CN1444517A - Resin composition for mold cleaning - Google Patents
Resin composition for mold cleaning Download PDFInfo
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- CN1444517A CN1444517A CN01813315A CN01813315A CN1444517A CN 1444517 A CN1444517 A CN 1444517A CN 01813315 A CN01813315 A CN 01813315A CN 01813315 A CN01813315 A CN 01813315A CN 1444517 A CN1444517 A CN 1444517A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A mold-cleaning resin composition for removing stains from the mold surface in the molding of a curable molding resin material, which comprises a melamine resin as a mold-cleaning resin and a fibrous inorganic compound having an average fiber length of 5 to 30 mu m, an average fiber diameter of 0.1 to 1.0 mu m, and an aspect ratio of 10 to 60.
Description
Technical field
The present invention relates to clean the resin composition for mold cleaning of electronic part encapsulation, more specifically relate to the resin composition for mold cleaning that shows good spatter property for diversified polluter with injecting molding die or transfer molding die surface.
Background technology
In the past, when forming the sealing moulding thing of integrated circuit etc. (being designated hereinafter simply as ICLSI) with thermosetting resins such as epoxy resin, if molding time is long, in most cases the mould inside surface can be contaminated, if proceed moulding, then article shaped is surperficial contaminated, and perhaps article shaped can not continue following injection operation attached on the mould.Therefore, be necessary regular cleaning die, now proposed every hundreds of the injection mouldings of moulding material just for several times injection molding clean and carry out the cleaning of mould with the ratio of resin.
Proposed among for example special public clear JP-B-52-788 to clean, and disclose the resin composition for mold cleaning that contains amino resins, organic substrate and/or inorganic substrate, releasing agent in spot based on the die surface that is used for gel-type resin moulding material (but do not comprise amino resins moulding material) molding of amino resins.The resin composition for mold cleaning of the mineral dust of the condensation resin that contains amino resins and phenol resin and new Mohs' hardness 6～15 is disclosed in the public clear JP-B-64-10162 of spy in addition.
In recent years, the thermoset resin forming material of sealing ICLSI etc. is owing to be necessary to form according to its required characteristic changing, thereby uses multiple material.Therefore because the composition of the state of the mold fouling that causes of moulding and pollutant is also varied repeatedly.Wherein, use with biphenyl based epoxy resin, multifunctional based epoxy resin, dicyclopentadiene based epoxy resin and replace previously used novolaks based epoxy resin repeatedly during moulding, to produce serious mold fouling owing to ankylose as the moulding material of principal component.The pollution especially severe of biphenyl based epoxy resin and multifunctional based epoxy resin, the necessary frequency injection of pollution that mould is provided fully with the above-mentioned resin composition for mold cleaning that provides now enlarges markedly, and causes the productivity ratio of ICLSI etc. to reduce significantly.
If consider the mechanism of cleaning, this phenomenon of pollution that is difficult to remove on the mould means that spot is stronger than the adhesion of resin composition for mold cleaning and spot with the adhesion of mould.That is to say that because the interface binding power of mould and spot uprises, perhaps mould cleans interface binding power with resin forming resin and spot any reason that dies down, and causes the cleaning performance reduction.By improving at least a in these factors, preferred two kinds, can improve cleaning performance.
As the method that is used to improve the factor that makes above-mentioned cleaning performance reduction, consider that the raising mould cleaning intensity of resin formed product, raising mould clean the modulus of the article shaped of using resin, the cleaning of raising the mould article shaped of resin and the methods such as cohesive force of spot.
Summary of the invention
The object of the present invention is to provide a kind of resin composition for mold cleaning,, also can improve the operability that mould cleans, can clean diversified pollutant component simultaneously even for serious mould spot.
The inventor in order effectively to remove because moulding material moulding and the polluter that gathers at die surface repeatedly, carried out various researchs, employed moulding material mainly comprises as epoxy resin at widely used biphenyl based epoxy resin, multifunctional based epoxy resin and dicyclopentadiene based epoxy resin in recent years.Found that by adding specific fibrous inorganic compound in the melamine based resin composition that cleans usefulness at mould, can improve the cohesive force of composition to pollutant, compare with the above-mentioned resin composition for mold cleaning that provided in the past, need not increases necessary moulding number of times, can remove polluter.
