MY140695A - Mold cleaning resin composition - Google Patents
Mold cleaning resin compositionInfo
- Publication number
- MY140695A MY140695A MYPI20014649A MYPI20014649A MY140695A MY 140695 A MY140695 A MY 140695A MY PI20014649 A MYPI20014649 A MY PI20014649A MY PI20014649 A MYPI20014649 A MY PI20014649A MY 140695 A MY140695 A MY 140695A
- Authority
- MY
- Malaysia
- Prior art keywords
- mold cleaning
- resin composition
- cleaning resin
- mold
- average fiber
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A MOLD CLEANING RESIN COMPOSITION FOR REMOVING SOILS FROM THE SURFACE OF A MOLD IN MOLDING A CURING RESING MOLDING MATERIAL, WHICH COMPRISES A MELAMINE RESIN AS A MOLD CLEANING RESIN AND A FIBROUS INORGANIC COMPOUND HAVING AN AVERAGE FIBER LENGTH OF 5 TO 30 UM, AN AVERAGE FIBER DIAMETER OF 0.1 TO 1.0 UM , AND AN ASPECT RATIO OF 10 TO 60.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000310127 | 2000-10-11 | ||
JP2000331629 | 2000-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY140695A true MY140695A (en) | 2010-01-15 |
Family
ID=26601843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20014649A MY140695A (en) | 2000-10-11 | 2001-10-05 | Mold cleaning resin composition |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP4262476B2 (en) |
KR (1) | KR100545249B1 (en) |
CN (1) | CN1225349C (en) |
HK (1) | HK1058648A1 (en) |
MY (1) | MY140695A (en) |
TW (1) | TW537956B (en) |
WO (1) | WO2002030648A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100818454B1 (en) * | 2001-04-25 | 2008-04-01 | 닛뽕 카바이도 고교 가부시키가이샤 | Mold cleaning resin composition |
JP2010208131A (en) * | 2009-03-10 | 2010-09-24 | Daicel Polymer Ltd | Resin composition for cleaning of resin molding processing machine |
JP5409522B2 (en) * | 2010-06-01 | 2014-02-05 | 旭化成ケミカルズ株式会社 | Washing soap |
CN103702813B (en) * | 2011-07-15 | 2016-03-30 | 日本电石工业株式会社 | Resin composition for cleaning mold |
SG11201404265PA (en) * | 2012-01-23 | 2014-10-30 | Nippon Carbide Kogyo Kk | Resin composition for cleaning die |
CN103526214B (en) * | 2013-09-05 | 2015-12-09 | 汉中锌业有限责任公司 | The method for cleaning of zinc ingot metal mould in a kind of zinc hydrometallurgy |
JP6803165B2 (en) * | 2015-08-07 | 2020-12-23 | 日本カーバイド工業株式会社 | Resin composition for mold cleaning |
CN105291347A (en) * | 2015-09-08 | 2016-02-03 | 合肥邦立电子股份有限公司 | Packaging production process of reed switch |
CN105773882A (en) * | 2016-04-19 | 2016-07-20 | 上海东恒化工有限公司 | Composition for die cleaning and die cleaning method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55113517A (en) * | 1979-02-23 | 1980-09-02 | Nippon Carbide Ind Co Ltd | Resin composition for cleaning metallic mold |
JPS58113242A (en) * | 1981-12-25 | 1983-07-06 | Mitsubishi Rayon Co Ltd | Delustering impact-resistant resin composition |
JPS59126426A (en) * | 1983-01-06 | 1984-07-21 | Matsushita Electric Works Ltd | Resin molding material for cleaning mold |
JP2978308B2 (en) * | 1991-11-15 | 1999-11-15 | 松下電工株式会社 | Mold cleaning resin composition |
JPH06200041A (en) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | Production of molding material |
JP3328424B2 (en) * | 1994-04-25 | 2002-09-24 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
JP3781445B2 (en) * | 1994-08-24 | 2006-05-31 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
JP3301870B2 (en) * | 1994-08-24 | 2002-07-15 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
JP3783042B2 (en) * | 1995-08-23 | 2006-06-07 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
JP3270315B2 (en) * | 1995-10-31 | 2002-04-02 | 日本カーバイド工業株式会社 | Mold cleaning resin composition tablet |
JPH09123184A (en) * | 1995-11-06 | 1997-05-13 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
-
2001
- 2001-10-02 WO PCT/JP2001/008678 patent/WO2002030648A1/en active IP Right Grant
- 2001-10-02 KR KR1020027016088A patent/KR100545249B1/en active IP Right Grant
- 2001-10-02 CN CNB018133150A patent/CN1225349C/en not_active Expired - Lifetime
- 2001-10-02 JP JP2002534058A patent/JP4262476B2/en not_active Expired - Lifetime
- 2001-10-05 MY MYPI20014649A patent/MY140695A/en unknown
- 2001-10-11 TW TW090125097A patent/TW537956B/en not_active IP Right Cessation
-
2004
- 2004-03-02 HK HK04101514A patent/HK1058648A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPWO2002030648A1 (en) | 2004-02-19 |
CN1444517A (en) | 2003-09-24 |
JP4262476B2 (en) | 2009-05-13 |
WO2002030648A1 (en) | 2002-04-18 |
HK1058648A1 (en) | 2004-05-28 |
KR20030045676A (en) | 2003-06-11 |
TW537956B (en) | 2003-06-21 |
CN1225349C (en) | 2005-11-02 |
KR100545249B1 (en) | 2006-01-24 |
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