KR20170113263A - Resin composition for cleaning die - Google Patents

Abstract

A melamine resin and a second curing catalyst having a melting point in the range of 43 to 115 占 폚 and a second curing catalyst having a melting point in the range of 53 to 125 占 폚 and at least 10 占 폚 higher than the melting point of the first curing catalyst A cleaning resin composition.

Description

[0001] Resin composition for cleaning die [0002]

The present disclosure relates to a resin composition for cleaning a mold.

When an encapsulation molding operation of an integrated circuit or an LED element is continued for a long time using an encapsulating material containing a thermosetting resin composition typified by an epoxy resin, a silicone resin, a phenol resin, a polyimide resin, or the like, Is attached to the inner surface of the molding die. If the dirt adhering to the inner surface of the molding die is left to stand, there is a defect that dirt adheres to the surface of an encapsulating material such as an integrated circuit or an LED element. In order to prevent such defects, it is necessary to remove the dirt adhering to the inner surface of the molding die in the bag molding step. More specifically, a resin composition for cleaning a mold is formed at a rate of a few shots per hundred of the shot forming operations to remove dirt.

Various studies have been made on such resin composition for mold cleaning in the past. For example, International Publication No. 2002/30648 and International Publication No. 2013/111709 disclose a resin composition for cleaning a mold comprising a melamine resin.

Normally, the encapsulation molding operation of an integrated circuit, an LED element, or the like is performed by controlling the temperature of the molding die at 160 ° C to 200 ° C. Therefore, these resin compositions for cleaning a mold are designed to be able to remove dirt adhering to the inner surface of a molding die by molding at 160 ° C to 200 ° C.

BACKGROUND ART [0002] In recent years, for example, encapsulating materials to be molded at a molding mold temperature lower than the conventional one, specifically in the range of 125 占 폚 to 150 占 폚, have been continuously used in encapsulation of LED devices. When the conventional resin composition for cleaning a mold is used in the range of 125 ° C to 150 ° C, it takes a very long time to cure the resin composition for cleaning a mold, and the cured product of the resin composition for cleaning a mold easily remains on the inner surface of the mold, And causes dirt to adhere to the surface of the bag molding.

The improvement of such defects can be considered as a design change in which the melting point of the curing agent contained in the resin composition for cleaning a mold is lowered and cured in the range of 125 캜 to 150 캜. However, when the resin composition for cleaning a mold containing a curing agent having a low melting point is used for cleaning, excessive curing or lack of curing (excessive flow) occurs and the curing control of the resin composition for cleaning a mold is not sufficient, Can not be removed. This is because when the inner surface of the mold is cleaned, the temperature from the room temperature to the temperature at which the resin composition for cleaning a mold can be formed is narrowed so that the temperature rises sharply so that the hardening of the mold cleaning resin composition is accelerated and the resin composition for cleaning a mold is hardened uniformly This is because excessive curing or excessive flow occurs.

The present disclosure has been made in view of the above circumstances. That is, the object of the present invention is to provide a resin composition for cleaning a mold, which can suppress excessive curing and excessive flow in cleaning the inner surface of a molding die at a molding die temperature of 125 ° C to 150 ° C, .

Specific means for achieving the above object are as follows.

[1] A curable composition comprising a melamine resin, a first curing catalyst having a melting point in the range of 43 캜 to 115 캜,

And a second curing catalyst having a melting point in the range of 53 ° C to 125 ° C and at least 10 ° C higher than the melting point of the first curing catalyst.

[2] The resin composition for cleaning a mold according to [1], wherein the total content of the first curing catalyst and the second curing catalyst relative to 100 parts by mass of the resin composition for mold cleaning is in the range of 0.02 mass parts to 9 mass parts.

[3] The resin composition for cleaning a mold according to [1] or [2], wherein the ratio (by mass) of the content of the second curing catalyst to the content of the first curing catalyst is in the range of 400/1 to 1/400 .