The present invention is based on that above-mentioned discovery finishes, a kind of resin composition for mold cleaning is provided, when the moulding of curable resin moulding material, be used to remove the die surface spot, it is characterized in that containing melmac and clean as mould and use resin, but also contain the fibrous inorganic compound of average fiber length 5～30 μ m, fiber diameter 0.1～1.0 μ m and ratio of height to diameter 10～60.
Preferred forms of the present invention
Below describe embodiments of the present invention in detail.
The melmac that uses among the present invention can prepare according to known method.For example make formaldehyde and melamine crystals with mol ratio 1: 1～3: 1, preferred 1.5: 1～2: 1, in the aqueous solution, react the preparation expection condensation product aqueous solution.Can be in melamine crystals concentration 20～60%, 70～100 ℃ of reaction temperatures make it reaction under the weakly alkaline condition, finish at 10～100 minutes internal reactions.
As the melmac that uses among the present invention, can also can use commercially available melmac with as mentioned above according to the known method preparation.
In addition, the melmac that uses among the present invention in the scope of not damaging effect of the present invention, can with can with other compound of melamine and formaldehyde condensation polymer, for example part of substituted melamines such as urea, benzoguanamine, phenol.The consumption of this compound is below 10 weight portions with respect to melamine 100 weight portions preferably.
In addition, above-mentioned formaldehyde can be used the aldehyde component beyond the paraformaldehyde, formaldehyde, for example aliphatic aldehydes such as acetaldehyde; Aromatic series aldehydes such as benzaldehyde; Furfural and other can replace with the aldehyde compound of melamine, formaldehyde and above-mentioned other compound reaction that can polycondensation.The consumption of this compound is below 10 weight portions with respect to formaldehyde 100 weight portions preferably.
Except melamine, can also comprise in the resin composition for mold cleaning of the present invention bring other resinae of the minor amount that dysgenic amount can mix with this melmac can not for effect of the present invention.These resins comprise alkyd resins, mylar, acrylic resin, epoxy resin, rubber-like etc.
Resin composition for mold cleaning of the present invention is owing to contain above-mentioned melmac and fibrous inorganic compound, improved the cohesive force with pollutant component etc., thereby produced good cleaning performance.
As the example of above-mentioned fibrous inorganic compound, comprise ALBOREX Y, ALBOREX M20 (above is Shikoku Chem's system), TISMO-D, TISMO-L (above is Otsuka Kagaku K.K.'s system), USB-SN-WA, MOS-HIGE (above is Ube Industries, Ltd's system) etc.Wherein preferably use ALBOREXY, but so long as average fiber length is 5～30 μ m, fiber diameter is that 0.1～1.0 μ m and ratio of height to diameter are that 10～60 fibrous inorganic compound just can use.
In addition, by above-mentioned fibrous inorganic compound being implemented surface treatment, can further improve these effects with epoxy silane compounds, amino silane compounds, methacryloxy silane compound etc. or various resin.As the example of having implemented the fibrous inorganic compound of above-mentioned surface-treated, comprise ALBOREX YS3A, ALBOREXYS2B, ALBOREX YS4 (above change into Co., Ltd.'s system for four countries) and TISMO-D101, TISMO-D102 (above be Otsuka Kagaku K.K.'s system) etc.
The content of above-mentioned fibrous inorganic compound cleans with resin 100 weight portions with respect to mould, preferred 1～30 weight portion, more preferably 5～20 weight portions, preferred especially 5～10 weight portions.If the content of above-mentioned fibrous inorganic compound is lower than 1 weight portion, then cleaning performance is not enough.If fibrous inorganic compound content surpasses 30 weight portions, the mobile variation of resin composition for mold cleaning then, and because this fibrous inorganic compound costs an arm and a leg, be not very wise move at economic aspect.
