WO2002030648A1

WO2002030648A1 - Resin composition for mold cleaning

Info

Publication number: WO2002030648A1
Application number: PCT/JP2001/008678
Authority: WO
Inventors: Kiyohito Hiromitsu; Mitsuyoshi Sasayama; Hiroaki Nomura
Original assignee: Nippon Carbide Kogyo Kabushiki Kaisha
Priority date: 2000-10-11
Filing date: 2001-10-02
Publication date: 2002-04-18
Also published as: KR100545249B1; HK1058648A1; JP4262476B2; CN1225349C; JPWO2002030648A1; KR20030045676A; MY140695A; TW537956B; CN1444517A

Abstract

A mold-cleaning resin composition for removing stains from the mold surface in the molding of a curable molding resin material, which comprises a melamine resin as a mold-cleaning resin and a fibrous inorganic compound having an average fiber length of 5 to 30 νm, an average fiber diameter of 0.1 to 1.0 νm, and an aspect ratio of 10 to 60.

Description

Description Resin composition for mold cleaning Technical field

The present invention relates to a resin composition for cleaning a mold for injection molding and a mold for transfer molding for sealing an electronic component, and relates to a metal showing good cleaning properties against various contaminants. The present invention relates to a mold cleaning resin composition. Eyes-scenic fe

Conventionally, if the molding of an integrated circuit or the like (hereinafter abbreviated as IC. LSI) using thermosetting resin such as epoxy resin is continuously performed for a long time, the inner surface of the mold becomes dirty, and the molding is continued as it is. In many cases, the surface of the molded product was soiled, or the molded product adhered to the mold, making it impossible to continue the molding operation. For this reason, it is necessary to periodically clean the mold, and a method has been proposed in which the mold cleaning resin is molded at a rate of several shots every several hundred shots of the molding material, and the mold is cleaned. .

For example, Japanese Patent Publication No. 52-788 discloses that “a curable resin molding material (excluding an amino resin molding material) is used to remove stains on the mold surface during molding with a material mainly composed of an amino resin. A method of cleaning by molding ”has been proposed, and a resin composition for mold cleaning comprising an amino resin, an organic base material and / or an inorganic base material, and a release agent has been disclosed. Japanese Patent Publication No. Sho 64-10162 contains a co-condensation resin of an amino resin and a phenol resin, and a mineral powder having a new Mohs hardness of 6 to 15. A resin composition for cleaning a mold is disclosed.

In recent years, thermosetting resin molding materials for encapsulating ICs and LSIs have been required to change their composition according to their required characteristics, and thus many types have been used. There is a wide variety of mold contamination conditions and contaminant components. Among these, a molding material that uses a biphenyl-based epoxy resin, a polyfunctional epoxy resin, or a dicyclopentagen-based epoxy resin as a main component instead of the novolak-based epoxy resin conventionally used is used. Repeat molding The mold contaminants are severely burned on the mold surface, and the dirt of biphenyl-based epoxy resin and polyfunctional epoxy resin is particularly severe. However, the number of moldings required to completely remove the dirt from the molds has been significantly increased, and the productivity of ICs and LSIs has been greatly reduced.

Considering the phenomenon that dirt on the mold is difficult to remove, from the viewpoint of the cleaning mechanism, it is said that the dirt-to-die bonding force is stronger than the die-cleaning resin composition to dirt-binding force. Means that. That is, a decrease in the creeping property is caused by either the bonding force at the interface between the mold and the dirt or the bonding force at the interface between the die-forming resin molding and the dirt is weakened. . By improving at least one of these factors, and preferably both, it is possible to improve the cleaning performance.

Methods for improving the above factors that lower the cleaning performance include improving the strength of the resin molding for mold cleaning, improving the modulus of the resin molding for mold cleaning, and resin molding for mold cleaning. For example, a method of improving the adhesive strength between the soil and dirt can be considered. Disclosure of the invention

An object of the present invention is to provide a resin composition for cleaning a mold, which can enhance the workability of cleaning the mold even when the mold is extremely contaminated and can also clean various kinds of contaminated components.

The present inventors have formed by molding repeatedly using a molding material mainly composed of a biphenyl-based epoxy resin, a polyfunctional epoxy resin, and a dicyclopentadiene-based epoxy resin, which are frequently used as epoxy resins in recent years. Various studies were conducted to effectively remove the contaminants from the mold surface, and as a result, the specific fibrous inorganic compound was added to the melamine resin composition for mold cleaning to adhere to the contaminants. It has been found that the power is increased, and contaminants can be removed without increasing the number of required moldings compared to the above-described conventionally provided mold cleaning resin composition.