[4] The process according to [1], wherein the first curing catalyst is at least one selected from the group consisting of stearic acid and behenic acid,

The resin composition for cleaning a mold according to any one of [1] to [3], wherein the second curing catalyst is at least one selected from the group consisting of benzoic acid and o-toluic acid.

[5] The resin composition for cleaning a mold according to any one of [1] to [4], which is used for cleaning a mold of a transfer molding machine.

According to the present invention, it is possible to provide a resin composition for cleaning a mold, which can suppress excessive curing and excessive flow in cleaning the inner surface of a molding die in the range of 125 deg. C to 150 deg.

Hereinafter, a specific embodiment of the present disclosure will be described in detail. Note that the present disclosure is not limited to the following embodiments, but can be carried out by appropriately modifying it within the scope of the object of the present disclosure.

In the present specification, the numerical range indicated by using " ~ " indicates a range including the numerical values described before and after " ~ " as the minimum value and the maximum value, respectively. The amount of each component in the composition is represented by the total amount of these plural kinds of substances when a plurality of kinds of substances corresponding to each component are included unless otherwise specified.

In the present specification, the " resin composition for cleaning a mold " is sometimes simply referred to as a " resin composition ".

In the present specification, the term " inner surface of the molding die " refers to a region in contact with the article to be molded in the molding die. In the present specification, a " molding die " is sometimes simply referred to as a " die ".

The resin composition for mold cleaning of the present disclosure occurs in a molding process of a sealant molding material (curable resin composition) which is cured at a temperature of 125 ° C to 150 ° C selected from the group consisting of epoxy resin, silicone resin, phenol resin and polyimide resin It is possible to remove the dirt on the inner surface of the molding die.

The resin composition for cleaning a mold of the present disclosure comprises a melamine resin and a first curing catalyst and a second curing catalyst having different melting points.

The melting point of the first curing catalyst is lower than the melting point of the second curing catalyst.

The inner surface cleaning process of a molding die using the resin composition of the present disclosure is as follows. First, a lead frame is placed on a molding die at room temperature, and then a resin composition molded into a tablet shape is inserted into the port portion and tightened. When the temperature of the molding die rises, the melamine resin and the first curing catalyst act first and the resin composition cures accordingly. At this time, the flow (fluidity) is also controlled. The temperature of the mold is further increased and the resin composition and the second curing catalyst start to operate. Next, the resin composition is caused to flow through the plunger. At this time, the resin composition in the port portion passes through the runner portion and flows through the gate portion into the cavity (the inner surface of the molding die). Thereafter, the melamine resin and the second curing catalyst further act to cure the resin composition. Since the second curing catalyst has a melting point higher than the melting point of the first curing catalyst and the first curing catalyst by at least 10 ° C, the resin composition of the present disclosure has a hardness of 125 ° C to 150 ° C, The resin composition is well-balanced, the mold releasability is sufficient, and excellent mold cleaning performance can be exhibited.

In the resin composition using the first curing catalyst having a low melting point in cleaning the inner surface of the mold at a mold temperature of 125 ° C to 150 ° C alone, the resin composition can not be sufficiently cured on the inner surface of the mold Therefore, the mold cleaning performance becomes insufficient. Further, in the resin composition using the second curing catalyst having a high melting point alone, the flow becomes excessive when flowing into the plunger, so that the resin composition does not uniformly spread on the inner surface of the molding die, and the mold cleaning performance is likewise insufficient.

[Melamine resin]

The resin composition for mold cleaning of the present disclosure includes at least one kind of melamine resin.

The melamine resin refers to a melamine resin, a melamine-phenol cocondensate or a melamine-urea cocondensate.

The melamine resin is a condensate of triazine and aldehydes. The triazines include, for example, melamine, benzoguanamine and acetoguanamine. Aldehydes include, for example, formaldehyde, paraformaldehyde and acetaldehyde.

The melamine resin preferably has a molar ratio of the repeating unit derived from the triazine compound and the repeating unit derived from the aldehyde compound of 1: 1.2 to 1: 4.