Also can contain paper pulp in the resin composition for mold cleaning of the present invention.As this paper pulp, can use straw pulp, bamboo pulp, wood pulp (softwood pulp, broad leaf tree slurry) etc., can use chemical pulp, any one paper pulp of mechanical pulp in addition.
In addition, as above-mentioned paper pulp, also can use paper pulp (melamine class Tetefol slurry) with the melmac dipping.
Above-mentioned melamine resinoid comprises melmac, melamine-phenol condensation polymer or melamine-urea condensation polymer etc.This melamine-phenol condensation polymer is the product that is obtained by polycondensations such as aldehydes such as triazines such as melamine, phenol, formaldehyde, and this melamine-urea condensation polymer is the product that triazines, ureas and aldehyde condensation polymers such as melamine obtain.
Above-mentioned melamine resinoid preferably uses with the state of the aqueous solution, and for example above-mentioned melamine class Tetefol slurry can be by the impregnated melamine resinoid aqueous solution in paper pulp, and drying is prepared then.
In addition, also part or all of above-mentioned paper pulp powder paper pulp can be replaced to, flowability can be improved like this.
There is no particular limitation for the size of above-mentioned paper pulp, is generally about 5～1000 μ m, preferred about 10～200 μ m.
In addition, the content of above-mentioned paper pulp cleans with resin 100 weight portions with respect to mould, is generally 5～70 weight portions, preferred 20～60 weight portions.
In addition, resin composition for mold cleaning of the present invention also can contain mineral dust.As mineral dust, natural materials such as preference such as corundum, diamond dust, garnet, silica, and the oxidation or the carbide of silicon, iron, titanium, sodium, calcium, magnesium, aluminium, chromium, boron etc.Described oxide or carbide comprise silica, magnesia, aluminium oxide, carborundum, boron carbide etc.
Above-mentioned mineral dust preferred hardness is new Mohs' hardness 6～15.
There is no particular limitation for above-mentioned mineral dust granularity, generally can be #100～#4000, is preferably #100～#2000, more preferably #100～#1000.If granularity less than #4000, then is easy to generate the cleaning performance variation, and when operation produce dust, operating environment is worsened.If granularity, then is easy to generate the mould damage greater than #100, cleans shortcomings such as inhomogeneous.
The content of above-mentioned mineral dust is not special to be limited, and cleans with resin 100 weight portions, preferred 10～90 weight portions, more preferably 10～30 weight portions with respect to mould.
In addition, resin composition for mold cleaning of the present invention can contain lubricant.Described lubricant comprises metallic soaps such as zinc stearate, calcium stearate and Zinc tetradecanoate, aliphatic acid such as stearic acid, oleic acid and behenic acid; Fatty acid esters such as butyl stearate, stearic acid dodecyl ester; Fatty acid partial esters such as glyceryl monostearate, glycerin mono-fatty acid ester, glycerine monohydroxy stearic acid, pentaerythritol stearate, polyglycereol stearate, sorbitan trioleate; Fatty acid acyl amines such as lauramide, myristamide, erucyl amide, oleamide, stearmide; Aliphatic acid diamides such as methylene distearyl acid acid amides, ethylene bis-stearamide, ethylene oleamide etc.In order to keep good mould cleaning, the content of above-mentioned lubricant is below 1.5 weight portions with respect to resin composition for mold cleaning 100 weight portions, preferred 1 weight portion or following.