The present invention has been made based on the above findings, and is used for molding a curable resin molding material. A mold cleaning resin composition for removing stains on the mold surface, which contains a melamine resin as the mold cleaning resin, and has an average fiber length of 5 to 30 m and an average fiber diameter of 0.1 to 1; It is an object of the present invention to provide a resin composition for cleaning a mold, comprising a fibrous inorganic conjugate having a diameter of 0.1 μm and an aspect ratio of 10 to 60. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail.

The melamine resin used in the present invention can be produced by a known method. For example, formaldehyde and melamine crystal are reacted in an aqueous solution at a molar ratio of 1: 1 to 3: 1, preferably 1.5: 1 to 2: 1, to produce an aqueous precondensate solution. The reaction can be carried out with a melamine crystal concentration of 20 to 60%, a reaction temperature of 70 to 100 ° C, and a weak force, and the reaction is completed in 10 to 100 minutes.

The melamine resin used in the present invention may be one produced by a known method as described above, or a commercially available melamine resin may be used.

In the melamine resin used in the present invention, a part of the melamine is replaced with another compound capable of co-condensing with melamine and formaldehyde, for example, urea, benzoguanamine, phenol, etc., as long as the effects of the present invention are not impaired. be able to. The use amount of such a compound is preferably 10 parts by weight or less based on 100 parts by weight of melamine.

In addition, the formaldehyde is partially formed of aldehyde components other than paraformaldehyde and formaldehyde, for example, aliphatic aldehydes such as acetoaldehyde; aromatic aldehydes such as benzaldehyde; furfural; An aldehyde compound capable of reacting with another compound capable of co-condensation described above. The use amount of such a compound is preferably 10 parts by weight or less based on 100 parts by weight of formaldehyde.

In the resin composition for cleaning a mold of the present invention, in addition to the melamine resin, a secondary amount of another resin that can be blended with the melamine resin is mixed in an amount that does not adversely affect the effects of the present invention. be able to. Examples of such fats and oils include alkyd spirits, polyester resins, acrylic resins, epoxy resins, and rubbers. Since the resin composition for mold cleaning of the present invention contains the melamine resin and the fibrous inorganic compound, the adhesive force with a dirt component or the like is improved, and exhibits an excellent cleaning effect.

Examples of the above-mentioned fibrous inorganic compounds include Albolex Y, Albolex Μ20 (all, manufactured by Shikoku Chemicals), Tismo-D, Tismo-L (all, manufactured by Otsuka Chemical Co., Ltd.) ', USB — SN—WA, Moss Heidi (above, manufactured by Ube Industries, Ltd.) and the like. Of these, Albolex Y is preferably used, but the average fiber length is 5 to 3 and the average fiber diameter is 0.1 to 0. Any fibrous inorganic compound having a 〃m and an aspect ratio of 10 to 60 can be used.

In addition, these effects can be further enhanced by subjecting the fibrous inorganic compound to a surface treatment with an epoxysilane-based, aminosilane-based, methacryloxysilane-based, or other resin. Examples of the fibrous inorganic compound subjected to the above surface treatment include Alvolex YS3k Alvolex YS2B, Alpolex YS4 (all manufactured by Shikoku Chemicals Co., Ltd.), Tismo D101, and Tismo-1 D 102 (all manufactured by Otsuka Chemical Co., Ltd.).

The content of the fibrous inorganic compound is preferably 1 to 30 parts by weight, more preferably 5 to 20 parts by weight, particularly preferably 5 to 100 parts by weight, based on 100 parts by weight of the mold cleaning resin. It is 10 parts by weight. When the content of the fibrous inorganic compound is less than 1 part by weight, the cleaning effect is poor. When the content is more than 30 parts by weight, the fluidity of the resin composition for mold cleaning deteriorates, and the fibrous inorganic compound is expensive. Therefore, it is not economically advantageous.

The resin composition for cleaning a mold of the present invention may contain pulp. As the pulp, straw pulp, bamboo pulp, wood pulp (conifer pulp, hardwood pulp) and the like are used, and any of chemical pulp and mechanical pulp may be used.

Moreover, pulp impregnated with a melamine resin (melamine resin impregnated pulp) may be used as the pulp.