In the present specification, a condensation product of melamine and formaldehyde is referred to as a melamine-formaldehyde resin.

The melamine-phenol cocondensate is a co-condensation product of triazines, phenols and aldehydes. Phenols include, for example, phenol, cresol, xylenol, ethyl phenol and butyl phenol.

The melamine-urea co-condensate is a co-condensation product of triazine and urea and aldehyde.

Examples of urea compounds include urea, thiourea, and ethylene urea.

In the melamine-phenol cocondensation resin and the melamine-urea cocondensation resin, the total amount of the triazine and the phenol in the raw material or the total amount of the triazine and urea among the raw materials is 30 mass% or more, 40 mass% or more, 50 At least 60 mass%, at least 70 mass%, at least 80 mass%, or at least 90 mass% and less than 100 mass%.

The resin composition of the present disclosure may contain, in addition to the melamine resin, other resin compositions such as an alkyd resin, a polyester resin, an acrylic resin, an epoxy resin and a rubber to the extent that the effect of the disclosure is not impaired.

Since the resin composition of the present disclosure contains a melamine resin, the resin composition exhibits excellent cleaning property against the dirt on the inner surface of the mold. The reason for this is unclear. However, the present inventors have found that the resin composition of the present disclosure has a high polarity of the methylol group contained in the melamine resin and is generated due to the sealing molding material adhering to the inner surface of the mold, It is believed that the resin composition containing the melamine resin exhibits excellent mold cleaning performance.

[Curing catalyst]

The resin composition for cleaning a mold of the present disclosure comprises a first curing catalyst having a melting point of 43 ° C to 115 ° C and a second curing catalyst having a melting point of 53 ° C to 125 ° C and higher than the melting point of the first curing catalyst by 10 ° C or more do.

Since the melting point of the first curing catalyst is 43 ° C or higher, the resin composition of the present disclosure does not undergo curing and deterioration during storage of the resin composition.

In addition, since the melting point of the second curing catalyst is not higher than 125 캜, the resin composition of the present disclosure cures the resin composition sufficiently at the time of cleaning the inner surface of the molding die using the resin composition and becomes uniform when the molding die is pressed, It is possible to properly remove the dirt on the inner surface of the mold.

Furthermore, since the melting point of the second curing catalyst is higher than the melting point of the first curing catalyst by at least 10 ° C, the resin composition of the present invention can be obtained by molding a sealing material which is cured at 125 ° C to 150 ° C The curing of the resin composition before flow and the curing of the resin composition in the cavity (the inner surface of the molding die) due to the action of the second curing catalyst can be appropriately accomplished without causing excessive flow.

The melting point of the second curing catalyst is more preferably 15 ° C higher than the melting point of the first curing catalyst, and more preferably 25 ° C or higher.

In the present specification, the melting point of each of the first curing catalyst and the second curing catalyst is determined in accordance with JIS K0064: " Method of measuring melting point and melting range of a chemical product ".

The resin composition of the present disclosure preferably has a total content of 0.02 mass parts to 9 mass parts, more preferably 0.05 mass parts to 5 mass parts, of the first curing catalyst and the second curing catalyst relative to 100 mass parts of the resin composition, more preferably 0.1 By mass to 3 parts by mass. When the total content of the first curing catalyst and the second curing catalyst is 0.02 parts by mass or more, the resin composition of the present disclosure can be cured before flowing the resin composition into the plunger and in each of the cavities without excessively long time, The workability in the inner surface cleaning process of the mold becomes favorable, and when it is 9 parts by mass or less, it is preferable since excessive curing can be suppressed before flowing into the plunger and in each of the cavities.

The first cure catalysts that may be suitably employed in the present disclosure include, for example, lauric acid, 3-phenylpropionic acid, maleic anhydride, myristic acid, palmitic acid, stearic acid, behenic acid, p- methoxyphenylacetic acid, , p-tolylacetic acid, montanic acid, citric acid monohydrate, m-toluic acid, o-toluic acid, succinic anhydride, benzoic acid and naphthalenesulfonic acid hydrate.