Resin composition for mold cleaning of the present invention also can contain other additives such as inorganic and organic filler, colouring agent, curing catalysts, the lubricant except that above-mentioned lubricant and antioxidant except that above-mentioned mineral dust.As the instantiation of this additive, comprise wood powder, vinylon fiber, glass dust, glass fibre, inorganic or organic fillers such as carbonic acid calcium, talcum, aluminium hydroxide, barium sulfate, zinc sulphide are untreated; Inorganic pigments such as titanium dioxide, carbon black, zinc white, cadmium yellow, colcother, organic pigments such as phthalocyanines, azo class, diazonium class, fluorescent pigments such as benzoxazoles class, naphthothiazoles class, Coumarins, colouring agents such as dyestuff such as anthraquinone class, indigo class, azo class; Organic acids such as phthalic anhydride, oxalic acid, sulfamic acid, p-methyl benzenesulfonic acid, inorganic acids such as hydrochloric acid, sulfuric acid, the curing catalysts such as salt of these acids and triethylamine, triethanolamine, beta-dimethyl-ethylaminoethanol, 2-methyl-2-amino-1-propyl alcohol etc.; Lubricants such as zinc stearate, stearmide, methylol stearmide, methylene distearyl acid amides, para toluene sulfonamide, cetanol, paraffin, silicone oil; Antioxidants such as naphthylamines class antioxidant, p-phenylenediamine (PPD) class antioxidant, thiobis phenols antioxidant etc.
Resin composition for mold cleaning of the present invention preferably contains at least a in mineral dust, curing catalysts and the lubricant that is selected from melamine class Tetefol slurry, granularity #100～#4000.
An example of the optimization formula of resin composition for mold cleaning of the present invention is as follows.
(A) melmac 100 weight portions
(B) paper pulp 5～70 weight portions
(C) mineral dust 10～90 weight portions of granularity #100～#4000
(D) fibrous inorganic compound 1～30 weight portion of average fiber length 5～30 μ m, fiber diameter 0.1～1.0 μ m and ratio of height to diameter 10～60
When preparation resin composition for mold cleaning of the present invention, can adopt can be with resin, paper pulp, mineral dust and the mixed uniformly any means of other additive kind of melmac, fibrous inorganic compound and other minor amount of using as required.These methods comprise kneader, ribbon blender, Henschel mixer, ball mill, roll mill, grinder and barrel mixer.
Curable resin moulding material as the mould that uses resin composition for mold cleaning of the present invention to clean comprises epoxy resin molding material and phenolic resin moulding material etc., the preferred epoxy moulding material, special preferred semiconductor encapsulating epoxy resin moulding material.Any mould that resin composition for mold cleaning of the present invention uses in the time of can being used for this curable resin moulding material automatic moulding.Generally go for the mould that iron, chromium etc. are made.
Describe the present invention in detail below in conjunction with embodiment, but the present invention is not limited to these embodiment.
Reference example 1
Make melamine 346 weight portions and formalin (37% aqueous solution) 522 weight portions and phenol 131 weight portions add thermal response, prepare melamine resin according to known method.Add paper pulp 248 weight portions in the resin liquid that obtains, mixture is mediated, drying under reduced pressure makes pulp content and is 27% melamine resin powder (melamine class Tetefol slurry).
Reference example 2
Make melamine 480 weight portions and formalin (37% aqueous solution) 522 weight portions add thermal response, prepare melamine resin(a) according to known method.In the resin liquid that obtains, add paper pulp 248 weight portions.Mixture is mediated, and drying under reduced pressure makes pulp content and is 27% melamine resin(a) powder (melamine class Tetefol slurry).
Embodiment 1
The melamine class Tetefol that reference example 1 is obtained is starched 30 weight portions, commercially available melmac (Japanese Carbide Industrial Co., Ltd system, Nikaresin S-176) Cab-O-sil 20 weight portions of 50 weight portions, granularity #200, aluminium borate (Shikoku Chem's system, ALBOREX YS4) 5 weight portions, benzoic acid 0.2 weight portion, zinc stearate 0.5 weight portion and ethylene bis stearamide 0.3 weight portion mix pulverizing with ball mill, make resin composition for mold cleaning A.
The characteristic value of the resin composition for mold cleaning that obtains and the result of the test of cleaning are recorded in the table 1.Judge that according to result of the test resin composition for mold cleaning A shows excellent cleaning effect.
Embodiment 2
The melamine class Tetefol that reference example 1 is obtained is starched melamine class Tetefol that 1 weight portion, reference example 2 obtain and is starched 29 weight portions, commercially available melmac (Japanese Carbide Industrial Co., Ltd system, Nikaresin S-176) Cab-O-sil 20 weight portions of 50 weight portions, granularity #200, aluminium borate (Shikoku Chem's system, ALBOREXYS4) 5 weight portions, benzoic acid 0.2 weight portion, zinc stearate 0.5 weight portion and ethylene bis stearamide 0.3 weight portion mix pulverizing with ball mill, make resin composition for mold cleaning B.
