JPWO2002030648A1 - Mold cleaning resin composition - Google Patents
Mold cleaning resin composition Download PDFInfo
- Publication number
- JPWO2002030648A1 JPWO2002030648A1 JP2002534058A JP2002534058A JPWO2002030648A1 JP WO2002030648 A1 JPWO2002030648 A1 JP WO2002030648A1 JP 2002534058 A JP2002534058 A JP 2002534058A JP 2002534058 A JP2002534058 A JP 2002534058A JP WO2002030648 A1 JPWO2002030648 A1 JP WO2002030648A1
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- mold
- resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 113
- 239000011342 resin composition Substances 0.000 title claims abstract description 69
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 66
- 239000004640 Melamine resin Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 238000000465 moulding Methods 0.000 claims abstract description 19
- 239000012778 molding material Substances 0.000 claims abstract description 18
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 17
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 17
- 239000000835 fiber Substances 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims description 28
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 14
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 12
- 239000011707 mineral Substances 0.000 claims description 12
- 239000000314 lubricant Substances 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 22
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 19
- 239000003822 epoxy resin Substances 0.000 description 16
- 229920000647 polyepoxide Polymers 0.000 description 16
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 14
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 235000010755 mineral Nutrition 0.000 description 10
- 239000000377 silicon dioxide Substances 0.000 description 9
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 9
- -1 aliphatic aldehydes Chemical class 0.000 description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 8
- 239000005711 Benzoic acid Substances 0.000 description 7
- 235000010233 benzoic acid Nutrition 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- 229920003180 amino resin Polymers 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- CGXBXJAUUWZZOP-UHFFFAOYSA-N formaldehyde;phenol;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 CGXBXJAUUWZZOP-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229920001131 Pulp (paper) Polymers 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 150000004665 fatty acids Chemical class 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- LDGZSKOAALVKLH-UHFFFAOYSA-N ethene octadecanoic acid Chemical compound C=C.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O LDGZSKOAALVKLH-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- NJNNJTZOZPHSRA-UHFFFAOYSA-N octatriacontanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O NJNNJTZOZPHSRA-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- JYIZNFVTKLARKT-UHFFFAOYSA-N phenol;1,3,5-triazine-2,4,6-triamine Chemical compound OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 JYIZNFVTKLARKT-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 150000003918 triazines Chemical class 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- MXJJJAKXVVAHKI-WRBBJXAJSA-N (9z,29z)-octatriaconta-9,29-dienediamide Chemical compound NC(=O)CCCCCCC\C=C/CCCCCCCCCCCCCCCCCC\C=C/CCCCCCCC(N)=O MXJJJAKXVVAHKI-WRBBJXAJSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- NLSFWPFWEPGCJJ-UHFFFAOYSA-N 2-methylprop-2-enoyloxysilicon Chemical compound CC(=C)C(=O)O[Si] NLSFWPFWEPGCJJ-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- YTZPUTADNGREHA-UHFFFAOYSA-N 2h-benzo[e]benzotriazole Chemical compound C1=CC2=CC=CC=C2C2=NNN=C21 YTZPUTADNGREHA-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241000218631 Coniferophyta Species 0.000 description 1
- UAUDZVJPLUQNMU-UHFFFAOYSA-N Erucasaeureamid Natural products CCCCCCCCC=CCCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-UHFFFAOYSA-N 0.000 description 1
- SHBUUTHKGIVMJT-UHFFFAOYSA-N Hydroxystearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OO SHBUUTHKGIVMJT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- TXQVDVNAKHFQPP-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(CO)(CO)CO TXQVDVNAKHFQPP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- CJOBVZJTOIVNNF-UHFFFAOYSA-N cadmium sulfide Chemical compound [Cd]=S CJOBVZJTOIVNNF-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229960000541 cetyl alcohol Drugs 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
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- 239000010431 corundum Substances 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 1
- JRTVEUGOGWTHTR-UHFFFAOYSA-N dodecyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCCCCCCC JRTVEUGOGWTHTR-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
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- 150000002148 esters Chemical class 0.000 description 1
- ZJOLCKGSXLIVAA-UHFFFAOYSA-N ethene;octadecanamide Chemical compound C=C.CCCCCCCCCCCCCCCCCC(N)=O.CCCCCCCCCCCCCCCCCC(N)=O ZJOLCKGSXLIVAA-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
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- 239000002223 garnet Substances 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- FEEPBTVZSYQUDP-UHFFFAOYSA-N heptatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O FEEPBTVZSYQUDP-UHFFFAOYSA-N 0.000 description 1
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- 229910052749 magnesium Inorganic materials 0.000 description 1
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- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- QEALYLRSRQDCRA-UHFFFAOYSA-N myristamide Chemical compound CCCCCCCCCCCCCC(N)=O QEALYLRSRQDCRA-UHFFFAOYSA-N 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- JHOKTNSTUVKGJC-UHFFFAOYSA-N n-(hydroxymethyl)octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCO JHOKTNSTUVKGJC-UHFFFAOYSA-N 0.000 description 1
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- WGOROJDSDNILMB-UHFFFAOYSA-N octatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O WGOROJDSDNILMB-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229940105125 zinc myristate Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- GBFLQPIIIRJQLU-UHFFFAOYSA-L zinc;tetradecanoate Chemical compound [Zn+2].CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O GBFLQPIIIRJQLU-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
硬化性樹脂成形材料の成形時、金型表面の汚れを取り除く金型清掃用樹脂組成物において、金型清掃用樹脂としてメラミン樹脂を含有させ、且つ、平均繊維長５〜３０μｍ、平均繊維径０．１〜１．０μｍ及びアスペクト比１０〜６０の繊維状無機化合物を含有させた、金型清掃用樹脂組成物である。When molding a curable resin molding material, the mold cleaning resin composition for removing stains on the mold surface contains a melamine resin as the mold cleaning resin, and has an average fiber length of 5 to 30 μm and an average fiber diameter of 0. A mold cleaning resin composition containing a fibrous inorganic compound having a thickness of 0.1 to 1.0 μm and an aspect ratio of 10 to 60.
