GB2298650A

GB2298650A - Amino resin composition for mold cleaning

Info

Publication number: GB2298650A
Application number: GB9607369A
Authority: GB
Inventors: Akira Omura; Nobuyuki Sawada; Hiroshi Mizuoka
Original assignee: Nippon Carbide Industries Co Inc
Current assignee: Nippon Carbide Industries Co Inc
Priority date: 1994-08-24
Filing date: 1995-08-22
Publication date: 1996-09-11
Anticipated expiration: 2015-08-22
Also published as: WO1996005954A1; TW343171B; GB2298650B; JP3781445B2; MY112167A; KR960705667A; GB9607369D0; HK1009697A1; CN1134129A; KR100305180B1; CN1073499C; JPH0857865A

Description

SPECIFICATION AMINO RESIN COMPOSITIONS FOR CLEANING MOLD Technical Field This invention relates to an amino resin compositions used to remove residuary soil from the surface of a mold during molding of a curable resin molding material. This invention particularly relates to an amino resin compositions which have good mold cleaning performances and good tableting characteristics under the wide range of molding conditions.

Background Art It has theretofore often occurred that, during the molding of sealed molded products, such as integrated circuits, with curable resins, such as epoxy resins, when the molding is continued for a long period of time, the inner surface of the mold becomes soiled.

When the molding is continued even further, the surfaces of the sealed molded products are soiled. Also, the sealed molded product clings to the mold, and therefore the molding process becomes inoperable. Therefore, it is necessary to periodically clean the mold. For such purposes, a method has been proposed wherein a mold is cleaned by molding a cleaning resin for removing re siduary soil by several shots each time a molding material has been molded by several hundreds of shots.

For example, in Japanese Patent Publication 52-788, a method for cleaning the surface of a mold has been proposed, wherein residuary soil on the surface of the mold in the molding of a curable resin (excluding an amino resin) is removed by carrying out the molding with a cleaning material, which contains an amino resin as a predominant component. In this publication, a mold cleaning resin composition, which comprises an amino resin, an organic materials such as pulp and wood powder and/or an inorganic materials such as silica and calcium carbonate, and a lubricant, is disclosed.

Also, Japanese Patent Publication 64-10162 discloses a mold cleaning resin composition, which contains a cocondensation resin of an amino resin and a phenol resin, and a mineral powder having a new Mohs hardness number of 6 to 15.

These mold cleaning resin compositions are ordinarily used in the form of tablets having the same size as the size of the molding materials. The molding is carried out by preheating such that the temperature of the tablets becomes 90 'C to 110 C. In this manner, the mold cleaning resin composition is filled in the entire area of the mold. When the mold cleaning resin composition is cured, it takes up residuary soil from the surface of the mold and thereby cleans the surface of the mold.

Recently, in order to satisfy requirements for unmanned and clean molding work, an automatic molding machine for a curable resin has been developed, and automatic molding work has become popular. With the automatic molding machine, sealed molded products, such as IC's and LSI's, are molded with small molds having several cavities to several tens of cavities. Sealing resins used are supplied as a form of mini-tablets having a diameter of approximately 5 mm to approximately 40 mm.

The above automatic molding machine employs a molding process of automatically repeating a series of steps comprising supplying mini-tablets into a pot, molding the mini-tablets while preheating them within the pot, and then automatically taking out a molded product.

Also, there has arisen a tendency in the field of IC's, LSI's, and the like, towards a higher degree of integration, a thinner shape, and surface mounting.

Therefore, molded products have became increasingly diversified, and tablets having a wide variety of sizes are used in accordance with the required molded pro ducts. Also, the sizes of mold cleaning resin composition have been reduced in accordance with sealing resin mini-tablets. Thus mini-tablets of the mold cleaning resin composition having various sizes are required.

Therefore, such a conventionally known resin composition as described in Japanese Patent Publication 52-788 has been heretofore used for cleaning the mold of the automatic machine by forming it into a form of mini-tablets.

However, when such a cleaning resin composition as described in Japanese Patent Publication 52-788 is formed into mini-tablets, the mini-tablets thus formed are difficult to push out from the mold. Therefore, a creaky sound is generated when the mini-tablets are pushed out from the mold, and faults such as cracking or chipping are liable to occur in the mini-tablets, increasing the rejection rate of the mini-tablets.