As the melamine resin, a melamine resin, a melamine-phenol co-condensate, a melamine-urea co-condensate, or the like is used. The melamine-phenol co-condensate is obtained by co-condensing triazines such as melamine, phenols, aldehydes such as formaldehyde, and the like. It is co-condensed from triazines such as melamine, ureas, and aldehydes.

The melamine-based resin is preferably used in the form of an aqueous solution. For example, the melamine-based resin-impregnated pulp is prepared by impregnating the melamine-based resin aqueous solution into pulp and then drying.

Further, a part or all of the pulp may be replaced with powder pulp, whereby the fluidity can be improved.

The size of the pulp is not particularly limited, but is generally about 5 to 100 m, preferably about 10 to 200 m.

The content of the pulp is generally 5 to 70 parts by weight, preferably 20 to 60 parts by weight, based on 100 parts by weight of the mold cleaning resin.

Further, the resin composition for cleaning a mold of the present invention may contain a mineral substance powder. Examples of the mineral powder include natural materials such as corundum, emery, garnet, and gay stone, and oxides or carbides such as iron, titanium, sodium, calcium, magnesium, aluminum, chromium, and boron. Preferably, examples of these oxides and carbides include gay oxide, magnesium oxide, aluminum aluminum oxide, gay carbide, boron carbide and the like.

It is preferable that the mineral powder has a hardness of 6 to 15 in hardness.

The particle size of the mineral powder is not particularly limited, but is generally # 100 to # 400, preferably # 100 to 200, more preferably # 100 to # 100. It is preferably 100. If the particle size is smaller than # 400, the cleaning effect will be worse, dust will be generated during handling and the working environment will deteriorate, and if the particle size is larger than # 100, the mold will be damaged and cleaning will not be possible. Defects such as unevenness are likely to occur.

The content of the mineral substance powder is not particularly limited, but is preferably from 10 to 90 parts by weight, more preferably from 10 to 3 parts by weight, based on 100 parts by weight of the mold cleaning resin. 0 parts by weight.

The mold cleaning resin composition of the present invention may contain a lubricant. Examples of the lubricant include metal stones such as zinc stearate, calcium stearate, and zinc myristate; and fatty acids such as stearic acid, oleic acid, and behenic acid. Fatty acid esters, such as butyl stearate, dodecyl stearate, etc. Esters, lauric acid amide, myristic acid amide, erlic acid amide, oleic acid amide, stearyl acid amide, and other fatty acid amides, methylenebisstearic acid amide, ethylenebisstearic acid amide, Fatty acid bisamides such as ethylene bisoleic acid amide and the like can be mentioned. In order to maintain good mold cleaning properties, the content of the above lubricant should be 1.5 parts by weight or less, preferably 1 part by weight or less, based on 100 parts by weight of the resin composition for mold cleaning. Is good.

The resin composition for cleaning a mold of the present invention contains other additives such as an inorganic or organic filler other than the above-mentioned mineral powder, a coloring agent, a curing catalyst, a lubricant other than the above-mentioned lubricant, and an antioxidant. You may have. Specific examples of such additives include, for example, inorganic powders such as wood powder, vinylon fiber, glass powder, glass fiber, untreated calcium carbonate, talc, 7_K sodium hydroxide aluminum, barium sulfate, and zinc sulfide. Organic fillers: For example, inorganic pigments such as titanium oxide, carbon black, zinc white, cadmium yellow, and bengalara; organic face such as phthalocyanine, azo, and diazo; Colorants such as fluorescent pigments such as phenolic and co-marine pigments, and dyes such as anthraquinone-based, indico-based, and azo-based dyes: For example, organic acids such as phthalic anhydride, oxalic acid, sulfamic acid, and paratoluenesulfonic acid , Hydrochloric acid, sulfuric acid, and other inorganic acids, these acids and triethylamine, triethanolamine, β-dimethylaminoethanol, Curing catalysts such as salts with roux 2-amino-1-propanol; for example, zinc stearate, stearamide, methyl stearamide, methylenebis stearamide, paratoluenesulfonic acid amide, cetyl alcohol, paraffin And lubricants such as silicone oil; and antioxidants such as naphthylamine-based antioxidants, ρ-phenylenediamine-based antioxidants, and thiobisphenol-based antioxidants.

The resin composition for cleaning a mold of the present invention contains at least one selected from melamine resin impregnated pulp, mineral powder having a particle size of # 100 to # 400, a curing catalyst, and a lubricant. Preferably.

An example of a preferable compounding example of the resin composition for cleaning a mold of the present invention is shown below.