In addition, the second curing catalysts that may be suitably employed in the present disclosure include, for example, maleic anhydride, myristic acid, palmitic acid, stearic acid, behenic acid, p-methoxyphenylacetic acid, o-tolylacetic acid, Carbonic acid, citric acid monohydrate, m-toluic acid, o-toluic acid, succinic anhydride benzoic acid, naphthalene sulfonic acid hydrate, benzylic acid and terephthalic acid.

The curing catalyst having a melting point of 53 ° C to 115 ° C can be suitably used as both the first curing catalyst and the second curing catalyst in the resin composition of the present disclosure. For example, stearic acid having a melting point of 70 占 폚 acts as a first curing catalyst when used in combination with benzoic acid having a melting point higher than 10 占 폚 higher than stearic acid, and when it is used in combination with myristic acid having a melting point lower than that of stearic acid by 10 占 폚 or more And serves as a second curing catalyst. The resin composition of the present disclosure exhibits the above-mentioned excellent effects by using the second curing catalyst in combination with the first curing catalyst and the first curing catalyst having a melting point of at least 10 캜 higher than the melting point of the first curing catalyst.

Further, the resin composition of the present disclosure may contain, for example, two or more kinds of the first curing catalyst or the second curing catalyst to the extent that the effect of the present disclosure is not impaired. For example, the resin composition of the present disclosure may include behenic acid having a melting point of 76 占 폚, citric acid monohydrate having a melting point of 100 占 폚, and benzoic acid having a melting point of 124 占 폚. In the resin composition of this combination, citric acid monohydrate acts both as a first curing catalyst and as a second curing catalyst.

It is more preferable that each of the first curing catalyst and the second curing catalyst included in the resin composition of the present disclosure is one because the curing of each of the inside of the cavity is more appropriately performed before flowing into the plunger.

In the resin composition of the present disclosure, the ratio (by mass) of the content of the second curing catalyst to the content of the first curing catalyst in the case where each of the first curing catalyst and the second curing catalyst contained in the resin composition of the present disclosure is one It is preferably 400/1 to 1/400, more preferably 10/1 to 1/10, and further preferably 3/1 to 1/3. When the ratio of the content is 400/1 to 1/400, the flow overflow can be further suppressed and appropriately cured before flowing into the plunger and in each of the cavities.

For example, as a first curing catalyst, 0.3 mass part of stearic acid having a melting point of 70 deg. C and 0.1 mass part of benzoic acid having a melting point of 122 deg. C as a second curing catalyst are added to the content of the first curing catalyst 2 curing catalyst is 1/3.

The ratio of the content of the second curing catalyst to the content of the first curing catalyst is not defined when the resin composition of the present disclosure contains at least two kinds of the first curing catalyst or the second curing catalyst.

The resin composition of the present disclosure is characterized in that the first curing catalyst comprises at least one selected from the group consisting of stearic acid and behenic acid, and the second curing catalyst comprises at least one selected from the group consisting of benzoic acid and o-toluic acid It is preferable because excessive curing and excessive flow can be suppressed.

The resin composition of the present disclosure may contain a curing catalyst other than the first curing catalyst and the second curing catalyst to the extent that the excellent effects of the present invention are not impaired.

[Other additives]

The resin composition for cleaning a mold of the present disclosure may further contain other additives. Other additives include, for example, organic fillers, inorganic fillers, metal salts of saturated or unsaturated fatty acids, lubricants, wax components, colorants and antioxidants.

The resin composition of the present disclosure preferably includes an organic filler as an additive in order to appropriately maintain the strength of the resin composition.

Examples of the organic filler include pulp, sawdust, and synthetic fibers. Of these, pulp is particularly preferable.

The pulp may include wood pulp such as softwood pulp and light leaf pulp, and non-wood pulp such as straw, bamboo, bur gas, cotton, and the like.

In addition, the resin composition of the present disclosure can be used in both chemical pulp and mechanical pulp.