Further, since the curing rate of the cleaning resin composition is very low, the cleaning resin composition blisters when the molding is conducted at low temperatures, and therefore the cleaning resin composition cannot be used for cleaning the molds when automatic molding is conducted at low temperatures. When a cleaning resin composition as disclosed in Japanese Patent Publication 64-10162 is used in the form of mini-tablets, the rejection rate for forming the minitablets is too high. The cleaning resin composition can effectively clean the molds when the molding is conducted at low temperatures since the cleaning resin composition shows high curing rate. However, it cannot clean the mold of the automatic molding machine at high temperatures even when the mold is cleaned at twice as many shots as usual.

Also, the compositions of the conventional cleaning resin compositions are determined, in general, in view of enhancing molding performance of the preheated large-sized tablets or shortening cleaning time.

Therefore, when the mini-tablets are formed under the same composition as that of the large-sized tablets, the range of the molding conditions for exhibiting good cleaning performances becomes narrow, since the minitablets require non-preheating molding with the automatic molding machine, which is entirely different molding conditions from those for molding the largesized tablets. Further, when cleaning is conducted under a molding condition producing poor cleaning performances, the operator must increase the number of shots of the cleaning resin composition.

Accordingly, an attempt has been made to increase the amount of a lubricant contained in the cleaning resin composition, such as the composition described in Japanese Patent Publication 52-788, and thereby to enhance the yield in the tableting process.

However, where the amount of the lubricant contained in the cleaning resin composition is increased, the problems occur in that the lubricant itself bleeds out and causes soiling of the molds, in that the number of shots of the cleaning resin composition must be increased under the molding conditions of poor cleaning performances.

Thus a need exists for a mold cleaning resin composition which has good tableting characteristics and good cleaning characteristics under the wide range of molding conditions.

Disclosure of the Invention The inventors carried out extensive research and found that the cleaning characteristics of a cleaning resin composition can be kept good, and the tableting characteristics thereof can be improved when a nonmetallic fatty acid lubricant, which exhibits good lubricating effects, good compatibility with resins, and good thermal stability, is used as lubricants for enhancing the yield in the tableting process without increasing the amount of the lubricants, and a metallic soap, which participates in the fluidity and mold release characteristics of the cleaning resin composition during the molding, is used as a lubricant.

The present invention is based on such findings. Thus, the present invention provides an amino resin composition for removing residuary soil from the surface of a mold during the molding of a curable resin, comprising an amino resin, a metallic soap and a lubricant of a nonmetallic fatty acid.

Detailed Description of the Invention The present invention will hereinbelow be described in detail.

The term "amino resin" as used herein includes melamine resins, melamine-phenol co-condensation resins, melamine-urea co-condensation resins, and the like. The melamine-phenol co-condensation resins can be obtained by the co-condensation of triazines such as melamine and phenols or aldehydes such as formaldehyde. The melamine-urea co-condensation resins can be obtained by the co-condensation of triazines such as melamine and ureas or aldehydes.

The melamine resins described above can be obtained by the condensation of triazines such as melamine and aldehydes. The urea resins can be obtained by the condensation of ureas and aldehydes. The aforesaid triazines may contain, in addition to melamine, e.g., benzoguanidine and acetoguanamine, in a proportion of at most 30 parts by weight per 100 parts by weight of the aforesaid triazines.

The aforesaid phenols may contain, in addition to phenol, e.g., cresol, xylenol, ethyl phenol, and butyl phenol, in a proportion of at most 30 parts by weight per 100 parts by weight of the aforesaid phenols. The aforesaid aldehydes may contain, in addition to formaldehyde, e.g., paraform aldehyde and acetaldehyde.

The amino resin composition in accordance with the present invention may contain the other resins, which can be blended with the amino resin composition in accordance with the present invention, in a minor amount such that the improved properties of the amino resin composition in accordance with the present invention may not be adversely affected. Examples of such other resins include alkyd resins, polyester resins, acrylic resins, epoxy resins, and rubbers.

