is hardly damaged by the fibrous inorganic compound during cleaning.
The surface of the ceramic fiber is preferably surface-treated with, for example, a silane coupling agent such as an epoxy silane-based, amino silane-based, or methacryloxy silane-based resin, or various resins. The resin composition of the present invention contains the ceramic fiber subjected to the surface treatment, thereby improving the adhesion between the fibrous inorganic compound and the melamine resin and further improving the internal strength of the resin composition.
As the ceramic fiber, for example, there are commercially available: trade names of alumina Y, alumina M20, alumina YS3A, alumina YS2B and alumina YS4, trade names of TISMO D, TISMO L, TISMO D101 and TISMO D102, from Tsukamur chemical corporation, which is a potassium titanate fiber, trade names of MOS-HIGE, from Yutsukawa K.K. as a magnesium sulfate fiber, trade name of calcium carbonate fiber, from calcium carbonate Kawaku K.K., trade name of WHISCAL A, and trade name of FXL BulkFiber, from ITM, which is an alumina/silica fiber, are available from Sikko chemical corporation.
The fibrous inorganic compound contained in the resin composition of the present invention particularly preferably contains at least one selected from the group consisting of potassium titanate fibers and aluminum borate fibers. That is, the resin composition of the present invention preferably contains at least one selected from the group consisting of potassium titanate fibers and aluminum borate fibers as the ceramic fibers.
As long as the fibrous inorganic compound contains at least one selected from the group consisting of potassium titanate fibers and aluminum borate fibers, the above-described action and effect, particularly the effect of suppressing the occurrence of chipping due to the improvement in internal strength, is extremely excellent. Further, the potassium titanate fibers and the aluminum borate fibers are chemically and thermally stable in a homogeneous manner, and therefore, exert a stabilizing effect during the production and storage of the resin composition and during the cleaning with the resin composition. Further, it is preferable that the entanglement between the softwood pulp and both the potassium titanate fibers and the aluminum borate fibers is sufficient to further improve the internal strength of the resin composition.
The content of the fibrous inorganic compound in the resin composition of the present invention is preferably in the range of 1.0 part by mass or more and 30.0 parts by mass or less, more preferably in the range of 1.0 part by mass or more and 10.0 parts by mass or less, and still more preferably in the range of 3.0 parts by mass or more and 6.0 parts by mass or less, with respect to 100 parts by mass of the resin composition. When the amount is 1.0 part by mass or more, the following effects are sufficiently exhibited, and therefore, the range is preferable. The effect of the contaminants acting on the inner surface of the molding die during cleaning to bond the resin composition and the contaminants; and an effect of improving the internal strength in the resin composition. It is preferable that the amount of the resin composition is 30.0 parts by mass or less because the resin composition has sufficient fluidity and is filled in each corner of a package (package) of a mold.
[ softwood pulp ]
The resin composition of the present invention comprises softwood pulp.
The "softwood pulp" is pulp made from softwood trees such as red pine, larch, fir (Abies sachalinensis), Douglas fir (Douglas fir), japanese fir (Abies fira), japanese larch (Larix kaempferi), pine (pine), hemlock (Tsuga heterophylla), and american Picea (Picea sietchensis) as a raw material.
Softwood pulp has the characteristics of coarse and long fibers and high strength. Hardwood pulp, on the other hand, has the characteristics of short, fine fibers and smooth surfaces. In the case where the resin composition for mold cleaning has a composition containing pulp, when softwood pulp is used as the pulp, the fluidity of the resin composition for mold cleaning is liable to become small. Hardwood pulp has been widely used for improving flowability in conventional resin compositions for mold cleaning.