The resin composition of the present disclosure preferably contains an inorganic filler because the strength of the resin composition is suitably maintained and the cleaning performance is further improved by the physical polishing action on the surface of the mold.

The inorganic filler may be, for example, glass fibers, metal fibers, ceramics (e.g., silicon carbide), silicon oxide (silica), titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, And inorganic compounds (inorganic fibers) in the form of fibers such as fibers.

In particular, the resin composition of the present disclosure preferably contains silicon oxide (silica) because it is excellent in the dirt removing performance by the polishing effect in the inner surface cleaning process of the mold.

Examples of the metal salt of a saturated fatty acid or an unsaturated fatty acid include a metal salt of a saturated fatty acid or an unsaturated fatty acid in which the metal nucleus is Ca, Zn, Al, Ba, Mg, Li, Mn,

The lubricant may be, for example, a fatty acid amide-based lubricant, specifically a saturated or unsaturated monoamide-type lubricant such as lauric acid amide, myristic acid amide, erucic acid amide, oleic acid amide, stearic acid amide, methylene bisstearic acid amide, ethylene And saturated or unsaturated bisamide-type lubricants represented by bisstearic acid amide and ethylene bisoleic acid amide.

The wax component includes, for example, synthetic wax represented by polyethylene wax and polypropylene wax, mineral wax represented by montanic acid wax, vegetable wax represented by carnauba wax and palm wax, animal wax represented by beeswax, paraffin wax Based wax represented by the following formula (1).

The resin composition for mold cleaning of the present disclosure is suitable for removing dirt originating from a sealing molding material containing a thermosetting resin composition typified by an epoxy resin, a silicone resin, a phenol resin and a polyimide resin from the inner surface of a molding die.

The resin composition for mold cleaning of the present disclosure is a transfer type resin composition used for cleaning a mold of a transfer molding machine (transfer type press machine).

The resin composition for mold cleaning of the present disclosure can be prepared by mixing a melamine resin, a first curing catalyst, a second curing catalyst and, if necessary, other additives. As a method for mixing, for example, a method using a kneader, a ribbon blender, a Henschel mixer, a ball mill, a roll kneader, a brain ball, and a tumbler can be mentioned.

The resin composition for cleaning a mold of the present disclosure is usually used for cleaning an inner surface of a molding die by molding into a tablet shape. Specifically, after placing the lead frame on the mold, the resin composition for cleaning the mold of the tablet is inserted into the port portion, and after joining, the resin is flowed to the plunger. At this time, the resin composition flows into the mold cavity from the gate portion via the runner portion from the port portion. The cleaning operation is performed by opening the mold after a predetermined molding time has elapsed, and removing the resin composition and the molding containing the dirt, which are integrated with the lead frame.

The resin composition for cleaning a mold of the present disclosure is suitably used for removing contaminants present on the inner surface of a molding die in an encapsulation molding operation of an integrated circuit, an LED element or the like. The material of the molding die is, for example, iron or chromium. The inner surface of the mold is usually plated.

After repeatedly performing a bag-molding operation using a bag-molding material as described above, the inner surface of the mold is cleaned by using the resin composition of the present disclosure, and then the bag-molding operation is repeated for several hundred shots. It is possible to stably produce an encapsulated molding such as a circuit or an LED element.

Example

Hereinafter, the present disclosure will be described in more detail with reference to Examples and Comparative Examples. Note that the present disclosure is not limited to these examples.

[Preparation of pulp-mixed melamine-formaldehyde resin powder]

(Production Example 1)

346 parts by mass of melamine and 522 parts by mass of formaldehyde (37% by mass aqueous solution) were heated and reacted to prepare a melamine-formaldehyde resin. To the obtained resin solution, an optical fiber pulp (trade name: LDPT, manufactured by Nippon Paper Co., ), Kneaded, and dried under reduced pressure to obtain a pulp-mixed melamine-formaldehyde resin powder having a pulp content of 15 mass%.