The characteristic value of the resin composition for mold cleaning that obtains and the result of the test of cleaning are recorded in the table 1.Judge that according to result of the test resin composition for mold cleaning B shows excellent cleaning effect.
Embodiment 3
The melamine class Tetefol that reference example 2 is obtained is starched 30 weight portions, commercially available melmac (Japanese Carbide Industrial Co., Ltd system, Nikaresin S-176) Cab-O-sil 20 weight portions of 50 weight portions, granularity #200, aluminium borate (Shikoku Chem's system, ALBOREX YS4) 5 weight portions, benzoic acid 0.2 weight portion, zinc stearate 0.5 weight portion and ethylene bis stearamide 0.3 weight portion mix pulverizing with ball mill, make resin composition for mold cleaning C.
The characteristic value of the resin composition for mold cleaning that obtains and the result of the test of cleaning are recorded in the table 1.Judge that according to result of the test resin composition for mold cleaning C shows excellent cleaning effect.
Embodiment 4
Identical with embodiment 1, except the amount of aluminium borate (Shikoku Chem's system, ALBOREX YS4) is changed into 20 weight portions, make resin composition for mold cleaning D.
The characteristic value of the resin composition for mold cleaning that obtains and the result of the test of cleaning are recorded in the table 1.Judge that according to result of the test resin composition for mold cleaning D shows excellent cleaning effect.
Comparative example 1
Identical with embodiment 1, except the amount of aluminium borate (Shikoku Chem's system) ALBOREX YS4 is changed into 0 weight portion, make resin composition for mold cleaning E.
Comparative example 2
Identical with embodiment 1, except with the kind of aluminium borate by the particle shape aluminium borate ALBORITE PC08 (Shikoku Chem's system) that ALBOREX YS4 (Shikoku Chem's system) changes into medium particle diameter 8 μ m, make resin composition for mold cleaning F.
Comparative example 3
Identical with embodiment 3, except the amount of aluminium borate (Shikoku Chem's system, ALBOREX YS4) is changed into 0 weight portion, make resin composition for mold cleaning G.
Comparative example 4
Identical with embodiment 1, except the amount of aluminium borate (Shikoku Chem's system, ALBOREX YS4) is changed into 40 weight portions, make resin composition for mold cleaning H.
Use the resin composition for mold cleaning of A～H,, implement the mould washing test according to following test method.The result is recorded in the table 1.
Test method
(Hitachi changes into Co., Ltd.'s system, CEL-9200XU), with the mould of TQFP, by 500 injection moulding, realizes the pollution of mould to use commercially available biphenyl based epoxy resin moulding material.By using the mould of this pollution, with resin composition for mold cleaning repeatedly moulding clean up up to die surface, estimate.
Table 1
| Resin composition for mold cleaning | Characteristic value | Cleaning needs the injection number | |||
| Curing property (second) | Mobile (cm) | ||||
| Embodiment | ????1 | ????A | ????330 | ????52 | ????6 |
| ????2 | ????B | ????320 | ????48 | ????6 | |
| ????3 | ????C | ????316 | ????46 | ????6 | |
| ????4 | ????D | ????305 | ????38 | ????6 | |
| Comparative example | ????1 | ????E | ????323 | ????55 | ????14 |
| ????2 | ????F | ????335 | ????54 | ????10 | |
| ????3 | ????G | ????302 | ????54 | ????10 | |
| ????4 | ????H | ????290 | ????23 | ????12 | |
Reference example 3
Make melamine 346 weight portions and formalin (37% aqueous solution) 522 weight portions add thermal response, prepare melamine resin(a), in the resin liquid that obtains, add paper pulp 95 weight portions according to known method.Mixture is mediated, and drying under reduced pressure makes pulp content and is 15% melamine formaldehyde resin powder (melamine class Tetefol slurry).