Description
技術分野
本発明は、電子部品封止用射出成形用金型やトランスファー成形用金型表面を清掃する金型清掃用樹脂組成物に関し、多種多様の汚染物質に対して、良好な清掃性を示す金型清掃用樹脂組成物に関する。
背景技術
従来、エポキシ樹脂等の熱硬化性樹脂による集積回路等（以下ＩＣ・ＬＳＩと略記する）の封止成形物の成形を長時間続けると、金型内部表面が汚れ、そのまま連続して成形を続けると、成形品の表面が汚れたり、成形品が金型に付着して成形作業が続けられなくなる場合が多々あった。そのため、金型を定期的に清掃する必要があり、成形材料数百ショット成形する毎に数ショットの割合で金型清掃用樹脂を成形して金型清掃を行う方法が提案されている。
例えば、特公昭５２−７８８号公報には、「硬化性樹脂成形材料（但しアミノ系樹脂成形材料を除く）の成形時における金型表面の汚れをアミノ系樹脂を主体とする材料で成形することによって、清掃する方法」が提案され、アミノ系樹脂、有機質基材及び／又は無機質基材、離型剤からなる金型清掃用樹脂組成物が開示されている。また、特公昭６４−１０１６２号公報には、アミノ系樹脂とフェノール樹脂との共縮合樹脂及び新モース硬度６〜１５の鉱物性粉体を含有してなる金型清掃用樹脂組成物が開示されている。
近年、ＩＣ・ＬＳＩ等を封止する熱硬化性樹脂成形材料は、その要求特性によって組成を変える必要があるため、多種類のものが用いられており、従って、成形の繰り返しにより発生する金型汚染の状態及び汚染物の成分も多種多様である。これらの中でも、従来から使用されているノボラック系のエポキシ樹脂に代わって、ビフェニル系エポキシ樹脂、多官能系エポキシ樹脂、ジシクロペンタジエン系エポキシ樹脂を主成分として使用してなる成形材料を用いて成形を繰り返した際の金型汚染物は、金型表面に対する焼付けがひどく、特にビフェニル系エポキシ樹脂や多官能系エポキシ樹脂の汚れはひどく、従来提供されている上記の金型清掃用樹脂組成物では、金型の汚れを完全に除去するために必要な成形回数が著しく増大しており、ＩＣ・ＬＳＩ等の生産性を大幅に低下させるという問題を生じている。
金型上の汚れが除去し難いという現象は、クリーニングの機構から考えると、金型清掃用樹脂組成物と汚れが結合する力よりも汚れと金型が結合する力の方が強いということを意味している。即ち、金型と汚れとの界面の結合力が高くなったか、あるいは金型清掃用樹脂成形物と汚れとの界面の結合力が弱くなったかの何れかの理由によりクリーニング性の低下を生じている。これらの要因の少なくとも一方、好ましくは両方を改善することによりクリーニング性能を向上させることが可能となる。
上記のクリーニング性能を低下させる要因を改善するための方法としては、金型清掃用樹脂成形物の強度を向上させる、金型清掃用樹脂成形物のモジュラスを向上させる、金型清掃用樹脂成形物と汚れとの接着力を向上させる等の方法が考えられる。
発明の開示
本発明の目的は、著しい金型汚れでも金型清掃の作業性を高めることができるとともに、多種多様の汚染成分をも清掃できる金型清掃用樹脂組成物を提供することにある。
本発明者らは、近年、エポキシ樹脂として多用されているビフェニル系エポキシ樹脂、多官能系エポキシ樹脂及びジシクロペンタジエン系エポキシ樹脂を主成分とする成形材料を用いた成形の繰り返しにより形成された金型表面の汚染物質を効果的に除去するするために、種々検討した結果、特定の繊維状無機化合物を金型清掃用メラミン系樹脂組成物に配合することにより、汚染物への接着力が高まり、従来提供されている上記の金型清掃用樹脂組成物に比べて、必要な成形回数が増大することなく、汚染物質を除去できることを知見した。
本発明は、上記知見に基づいてなされたもので、硬化性樹脂成形材料の成形時、金型表面の汚れを取り除く金型清掃用樹脂組成物において、金型清掃用樹脂としてメラミン樹脂を含有し、且つ、平均繊維長５〜３０μｍ、平均繊維径０．１〜１．０μｍ及びアスペクト比１０〜６０の繊維状無機化合物を含有することを特徴とする金型清掃用樹脂組成物を提供するものである。
発明を実施するための最良の形態
以下本発明の実施の形態について詳しく説明する。
本発明で用いられるメラミン樹脂は、公知の方法により製造することができる。例えば、ホルムアルデヒドとメラミンクリスタルとをモル比１：１〜３：１、有利には１．５：１〜２：１で水溶液中で反応させて初期縮合物水溶液を製造する。メラミンクリスタル濃度２０〜６０％、反応温度７０〜１００℃、弱アルカリ性で反応させることができ、１０〜１００分間で反応は完了する。
本発明で用いられるメラミン樹脂としては、上記のように公知の方法により製造したものでもよく、また市販のメラミン樹脂を用いることもできる。
なお、本発明で用いられるメラミン樹脂は、本発明の効果を損なわない範囲において、メラミンの一部を、メラミン及びホルムアルデヒドと共縮合可能な他の化合物、例えば尿素、ベンゾグアナミン、フェノール等で置き換えることができる。このような化合物の使用量は、メラミン１００重量部に対して、１０重量部以下が好ましい。
また、前記ホルムアルデヒドは、その一部を、パラホルムアルデヒド、ホルムアルデヒド以外のアルデヒド成分、例えばアセトアルデヒド等の脂肪族アルデヒド類；ベンズアルデヒド等の芳香族アルデヒド類；フルフラール；その他「メラミン、ホルムアルデヒド及び上記の共縮合可能な他の化合物と反応し得るアルデヒド化合物」によって置き換えることができる。このような化合物の使用量は、ホルムアルデヒド１００重量部に対して、１０重量部以下が好ましい。
本発明の金型清掃用樹脂組成物には、メラミン樹脂の他に、該メラミン樹脂とブレンド可能な副次量の他の樹脂類を、本発明の効果に悪影響を与えない量で配合することができる。このような樹脂類としては、アルキッド樹脂、ポリエステル樹脂、アクリル系樹脂、エポキシ樹脂、ゴム類等を例示できる。
本発明の金型清掃用樹脂組成物は、前記のメラミン樹脂及び繊維状無機化合物を含有することにより、汚れ成分等との接着力が向上し、優れたクリーニング効果を示す。
上記繊維状無機化合物の例としては、アルボレックスＹ、アルボレックスＭ２０（以上、四国化成工業株式会社製）、ティスモ−Ｄ、ティスモ−Ｌ（以上、大塚化学株式会社製）、ＵＳＢ−ＳＮ−ＷＡ、モスハイジ（以上、宇部興産株式会社製）等が挙げられ、これらの中でもアルボレックスＹが好適に用いられるが、平均繊維長５〜３０μｍ、平均繊維径０．１〜１．０μｍ及び、アスペクト比が１０〜６０である繊維状無機化合物であれば使用可能である。
また、上記繊維状無機化合物にエポキシシラン系、アミノシラン系、メタクリロキシシラン系等や各種樹脂による表面処理を施すことにより、これらの効果をさらに高めることが可能となる。上記の表面処理を施した繊維状無機化合物の例としては、アルボレックスＹＳ３Ａ、アルボレックスＹＳ２Ｂ、アルボレックスＹＳ４（以上、四国化成工業株式会社製）、ティスモ−Ｄ１０１、ティスモ−Ｄ１０２（以上、大塚化学株式会社製）等が挙げられる。
上記繊維状無機化合物の含有量は、金型清掃用樹脂１００重量部に対して、好ましくは１〜３０重量部、より好ましくは５〜２０重量部、特に好ましくは５〜１０重量部である。上記繊維状無機化合物の含有量が１重量部未満では、清掃効果に乏しく、３０重量部超では、金型清掃用樹脂組成物の流動性が悪くなる上、該繊維状無機化合物は高価であるので経済的にも得策ではない。
本発明の金型清掃用樹脂組成物には、パルプを含有させてもよい。該パルプとしては、藁パルプ、竹パルプ、木材パルプ（針葉樹パルプ、広葉樹パルプ）等が使用され、また化学パルプ、機械パルプのいずれを使用してもよい。
また、上記パルプとして、メラミン系樹脂で含浸されたパルプ（メラミン系樹脂含浸パルプ）を用いてもよい。