Examples of the lubricant of a non-metallic fatty acid, which are employed in the present invention, include fatty acids, such as stearic acid, oleic acid, and behenic acid; esters of a fatty acid, such as butyl stearate and dodecyl stearate; partial esters of a fatty acid, such as monoglyceryl searate, monoglyceryl oleate , monoglyceryl hydroxystearate, pentaerythritol stearic acid ester, polyglycerol stearate, and sorbitan trioleate; fatty acid amides, such as lauramide, myristamide, erucamide, oleamide, and stearamide; and fatty acid bisamides, such as methylene bis-stearamide, ethylene bis-stearamide, and ethylene bis-oleamide. Among the above-enumerated lubricants of a non-metallic fatty acid, the fatty acids, the fatty acid amides, and the fatty acid bisamides, which haste large effects with small amounts used, are preferred.The fatty acid amides and the fatty acid bisamides are more preferred. The fatty acid bisamides are particularly preferred in view of good thermal stability. The lubricant can be preferably used in a proportion falling within the range of 0.1 parts by weight to 1.5 parts by weight per 100 parts by weight of the amino resin composition, more preferably 0.2 parts by weight to 0.8 parts by weight, and still preferably 0.2 parts by weight to 0.6 parts by weight.

If the proportion of the lubricant is lower than 0.1 parts by weight, the pressure during pushing the tablets out from the molds for forming the tablets may become very high. As a result, the problems will occur in that creaky sound occurs when the molded tablets are pushed out from the molds, and in that defects, such as cracking and chipping, occur with the formed tablets and cause the rejection rate of the formed tablets to become high. If the proportion of the lubricant is higher than 1.5 parts by weight, the cleaning characteristics will become markedly bad, and the lubricant will often bleed out and will soil the surface of a mold.

The metallic soap employed in the present invention participates in the enhancement of the fluidity of the molten resin in the mold and the mold release characteristics of the resin after being cured.

Examples of the metallic soaps include calcium stearate, zinc stearate, magnesium stearate, aluminum stearate, and zinc myristate. The metallic soap can be preferably used in a proportion falling within the range of 0.1 parts by weight to 1.5 parts by weight per 100 parts by weight of the amino resin composition, preferably 0.2 parts by weight to 1 part by weight, and still preferably 0.3 parts by weight to 0.8 parts by weight. If the amount of the metallic soap is insufficient, the amino resin composition may not spread to minute portions in a mold having a complicated shape, and cleaning failures will thus occur. Also, the amino resin composition having been cured cannot separate from the mold, and- cleaning failures will thus occur.

In the amino resin composition in accordance with the present invention, the lubricants described above may be used in combination of two or more. In order that the mold cleaning characteristics can be kept good, the total amount of the lubricants are preferably set to be at most 1.5 parts by weight per 100 parts by weight of the amino resin composition, and more preferably at most 1 part by weight.

The amino resin composition in accordance with the present invention may also contain mineral powders.

Examples of the mineral powder include natural materials, such as corundum, emery, garnet, and silica; and oxides or carbides of silicon, iron, titanium, sodium, calcium, magnesium, aluminum, chromium, and boron.

Preferred examples of the oxides and carbides are silicon oxide, magnesium oxide, aluminum oxide, silicon carbide, and boron carbide.

No limitation is imposed on the particle size of the mineral powder. The particle size of the mineral powder generally falls within the range of &num;10 to &num;8,000, should preferably fall within the range of &num;50 to &num;4,000, and should more preferably fall within the range of &num;100 to $2,000. If the particle size of the mineral powder is smaller than &num;8,000, the drawbacks will occur in that the cleaning performances will become bad, and in that dust occurs during the handling and the working atmosphere will thus become bad. If the particle size of the mineral powder is larger than +10, the drawbacks, such as breakage of the mold and cleaning nonuniformity, will occur.

No limitation is imposed on the amount of the mineral powder used. The proportion of the mineral powder generally falls within the range of 10 parts by weight to 90 parts by weight per 100 parts of the amino resin composition in accordance with the present invention, and should preferably fall within the range of 10 parts by weight to 30 parts by weight.