The resin composition of the present invention does not suffer from a decrease in internal strength even when a large amount of a metal soap acting in a direction of weakening the internal strength, that is, 1.6 parts by mass or more of a metal soap is contained per 100 parts by mass of the resin composition for mold cleaning, and can suppress the occurrence of chipping of the resin composition in a step of removing the resin composition from a cleaned molding die. This is considered to be because the resin composition of the present invention has a constitution containing softwood pulp and the fibrous inorganic compound, thereby obtaining a constitution in which the softwood pulp and the fibrous inorganic compound are entangled with each other, thereby improving the internal strength of the resin composition. Further, the resin composition of the present invention contains a large amount of metal soap, and therefore, even if softwood pulp is contained, it has sufficient fluidity and exhibits excellent cleaning performance.
The softwood pulp is commercially available, and examples thereof include NSPP1 (trade name) manufactured by japan paper-making co.
The resin composition of the present invention may contain a fibrous organic compound such as hardwood pulp, straw pulp, bamboo pulp, or cotton pulp, in addition to softwood pulp, within a range in which the excellent effects of the present invention are not lost.
In the resin composition of the present invention, it is preferable that the softwood pulp is a pulp impregnated with a melamine resin, because the dispersibility of the softwood pulp in the resin composition is improved, and unevenness in mold cleaning performance and in internal strength are reduced. The "pulp impregnated with melamine resin" is selected from a state in which at least a part of the amount of melamine resin enters the gaps between the fibers of softwood pulp; and at least one state selected from the group consisting of a state in which at least a part of the amount of the melamine resin covers a part or all of the surface of the fibers of the softwood pulp.
When the pulp is impregnated with the melamine resin, the melamine resin is preferably in an aqueous solution state. For example, the melamine resin-impregnated pulp (in other words, the pulp contains a melamine resin) is obtained by impregnating the pulp in an aqueous melamine resin solution and then drying the impregnated pulp.
The size of the softwood pulp is not particularly limited, but from the viewpoint of further improving the internal strength of the resin composition, the fiber length is preferably in the range of 5 to 1000 μm, and more preferably in the range of 10 to 200 μm. The fiber length of the pulp can be measured, for example, by a method based on JIS P8226-2 corresponding to ISO 16065-2.
The content of the softwood pulp is not particularly limited, but is preferably 2 parts by mass or more and 50 parts by mass or less, more preferably 2 parts by mass or more and 10 parts by mass or less, with respect to 100 parts by mass of the resin composition, from the viewpoint of improving the flowability of the resin composition in the mold cleaning step.
The softwood pulp and the fibrous inorganic compound contained in the resin composition of the present invention exhibit not only an action effect of improving the internal strength of the resin composition but also a cleaning performance by a so-called polishing effect of physically acting on a contaminant present on the inner surface of a molding die in a die cleaning step. In particular, in the resin composition of the present invention, since softwood pulp and the fibrous inorganic compound are appropriately entangled with each other, the above-described polishing effect is more excellent than that of the conventional resin composition.
[ other additives ]
The resin composition of the present invention may further contain other additives within a range in which the excellent action and effect of the present invention are not lost.
Specifically, the resin composition of the present invention may further contain resins such as alkyd resin, polyester resin, acrylic resin, and epoxy resin, and/or rubbers, as necessary. Further, various additives such as a lubricant other than a metal soap, a colorant, and an antioxidant may be contained.
The resin composition of the present invention may contain a curing catalyst. The curing catalyst is preferably at least one organic acid selected from the group consisting of phthalic anhydride, myristic acid, stearic acid, sulfamic acid, oxalic acid, benzoic acid, trimellitic acid, and p-toluenesulfonic acid, from the viewpoint of the material properties of the hardening catalyst and melamine resin.
The resin composition of the present invention may contain an inorganic filler other than the fibrous inorganic compound, from the viewpoint of improving the mold cleaning performance by the polishing effect.
As the inorganic filler, silicon carbide, silicon oxide (silica), titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, calcium carbonate can be exemplified. Particularly, silicon oxide is preferable because of its excellent polishing effect.
The composition of these inorganic fillers may be the same as that of the fibrous inorganic compound.