上記メラミン系樹脂としては、メラミン樹脂、メラミン−フェノール共縮合物又はメラミン−ユリア共縮合物等が用いられる。該メラミン−フェノール共縮合物は、メラミン等のトリアジン類、フェノール類、ホルムアルデヒド等のアルデヒド類等から共縮合されてなるものであり、該メラミン−ユリア共縮合樹脂は、メラミン等のトリアジン類、ユリア類、アルデヒド類から共縮合されてなるものである。
上記メラミン系樹脂は水溶液の状態で使用するのが好ましく、例えば、上記メラミン系樹脂含浸パルプは、メラミン系樹脂水溶液をパルプに含浸させた後に乾燥して調製される。
また、上記パルプの一部又は全部を粉末パルプに代えてもよく、そうすることにより流動性を向上させることができる。
上記パルプのサイズは、特に限定されないが、一般には５〜１０００μｍ、好ましくは１０〜２００μｍ程度がよい。
また、上記パルプの含有量は、金型清掃用樹脂１００重量部に対して、一般には５〜７０重量部、好ましくは２０〜６０重量部である。
また、本発明の金型清掃用樹脂組成物には、鉱物質粉体を含有させてもよい。該鉱物質粉体としては、例えば、コランダム、エメリー、ざくろ石、ケイ石等の天然材及びケイ素、鉄、チタン、ナトリウム、カルシウム、マグネシウム、アルミニウム、クロム、ホウ素等の酸化物もしくは炭化物が好ましく、これらの酸化物及び炭化物としては、酸化ケイ素、酸化マグネシウム、酸化アルミニウム、炭化ケイ素、炭化ホウ素等を挙げることができる。
上記鉱物質粉体は、硬度が新モース硬度６〜１５であるものが好ましい。
上記鉱物質粉体の粒度は特に限定されるわけではないが、一般に＃１００〜＃４０００、好ましくは＃１００〜２０００、さらに好ましくは＃１００〜＃１０００であるのがよい。＃４０００より粒度が小さくなると清掃効果が悪くなり、取扱い時粉塵が発生し作業環境が悪化する等の欠点が生じやすく、＃１００より粒度が大きくなると金型の損傷、清掃の不均一等の欠点が生じ易い。
上記鉱物質粉体の含有量は、特に限定されるわけではないが、金型清掃用樹脂１００重量部に対して、好ましくは１０〜９０重量部、より好ましくは１０〜３０重量部である。
また、本発明の金型清掃用樹脂組成物には、滑剤を含有させることができる。該滑剤としては、例えば、ステアリン酸亜鉛、ステアリン酸カルシウム、ミリスチン酸亜鉛等の金属石鹸、ステアリン酸、オレイン酸、ベヘニン酸等の脂肪酸類、ブチルステアレート、ドデシルステアレート等の脂肪酸エステル類、ステアリン酸モノグリセライド、オレイン酸モノグリセライド、ヒドロキシステアリン酸モノグリセライド、ペンタエリスリトールステアリン酸エステル、ポリグリセリンステアレート、ソルビタントリオレート等の脂肪酸部分エステル類、ラウリン酸アミド、ミリスチン酸アミド、エルカ酸アミド、オレイン酸アミド、ステアリン酸アミド等の脂肪酸アミド類、メチレンビスステアリン酸アミド、エチレンビスステアリン酸アミド、エチレンビスオレイン酸アミド等の脂肪酸ビスアミド類等が挙げられる。金型清掃性を良好に保つため、上記滑剤の含有量は、金型清掃用樹脂組成物１００重量部に対して、１．５重量部以下、好ましくは１重量部以下にするのがよい。
本発明の金型清掃用樹脂組成物には、上記鉱物質粉体以外の無機もしくは有機充填剤、着色剤、硬化触媒、上記滑剤以外の滑剤、抗酸化剤等の他の添加剤を含有させてもよい。そのような添加剤の具体例としては、例えば、木粉、ビニロン繊維、ガラス粉、ガラス繊維、無処理炭酸カルシウム、タルク、水酸化アルミニウム、硫酸バリウム、硫化亜鉛の如き無機もしくは有機充填剤；例えば、酸化チタン、カーボンブラック、亜鉛華、カドミウムイエロー、ベンガラ等の無機顔料、フタロシアニン系、アゾ系、ジアゾ系等の有機顔料、ベンゾオキサゾール系、ナフトトリアゾール系、コーマリン系等の蛍光顔料、アンスラキノン系、インジコ系、アゾ系等の染料の如き着色剤；例えば、無水フタル酸、蓚酸、スルファミン酸、パラトルエンスルホン酸等の有機酸、塩酸、硫酸等の無機酸、これら酸類とトリエチルアミン、トリエタノールアミン、β−ジメチルアミノエタノール、２−メチル−２−アミノ−１−プロパノール等との塩類の如き硬化触媒；例えばステアリン酸亜鉛、ステアロアミド、メチロールステアロアミド、メチレンビスステアロアミド、パラトルエンスルホン酸アミド、セチルアルコール、パラフィン、シリコンオイルの如き滑剤；例えばナフチルアミン系抗酸化剤、ｐ−フェニレンジアミン系抗酸化剤、チオビスフェノール系抗酸化剤の如き抗酸化剤等を挙げることができる。
本発明の金型清掃用樹脂組成物は、メラミン系樹脂含浸パルプ、粒度＃１００〜＃４０００の鉱物質粉体、硬化触媒及び滑剤から選択される１種以上を含有することが好ましい。
本発明の金型清掃用樹脂組成物の好ましい配合例の一例を下記に示す。
（Ａ）メラミン樹脂１００重量部
（Ｂ）パルプ５〜７０重量部
（Ｃ）粒度＃１００〜＃４０００の鉱物質粉体１０〜９０重量部
（Ｄ）平均繊維長５〜３０μｍ、平均繊維径０．１〜１．０μｍ及びアスペクト比１０〜６０の繊維状無機化合物１〜３０重量部
本発明の金型清掃用樹脂組成物の調製に際しては、メラミン樹脂、繊維状無機化合物、所望により他の副次量の樹脂、パルプ、鉱物質粉体、その他の添加剤類を均一に混合し得る任意の手段が採用できる。例えばニーダー、リボンブレンダー、ヘンシェルミキサー、ボールミル、ロール練り、らいかい機、タンブラー等を例示できる。
本発明の金型清掃用樹脂組成物を用いて金型を清掃できる硬化性樹脂成形材料としては、例えば、エポキシ樹脂成形材料、フェノール樹脂成形材料等が挙げられ、好ましくはエポキシ樹脂成形材料であり、特に半導体封止用エポキシ樹脂成形材料である。また、本発明の金型清掃用樹脂組成物は、該硬化性樹脂成形材料を自動成形する際に使用する金型ならいかなる金型にも使用できるが、一般には鉄、クロム等よりなる金型に好適に適用できる。
以下に実施例を挙げて本発明を詳しく説明するが、本発明はこれら実施例に限定されるものではない。
参考例１
メラミン３４６重量部とホルマリン（３７％水溶液）５２２重量部及びフェノール１３１重量部とを加熱反応し、公知の方法でメラミンフェノール−ホルムアルデヒド樹脂を作り、得られた樹脂液にパルプ２４８重量部を加えて混練した後、減圧乾燥させてパルプ含量２７％のパルプ混入メラミンフェノール−ホルムアルデヒド樹脂粉末（メラミン系樹脂含浸パルプ）とした。
参考例２
メラミン４８０重量部とホルマリン（３７％水溶液）５２２重量部とを加熱反応し、公知の方法でメラミン−ホルムアルデヒド樹脂を作り、得られた樹脂液にパルプ２４８重量部を加えて混練した後、減圧乾燥させてパルプ含量２７％のパルプ混入メラミン−ホルムアルデヒド樹脂粉末（メラミン系樹脂含浸パルプ）とした。
実施例１
参考例１で得られたメラミン系樹脂含浸パルプ３０重量部、市販のメラミン樹脂（日本カーバイド工業株式会社製 ニカレジンＳ−１７６）５０重量部、粒度＃２００の硅石粉２０重量部、ホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）５重量部、安息香酸０．２重量部、ステアリン酸亜鉛０．５重量部及びエチレンビスステアリン酸アミド０．３重量部をボールミルにて混合粉砕したものを金型清掃用樹脂組成物Ａとした。
得られた金型清掃用樹脂組成物の特性値及び清掃効果の試験結果を表−１に記す。試験結果から判るように、金型清掃用樹脂組成物Ａは良好な清掃効果を示した。
実施例２
参考例１で得られたメラミン系樹脂含浸パルプ１重量部、参考例２で得られたメラミン系樹脂含浸パルプ２９重量部、市販のメラミン樹脂（日本カーバイド工業株式会社製 ニカレジンＳ−１７６）５０重量部、粒度＃２００の硅石粉２０重量部、ホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）５重量部、安息香酸０．２重量部、ステアリン酸亜鉛０．５重量部及びエチレンビスステアリン酸アミド０．３重量部をボールミルにて混合粉砕したものを金型清掃用樹脂組成物Ｂとした。