Besides the mineral powders described above, the amino resin compositions in accordance with the present invention may also contain other additives, such as inorganic or organic fillers, coloring agents, curing catalysts, and anti-oxidants. Examples of such additives include the inorganic or organic fillers, such as pulp, wood powder, vinylon fiber, glass powder, glass fiber, untreated calcium carbonate, talc, aluminum hydroxide, barium sulfate, and zinc sulfide; the coloring agents, such as inorganic pigments, e.g., titanium oxide, carbon black, zinc white, cadmium yellow, and red iron oxide, organic pigments, e.g., phthalocyanine compounds, azo compounds, and diazo compounds, fluorescent pigments, e.g., benzoxazole compounds, naphthotriazole compounds, and coumalin compounds, and dyes, such as anthraquinone dyes, indigo dyes, and azo dyes; the curing catalysts, such as organic acids, e.g. benzoic acid, phthalic anhydride, oxalic acid, sulfamic acid, and p-toluenesulfonic acid, inorganic acids, e.g. hydrochloric acid and sulfuric acid, and salts of these acids with triethylamine, triethanolamine, ss-dimethylamino ethanol, and 2-methyl-2-amino-l-propanol; and the anti-oxidants, such as naphthylamine anti-oxidants, p-phenylenediamine antioxidants, and thiobisphenol anti-oxidants.

As the pulp, it is possible to use straw pulp, bamboo pulp, wood pulp (softwood pulp and hardwood pulp), and the like. Also, either the chemical pulp or the mechanical pulp may be used.

No limitation is imposed on the size of the fillers, such as the pulp and the wood powder. The size of the fillers generally falls within the range of 5 sm to 1,000 am, and should preferably fall within the range of 10 zm to 200 zm.

The proportion of the pulp or wood powder to be added, generally falls within the range of 15 parts by weight to 70 parts by weight per 100 parts by weight of the amino resin composition, and should preferably fall within the range of 20 parts by weight to 60 parts by weight.

In order to prepare the amino resin composition in accordance with the present invention, an arbitrary means may be employed which can uniformly mix the amino resin, the mineral powder, and minor amounts of optionally used other resins and additives. For example, it is possible to use kneaders, ribbon blenders, Henschel mixers, ball mills, roll mills, compression mixers, and tumblers.

The amino resin composition in accordance with the present invention should preferably have a T90 value, 220 to 420 seconds, more preferably 250 to 400 seconds, at the surface temperature of the mold of 145 C, the T90 value being measured with a Curast meter. Where the T90 value is 420 seconds or smaller, even when the molding temperature is low, blisters will rarely occur during molding, and the amino resin composition will remain little in the mold. Where the T20 value is 220 seconds or greater, even when the molding temperature is high, cleaning performances are not deteriorated. Therefore, the above range is pre ferred.

No limitation is imposed on the method wherein the T90 value of the amino resin composition in accordance with the present invention is set to fall within the above range. For example, the amount of the curing catalyst used, proportion of the resin components based on the total amount of the amino resin composition, molar ratio of aldehydes to melamine in the amino resin composition, or combinations thereof may be adjusted.

Examples of the curable resin, for which the amino resin composition in accordance with the present invention can be used to clean the mold, include epoxy resins and phenol resins. Preferred among them is the epoxy resin, with an epoxy resin for sealing semiconductors being still preferred. The amino resin composition in accordance with the present invention is applicable to any of molds, which are used for the automatic molding of the curable resins. In general, the amino resin composition in accordance with the present invention is applicable to the molds made of iron, chrome, or the like.

With the amino resin composition in accordance with the present invention, the yield in the tableting process can be enhanced under the wide range of molding conditions without deteriorating the mold cleaning performances. In particular, with the amino resin composition in accordance with the present invention, in the forming of mini-tablets, the tablets can be formed with a high yield.

Incidentally, the term "mini-tablet" as used herein means a tablet having a diameter of approximately 5 to 40 mm, which is generally used for cleaning the molds in the automatic molding machines for curable resins.

Examples The present invention will further be illustrated by the following nonlimitative examples.

The tableting characteristics, the T90 value, and the cleaning performances were measured with the methods described below.

< Method for measuring the tableting characteristics > Five grams of raw material powder was introduced into a tableting mold (20 mm diameter x 30 mm height) and pressurized to 350 kgf/cm2 with a pressurizing apparatus. The pressure was kept for approximately one minute. The lower part of the mold was then removed, and the maximum pressure during pushing out the tablet under pressure was read out.