Reference example 4
Make melamine 346 weight portions and formalin (37% aqueous solution) 522 weight portions and phenol 131 weight portions add thermal response, prepare melamine resin according to known method.In the resin liquid that obtains, add paper pulp 120 weight portions.Mixture is mediated, and drying under reduced pressure makes pulp content and is 15% melamine resin powder (melamine class Tetefol slurry).
Embodiment 5
The melamine class Tetefol that reference example 3 obtains is starched 100 weight portions (pulp content 15 weight portions), commercially available melmac (Japanese Carbide Industrial Co., Ltd system, Nikaresin S-176) 100 weight portions, powder paper pulp 8 weight portions are (with respect to melmac 100 portions of paper pulp by weight amounts: 12.4 weight portions), Cab-O-sil 51 weight portions of granularity #200 are (with respect to the Cab-O-sil amount of melmac 100 weight portions: 27.6 weight portions), aluminium borate (Shikoku Chem's system, ALBOREX YS4) 10 weight portions are (with respect to the aluminium borate amount of melmac 100 weight portions: 5.4 weight portions), benzoic acid 0.2 weight portion is (with respect to the benzoic acid amount of melmac 100 weight portions: 0.1 weight portion), zinc stearate 1.5 weight portions (with respect to the zinc stearate amount of melmac 100 weight portions: 0.8 weight portion) and ethylene bis stearamide 0.8 weight portion (with respect to the ethylene stearic acid amount of melmac 100 weight portions: 0.4 weight portion) mix with ball mill and pulverize, make resin composition for mold cleaning I.
The characteristic value of the resin composition for mold cleaning that obtains and the result of the test of cleaning are recorded in the table 2.Judge that according to result of the test resin composition for mold cleaning I shows excellent cleaning effect.
Embodiment 6
The melamine class Tetefol that reference example 3 obtains is starched 40 weight portions (pulp content 6 weight portions), commercially available melmac (Japanese Carbide Industrial Co., Ltd system, Nikaresin S-176) 110 weight portions, powder paper pulp 12 weight portions are (with respect to melmac 100 portions of paper pulp by weight amounts: 12.5 weight portions), Cab-O-sil 40 weight portions of granularity #200 are (with respect to the Cab-O-sil amount of melmac 100 weight portions: 27.8 weight portions), aluminium borate (Shikoku Chem's system, ALBOREX YS4) 15 weight portions are (with respect to the aluminium borate amount of melmac 100 weight portions: 10.4 weight portions), benzoic acid 0.2 weight portion, zinc stearate 1.2 weight portions and ethylene bis stearamide 0.6 weight portion mix with ball mill to be pulverized, and makes resin composition for mold cleaning J.
The characteristic value of the resin composition for mold cleaning that obtains and the result of the test of cleaning are recorded in the table 2.Judge that according to result of the test resin composition for mold cleaning J shows excellent cleaning effect.
Embodiment 7
With commercially available melmac (Japanese Carbide Industrial Co., Ltd system, Nikaresin S-176) Cab-O-sil 28 weight portions of 100 weight portions, powder paper pulp 30 weight portions, granularity #200, aluminium borate (Shikoku Chem's system, ALBOREX YS4) 5 weight portions, benzoic acid 0.1 weight portion, zinc stearate 0.8 weight portion and ethylene bis stearamide 0.4 weight portion mix pulverizing with ball mill, make resin composition for mold cleaning K.
The characteristic value of the resin composition for mold cleaning that obtains and the result of the test of cleaning are recorded in the table 2.Judge that according to result of the test resin composition for mold cleaning K shows excellent cleaning effect.
Embodiment 8
Except that the melamine class Tetefol slurry that obtains for the reference example 3 among the embodiment 5 impregnating resin pulp powder last reign of a dynasty of using reference example 4 to obtain, similarly to Example 5, mix with ball mill and to pulverize, make mould composition for cleaning L.
The characteristic value of the resin composition for mold cleaning that obtains and the result of the test of cleaning are recorded in the table 2.Judge that according to result of the test resin composition for mold cleaning L shows excellent cleaning effect.