得られた金型清掃用樹脂組成物の特性値及び清掃効果の試験結果を表−１に記す。試験結果から判るように、金型清掃用樹脂組成物Ｂは良好な清掃効果を示した。
実施例３
参考例２で得られたメラミン系樹脂含浸パルプ３０重量部、市販のメラミン樹脂（日本カーバイド工業株式会社製 ニカレヂンＳ−１７６）５０重量部、粒度＃２００の硅石粉２０重量部、ホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）５重量部、安息香酸０．２重量部、ステアリン酸亜鉛０．５重量部及びエチレンビスステアリン酸アミド０．３重量部をボールミルにて混合粉砕したものを金型清掃用樹脂組成物Ｃとした。
得られた金型清掃用樹脂組成物の特性値及び清掃効果の試験結果を表−１に記す。試験結果から判るように、金型清掃用樹脂組成物Ｃは良好な清掃効果を示した。
実施例４
実施例１においてホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）の量を２０重量部としたものを金型清掃用樹脂組成物Ｄとした。
得られた金型清掃用樹脂組成物の特性値及び清掃効果の試験結果を表−１に記す。試験結果から判るように、金型清掃用樹脂組成物Ｄは良好な清掃効果を示した。
比較例１
実施例１においてホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）の量を０重量部としたものを金型清掃用樹脂組成物Ｅとした。
比較例２
実施例１においてホウ酸アルミニウムの種類をアルボレックスＹＳ４（四国化成工業株式会社製）から中心粒径８μｍの粒子状ホウ酸アルミニウムであるアルボライトＰＣ０８（四国化成工業株式会社製）に変更したものを金型清掃用樹脂組成物Ｆとした。
比較例３
実施例３においてホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）の量を０重量部としたものを金型清掃用樹脂組成物Ｇとした。
比較例４
実施例１においてホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）の量を４０重量部としたものを金型清掃用樹脂組成物Ｈとした。
Ａ〜Ｈの金型清掃用樹脂組成物を用いて下記の試験方法により金型清掃試験を実施した結果を表−１に記す。
試験方法
市販のビフェニル系エポキシ樹脂成形材料（日立化成株式会社製 ＣＥＬ−９２００ＸＵ）を用い、ＴＱＦＰの金型で５００ショットの成形により金型の汚れを実現した。この汚れた金型を用いて、金型表面がきれいに清掃されるまで金型清掃用樹脂組成物を繰り返し成形することにより評価を行った。
メラミン３４６重量部とホルマリン（３７％水溶液）５２２重量部とを加熱反応し、公知の方法でメラミン−ホルムアルデヒド樹脂を作り、得られた樹脂液にパルプ９５重量部を加えて混練した後、減圧乾燥させてパルプ含量１５％のパルプ混入メラミン−ホルムアルデヒド樹脂粉末（メラミン系樹脂含浸パルプ）を得た。
参考例４
メラミン３４６重量部とホルマリン（３７％水溶液）５２２重量部及びフェノール１３１重量部とを加熱反応し、公知の方法でメラミンホルムアルデヒド−フェノール樹脂を作り、得られた樹脂液にパルプ１２０重量部を加えて混練した後、減圧乾燥させてパルプ含量１５％のパルプ混入メラミンホルムアルデヒド−フェノール樹脂粉末（メラミン系樹脂含浸パルプ）を得た。
実施例５
参考例３で得られたメラミン系樹脂含浸パルプ１００重量部（パルプ含量１５重量部）、市販のメラミン樹脂（日本カーバイド工業株式会社製 ニカレジンＳ−１７６）１００重量部、粉末パルプ８重量部（メラミン樹脂１００重量部に対するパルプ量：１２．４重量部）、粒度＃２００の珪石粉５１重量部（メラミン樹脂１００重量部に対する珪石粉量：２７．６重量部）、ホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）１０重量部（メラミン樹脂１００重量部に対するホウ酸アルミニウム量：５．４重量部）、安息香酸０．２重量部（メラミン樹脂１００重量部に対する安息香酸量：０．１重量部）、ステアリン酸亜鉛１．５重量部（メラミン樹脂１００重量部に対するステアリン酸亜鉛量：０．８重量部）及びエチレンビスステアリン酸アミド０．８重量部（メラミン樹脂１００重量部に対するエチレンビスステアリン酸量：０．４重量部）をボールミルにて混合粉砕したものを金型清掃用樹脂組成物Ｉとした。
得られた金型清掃用樹脂組成物の特性値及び清掃効果の試験結果を表−２に記す。試験結果から判るように、金型清掃用樹脂組成物Ｉは良好な清掃効果を示した。
実施例６
参考例３で得られたメラミン系樹脂含浸パルプ４０重量部（パルプ含量６重量部）、市販のメラミン樹脂（日本カーバイド工業株式会社製 ニカレジンＳ−１７６）１１０重量部、粉末パルプ１２重量部（メラミン樹脂１００重量部に対するパルプ量：１２．５重量部）、粒度＃２００の珪石粉４０重量部（メラミン樹脂１００重量部に対する珪石粉量：２７．８重量部）、ホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）１５重量部（メラミン樹脂１００重量部に対するホウ酸アルミニウム量：１０．４重量部）、安息香酸０．２重量部、ステアリン酸亜鉛１．２重量部及びエチレンビスステアリン酸アミド０．６重量部をボールミルにて混合粉砕したものを金型清掃用樹脂組成物Ｊとした。 得られた金型清掃用樹脂組成物の特性値及び清掃効果の試験結果を表−２に記す。試験結果から判るように、金型清掃用樹脂組成物Ｊは良好な清掃効果を示した。
実施例７
市販のメラミン樹脂（日本カーバイド工業株式会社製 ニカレジンＳ−１７６）１００重量部、粉末パルプ３０重量部、粒度＃２００の珪石粉２８重量部、ホウ酸アルミニウム（四国化成工業株式会社製 アルボレックスＹＳ４）５重量部、安息香酸０．１重量部、ステアリン酸亜鉛０．８重量部及びエチレンビスステアリン酸アミド０．４重量部をボールミルにて混合粉砕したものを金型清掃用樹脂組成物Ｋとした。
得られた金型清掃用樹脂組成物の特性値及び清掃効果の試験結果を表−２に記す。試験結果から判るように、金型清掃用樹脂組成物Ｋは良好な清掃効果を示した。
実施例８
実施例５における参考例３で得られたメラミン系樹脂含浸パルプに代えて、参考例４で得られたパルプ含浸樹脂粉末を用いる以外は実施例５と同様にして、ボールミルにて混合粉砕したものを金型清掃用樹脂組成物Ｌとした。
得られた金型清掃用樹脂組成物の特性値及び清掃効果の試験結果を表−２に記す。試験結果から判るように、金型清掃用樹脂組成物Ｌは良好な清掃効果を示した。
Ｉ〜Ｌの金型清掃用樹脂組成物を用いて、前記のＡ〜Ｈの金型清掃用樹脂組成物の場合と同様の試験方法により金型清掃試験を実施した結果を表−２に記す。
本発明の金型清掃用樹脂組成物は、著しい金型汚れでも金型清掃の作業性を高めることができるとともに、多種多様の汚染成分をも清掃できる。TECHNICAL FIELD The present invention relates to a mold cleaning resin composition for cleaning the surface of an injection mold for transfer of electronic parts and a mold for transfer molding, and shows a good cleaning property against various kinds of contaminants. The present invention relates to a resin composition for cleaning a mold.