Also, it was investigated whether or not creaky sound occurred, and whether or not defects, such as breakage of the tablet (cracking, chipping, or the like), occurred. In the same manner, 100 tablets were formed, the number of rejects was counted, and the rejection rate was calculated.

Method for measuring the curing rate (T90 value) with the Curast meter > With a commercially available Type JSR Curast meter, the surface temperature of the mold was set at 145' C, a vibration deformation with a predetermined amplitude was given, and a change in the generated stress of the amino resin composition with respect to the curing time was detected. The maximum stress value, at which the change in the stress became approximately constant, was taken as 100%. The time, which occurred between when the curing was begun and when the generated stress corresponding to 90% of the maximum stress value was reached, was taken as the T90 value (in the units of second).

< Method for testing the cleaning performances (1) > Mini-tablets of a commercially available epoxy resin (Nitron MP supplied by Nitto Electric Industrial Co., Ltd.) were used to obtain sealed molded products.

With molds for an automatic molding machine, 400 shots of the sealed molded products were molded with a trans fer molding process. The molds were thereby caused to soil. Thereafter, the amino resin composition for the test was molded with these molds. The number of shots and the cleaning performances were rated on the following criteria. In the testing, the molding was conducted with a surface temperature of the mold of 180 C and a curing time of 240 seconds.

5: No fog occurred.

4: Little fog occurred.

3: Slight fog occurred.

2: Fog occurred.

1: Much residuary soil occurred.

< Method for testing the cleaning performances (2) > (Preferred conditions for cleaning) Mini-tablets made of commercially available epoxy resin (Nitron MP supplied by Nitto Electric Industrial Co., Ltd. ) were used to obtain sealed molded products. With molds for an automatic molding machine, 400 shots of the sealed molded products were molded with a transfer molding process. The molds were thereby caused to soil. Thereafter, five shots were molded using the amino resin composition while keeping the mold at the test temperature and changing the curing time. Then the surface of the mold was observed to evaluate cleaning effects in the same manner as in the method No. 1 for testing.

Example 1 A melamine-phenol co-condensation resin liquid was prepared in accordance with a known method by heat treating a mixture of 343 parts by weight of melamine, 130 parts by weight of phenol, 517 parts by weight of formalin (37% aqueous solution), and 4 parts by weight of potassium hydroxide. The melamine-phenol co-condensation resin liquid was dried under reduced pressure, and powder was thereby obtained. Thereafter, 70 parts by weight of the obtained resin powder, 20 parts by weight of silica powder having a particle size of &num;200, 9.5 parts by weight of powdered pulp, 0.1 parts by weight of benzoic acid, and 0.5 parts by weight of zinc stearate were ground with a ball mill.

To the ground mixture, 0.3 parts by weight of ethylene bis-stearamide was added with a knowter mixer. In this manner, the amino resin composition A was obtained.

As for the obtained amino resin composition, the tableting characteristics, the T90 value, and the cleaning performances (1) and (2) were investigated.

The results on the tableting characteristics and the cleaning performances (1) are shown in Table 1, and those on the T90 value and cleaning performances (2) are shown in Table 2. As is clear from the test re sults, very good cleaning performances were obtained.

Example 2 In a kneader, 190 parts by weight of the melamine-phenol co-condensation resin liquid, which had been obtained in Example 1, and 50 parts by weight of pulp were kneaded together. The kneaded mixture was dried and ground. In this manner, a melamine-phenol co-condensation resin compound was obtained.

Thereafter, 30 parts by weight of the compound having thus been obtained, 50 parts by weight of a commercially available melamine resin (Nikaresin S-176, supplied by Nippon Carbide Kogyo), 20 parts by weight of silica powder having a particle size of &num;200, 0.1 parts by weight of benzoic acid, and 0.5 part by weight of zinc myristate were ground with a ball mill. To the ground mixture, 0.3 parts by weight of ethylene bisstearicamide was added with a knowter mixer. In this manner, the amino resin composition B was obtained.

The results on the tableting characteristics and the cleaning performances (1) are shown in Table 1, and those on the T90 values and cleaning performances (2) are shown in Table 2. As is clear from the test re sults, very good cleaning performances were obtained.