[ method for producing resin composition ]
The resin composition of the present invention is prepared by substantially uniformly mixing the melamine resin, the metal soap, the fibrous inorganic compound, the softwood pulp, and other additives used as needed, for example, using a kneader, a ribbon mixer, a Henschel mixer (Henschel mixer), a ball mill, a roll mill (roll mill), a grinding mixer (grinding machine), a tumbler (tubbler), or the like.
[ method of Using resin composition ]
The resin composition for mold cleaning of the present invention is suitable for a transfer-type resin composition for mold cleaning used in a transfer-type molding machine.
The resin composition of the present invention is usually processed into a sheet form and used for cleaning work on the inner surface of a molding die (inside the molding die). Specifically, in the cleaning operation, after the lead frame is placed on the molding die, the sheet-like resin composition is inserted into the charge cavity (pot) portion. After the mold is closed, the resin composition is extruded and discharged by the plunger. At this time, the resin composition flows from the charging cavity portion through the runner (runner) portion, through the gate (gate) portion, and into the cavity (cavity). After a predetermined molding time has elapsed, the mold is opened to remove the molded article integrated with the lead frame, that is, the molded article of the resin composition containing the contaminants, thereby completing the cleaning operation.
The resin composition of the present invention is suitably used for removing contaminants generated on the inner surface of a molding die in a sealing molding operation of an integrated circuit or the like. The material of the molding die is, for example, iron, chromium, or the like.
The resin composition of the present invention is suitable for removing contaminants from the inner surface of a molding die, wherein the contaminants originate from a seal molding material containing a thermosetting resin composition typified by an epoxy resin, a silicone resin, a phenol resin, and a polyimide resin.
In particular, the resin composition of the present invention exhibits excellent cleaning performance even in cleaning the inside of a mold after molding using a sealing molding material called an eco-friendly composite material which does not contain a mixture having a large environmental load represented by lead, antimony, and a halogen compound.
A sealing molding material containing a metal hydroxide flame retardant or an organic phosphorus flame retardant called an eco-friendly composite material, or a sealing molding material designed or blended with an epoxy resin to achieve flame retardancy has higher adhesion to a mold than a conventional sealing molding material. Therefore, it is more difficult to clean the mold after molding using such a seal molding material.
The resin composition of the present invention contains 1.6 parts by mass or more of the metal soap per 100 parts by mass of the resin composition, and thus is excellent in both cleaning performance and workability. Therefore, the resin composition of the present invention is suitable for an application of cleaning the inside of a mold after seal molding a seal molding material called an eco-composite.
[ examples ]
The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to the following examples as long as the invention does not depart from the gist thereof.
[ preparation of Melamine-based resin comprising softwood pulp and Melamine-Formaldehyde resin ]
Production example 1
A melamine-formaldehyde resin was prepared by a known method by heating and reacting 480 parts by mass of melamine with 522 parts by mass of formaldehyde (37 mass% aqueous solution), 248 parts by mass of softwood pulp (trade name: NSPP1, manufactured by Nippon paper-making Co., Ltd.) was added to the obtained resin solution, and kneading was carried out, followed by drying under reduced pressure and powdering to obtain a softwood pulp-containing melamine-formaldehyde resin.
Production example 2
A melamine-phenol co-condensation resin was prepared by a known method by reacting 346 parts by mass of melamine, 522 parts by mass of formaldehyde (37 mass% aqueous solution) and 131 parts by mass of phenol under heating, and then 248 parts by mass of softwood pulp (trade name: NSPP1, manufactured by Nippon paper-making Co., Ltd.) was added to the obtained resin solution and kneaded, followed by drying under reduced pressure and powdering to obtain a softwood pulp-containing melamine-phenol co-condensation resin.