(A) Melamine content 100 parts by weight

(B) Pulp 5 to 70 parts by weight

(C) Mineral powder with a particle size of # 100 to # 400000 10 to 90 parts by weight

(D) Average fiber length of 5 to 30πι, average fiber diameter of 0.1 to 1.0 -m and aspect ratio of 10 to 60, 1 to 30 parts by weight of a fibrous inorganic compound

In preparing the mold cleaning resin composition of the present invention, the melamine resin, the fibrous inorganic compound, and, if desired, other secondary amounts of resin, pulp, mineral powder, and other additives are uniformly mixed. Any means of obtaining can be employed. For example, 210, ribbon blender, hensile mixer, ball mill, roll kneading machine, raisin machine, tumbler and the like can be exemplified.

Examples of the curable resin molding material that can clean the mold using the resin composition for mold cleaning of the present invention include an epoxy resin molding material and a phenol resin molding material. Yes, especially epoxy resin molding materials for semiconductor encapsulation. Further, the mold cleaning resin composition of the present invention can be used for any mold as long as the mold is used for automatically molding the curable resin molding material. Generally, a mold made of iron, chromium, or the like is used. It can be suitably applied to Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to these Examples.

Reference example 1

The melamine phenol-formaldehyde resin is prepared by a known method by heat-reacting 346 parts by weight of melamine, 52 parts by weight of formalin (37% aqueous solution) and 31 parts by weight of phenol, and the obtained resin is obtained. After adding 248 parts by weight of pulp to the liquid and kneading the mixture, it was dried under reduced pressure to obtain a pulp content of 27-%. Melamine phenol-formaldehyde resin powder mixed (melamine resin impregnated pulp) was used.

Reference example 2

Heating 480 parts by weight of melamine and 52 parts by weight of formalin (37% aqueous solution) A melamine-formaldehyde resin was prepared by a known method, and 248 parts by weight of pulp was added to the obtained resin solution, kneaded, and then dried under reduced pressure to obtain a melamine-formaldehyde resin having a pulp content of 27%. Powder (melamine resin impregnated pulp) and o

Example 1

30 parts by weight of the melamine resin-impregnated pulp obtained in Reference Example 1, 50 parts by weight of a commercially available melamine resin (Nicarezin S-176 of Nippon Riki-Vide Dye Co., Ltd.), particle size # 200 20 parts by weight of silica powder, 5 parts by weight of aluminum borate (Albolex YS4 manufactured by Shikoku Chemicals Co., Ltd.), 0.2 part by weight of benzoic acid, 0.5 part by weight of zinc stearate, and 0 parts by weight of ethylene bisstearic acid amide 3 parts by weight were mixed and pulverized with a ball mill to obtain a resin composition A for cleaning a mold.

Table 1 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the mold cleaning resin composition A exhibited a good cleaning effect.

Example 2

1 part by weight of the melamine-based resin-impregnated pulp obtained in Reference Example 1, 29 parts by weight of the melamine-based resin-impregnated pulp obtained in Reference Example, and a commercially available melamine resin (Nikaresin S—17 manufactured by Nippon Carbide Co., Ltd.) 6) 50 parts by weight, silica powder having a particle size of # 100 20 parts by weight, aluminum borate (Albolex YS 4 manufactured by Shikoku Chemicals Co., Ltd.) 5 parts by weight, benzoic acid 0.2 parts by weight, zinc stearate A mixture of 0.5 parts by weight and 0.3 parts by weight of ethylene bis stearic acid amide mixed and ground with a pole mill was used as a resin composition B for mold cleaning.

Table 1 shows the characteristic values of the obtained mold cleaning resin composition and the test results of the cleaning effect. As can be seen from the test results, the mold cleaning resin composition B exhibited a good cleaning effect.

Example 3

30 parts by weight of the melamine-based resin-impregnated pulp obtained in Reference Example 2, 50 parts by weight of a commercially available melamine resin (Nippon Carbide Co., Ltd. Siroku S_176), particle size # 200 20 parts by weight of silica powder, aluminum borate (manufactured by Shikoku Chemical Industry Co., Ltd.) Albolex YS 4) 5 parts by weight, 0.2 parts by weight of benzoic acid, 0.5 parts by weight of zinc stearate and 0.3 parts by weight of ethylene bisstearic acid mixed and ground with a ball mill for mold cleaning Resin composition C was obtained.

Table 1 shows the characteristic values and the cleaning effect test results of the obtained resin composition for cleaning a mold. As can be seen from the test results, the mold cleaning resin composition C exhibited a good cleaning effect.