Example 3 A melamine-urea co-condensation resin liquid was prepared in accordance with a known method by using 363 parts by weight of melamine, 87 parts by weight of urea, and 550 parts by weight of formalin (37% aqueous solution). The melamine-urea co-condensation resin liquid was dried under reduced pressure, and powder was thereby obtained. Thereafter, 60 parts by weight of the obtained resin powder, 19.3 parts by weight of quartz powder having a particle size of &num;1,000, 20 parts by weight of powdered pulp, 0.05 parts by weight of phthalic anhydride, and 0.5 part by weight of calcium stearate were ground with a ball mill. To the ground mixture, 0.4 part by weight of ethylene bisoleamide was added with a knowter mixer. In this manner, the amino resin composition C was obtained.

The results on the tableting characteristics and the cleaning performances (1) are shown in Table 1, and those on the T90 value and cleaning performances (2) are shown in Table 2. As is clear from the test results, very good cleaning performances were obtained.

Example 4 In a kneader, 190 parts by weight of the melamine-phenol co-condensation resin liquid, which had been obtained in Example 1, and 50 parts by weight of pulp were kneaded together. The kneaded mixture was dried and ground. In this manner, a melamine-phenol co-condensation resin compound was obtained.

Thereafter, 30 parts by weight of the compound having thus been obtained, 50 parts by weight of a commercially available melamine resin (Nikaresin S-176, supplied by Nippon Carbide Kogyo), 20 parts by weight of silica powder having a particle size of &num;200, 0.1 parts by weight of benzoic acid, and 0.5 part by weight of zinc myristate were ground with a ball mill. To the ground mixture, 0.3 part by weight of erucic acid amide was added with a knowter mixer. In this manner, the amino resin composition D was obtained.

Example 5 The amino resin composition E was prepared in the same manner as that in Example 1, except that stearic acid was used in lieu of ethylene bis-stearamide.

Example 6 The amino resin composition F was prepared in the same manner as that in Example 1, except that pentaerythritol stearic acid ester was used in lieu of ethylene bis-stearamide.

Example 7 The amino resin composition G was prepared in the same manner as that in Example 1, except that the amount of the benzoic acid used was determined to 0.05 parts by weight.

Example 8 A melamine resin liquid was prepared in accordance with a known method by heat treating a mixture of 490 parts by weight of melamine and 517 parts by weight (37% aqueous solution) of formalin. The melamine resin liquid was dried under reduced pressure, and powder was thereby obtained. Thereafter, 75 parts by weight of the obtained resin powder, 16 parts by weight of silica powder having a particle size of &num;200, 8.2 parts by weight of powdered pulp, 0.05 parts by weight of benzoic acid, and 0.5 parts by weight of zinc stearate were ground with a ball mill. To the ground mixture, 0.3 part by weight of ethylene bis-stearamide was added with a knowter mixer. In this manner, the amino resin composition H was obtained.

Comparative Example 1 The amino resin composition I was prepared in the same manner as that in Example 1, except that the amount of ethylene bis-stearamide and the amount of zinc stearate were set to be zero.

The results on the tableting characteristics and the cleaning performances (1) are shown in Table 1, and those on the T90 value and cleaning performances (2) are shown in Table 3.

Comparative Example 2 The amino resin composition J was prepared in the same manner as that in Example 1, except that the amount of ethylene bis-stearamide was set to be zero.

Comparative Example 3 The amino resin composition K was prepared in the same manner as that in Example 1, except that the amount of zinc stearate was set to be zero.

Comparative Example 4 The amino resin composition L was prepared in the same manner as that in Example 1, except that the amount of ethylene bis-stearamide was set to be 1.2 parts by weight.