(production example 3)
Melamine 480 parts by mass and formaldehyde (aqueous solution 37% by mass) 522 parts by mass were reacted by heating to prepare a melamine-formaldehyde resin by a known method, and hardwood pulp (trade name: LDPT, manufactured by Nippon paper-making Co., Ltd.) 248 parts by mass was added to the obtained resin solution to knead the resin solution, followed by drying under reduced pressure and powdering to obtain a hardwood pulp-containing melamine-formaldehyde resin.
[ preparation of resin composition for mold cleaning ]
(example 1)
30 parts by mass of a melamine-formaldehyde resin containing softwood pulp (22 parts by mass of the melamine-formaldehyde resin and 8 parts by mass of the softwood pulp) and 50 parts by mass of a melamine-based resin (product name: Nikaresin S-166, manufactured by Nippon calcium carbide industries, Ltd.), 20 parts by mass of silica (product name: pure silica powder, manufactured by Rekekushikaki Kaisha), 5.0 parts by mass of potassium titanate fiber (product name: TISMO D, manufactured by Tsukamur chemical Co., Ltd.), and 1.8 parts by mass of zinc myristate were added to a ball mill and pulverized. Then, 0.4 part by mass of ethylenebisstearamide was added and mixed in a Nauta mixer (Nauta mixer) to obtain the resin composition of example 1. The resin composition thus obtained was subjected to sheet molding and used for evaluation of mold cleaning.
The amount of the metal soap was 1.7 parts by mass per 100 parts by mass of the resin composition.
(example 2)
Resin compositions were obtained in the same manner as in example 1, except that 2.0 parts by mass of zinc myristate was used as the metal soap and the amount of the metal soap was 1.9 parts by mass based on 100 parts by mass of the resin composition, as the composition shown in table 1.
(example 3)
Resin compositions were obtained in the same manner as in example 1, except that zinc myristate was used in an amount of 5.0 parts by mass as the metal soap and the amount of the metal soap was 4.5 parts by mass based on 100 parts by mass of the resin composition, as the compositions shown in table 1.
(example 4)
Resin compositions were obtained in the same manner as in example 1, except that 2.0 parts by mass of zinc laurate was used as the metal soap and the amount of the metal soap was 1.9 parts by mass based on 100 parts by mass of the resin composition, as shown in table 1.
(example 5)
Resin compositions were obtained in the same manner as in example 1, except that 2.0 parts by mass of zinc stearate was used as the metal soap, as the composition described in table 1.
(example 6)
Resin compositions were obtained in the same manner as in example 1 except that, as the fibrous inorganic compound, aluminum borate fiber (trade name: Alborex Y, manufactured by Sikko chemical Co., Ltd.), 2.0 parts by mass of zinc myristate as the metal soap, and 0.1 part by mass of benzoic acid as the curing catalyst were used in the compositions shown in Table 1.
(example 7)
Resin compositions were obtained in the same manner as in example 1 except that 30 parts by mass of the softwood pulp-containing melamine-phenol co-condensed resin of production example 2 was used in place of the softwood pulp-containing melamine-formaldehyde resin of production example 1, aluminum borate fiber (trade name: Alborex Y, manufactured by Sikko chemical industries Co., Ltd.) was used as the fibrous inorganic compound, and zinc myristate was used in an amount of 2.0 parts by mass as the metal soap, and the compositions shown in Table 1 were used.
(example 8)
Resin compositions were obtained in the same manner as in example 1 except that, as the fibrous inorganic compound, aluminum borate fiber (trade name: Alborex Y, manufactured by Sikko chemical Co., Ltd.) was used and that, as the metal soap, 2.0 parts by mass of zinc myristate was used in the composition shown in Table 1.
Comparative example 1
Resin compositions were obtained in the same manner as in example 1, except that 1.6 parts by mass of zinc myristate was used as the metal soap and the amount of the metal soap was 1.5 parts by mass based on 100 parts by mass of the resin composition, as the composition shown in table 1.
Comparative example 2
Resin compositions were obtained in the same manner as in example 1, except that zinc myristate was used in an amount of 5.7 parts by mass as the metal soap and the amount of the metal soap was 5.1 parts by mass based on 100 parts by mass of the resin composition, as the compositions shown in table 1.