Use the resin composition for mold cleaning of I～L, according to the same test method of occasion of the resin composition for mold cleaning of above-mentioned A～H, implement the mould washing test, the result is recorded in the table 2.
Table 2
| Embodiment | Resin composition for mold cleaning | Characteristic value | Clean and finish the injection number | |
| Curing property (second) | Mobile (cm) | |||
| ????5 | ????I | ????330 | ????52 | ????6 |
| ????6 | ????J | ????326 | ????48 | ????6 |
| ????7 | ????K | ????332 | ????55 | ????6 |
| ????8 | ????L | ????334 | ????53 | ????7 |
Industrial applicibility
Even significant mould spot, resin composition for mold cleaning of the present invention also can improve the operability that mould cleans, and can clean diversified pollutant component simultaneously.
Claims (8)
1, a kind of resin composition for mold cleaning, be used for when the moulding of curable resin moulding material, removing the die surface spot, it is characterized in that containing melmac and clean as mould and use resin, but also contain the fibrous inorganic compound of average fiber length 5～30 μ m, fiber diameter 0.1～1.0 μ m and ratio of height to diameter 10～60.
2, resin composition for mold cleaning as claimed in claim 1, it is 1～30 weight portion that the content of wherein said fibrous inorganic compound cleans with resin with respect to this mould of 100 weight portions.
3, resin composition for mold cleaning as claimed in claim 1, wherein said fibrous inorganic compound are the materials after surface treatment.
4, resin composition for mold cleaning as claimed in claim 1 further contains at least a in mineral dust, curing catalysts and the lubricant that is selected from melamine class Tetefol slurry, granularity #100～#4000.
5, resin composition for mold cleaning is used for removing the die surface spot when the moulding of curable resin moulding material, it is characterized in that containing following (A)～(D) component:
(A) melmac 100 weight portions
(B) paper pulp 5～70 weight portions
(C) mineral dust 10～90 weight portions of granularity #100～#4000
(D) fibrous inorganic compound 1～30 weight portion of average fiber length 5～30 μ m, fiber diameter 0.1～1.0 μ m and ratio of height to diameter 10～60.
6, resin composition for mold cleaning as claimed in claim 5, part or all of wherein said paper pulp are powder paper pulp.
7, resin composition for mold cleaning as claimed in claim 5, wherein said paper pulp comprise melamine class Tetefol slurry.
8, resin composition for mold cleaning as claimed in claim 5, wherein said fibrous inorganic compound are the materials after surface treatment.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000310127 | 2000-10-11 | ||
| JP310127/2000 | 2000-10-11 | ||
| JP310127/00 | 2000-10-11 | ||
| JP331629/00 | 2000-10-31 | ||
| JP2000331629 | 2000-10-31 | ||
| JP331629/2000 | 2000-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1444517A true CN1444517A (en) | 2003-09-24 |
| CN1225349C CN1225349C (en) | 2005-11-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB018133150A Expired - Lifetime CN1225349C (en) | 2000-10-11 | 2001-10-02 | Resin composition for mold cleaning |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP4262476B2 (en) |
| KR (1) | KR100545249B1 (en) |
| CN (1) | CN1225349C (en) |
| HK (1) | HK1058648A1 (en) |
| MY (1) | MY140695A (en) |
| TW (1) | TW537956B (en) |
| WO (1) | WO2002030648A1 (en) |
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| CN103702813A (en) * | 2011-07-15 | 2014-04-02 | 日本电石工业株式会社 | Mold-cleaning resin composition |
| CN104066563A (en) * | 2012-01-23 | 2014-09-24 | 日本电石工业株式会社 | Resin composition for cleaning die |
