KR960705667A - Amino resin composition (AMINO RESIN COMPOSITION FOR MOLD CLEANING) for mold cleaning - Google Patents

Amino resin composition (AMINO RESIN COMPOSITION FOR MOLD CLEANING) for mold cleaning

Info

Publication number
KR960705667A
KR960705667A KR1019960702081A KR19960702081A KR960705667A KR 960705667 A KR960705667 A KR 960705667A KR 1019960702081 A KR1019960702081 A KR 1019960702081A KR 19960702081 A KR19960702081 A KR 19960702081A KR 960705667 A KR960705667 A KR 960705667A
Authority
KR
South Korea
Prior art keywords
resin composition
fatty acid
amino resin
mold cleaning
metal mold
Prior art date
Application number
KR1019960702081A
Other languages
Korean (ko)
Other versions
KR100305180B1 (en
Inventor
아키라 오무라
노부유키 사와다
히로시 미즈오카
Original Assignee
아메미야 이사무
닛뽕 카바이드 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아메미야 이사무, 닛뽕 카바이드 고교 가부시끼가이샤 filed Critical 아메미야 이사무
Publication of KR960705667A publication Critical patent/KR960705667A/en
Application granted granted Critical
Publication of KR100305180B1 publication Critical patent/KR100305180B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C33/722—Compositions for cleaning moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning

Abstract

경화성 수지 성형재료의 성형시에 있어서, 금형표면의 더러움을 청소하는 금형 청소용 아미노계 수지 조성물로서, 금속비누 및 비금속계의 지방산계 윤활제를 함유하는 금형 청소용 아미노계 수지 조성물을 제공한다.When forming curable resin molding material, the amino resin composition for metal mold | die cleaning which cleans the dirt of a metal mold surface and metal mold | die and a non-metallic fatty acid type lubricant contains the amino resin composition for metal mold | die cleaning.

Description

금형 청소용 아미노계 수지 조성물(AMINO RESIN COMPOSITION FOR MOLD CLEANING)Amino resin composition (AMINO RESIN COMPOSITION FOR MOLD CLEANING) for mold cleaning

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (6)

경화성 수지 성형재료의 성형시, 금형표면의 더러움을 제거하는 금형 청소용 아미노계 수지 조성물에 있어서, 금속비누 및 비금속계의 지방산계 윤활제를 함유하여 이루어지는 것을 특징으로 하는 금형 청소용 아미노계 수지 조성물.An amino-based resin composition for cleaning molds, which removes dirt on the surface of a mold during molding of the curable resin molding material, comprising a metal soap and a non-metallic fatty acid-based lubricant. 제1항에 있어서, 상기 비금속계의 지방산계 윤활제가 지방산류, 지방산에스테르류, 지방산부분에스테르류, 지방산아미드류 또는 지방산비스아미드류인 것을 특징으로 하는 금형 청소용 아미노계 수지 조성물.2. The amino resin composition for metal mold cleaning according to claim 1, wherein the nonmetallic fatty acid lubricant is fatty acid, fatty acid ester, fatty acid partial ester, fatty acid amide or fatty acid bisamide. 제2항에 있어서, 상기 비금속계의 지방산계 윤활제가 지방산비스아미드류인 것을 특징으로 하는 금형 청소용 아미노계 수지 조성물.3. The amino resin composition for metal mold cleaning according to claim 2, wherein the nonmetallic fatty acid lubricant is fatty acid bisamides. 제1항에 있어서, 상기 금속비누가 스테아린산칼슘, 스테아릴산아연 또는 미리스틴산아연인 것을 특징으로 하는 금형 청소용 아미노계 수지 조성물.2. The amino resin composition for metal mold cleaning according to claim 1, wherein the metal soap is calcium stearate, zinc stearyl acid or zinc myristic acid. 제1항에 있어서, 큐래스트 미터에 있어서의 경화속도가, 금형의 표면온도 145℃에서의 T90값이 220∼420초인 것을 특징으로 하는 금형 청소용 아미노계 수지 조성물.The amino resin composition for mold cleaning according to claim 1, wherein the curing rate in the curst meter is a T90 value of 220 to 420 seconds at a surface temperature of 145 ° C of the mold. 제1항에 있어서, 미니타블렛(mini-tablet)의 형태인 것을 특징으로 하는 금형 청소용 아미노계 수지 조성물.The amino resin composition for metal mold cleaning according to claim 1, which is in the form of a mini-tablet. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019960702081A 1994-08-24 1995-08-22 Amino resin composition for mold cleaning KR100305180B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP22085394A JP3781445B2 (en) 1994-08-24 1994-08-24 Mold cleaning resin composition
JP6-220853 1994-08-24
PCT/JP1995/001659 WO1996005954A1 (en) 1994-08-24 1995-08-22 Amino resin composition for mold cleaning