Comparative example 3
A resin composition was obtained in the same manner as in example 7, except that the hardwood pulp-containing melamine-formaldehyde resin of production example 3 was used in place of the softwood pulp-containing melamine-formaldehyde resin of production example 1, in the composition shown in table 1.
Comparative example 4
Resin compositions were obtained in the same manner as in example 2, except that the fibrous inorganic compound was not used, as in the composition shown in Table 1.
[ Table 1]
[ evaluation ]
The resin compositions of examples and comparative examples were evaluated for mold cleaning performance and mold releasability by the following methods.
The compositions and evaluations of the resin compositions of examples and comparative examples are summarized in table 1.
An epoxy resin molding material (product name: CEL-9240HF10, manufactured by hitachi chemical co., ltd.) called an eco-composite was used, and the inside surface of the molding die was contaminated by injection molding 500 times of QFP using a mold for QFP (quad flatpackage) molding having a gate portion with a width of 800 μm and a height of 300 μm by a transfer type automatic molding machine (mold temperature: 175 ℃, transfer pressure: 8.7MPa, transfer time: 6.5 seconds, curing time: 80 seconds).
The resin compositions of examples and comparative examples were repeatedly molded using the molding die having contaminants on the inner surface under the same molding conditions as those of the above-described epoxy resin molding material except that the curing time was set to 180 seconds, and the die was cleaned. Then, the number of injections required until the contaminating substances present on the inner surface of the forming mold can be completely removed was measured. This number of injections was used as an index for evaluating the mold cleaning performance of the resin composition. Whether the contaminants were completely removed was judged by visual observation.
In evaluating the cleaning performance, attention is paid particularly to whether or not contaminants adhering to the gate portion or the corner portion of the cavity of the forming die can be removed. The smaller the number of injections, the more excellent the mold cleaning performance of the resin composition. The resin composition is qualified when the number of injections is within the range of 1 to 3.
In short, in the cleaning step using the resin composition, after 1 injection molding, the presence or absence of chipping of the resin composition was visually confirmed to evaluate workability. That is, in the step of removing the resin composition after 1 injection molding from the molding die, "none" is used as long as there is no chipping (chipping) of the resin composition and workability of die cleaning is good, and "present" is used as long as there is chipping and difficulty occurs in workability.
The resin compositions of examples and comparative examples were evaluated for mold cleaning performance by the evaluation methods described above. In the resin compositions of examples 1 to 8 and comparative examples 2 to 4, the number of injections required until the completion of cleaning was 3 or less. That is, the resin compositions of all examples and comparative examples 2 to 4 exhibited excellent cleaning performance.
On the other hand, the resin composition of comparative example 1 was injected 4 times more than in any of the examples.
From the results, it is understood that the resin composition of the present invention comprises a melamine resin, a metal soap, a fibrous inorganic compound, and softwood pulp, and exhibits excellent cleaning performance because the content of the metal soap is 1.6 parts by mass or more and 5.0 parts by mass or less with respect to 100 parts by mass of the resin composition for mold cleaning.
In addition, with respect to each of the resin compositions of examples and comparative examples, the presence or absence of chipping was evaluated by the above-described evaluation method. In the mold cleaning process using all of the resin compositions of examples and comparative example 1, no chipping occurred in the resin composition after molding, and workability was good. On the other hand, in the mold cleaning process using each of the resin compositions of comparative examples 2 to 4, chipping occurred, and workability was low.
That is, in cleaning the mold after molding of the eco-friendly composite material, the resin composition of all examples was excellent in cleaning performance and workability in the removal process from the cleaned molding mold. In contrast, the resin composition of the comparative example is inferior in at least one of cleaning performance and workability in the removal step from the cleaned molding die.