| CN105773882A (en) * | 2016-04-19 | 2016-07-20 | 上海东恒化工有限公司 | Composition for die cleaning and die cleaning method |
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| JP3847259B2 (en) * | 2001-04-25 | 2006-11-22 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
| JP5409522B2 (en) * | 2010-06-01 | 2014-02-05 | 旭化成ケミカルズ株式会社 | Washing soap |
| CN105291347A (en) * | 2015-09-08 | 2016-02-03 | 合肥邦立电子股份有限公司 | Packaging production process of reed switch |
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| JPS55113517A (en) * | 1979-02-23 | 1980-09-02 | Nippon Carbide Ind Co Ltd | Resin composition for cleaning metallic mold |
| JPS58113242A (en) * | 1981-12-25 | 1983-07-06 | Mitsubishi Rayon Co Ltd | Delustering impact-resistant resin composition |
| JPS59126426A (en) * | 1983-01-06 | 1984-07-21 | Matsushita Electric Works Ltd | Resin molding material for cleaning mold |
| JP2978308B2 (en) * | 1991-11-15 | 1999-11-15 | 松下電工株式会社 | Mold cleaning resin composition |
| JPH06200041A (en) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | Production of molding material |
| JP3328424B2 (en) * | 1994-04-25 | 2002-09-24 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
| JP3301870B2 (en) * | 1994-08-24 | 2002-07-15 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
| JP3781445B2 (en) * | 1994-08-24 | 2006-05-31 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
| JP3783042B2 (en) * | 1995-08-23 | 2006-06-07 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
| JP3270315B2 (en) * | 1995-10-31 | 2002-04-02 | 日本カーバイド工業株式会社 | Mold cleaning resin composition tablet |
| JPH09123184A (en) * | 1995-11-06 | 1997-05-13 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
-
2001
- 2001-10-02 KR KR1020027016088A patent/KR100545249B1/en active IP Right Grant
- 2001-10-02 CN CNB018133150A patent/CN1225349C/en not_active Expired - Lifetime
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- 2001-10-02 WO PCT/JP2001/008678 patent/WO2002030648A1/en active IP Right Grant
- 2001-10-05 MY MYPI20014649A patent/MY140695A/en unknown
- 2001-10-11 TW TW090125097A patent/TW537956B/en not_active IP Right Cessation
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102333627A (en) * | 2009-03-10 | 2012-01-25 | 大赛璐高分子株式会社 | Resin composition for cleaning of resin molding machines |
| CN103702813A (en) * | 2011-07-15 | 2014-04-02 | 日本电石工业株式会社 | Mold-cleaning resin composition |
| CN103702813B (en) * | 2011-07-15 | 2016-03-30 | 日本电石工业株式会社 | Resin composition for cleaning mold |
| CN104066563A (en) * | 2012-01-23 | 2014-09-24 | 日本电石工业株式会社 | Resin composition for cleaning die |
| CN104066563B (en) * | 2012-01-23 | 2016-12-14 | 日本电石工业株式会社 | Resin composition for cleaning mold |
| CN103526214A (en) * | 2013-09-05 | 2014-01-22 | 汉中锌业有限责任公司 | Cleaning method of zinc ingot moulds in wet-process zinc smelting |
| CN103526214B (en) * | 2013-09-05 | 2015-12-09 | 汉中锌业有限责任公司 | The method for cleaning of zinc ingot metal mould in a kind of zinc hydrometallurgy |
| CN106433021A (en) * | 2015-08-07 | 2017-02-22 | 日本电石工业株式会社 | Resin Composition For Cleaning Die |
| CN106433021B (en) * | 2015-08-07 | 2020-08-14 | 日本电石工业株式会社 | Resin composition for cleaning mold |
| CN105773882A (en) * | 2016-04-19 | 2016-07-20 | 上海东恒化工有限公司 | Composition for die cleaning and die cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030045676A (en) | 2003-06-11 |
| HK1058648A1 (en) | 2004-05-28 |
| MY140695A (en) | 2010-01-15 |
| CN1225349C (en) | 2005-11-02 |
| TW537956B (en) | 2003-06-21 |
| KR100545249B1 (en) | 2006-01-24 |
| WO2002030648A1 (en) | 2002-04-18 |
| JP4262476B2 (en) | 2009-05-13 |
| JPWO2002030648A1 (en) | 2004-02-19 |
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