2. Description of the Related Art Conventionally, when molding of an integrated circuit or the like (hereinafter abbreviated as IC / LSI) using a thermosetting resin such as an epoxy resin is continuously performed for a long time, the inner surface of a mold becomes dirty, and the molding is continuously performed as it is. When the process is continued, there are many cases where the surface of the molded product becomes dirty or the molded product adheres to the mold and the molding operation cannot be continued. For this reason, it is necessary to periodically clean the mold, and a method has been proposed in which the mold cleaning resin is molded at a rate of several shots every several hundred shots of the molding material.
For example, Japanese Patent Publication No. Sho 52-788 discloses that "stain on a mold surface during molding of a curable resin molding material (excluding an amino resin molding material) is made of a material mainly composed of an amino resin. A method of cleaning is proposed, and a resin composition for mold cleaning comprising an amino resin, an organic base material and / or an inorganic base material, and a release agent is disclosed. Japanese Patent Publication No. 64-10162 discloses a resin composition for cleaning a mold comprising a co-condensation resin of an amino resin and a phenol resin and a mineral powder having a new Mohs hardness of 6 to 15. ing.
In recent years, thermosetting resin molding materials for encapsulating ICs / LSIs, etc., need to have different compositions depending on their required characteristics. Therefore, many types of thermosetting resin molding materials have been used. The state of contamination and the components of the contaminants also vary widely. Among these, instead of the novolak-based epoxy resin conventionally used, molding is performed using a molding material containing a biphenyl-based epoxy resin, a polyfunctional epoxy resin, and a dicyclopentadiene-based epoxy resin as a main component. When the mold contaminants are repeated, the baking on the mold surface is severe, particularly the dirt of the biphenyl-based epoxy resin and the polyfunctional epoxy resin is severe, and the above-described mold cleaning resin composition provided conventionally has the following problems. In addition, the number of moldings required to completely remove the stains on the mold is significantly increased, and the productivity of ICs, LSIs, and the like is greatly reduced.
The phenomenon that dirt on the mold is difficult to remove means that, from the viewpoint of the cleaning mechanism, the dirt and the mold are more strongly bonded to each other than the die cleaning resin composition is bonded to the dirt. Means. That is, the cleaning property is reduced due to either the bonding force at the interface between the mold and the dirt or the bonding force at the interface between the die-cleaning resin molding and the dirt being weakened. . By improving at least one of these factors, and preferably both, it becomes possible to improve the cleaning performance.
As a method for improving the factor of lowering the cleaning performance, there are a method of improving the strength of the resin molding for cleaning the mold, improving a modulus of the resin molding for cleaning the mold, a resin molding for cleaning the die. For example, a method of improving the adhesive strength between dirt and dirt can be considered.
DISCLOSURE OF THE INVENTION An object of the present invention is to provide a resin composition for cleaning a mold, which can enhance the workability of cleaning the mold even when the mold is extremely contaminated and can also clean various types of contaminant components.
The present inventors have developed a metal formed by repeating molding using a molding material containing a biphenyl-based epoxy resin, a polyfunctional-based epoxy resin, and a dicyclopentadiene-based epoxy resin as main components, which are widely used as an epoxy resin in recent years. In order to effectively remove contaminants on the surface of the mold, as a result of various studies, the addition of a specific fibrous inorganic compound to the melamine-based resin composition for mold cleaning increases the adhesion to contaminants. It has been found that contaminants can be removed without increasing the required number of moldings as compared with the above-described conventionally provided mold cleaning resin composition.
The present invention has been made based on the above findings, and when molding a curable resin molding material, a mold cleaning resin composition for removing stains on a mold surface, which contains a melamine resin as a mold cleaning resin. And a resin composition for cleaning a mold, comprising a fibrous inorganic compound having an average fiber length of 5 to 30 μm, an average fiber diameter of 0.1 to 1.0 μm, and an aspect ratio of 10 to 60. It is.
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail.
The melamine resin used in the present invention can be produced by a known method. For example, formaldehyde and melamine crystal are reacted in an aqueous solution at a molar ratio of 1: 1 to 3: 1, preferably 1.5: 1 to 2: 1 to produce an aqueous precondensate solution. The reaction can be carried out at a melamine crystal concentration of 20 to 60%, a reaction temperature of 70 to 100 ° C., and a weak alkali, and the reaction is completed in 10 to 100 minutes.
The melamine resin used in the present invention may be one produced by a known method as described above, or a commercially available melamine resin may be used.
In the melamine resin used in the present invention, a part of the melamine may be replaced with another compound capable of co-condensing with melamine and formaldehyde, for example, urea, benzoguanamine, phenol and the like, as long as the effects of the present invention are not impaired. it can. The use amount of such a compound is preferably 10 parts by weight or less based on 100 parts by weight of melamine.
In addition, the above-mentioned formaldehyde is partially formed of aldehyde components other than paraformaldehyde and formaldehyde, for example, aliphatic aldehydes such as acetaldehyde; aromatic aldehydes such as benzaldehyde; furfural; and other melamine, formaldehyde and the above-mentioned co-condensable Aldehyde compounds capable of reacting with other compounds ". The use amount of such a compound is preferably 10 parts by weight or less based on 100 parts by weight of formaldehyde.
In the mold cleaning resin composition of the present invention, in addition to the melamine resin, a secondary amount of other resins that can be blended with the melamine resin may be blended in an amount that does not adversely affect the effects of the present invention. Can be. Examples of such resins include alkyd resins, polyester resins, acrylic resins, epoxy resins, and rubbers.
The resin composition for cleaning a mold of the present invention contains the melamine resin and the fibrous inorganic compound described above, whereby the adhesive force with a stain component or the like is improved, and an excellent cleaning effect is exhibited.
Examples of the fibrous inorganic compound include Albolex Y, Albolex M20 (all manufactured by Shikoku Chemicals), Tismo-D, Tismo-L (all manufactured by Otsuka Chemical Co., Ltd.), and USB-SN-WA. And Moss Heidi (above, manufactured by Ube Industries, Ltd.). Of these, Albolex Y is preferably used, but the average fiber length is 5 to 30 μm, the average fiber diameter is 0.1 to 1.0 μm, and the aspect ratio is Can be used as long as it is a fibrous inorganic compound having a molecular weight of 10 to 60.
In addition, these effects can be further enhanced by subjecting the fibrous inorganic compound to a surface treatment with an epoxysilane-based, aminosilane-based, methacryloxysilane-based, or other resin. Examples of the fibrous inorganic compound subjected to the surface treatment include Alvolex YS3A, Alvolex YS2B, Alvolex YS4 (all manufactured by Shikoku Kasei Kogyo Co., Ltd.), Tismo-D101, and Tismo-D102 (all manufactured by Otsuka Chemical Co., Ltd.) Co., Ltd.).