Example 4

In Example 1, the amount of aluminum borate (Alpolex YS4 manufactured by Shikoku Chemicals Co., Ltd.) was changed to 20 parts by weight to obtain a resin composition D for cleaning a mold. Table 1 shows the characteristic values and the cleaning effect test results of the obtained resin composition for cleaning a mold. As can be seen from the test results, the mold cleaning resin composition D exhibited a good cleaning effect. '

Comparative Example 1

A mold cleaning resin composition E in which the amount of aluminum borate (Arborex YS4 manufactured by Shikoku Chemicals Co., Ltd.) in Example 1 was 0 part by weight was used. Comparative Example 2

In Example 1, a page of aluminum borate was obtained from Arbolex YS 4 (manufactured by Shikoku Chemicals Co., Ltd.). ) Was designated as mold cleaning shelf composition F.

Comparative Example 3

In Example 3, the amount of aluminum borate (Arborex YS4 manufactured by Shikoku Chemicals Co., Ltd.) was changed to 0 part by weight, and this was used as a resin composition G for cleaning a mold.

Comparative Example 4

In Example 1, the amount of aluminum borate (Arborex YS4 manufactured by Shikoku Chemicals Co., Ltd.) was changed to 40 parts by weight to obtain a resin composition H for mold cleaning.

Table 11 shows the results of a mold cleaning test performed using the mold cleaning resin compositions A to H by the following test method. Test method

Using a commercially available biphenyl-based epoxy resin molding material (CEL-9200 XU, manufactured by Hitachi Chemical Co., Ltd.), the mold was stained by molding 500 shots with a TQFP mold. The evaluation was performed by repeatedly molding the mold cleaning resin composition using the soiled mold until the mold surface was cleanly cleaned.

Table 1

Reference example 3

346 parts by weight of melamine and 522 parts by weight of formalin (37% aqueous solution) were heated and reacted to form a melamine-formaldehyde resin by a known method, and 95 parts by weight of pulp was added to the obtained resin solution, and kneaded. By drying, a melamine monoformaldehyde resin powder mixed with pulp having a pulp content of 15% (melamine resin impregnated pulp) was obtained.

Reference example 4

346 parts by weight of melamine, 522 parts by weight of formalin (37% 7 solution) and 131 parts by weight of phenol are heated and reacted to form a melamine formaldehyde-phenol resin by a known method. The mixture was kneaded by weight and then dried under reduced pressure to obtain a melamine formaldehyde phenol resin powder mixed with pulp having a pulp content of 15% (melamine resin impregnated pulp). Example 5

100 parts by weight (pulp content: 15 parts by weight) of the melamine resin-impregnated pulp obtained in Reference Example 3, commercially available melamine resin (Nishiko Residential Co., Ltd., Nistric Resin S-176) 10 0 parts by weight, powdered pulp 8 parts by weight (pulp amount based on 100 parts by weight of melamine resin: 12.4 parts by weight), silica powder of particle size # 200 51 parts by weight (melamine resin 100 parts by weight) Amount of silica powder with respect to: 27.6 parts by weight) Aluminum borate (Albolex YS 4 manufactured by Shikoku Chemicals Co., Ltd.) 10 parts by weight (melamine resin 1

Aluminum borate based on 100 parts by weight: 5.4 parts by weight), benzoic acid 0.2 parts by weight (melamine resin 100 parts by weight benzoic acid based on 0.1 parts by weight), zinc stearate 1 0.5 parts by weight (amount of zinc stearate based on 100 parts by weight of melamine resin: 0.8 parts by weight) and 0.8 parts by weight of ethylenebisstearic acid amide (amount of ethylene bisstearic acid based on 100 parts by weight of melamine resin) : 0.4 part by weight) was mixed and pulverized with a ball mill to obtain a resin composition I for mold cleaning.

Table 1 shows the characteristic values and the cleaning effect test results of the obtained resin composition for cleaning a mold. As can be seen from the test results, the mold cleaning resin composition I showed a good cleaning effect.