Publications (2)

Publication Number Publication Date
KR960705667A true KR960705667A (en) 1996-11-08
KR100305180B1 KR100305180B1 (en) 2001-11-22

Family

ID=16757571

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960702081A KR100305180B1 (en) 1994-08-24 1995-08-22 Amino resin composition for mold cleaning

Country Status (8)

Country Link
JP (1) JP3781445B2 (en)
KR (1) KR100305180B1 (en)
CN (1) CN1073499C (en)
GB (1) GB2298650B (en)
HK (1) HK1009697A1 (en)
MY (1) MY112167A (en)
TW (1) TW343171B (en)
WO (1) WO1996005954A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3783042B2 (en) * 1995-08-23 2006-06-07 日本カーバイド工業株式会社 Mold cleaning resin composition
JP3270315B2 (en) * 1995-10-31 2002-04-02 日本カーバイド工業株式会社 Mold cleaning resin composition tablet
JP3270312B2 (en) * 1995-10-24 2002-04-02 日本カーバイド工業株式会社 Mold cleaning resin composition tablet
TW320600B (en) * 1995-10-24 1997-11-21 Nippon Denseki Kogyo Kk
DE10005574A1 (en) * 2000-02-09 2001-08-23 Reckitt Benckiser Nv Detergent composition in tablet form
KR20020006342A (en) * 2000-07-12 2002-01-19 마이클 디. 오브라이언 Removal method for plating chip of forming die
KR100545249B1 (en) * 2000-10-11 2006-01-24 닛뽕 카바이도 고교 가부시키가이샤 Resin composition for mold cleaning
WO2002090077A1 (en) * 2001-04-25 2002-11-14 Nippon Carbide Kogyo Kabushiki Kaisha Resin composition for cleaning mold
KR100905843B1 (en) * 2002-01-21 2009-07-02 닛뽕 카바이도 고교 가부시키가이샤 Resin composition for mold cleaning
CN100408296C (en) * 2002-12-06 2008-08-06 日本碳化物工业株式会社 Cleaning material for molding metal die, and cleaning method
JP2004323780A (en) * 2003-04-28 2004-11-18 Nippon Carbide Ind Co Inc Thermoplastic resin composition for cleaning
SG11201404265PA (en) * 2012-01-23 2014-10-30 Nippon Carbide Kogyo Kk Resin composition for cleaning die
JP6803165B2 (en) * 2015-08-07 2020-12-23 日本カーバイド工業株式会社 Resin composition for mold cleaning
JP6715627B2 (en) * 2016-03-18 2020-07-01 日本カーバイド工業株式会社 Mold cleaning resin composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113517A (en) * 1979-02-23 1980-09-02 Nippon Carbide Ind Co Ltd Resin composition for cleaning metallic mold
JPS63246210A (en) * 1988-02-19 1988-10-13 Nippon Carbide Ind Co Ltd Resin composition for mold cleaning
JPH0381111A (en) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd Molding material and method for cleaning of die

Also Published As

Publication number Publication date
MY112167A (en) 2001-04-30
GB2298650B (en) 1998-08-05
HK1009697A1 (en) 1999-09-10
TW343171B (en) 1998-10-21
GB2298650A (en) 1996-09-11
JPH0857865A (en) 1996-03-05
CN1073499C (en) 2001-10-24
KR100305180B1 (en) 2001-11-22
CN1134129A (en) 1996-10-23
WO1996005954A1 (en) 1996-02-29
GB9607369D0 (en) 1996-06-26
JP3781445B2 (en) 2006-05-31

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