The content of the fibrous inorganic compound is preferably 1 to 30 parts by weight, more preferably 5 to 20 parts by weight, and particularly preferably 5 to 10 parts by weight based on 100 parts by weight of the mold cleaning resin. When the content of the fibrous inorganic compound is less than 1 part by weight, the cleaning effect is poor. When the content is more than 30 parts by weight, the fluidity of the resin composition for cleaning a mold is deteriorated and the fibrous inorganic compound is expensive. So it is not economical.
The resin composition for cleaning a mold of the present invention may contain pulp. As the pulp, straw pulp, bamboo pulp, wood pulp (conifer pulp, hardwood pulp) and the like are used, and any of chemical pulp and mechanical pulp may be used.
Further, pulp impregnated with a melamine resin (melamine resin impregnated pulp) may be used as the pulp.
As the melamine resin, a melamine resin, a melamine-phenol co-condensate, a melamine-urea co-condensate, or the like is used. The melamine-phenol co-condensate is obtained by co-condensing triazines such as melamine, phenols and aldehydes such as formaldehyde, and the melamine-urea co-condensation resin includes triazines such as melamine and urea. And aldehydes.
The melamine resin is preferably used in the form of an aqueous solution. For example, the melamine resin impregnated pulp is prepared by impregnating pulp with an aqueous melamine resin solution and then drying.
Further, a part or all of the pulp may be replaced with powdered pulp, whereby the fluidity can be improved.
The size of the pulp is not particularly limited, but is generally 5 to 1000 μm, preferably about 10 to 200 μm.
The content of the pulp is generally 5 to 70 parts by weight, preferably 20 to 60 parts by weight, based on 100 parts by weight of the mold cleaning resin.
The resin composition for cleaning a mold of the present invention may contain a mineral powder. As the mineral powder, for example, corundum, emery, garnet, natural materials such as silica and silicon, iron, titanium, sodium, calcium, magnesium, aluminum, chromium, oxides or carbides such as boron are preferable, Examples of these oxides and carbides include silicon oxide, magnesium oxide, aluminum oxide, silicon carbide, and boron carbide.
The mineral powder preferably has a new Mohs hardness of 6 to 15.
The particle size of the mineral powder is not particularly limited, but is generally from # 100 to # 4000, preferably from # 100 to 2,000, and more preferably from # 100 to # 1000. If the particle size is smaller than # 4000, the cleaning effect is deteriorated, dusts are generated during handling, and the working environment is likely to be deteriorated. If the particle size is larger than # 100, defects such as mold damage and uneven cleaning are caused. Tends to occur.
The content of the mineral substance powder is not particularly limited, but is preferably 10 to 90 parts by weight, more preferably 10 to 30 parts by weight, based on 100 parts by weight of the mold cleaning resin.
The mold cleaning resin composition of the present invention may contain a lubricant. Examples of the lubricant include metal soaps such as zinc stearate, calcium stearate, and zinc myristate; fatty acids such as stearic acid, oleic acid and behenic acid; fatty acid esters such as butyl stearate and dodecyl stearate; and stearic acid. Fatty acid partial esters such as monoglyceride, monoglyceride oleate, monoglyceride hydroxystearate, pentaerythritol stearate, polyglycerin stearate, sorbitan triolate, lauric amide, myristic amide, erucamide, oleic amide, stearic acid Fatty acid amides such as amides, and fatty acid bisamides such as methylenebisstearic acid amide, ethylenebisstearic acid amide, and ethylenebisoleic acid amide. In order to maintain good mold cleaning properties, the content of the lubricant is preferably 1.5 parts by weight or less, more preferably 1 part by weight or less, based on 100 parts by weight of the resin composition for mold cleaning.
The resin composition for cleaning a mold of the present invention contains an inorganic or organic filler other than the mineral powder, a coloring agent, a curing catalyst, a lubricant other than the lubricant, and other additives such as an antioxidant. You may. Specific examples of such additives include inorganic or organic fillers such as, for example, wood flour, vinylon fiber, glass powder, glass fiber, untreated calcium carbonate, talc, aluminum hydroxide, barium sulfate, zinc sulfide; Inorganic pigments such as titanium oxide, carbon black, zinc white, cadmium yellow and red iron, phthalocyanine-based, azo-based, diazo-based organic pigments, benzoxazole-based, naphthotriazole-based, and comarine-based fluorescent pigments, and anthraquinone-based pigments And colorants such as indico- and azo-based dyes; for example, organic acids such as phthalic anhydride, oxalic acid, sulfamic acid, and paratoluenesulfonic acid; inorganic acids such as hydrochloric acid and sulfuric acid; and these acids and triethylamine and triethanolamine. , Β-dimethylaminoethanol, 2-methyl-2-amino-1-propa Curing catalysts, such as salts with thiolamine, etc .; lubricants, such as zinc stearate, stearamide, methylol stearamide, methylenebisstearamide, paratoluenesulfonic acid amide, cetyl alcohol, paraffin, silicone oil; Examples thereof include an oxidizing agent, an antioxidant such as a p-phenylenediamine antioxidant, and a thiobisphenol antioxidant.
The resin composition for cleaning a mold of the present invention preferably contains at least one selected from melamine resin-impregnated pulp, mineral powder having a particle size of # 100 to # 4000, a curing catalyst, and a lubricant.
An example of a preferred compounding example of the resin composition for cleaning a mold of the present invention is shown below.
(A) 100 parts by weight of melamine resin (B) 5 to 70 parts by weight of pulp (C) 10 to 90 parts by weight of mineral powder having a particle size of # 100 to # 4000 (D) Average fiber length 5 to 30 μm, average fiber diameter 0 In the preparation of the resin composition for cleaning a mold of the present invention, a melamine resin, a fibrous inorganic compound, and optionally other Any means capable of uniformly mixing the next amount of resin, pulp, mineral powder, and other additives can be employed. For example, a kneader, a ribbon blender, a Henschel mixer, a ball mill, a roll mill, a grinder, a tumbler and the like can be exemplified.
Examples of the curable resin molding material that can clean the mold using the mold cleaning resin composition of the present invention include, for example, an epoxy resin molding material and a phenol resin molding material, and are preferably epoxy resin molding materials. In particular, an epoxy resin molding material for semiconductor encapsulation. In addition, the resin composition for cleaning a mold of the present invention can be used for any mold as long as it is a mold used for automatically molding the curable resin molding material. Generally, a mold made of iron, chromium, or the like. It can be suitably applied to
Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to these Examples.
Reference Example 1
346 parts by weight of melamine, 522 parts by weight of formalin (37% aqueous solution) and 131 parts by weight of phenol are reacted by heating to form a melamine phenol-formaldehyde resin by a known method, and 248 parts by weight of pulp is added to the obtained resin solution. After kneading, the mixture was dried under reduced pressure to obtain a melamine phenol-formaldehyde resin powder mixed with pulp having a pulp content of 27% (melamine resin impregnated pulp).
Reference Example 2
480 parts by weight of melamine and 522 parts by weight of formalin (37% aqueous solution) are heated and reacted to form a melamine-formaldehyde resin by a known method, and 248 parts by weight of pulp is added to the obtained resin solution, kneaded, and dried under reduced pressure. This was made into melamine-formaldehyde resin powder mixed with pulp having a pulp content of 27% (melamine resin-impregnated pulp).