From the results, it is understood that the resin composition of the present invention contains the melamine resin and the metal soap, and further contains the fibrous inorganic compound and the softwood pulp, and therefore, even if the content of the metal soap is relatively large, that is, 1.6 parts by mass or more and 5.0 parts by mass or less with respect to 100 parts by mass of the resin composition, the workability in the removal step from the cleaned molding die is good.
The workability in cleaning using each of the resin compositions of example 2, example 3 and comparative example 2 was evaluated in more detail.
The chipping at the time of cleaning is caused by the weak internal strength of the molded article formed by curing the resin composition. The internal strength of the molded article can be expressed by the bending strength, and the bending strength has a strong correlation with the presence or absence of chipping.
The flexural strength of each molded article was measured in accordance with the general test method for thermosetting plastics of JIS K6911 in the following procedures. First, using a transfer molding machine and a test piece molding die, molding was carried out at a molding temperature of 170 ℃ for a molding timeThe resin composition for mold cleaning was molded at 3 minutes to obtain a test piece having a height (h) of 4mm, a width (W) of 10mm and a length of 80 mm. Using a tensile compression tester, the distance (L) between the fulcrumsv) A load was applied to the test piece at a load speed of 2mm/min of 64mm, and the load P at the time of breaking the test piece was measured. Through the formula sigmafB＝3PLv/2Wh2Calculating the bending strength (σ)fB). As a result, the bending strengths of the molded articles of examples 2 and 3 and comparative example 2 were 180MPa, 140MPa and 105MPa, respectively.
From the above results, it was revealed that the formed articles of examples 2 and 3, in which no chipping occurred during cleaning, had large and moderate bending strength, while the formed article of comparative example 2, in which chipping occurred during cleaning, had small bending strength. Further, the formed article of example 2 exhibited a greater bending strength than the formed article of example 3.
Since the content of the metal soap is 1.6 parts by mass or more per 100 parts by mass of the resin composition for mold cleaning, the resin composition of the present invention exhibits sufficient fluidity and exhibits excellent cleaning performance even when it contains softwood pulp, which tends to have a small fluidity.
As described above, according to the present invention, it is possible to provide a resin composition for mold cleaning which is excellent in both cleaning performance and workability in a step of removing a mold from a cleaned molding die. In particular, the resin composition of the present invention exhibits excellent performance even in cleaning of a mold after molding of an eco-friendly composite material which is difficult to clean.
The resin composition for mold cleaning of the present invention is a transfer-type resin composition for mold cleaning for removing contaminants originating from a thermosetting resin composition and present on the inner surface of a molding die, and is excellent in both cleaning performance and workability in a removal step from the molding die after cleaning.
Claims (7)
1. A resin composition for cleaning a mold, wherein,
comprises melamine resin, metal soap, fibrous inorganic compound and softwood pulp,
the content of the metal soap is 1.6 to 5.0 parts by mass per 100 parts by mass of the resin composition for cleaning a mold,
the content of the fibrous inorganic compound is 1.0 part by mass or more and 30.0 parts by mass or less per 100 parts by mass of the resin composition for mold cleaning,
the content of the softwood pulp is 2 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the resin composition for mold cleaning.
2. The resin composition for mold cleaning according to claim 1, wherein,
the metal soap is fatty acid zinc.
3. The resin composition for mold cleaning according to claim 2, wherein,
the fatty acid zinc includes at least one selected from the group consisting of zinc myristate, zinc laurate, and zinc stearate.
4. The resin composition for mold cleaning according to claim 1 or 2, wherein,
the fibrous inorganic compound is a ceramic fiber.
5. The resin composition for mold cleaning according to claim 4, wherein,
the ceramic fiber includes at least one selected from the group consisting of a potassium titanate fiber and an aluminum borate fiber.
6. The resin composition for mold cleaning according to claim 1 or 2, wherein,
the melamine resin contains at least one selected from the group consisting of melamine-formaldehyde resins and melamine-phenol co-condensation resins.