[Preparation of resin composition for mold cleaning]

(Example 1)

30 parts by mass of a pulp-containing melamine-formaldehyde resin powder and 50 parts by mass of a melamine resin (product name: NIKE RESIN S-166, manufactured by Nippon Carbide Industries Co., Ltd.) prepared in Preparation Example 1 as a melamine resin, 0.1 part by mass of benzoic acid having a melting point of 122 占 폚 (manufactured by Wako Pure Chemical), 0.3 parts by mass of stearic acid at 70 占 폚 (manufactured by Wako Pure Chemical Industries, Ltd.), silica (product name: Pure Silica Powder, Product) and 0.4 part by weight of zinc stearate (zinc stearate GF200, manufactured by Nichiyu Co., Ltd.) as a metal salt of saturated fatty acid were each put into a ball mill and pulverized. Next, 0.4 parts by mass of ethylene bisstearic acid amide as a lubricant was added to a Nauta mixer and stirred to obtain a resin composition for cleaning a mold of Example 1. The mold cleaning resin composition thus obtained was molded into a tablet shape and used for evaluation of cleaning of the inner surface of the mold.

(Examples 2 to 12 and Comparative Examples 1 to 4)

The mold cleaning resin compositions of Examples 2 to 12 and Comparative Examples 1 to 4 were prepared in the same manner as in Example 1 except that the composition shown in Table 1 was used.

In Table 1, the numerical unit of the composition is the mass part.

&Quot; - " indicates unmixed.

The temperature indicated in parentheses after the component name of each curing catalyst is the melting point.

[Evaluation of resin composition for mold cleaning]

Each of the prepared mold cleaning resin compositions was evaluated for each performance by the following test method. The prepared resin compositions for cleaning the molds are all transfer type.

(Evaluation of hardenability)

The curability of the resin composition for mold cleaning was evaluated by curing the resin composition under the conditions of a mold temperature of 100 占 폚 by using a curelastometer WP type (trade name, W100 as a die) manufactured by JSR Corporation as an evaluator. The time when 90% of the maximum torque is taken as T90 and the case where T90 is 50 to 60 minutes as " excellent ", the case where the T90 is 60 to 70 minutes as " , And the case where it was not less than 80 minutes or the case where the resin composition was not cured was regarded as " impossible ". The curing of the resin composition was judged by naked eyes.

(Liquidity evaluation)

The flowability (flow) is an index indicating the flowability of the resin composition for cleaning a mold, and can be determined by the value of the spiral flow. When the fluidity of the resin composition is too large or too small, that is, when the spiral flow is too long or too short, defects may occur when the resin composition flows into the plunger or when the molding is pressurized on the inner surface of the molding die. It is not sufficiently supplied to the inner surface of the mold and defects are generated in the cleaning.

The fluidity of the resin compositions in each of the Examples and Comparative Examples was measured under the conditions of a molding die temperature of 120 占 폚, a clamp pressure of 17.5 Mpa, and a transfer pressure of 1.96 Mpa in accordance with ASTM D-3123.

The case where the flowability of the spiral flow is 15 to 30 inches and the flowability is very good is defined as " excellent ", and the case where the spiral flow is 10 inches to 15 inches long, &Quot; possible " when the fluidity fell from 5 inches to 10 inches in length, but " impossible " when the length of the spiral flow was less than 5 inches or 30 inches, respectively.

(Evaluation of mold releasability)

The mold releasability was evaluated by the time that the resin composition could be removed without sticking to the inner surface of the mold during molding of the resin composition (during mold cleaning). The shorter the time, the better the mold releasability.

The mold releasability of the resin compositions of each of the examples and the comparative examples was evaluated using a transfer type automatic molding machine using a QFP (Quad Flat Package) mold of 24 mm x 24 mm in which the gate portion of the cavity had a width of 800 mu m and a height of 300 mu m. The case where the resin composition after the cleaning was removed without sticking to the inner surface of the molding die at the molding die temperature of 120 deg. C and the molding time of 5 minutes in each resin composition was evaluated as " excellent " A case where the resin composition after cleaning after being cleaned without being adhered to the inner surface was evaluated as " acceptable ", a case where the resin composition after cleaning was removed without sticking to the inner surface of the molding die, And the case where the time required for 11 minutes or more was required was called " impossible ". The mold releasability was judged by naked eyes.