Example 1
30 parts by weight of the melamine resin-impregnated pulp obtained in Reference Example 1, 50 parts by weight of a commercially available melamine resin (Nikaresin S-176 manufactured by Nippon Carbide Industry Co., Ltd.), 20 parts by weight of silica powder having a particle size of # 200, aluminum borate ( 5 parts by weight of Albolex YS 4) manufactured by Shikoku Kasei Kogyo Co., Ltd. 5 parts by weight, 0.2 parts by weight of benzoic acid, 0.5 parts by weight of zinc stearate and 0.3 parts by weight of ethylenebisstearic acid are mixed and pulverized with a ball mill. The mold cleaning resin composition A was used.
Table 1 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the resin composition for mold cleaning A exhibited a good cleaning effect.
Example 2
1 part by weight of the melamine resin impregnated pulp obtained in Reference Example 1, 29 parts by weight of the melamine resin impregnated pulp obtained in Reference Example 2, 50 parts by weight of a commercially available melamine resin (Nikaresin S-176 manufactured by Nippon Carbide Industries Co., Ltd.) Parts, silica powder having a particle size of # 200, 20 parts by weight, aluminum borate (Albolex YS4 manufactured by Shikoku Chemicals Co., Ltd.) 5 parts by weight, benzoic acid 0.2 parts by weight, zinc stearate 0.5 parts by weight, and ethylenebisstearin A resin composition B for mold cleaning was obtained by mixing and pulverizing 0.3 part by weight of an acid amide with a ball mill.
Table 1 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the resin composition for mold cleaning B exhibited a good cleaning effect.
Example 3
30 parts by weight of the melamine resin-impregnated pulp obtained in Reference Example 2, 50 parts by weight of a commercially available melamine resin (Nikaren S-176 manufactured by Nippon Carbide Industries Co., Ltd.), 20 parts by weight of silica powder having a particle size of # 200, aluminum borate ( 5 parts by weight of Albolex YS 4) manufactured by Shikoku Kasei Kogyo Co., Ltd. 5 parts by weight, 0.2 parts by weight of benzoic acid, 0.5 parts by weight of zinc stearate and 0.3 parts by weight of ethylenebisstearic acid are mixed and pulverized with a ball mill. The mold cleaning resin composition C was obtained.
Table 1 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the mold cleaning resin composition C exhibited a good cleaning effect.
Example 4
In Example 1, the amount of aluminum borate (Alvolex YS4 manufactured by Shikoku Chemicals Co., Ltd.) was changed to 20 parts by weight to obtain a resin composition D for cleaning a mold.
Table 1 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the resin composition D for cleaning a mold exhibited a good cleaning effect.
Comparative Example 1
In Example 1, the amount of aluminum borate (Albolex YS4 manufactured by Shikoku Chemicals Co., Ltd.) was changed to 0 part by weight to obtain a resin composition E for cleaning a mold.
Comparative Example 2
In Example 1, the type of aluminum borate was changed from Alvolex YS4 (manufactured by Shikoku Kasei Kogyo Co., Ltd.) to Albolite PC08 (manufactured by Shikoku Kasei Kogyo Co., Ltd.), which is a particulate aluminum borate having a central particle diameter of 8 μm. The mold cleaning resin composition F was obtained.
Comparative Example 3
In Example 3, the amount of aluminum borate (Alvolex YS4 manufactured by Shikoku Chemicals Co., Ltd.) was changed to 0 part by weight, and this was used as a resin composition G for cleaning a mold.
Comparative Example 4
In Example 1, the amount of aluminum borate (Alvolex YS4 manufactured by Shikoku Chemicals Co., Ltd.) was changed to 40 parts by weight to obtain a mold cleaning resin composition H.
Table 1 shows the results of performing a mold cleaning test using the mold cleaning resin compositions A to H by the following test method.
Test Method Using a commercially available biphenyl-based epoxy resin molding material (CEL-9200XU, manufactured by Hitachi Chemical Co., Ltd.), the mold was stained by molding with a TQFP mold at 500 shots. The evaluation was performed by repeatedly molding the resin composition for mold cleaning using the soiled mold until the mold surface was cleanly cleaned.
346 parts by weight of melamine and 522 parts by weight of formalin (37% aqueous solution) are heated and reacted to form a melamine-formaldehyde resin by a known method, and 95 parts by weight of pulp is added to the obtained resin solution, kneaded, and dried under reduced pressure. Thus, a melamine-formaldehyde resin powder mixed with pulp having a pulp content of 15% (melamine resin-impregnated pulp) was obtained.
Reference example 4
346 parts by weight of melamine, 522 parts by weight of formalin (37% aqueous solution) and 131 parts by weight of phenol are heated and reacted to form a melamine formaldehyde-phenol resin by a known method, and 120 parts by weight of pulp is added to the obtained resin solution. After kneading, the mixture was dried under reduced pressure to obtain a melamine formaldehyde-phenol resin powder mixed with pulp having a pulp content of 15% (melamine resin impregnated pulp).
Example 5
100 parts by weight of the melamine resin impregnated pulp obtained in Reference Example 3 (pulp content: 15 parts by weight), 100 parts by weight of a commercially available melamine resin (Nikaresin S-176 manufactured by Nippon Carbide Industry Co., Ltd.), 8 parts by weight of powdered pulp (melamine) Pulp amount based on 100 parts by weight of resin: 12.4 parts by weight, 51 parts by weight of silica powder having a particle size of # 200 (amount of silica powder based on 100 parts by weight of melamine resin: 27.6 parts by weight), aluminum borate (Shikoku Chemical Industry Co., Ltd.) Alborex YS4, manufactured by a company: 10 parts by weight (amount of aluminum borate based on 100 parts by weight of melamine resin: 5.4 parts by weight), 0.2 parts by weight of benzoic acid (amount of benzoic acid based on 100 parts by weight of melamine resin: 0.1 parts by weight) Parts), 1.5 parts by weight of zinc stearate (amount of zinc stearate relative to 100 parts by weight of melamine resin: 0.8 parts by weight) and 0.8 parts by weight Ji Ren acid amide (ethylene bis-stearic acid weight relative to 100 parts by weight Melamine resin: 0.4 parts by weight) to a mixture pulverized in a ball mill and the mold cleaning resin composition I.
Table 2 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the mold cleaning resin composition I exhibited a good cleaning effect.
Example 6
40 parts by weight of the melamine resin-impregnated pulp obtained in Reference Example 3 (pulp content: 6 parts by weight), 110 parts by weight of a commercially available melamine resin (Nikaresin S-176 manufactured by Nippon Carbide Industry Co., Ltd.), 12 parts by weight of powdered pulp (melamine) Pulp amount based on 100 parts by weight of resin: 12.5 parts by weight, 40 parts by weight of silica powder having a particle size of # 200 (amount of silica powder based on 100 parts by weight of melamine resin: 27.8 parts by weight), aluminum borate (Shikoku Chemical Industry Co., Ltd.) 15 parts by weight (aluminum borate amount based on 100 parts by weight of melamine resin: 10.4 parts by weight), 0.2 parts by weight of benzoic acid, 1.2 parts by weight of zinc stearate, and ethylene bisstearic acid amide A resin composition J for cleaning a mold was prepared by mixing and pulverizing 0.6 parts by weight with a ball mill. Table 2 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the mold cleaning resin composition J exhibited a good cleaning effect.
Example 7
100 parts by weight of a commercially available melamine resin (Nikaresin S-176 manufactured by Nippon Carbide Industry Co., Ltd.), 30 parts by weight of powder pulp, 28 parts by weight of silica powder having a particle size of # 200, aluminum borate (Albolex YS4 manufactured by Shikoku Chemicals Co., Ltd.) 5 parts by weight, 0.1 parts by weight of benzoic acid, 0.8 parts by weight of zinc stearate and 0.4 parts by weight of ethylene bisstearic acid were mixed and pulverized with a ball mill to obtain a resin composition K for mold cleaning. .