Table 1

Tableting Characteristics Cleaning Characteristics Maximum Rejection Rate Number of Shots with Pressure Resin Composition and Cleaning Performances (kgf/cm2) (%) 1 2 3 4 5 6 7 8 1 Resin Composition A 20 1 3 4 5 5 5 5 5 5 2 Resin Composition B 21 1 3 5 5 5 5 5 5 5 3 Resin Composition C 22 2 3 4 4 5 5 5 5 5 Examples 4 Resin Composition D 23 4 3 4 5 5 5 5 5 5 5 Resin Composition E 23 5 3 3 5 5 5 5 5 5 6 Resin Composition F 25 6 3 4 4 5 5 5 5 5 7 Resin Composition G 21 1 3 5 5 5 5 5 5 5 8 Resin Composition H 20 2 3 3 5 5 5 5 5 5 1 Resin Composition I 28 21 2 2 3 3 3 3 4 5 Comparative 2 Resin Composition J 27 15 3 3 4 4 5 5 5 5 Examples 3 Resin Composition K 23 6 2 2 3 3 3 4 4 5 4 Resin Composition L 16 1 2 3 3 3 4 4 5 5 Table 2

Cleaning Characteristics T90 Value Curing Time Molding Temperature ( C) (sec) (sec) 150 160 170 180 190 180 4 4 4 4 4 Example 210 4 4 4 4 5 1 272 240 4 4 5 5 5 (A) 270 5 5 5 5 5 300 5 5 5 5 4 180 4 4 4 4 5 Example 210 4 4 4 4 5 2 260 240 4 4 4 5 5 (B) 270 4 5 5 5 5 300 5 5 5 5 4 180 4 4 4 4 4 Example 210 4 4 4 5 5 3 284 240 4 4 5 5 5 (C) 270 4 4 5 5 4 300 5 5 5 5 4 180 4 4 4 4 4 Example 210 4 4 4 4 5 4 278 240 4 4 4 5 5 (D) 270 4 4 5 5 5 300 5 5 5 5 4 180 4 4 5 5 4 Example 210 4 4 5 5 4 5 253 240 4 5 5 5 4 (E) 270 4 5 5 5 4 300 4 5 4 4 3 180 4 4 4 4 4 Example 210 4 4 4 4 5 6 297 240 4 4 5 5 5 (F) 270 4 4 5 5 5 300 5 5 5 5 4 180 4 4 4 4 4 Example 210 4 4 4 4 5 7 355 240 4 4 5 5 5 (G) 270 5 5 5 5 5 300 5 5 5 5 4 180 4 4 4 4 4 Example 210 4 4 4 4 5 8 302 240 4 4 4 5 5 (H) 270 4 5 5 5 5 300 5 5 5 5 4 Table 3

Cleaning Characteristics T90 Value Curing Time Molding Temperature ( C) (sec) (sec) 150 160 170 180 190 Comparative 180 2 2 2 2 3 210 2 2 2 3 3 Example 268 240 2 2 2 3 4 270 2 2 3 3 4 (I) 300 2 2 3 4 4 180 3 4 4 4 5 Comparative 210 4 4 4 5 5 Example 255 240 4 4 5 5 5 270 4 4 5 5 4 (J) 300 4 5 5 5 4 180 2 2 2 3 3 Comparative 210 2 2 2 3 3 Example 291 240 2 2 3 3 3 270 2 2 3 3 4 (K) 300 2 2 3 4 2 180 4 4 4 4 3 Comparative 210 4 4 4 4 2 Example 312 240 4 5 3 4 2 270 4 5 3 3 1 (L) 300 4 5 3 2 1 Industrial Applicability The amino resin composition for removing residuary soil from the surface of a mold during the molding of a curable resin in accordance with the present invention, which comprises an amino resin, a metallic soap and a lubricant of a non-metallic fatty acid, exhibits good tableting characteristics, particularly during the forming of mini-tablets, and exhibits good cleaning characteristics under the wide range of molding conditions.

Claims

1. An amino resin composition for removing residuary soil from the surface of a mold during the molding of a curable resin, comprising an amino resin, a metallic soap and a lubricant of a non-metallic fatty acid.

2. The amino resin composition according to claim 1, wherein said lubricant is a fatty acid, an ester of a fatty acid, a partial ester of a fatty acid, a fatty acid amide, or a fatty acid bisamide.

3. The amino resin composition according to claim 2, wherein said lubricant is a fatty acid bisamide.

4. The amino resin composition according to claim 1, wherein said metallic soap is calcium stearate, zinc stearate, or zinc myristate.

5. The amino resin composition according to claim 1, wherein said amino resin composition has a curing rate of 220 to 420 seconds, the curing rate being measured as a T90 value with a Curast meter at the surface temperature of the mold of 145 C.

6. The amino resin composition according to claim 1, which is in the form of mini-tablets.