Example 6

40 parts by weight (pulp content: 6 parts by weight) of the melamine resin-impregnated pulp obtained in Reference Example 3, 110 parts by weight of a commercially available melamine resin (Nikaresin S-176 manufactured by Nippon Carbide Co., Ltd.), powder Pulp 12 parts by weight (pulp amount based on 100 parts by weight of melamine resin: 12.5 parts by weight) Silica powder with particle size # 200 40 parts by weight (silica stone based on 100 parts by weight of melamine resin) Powder amount: 27.8 parts by weight) Aluminum borate (Alvolex YS 4 manufactured by Shikoku Chemicals) 15 parts by weight (Aluminum borate amount to 100 parts by weight of melamine resin: 10.4 parts by weight) Parts), 0.2 parts by weight of benzoic acid, 1. parts by weight of zinc stearate and 0.6 parts by weight of ethylene bis stearic acid were mixed and pulverized with a ball mill, and the resin composition for mold cleaning J was used. And Table 12 shows the characteristic values and the cleaning effect test results of the obtained resin composition for mold cleaning. As can be seen from the test results, the mold cleaning resin composition J exhibited a good cleaning effect. Example 7

Commercially available melamine resin (Nikaresin S-176, manufactured by Nippon Carbide Co., Ltd.) 100 parts by weight, powdered pulp 30 parts by weight, silica powder of particle size # 200 28 parts by weight, aluminum borate 5 parts by weight (Alvolex YS 4 manufactured by Shikoku Chemicals Co., Ltd.), 0.1 part by weight of benzoic acid, 0.8 part by weight of zinc stearate and 0.4 part by weight of ethylene bisstearic acid in a ball mill The mixed and pulverized product was designated as a resin composition K for cleaning a mold.

Table 1 shows the characteristic values of the obtained resin composition for mold cleaning and the test results of the cleaning effect. As can be seen from the test results, the mold cleaning resin composition K exhibited a good cleaning effect.

Example 8

In the same manner as in Example 5, except that the pulp impregnated resin powder obtained in Reference Example 4 was used instead of the melamine resin impregnated pulp obtained in Reference Example 3 in Example 5, and mixed and pulverized with a ball mill This was designated as mold cleaning resin composition L.

Table 1 shows the characteristic values of the obtained resin composition for cleaning a mold and the test results of the cleaning effect. As can be seen from the test results, the mold cleaning resin composition L showed a good cleaning effect.

Table 2 shows the results of a mold cleaning test performed using the mold cleaning resin compositions I to L by the same test method as that for the mold cleaning resin compositions A to H described above. . Table 1 2 Die blue cleaning properties Value Cleaning completed Resin composition Curability (sec) Flowability (cm) Number of shots

5 I 3 3 0 5 2 6

6 J 3 2 6 4 8 6

Out

7 K 3 3 2 5 5 6

An example

8 3 3 4 5 3 7 Industrial applicability

ADVANTAGE OF THE INVENTION The resin composition for metal mold cleaning of this invention can improve the workability of metal mold cleaning | cleaning also with remarkable metal mold | contamination, and can also clean various contaminated components.

Claims

The scope of the claims

1. When molding a curable resin molding material, the mold cleaning resin composition that removes stains on the mold surface contains a melamine resin as the mold cleaning resin, and has an average fiber length of 5 to 3 and an average fiber. A resin composition for cleaning a mold, comprising a fibrous inorganic compound having a diameter of 0.1 to 0 m and an aspect ratio of 10 to 60.

2. The resin composition for mold cleaning according to claim 1, wherein the content of the fibrous inorganic compound is 1 to 30 parts by weight based on 100 parts by weight of the resin for mold cleaning.

3. The resin composition for cleaning a mold according to claim 1, wherein the fibrous inorganic compound is surface-treated.

4. The mold cleaning resin according to claim 1, further comprising at least one selected from melamine resin impregnated pulp, mineral powder having a particle size of # 100 to # 400, a curing catalyst, and a lubricant. Composition.

5. A resin composition for cleaning a mold, which removes stains on the surface of a mold during molding of a curable resin molding material, comprising the following (A) to (D): object.

(A) Melamine resin 100 parts by weight

(B) Pulp 5 to 70 parts by weight

(C) Mineral powder of fiber # 100- # 400, 100-90 parts by weight

(D) An average fiber length of 5 to 30 m, an average fiber diameter of 0.1 to 1.◦m, and a fibrous inorganic conjugate having an aspect ratio of 10 to 60 1 to 30 parts by weight

6. The resin composition for cleaning a mold according to claim 5, wherein a part or all of the pulp is powder pulp.

7. The resin composition for cleaning a mold according to claim 5, wherein the pulp contains melamine resin-impregnated pulp.

8. The resin composition for cleaning a mold according to claim 5, wherein the fibrous inorganic compound is surface-treated.