(Cleaning property evaluation)

The cleaning property was evaluated by the number of times necessary for repeatedly molding the resin composition and removing the dirt on the inner surface of the mold. The smaller the number, the better the cleaning performance.

400 shots were molded at a mold temperature of 150 占 폚 using EME-G700L (manufactured by Sumitomo Bakelite Co., Ltd.), which is a commercially available epoxy resin molding material, and dirt was developed on the inner surface of the molding die. Next, the mold temperature at which the contaminants were present on the inner surface was lowered to 120 DEG C, and the mold cleaning operation was performed by repeatedly molding the resin composition until the contaminants on the inner surface could be removed. The maximum number of repeated molding cycles was 11 cycles. In the evaluation, the mold and the automatic molding machine used in the mold releasability evaluation described above were used.

The evaluation of the cleaning performance of each mold cleaning resin composition was made such that the number of times of repeated molding was 5 or less so that there was no contaminants on the entire inner surface of the molding die and the cleaning property was good and the number of times of molding was 6 to 8 Quot; acceptable " if the number of times of molding was 9 to 11, and " impossible " when the number of times of molding was repeated 11 times and the contaminants were not removed. The presence or absence of contaminants was judged by visual observation.

The evaluation results of the respective resin compositions are summarized in Table 1.

According to the results shown in Table 1, a melamine resin, a first curing catalyst having a melting point of 43 ° C to 115 ° C, and a second curing catalyst having a melting point of 53 ° C to 125 ° C and a melting point of 10 ° C or more higher than the melting point of the first curing catalyst It can be seen that the resin composition for mold cleaning of each of the examples including the catalyst has excellent evaluation results of curability, flowability (flow), mold releasability and cleaning property, suppresses excessive curing and excessive flow, and can perform better cleaning.

In particular, the respective resin compositions of Examples 1, 2, 4 and 9 exhibit particularly excellent performance, in which the first curing catalyst is stearic acid or behenic acid and the second curing catalyst is benzoic acid or o-toluic acid.

On the other hand, as in the resin composition of Comparative Example 1 or Comparative Example 2, the resin composition containing only either the first curing catalyst or the second curing catalyst, or the resin composition of Comparative Example 3 or Comparative Example 4, The resin composition obtained by using both the first curing catalyst and the curing catalyst having a melting point exceeding 125 캜 exhibits defects in the cleaning of the inner surface of the molding die at a mold temperature of 125 캜 to 150 캜.

As described in the foregoing examples and comparative examples, the mold cleaning resin capable of suppressing excessive curing and overflow of the resin during cleaning of the inner surface of the molding die at a molding die temperature of 125 ° C to 150 ° C, Compositions could be provided.

Claims (5)

Melamine resin, a first curing catalyst having a melting point in the range of 43 캜 to 115 캜,
And a second curing catalyst having a melting point in the range of 53 ° C to 125 ° C and at least 10 ° C higher than the melting point of the first curing catalyst. The method according to claim 1,
Wherein the total content of the first curing catalyst and the second curing catalyst relative to 100 parts by mass of the resin composition for mold cleaning ranges from 0.02 mass parts to 9 mass parts. The method according to claim 1 or 2,
Wherein the ratio (by mass) of the content of the second curing catalyst to the content of the first curing catalyst is in the range of 400/1 to 1/400. The method according to claim 1 or 2,
Wherein the first curing catalyst comprises at least one selected from the group consisting of stearic acid and behenic acid,
Wherein the second curing catalyst comprises at least one selected from the group consisting of benzoic acid and o-toluic acid. The method according to claim 1 or 2,
A resin composition for cleaning a mold used for cleaning a mold of a transfer molding machine.