Table 2 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the mold cleaning resin composition K showed a good cleaning effect.
Example 8
In place of the melamine-based resin-impregnated pulp obtained in Reference Example 3 in Example 5 except that the pulp-impregnated resin powder obtained in Reference Example 4 was used, the mixture was pulverized in a ball mill in the same manner as in Example 5. Was used as a resin composition L for cleaning a mold.
Table 2 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the mold cleaning resin composition L showed a good cleaning effect.
Using the mold cleaning resin compositions I to L, the mold cleaning test was performed by the same test method as in the case of the mold cleaning resin compositions A to H, and the results are shown in Table 2. .
Claims (8)
（Ａ）メラミン樹脂１００重量部
（Ｂ）パルプ５〜７０重量部
（Ｃ）粒度＃１００〜＃４０００の鉱物質粉体１０〜９０重量部
（Ｄ）平均繊維長５〜３０μｍ、平均繊維径０．１〜１．０μｍ及びアスペクト比１０〜６０の繊維状無機化合物１〜３０重量部A mold cleaning resin composition for removing stains on a mold surface during molding of a curable resin molding material, comprising: (A) to (D) below.
(A) 100 parts by weight of melamine resin (B) 5 to 70 parts by weight of pulp (C) 10 to 90 parts by weight of mineral powder having a particle size of # 100 to # 4000 (D) Average fiber length 5 to 30 μm, average fiber diameter 0 0.1 to 1.0 μm and 1 to 30 parts by weight of a fibrous inorganic compound having an aspect ratio of 10 to 60
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000310127 | 2000-10-11 | ||
| JP2000310127 | 2000-10-11 | ||
| JP2000331629 | 2000-10-31 | ||
| JP2000331629 | 2000-10-31 | ||
| PCT/JP2001/008678 WO2002030648A1 (en) | 2000-10-11 | 2001-10-02 | Resin composition for mold cleaning |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2002030648A1 true JPWO2002030648A1 (en) | 2004-02-19 |
| JP4262476B2 JP4262476B2 (en) | 2009-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002534058A Expired - Lifetime JP4262476B2 (en) | 2000-10-11 | 2001-10-02 | Mold cleaning resin composition |
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| Country | Link |
|---|---|
| JP (1) | JP4262476B2 (en) |
| KR (1) | KR100545249B1 (en) |
| CN (1) | CN1225349C (en) |
| HK (1) | HK1058648A1 (en) |
| MY (1) | MY140695A (en) |
| TW (1) | TW537956B (en) |
| WO (1) | WO2002030648A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002090077A1 (en) * | 2001-04-25 | 2002-11-14 | Nippon Carbide Kogyo Kabushiki Kaisha | Resin composition for cleaning mold |
| JP2010208131A (en) * | 2009-03-10 | 2010-09-24 | Daicel Polymer Ltd | Resin composition for cleaning of resin molding processing machine |
| JP5409522B2 (en) * | 2010-06-01 | 2014-02-05 | 旭化成ケミカルズ株式会社 | Washing soap |
| KR101934065B1 (en) | 2011-07-15 | 2019-01-02 | 닛뽕 카바이도 고교 가부시키가이샤 | Mold-cleaning resin composition |
| WO2013111709A1 (en) * | 2012-01-23 | 2013-08-01 | 日本カーバイド工業株式会社 | Resin composition for cleaning die |
| CN103526214B (en) * | 2013-09-05 | 2015-12-09 | 汉中锌业有限责任公司 | The method for cleaning of zinc ingot metal mould in a kind of zinc hydrometallurgy |
| JP6803165B2 (en) * | 2015-08-07 | 2020-12-23 | 日本カーバイド工業株式会社 | Resin composition for mold cleaning |
| CN105291347A (en) * | 2015-09-08 | 2016-02-03 | 合肥邦立电子股份有限公司 | Packaging production process of reed switch |
| CN105773882A (en) * | 2016-04-19 | 2016-07-20 | 上海东恒化工有限公司 | Composition for die cleaning and die cleaning method |
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| JPS55113517A (en) * | 1979-02-23 | 1980-09-02 | Nippon Carbide Ind Co Ltd | Resin composition for cleaning metallic mold |
| JPS58113242A (en) * | 1981-12-25 | 1983-07-06 | Mitsubishi Rayon Co Ltd | Delustering impact-resistant resin composition |
| JPS59126426A (en) * | 1983-01-06 | 1984-07-21 | Matsushita Electric Works Ltd | Resin molding material for cleaning mold |
| JPH05131460A (en) * | 1991-11-15 | 1993-05-28 | Matsushita Electric Works Ltd | Resin composition for cleaning of mold |
| JPH06200041A (en) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | Production of molding material |
| JPH07292262A (en) * | 1994-04-25 | 1995-11-07 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH0857866A (en) * | 1994-08-24 | 1996-03-05 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH0857865A (en) * | 1994-08-24 | 1996-03-05 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH0957762A (en) * | 1995-08-23 | 1997-03-04 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH09123184A (en) * | 1995-11-06 | 1997-05-13 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH09123182A (en) * | 1995-10-31 | 1997-05-13 | Nippon Carbide Ind Co Inc | Resin composition tablet for mold cleaning |
-
2001
- 2001-10-02 WO PCT/JP2001/008678 patent/WO2002030648A1/en active IP Right Grant
- 2001-10-02 CN CNB018133150A patent/CN1225349C/en not_active Expired - Lifetime
- 2001-10-02 KR KR1020027016088A patent/KR100545249B1/en active IP Right Grant
- 2001-10-02 JP JP2002534058A patent/JP4262476B2/en not_active Expired - Lifetime
- 2001-10-05 MY MYPI20014649A patent/MY140695A/en unknown
- 2001-10-11 TW TW090125097A patent/TW537956B/en not_active IP Right Cessation
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2004
- 2004-03-02 HK HK04101514A patent/HK1058648A1/en not_active IP Right Cessation
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113517A (en) * | 1979-02-23 | 1980-09-02 | Nippon Carbide Ind Co Ltd | Resin composition for cleaning metallic mold |
| JPS58113242A (en) * | 1981-12-25 | 1983-07-06 | Mitsubishi Rayon Co Ltd | Delustering impact-resistant resin composition |
| JPS59126426A (en) * | 1983-01-06 | 1984-07-21 | Matsushita Electric Works Ltd | Resin molding material for cleaning mold |
| JPH05131460A (en) * | 1991-11-15 | 1993-05-28 | Matsushita Electric Works Ltd | Resin composition for cleaning of mold |
| JPH06200041A (en) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | Production of molding material |
| JPH07292262A (en) * | 1994-04-25 | 1995-11-07 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH0857866A (en) * | 1994-08-24 | 1996-03-05 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH0857865A (en) * | 1994-08-24 | 1996-03-05 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH0957762A (en) * | 1995-08-23 | 1997-03-04 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| JPH09123182A (en) * | 1995-10-31 | 1997-05-13 | Nippon Carbide Ind Co Inc | Resin composition tablet for mold cleaning |
| JPH09123184A (en) * | 1995-11-06 | 1997-05-13 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1058648A1 (en) | 2004-05-28 |
| JP4262476B2 (en) | 2009-05-13 |
| CN1225349C (en) | 2005-11-02 |
| WO2002030648A1 (en) | 2002-04-18 |
| TW537956B (en) | 2003-06-21 |
| MY140695A (en) | 2010-01-15 |
| CN1444517A (en) | 2003-09-24 |
| KR100545249B1 (en) | 2006-01-24 |
| KR20030045676A (en) | 2003-06-11 |
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