7. The resin composition for mold cleaning according to claim 1 or 2, wherein,
the melamine resin is impregnated in the softwood pulp.
Applications Claiming Priority (4)
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| JP2015157474 | 2015-08-07 | ||
| JP2015-157474 | 2015-08-07 | ||
| JP2016143701A JP6803165B2 (en) | 2015-08-07 | 2016-07-21 | Resin composition for mold cleaning |
| JP2016-143701 | 2016-07-21 |
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| CN106433021A CN106433021A (en) | 2017-02-22 |
| CN106433021B true CN106433021B (en) | 2020-08-14 |
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| JP (1) | JP6803165B2 (en) |
| KR (1) | KR102525580B1 (en) |
| CN (1) | CN106433021B (en) |
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| TW (1) | TWI702131B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003061935A1 (en) * | 2002-01-21 | 2003-07-31 | Nippon Carbide Kogyo Kabushiki Kaisha | Resin composition for mold cleaning |
| CN1444517A (en) * | 2000-10-11 | 2003-09-24 | 日本碳化物工业株式会社 | Resin composition for mold cleaning |
| WO2008050682A1 (en) * | 2006-10-27 | 2008-05-02 | Nippon Carbide Kogyo Kabushiki Kaisha | Resin composition for cleaning molds and recovering the release properties of molds and method for cleaning molds and recovering the release properties of molds |
| CN104066563A (en) * | 2012-01-23 | 2014-09-24 | 日本电石工业株式会社 | Resin composition for cleaning die |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0742409B2 (en) * | 1987-11-27 | 1995-05-10 | 株式会社東芝 | Mold cleaning body and mold cleaning method |
| JP3781445B2 (en) * | 1994-08-24 | 2006-05-31 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
| JP3270312B2 (en) * | 1995-10-24 | 2002-04-02 | 日本カーバイド工業株式会社 | Mold cleaning resin composition tablet |
| TWI223657B (en) * | 2000-10-18 | 2004-11-11 | Chang Chun Plastics Co Ltd | Amino resin composition for the cleaning of the mold |
| CN101626878B (en) * | 2007-03-30 | 2012-12-26 | 日本碳化物工业株式会社 | Resin composition for recovering mold releasability and method for recovering mold releasability |
| JP2014019861A (en) * | 2012-07-24 | 2014-02-03 | Nikougiken Co Ltd | Composite crystalline polymer and composite crystalline polymer product |
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2016
- 2016-07-21 JP JP2016143701A patent/JP6803165B2/en active Active
- 2016-07-28 KR KR1020160096381A patent/KR102525580B1/en active IP Right Grant
- 2016-08-01 TW TW105124278A patent/TWI702131B/en active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1444517A (en) * | 2000-10-11 | 2003-09-24 | 日本碳化物工业株式会社 | Resin composition for mold cleaning |
| WO2003061935A1 (en) * | 2002-01-21 | 2003-07-31 | Nippon Carbide Kogyo Kabushiki Kaisha | Resin composition for mold cleaning |
| WO2008050682A1 (en) * | 2006-10-27 | 2008-05-02 | Nippon Carbide Kogyo Kabushiki Kaisha | Resin composition for cleaning molds and recovering the release properties of molds and method for cleaning molds and recovering the release properties of molds |
| CN104066563A (en) * | 2012-01-23 | 2014-09-24 | 日本电石工业株式会社 | Resin composition for cleaning die |
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| TW201707920A (en) | 2017-03-01 |
| SG10201912415WA (en) | 2020-02-27 |
| TWI702131B (en) | 2020-08-21 |
| KR20170017732A (en) | 2017-02-15 |
| KR102525580B1 (en) | 2023-04-25 |
| JP2017035881A (en) | 2017-02-16 |
| CN106433021A (en) | 2017-02-22 |
| SG10201606440PA (en) | 2017-03-30 |
| JP6803165B2 (en) | 2020-12-23 |
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